MC12002D

ML12002 LANSDALE

Document overview

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• PDF pages: 9

Technical content

and frequency doubling, at frequencies up to UHF .

• Plastic Dual Inline 14 Lead, P Dip.
• Plastic Surface Mount 14 Lead SOIC.
• Operating Temperature Range: TA = –30° to +85°C P DIP 14 = CP PLASTIC PACKAGE CASE 646 SOG 14 = -5P SOG CASE 751A CROSS REFERENCE/ORDERING INFORMATION MOTOROLA P DIP 14 MC12002P ML12002CP SOG 14 MC12002D ML12002-5P LANSDALEPACKAGE Note: Lansdale lead free ( Pb) product, as it becomes available, will be identified by a part number prefix change from ML to MLE. (Top View) PIN CONNECTIONS

14 V CC

Figure 1. Logic Diagram

11 Output

LANSDALE Semiconductor, Inc.ML12002 www.lansdale.comPage 2 of 9 Issue A TEST VOLTAGE VALUES Volts VIHmax VILmin VCC ELECTRICAL CHARACTERISTICS +2.9 +2.0 +5.0 Test Limits VOLTAGE APPLIED TO PINS LISTED BELOW Pin Under –30°C +25°C +85°C Characteristic Symbol Under Test Min Max Min Max Min Max Unit VIHmax VILmin VCC Gnd Power Supply Drain ICC 14 — — — 16 — — mAdc — — 11,12,14 5,6,7 Input Current IinH 2 0.75 0.75 0.75 0.75 mAdc mAdc mAdc mAdc 11,12,14 11,12,14 11,12,14 11,12,14 5,6,7 5,6,7 5,6,7 5,6,7 IinL 2 – 0.7 – 0.7 – 0.7 – 0.7 mAdc mAdc mAdc mAdc 11,12,14 11,12,14 11,12,14 11,12,14 5,6,7 5,6,7 5,6,7 5,6,7 Output Current IO1 11 0.7 0.7 1.3 1.3 mAdc mAdc 11,12,14 11,12,14 IO2 11 2.1 2.1 3.9 3.9 mAdc mAdc 11,12,14 11,12,14 5,6,7 5,6,7 Iout 11 4.2 4.2 4.2 4.2 7.8 7.8 7.8 7.8 — — mAdc mAdc mAdc mAdc 2,9 3,8 2,8 3,9 11,12,14 11,12,14 11,12,14 11,12,14 5,6,7 5,6,7 5,6,7 5,6,7 Differential Current ∆IO1 ∆IO2 11,12 11,12 –100 –200 +100 +200 –100 –200 +100 +200 –100 –200 +100 +200 µAdc µAdc 11,12,14 11,12,14 5,6,7 Bias Voltage VBias 1 2.33 390 275 275 1.26 2.53 590 415 415 1.46 2.32 400 285 285 1.185 2.52 600 425 425 1.385 2.3 410 295 295 1.105 2.5 610 435 435 1.305 Vdc mVdc mVdc mVdc Vdc 11,12,14 11,12,14 11,12,14 11,12,14 11,12,14 5,6,7 5,6,7 5,6,7 Pulse In Pulse Out –3.0 V Gnd VEE AC Gain (See Figure 1) AV 11 — — 5.0 — — — V/V 2 11 9 14 7 (Frequency =

100 MHz) *Note

11 — — 0.28 — — — V/V 8 11 3 14 7 NOTE: *Note: AC Gain is a function of collector load impedance.

LANSDALE Semiconductor, Inc.ML12002 www.lansdale.comPage 3 of 9 Issue A

Test 1 – Adjust potentiometer for c arrier null at fc = 100 kHz. Test 2 – Connect pins 5 and 6 to Gnd. Figure 4. Carrier Feedthrough Test Circuits

LANSDALE Semiconductor, Inc.ML12002 www.lansdale.comPage 7 of 9 Issue A RF out RF input AGC MOD input 10k 40% .1uF 1uF 1nF 1nF 1nF 1nF 1nF 1nF ML12002 bypP1LOinP2LOinP3altinP4nullP5nullP6gndP7 siginP8 siginP9 bypP10 rfoutP11 rfoutP12 loadP13 vccP14 50 R1 Figure 11b. Application Circuite Using ML12002 as a AM Modulator

LANSDALE Semiconductor, Inc.ML12002 www.lansdale.comPage 8 of 9 Issue A P DIP 14 = CP PLASTIC PACKAGE (ML12002CP) CASE 646–06 ISSUE M 14 8 B A DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.715 0.770 18.16 18.80 B 0.240 0.260 6.10 6.60 C 0.145 0.185 3.69 4.69 D 0.015 0.021 0.38 0.53 F 0.040 0.070 1.02 1.78 G 0.100 BSC 2.54 BSC H 0.052 0.095 1.32 2.41 J 0.008 0.015 0.20 0.38 K 0.115 0.135 2.92 3.43 L N 0.015 0.039 0.38 1.01 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. F HG D K C SEATING PLANE N –T– 14 PL M0.13 (0.005) L M J 0.290 0.310 7.37 7.87 OUTLINE DIMENSIONS

LANSDALE Semiconductor, Inc.ML12002 www.lansdale.comPage 9 of 9 Issue A SOG 14 = -5P (ML12002-5P) CASE 751A-03 -A- -B- P 7 PL G C KSEAT- ING PLANE M J R X 45 1 7 814 T F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982 2. CONTROLLING DIMENSION: MILLIMETER 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION 4. MAXIMUM HOLD PROTRUSION 0.15 (0.006) PER SIDE 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION DIM INCHES MILLIMETERS MIN MAX MIN MAX A 8.55 8.75 0.337 0.334 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 G 1.27 BSC 0.050 BSC 0.049 J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 P 5.80 6.20 0.228 0.244 R 0.25 0.50 0.010 0.019 M0 ° 7 °0 ° 7 ° 0.25 (0.010) B M 0.25 (0.010) B AM SS M OUTLINE DIMENSIONS Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve relia bili- ty, function or design. Lansdale does not assume any lia bility arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.