MB05S LEIDITECH
Document overview
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Technical content
Features
Ideal for automated placement Glass Passivated chip junction Low profile space Low leakage current High forward surge capability High temperature soldering: 260℃/10 seconds at terminals Component in accordance to Major Ratings and Characteristics I Mechanical Date Case:MBS Molded plastic over glass passivated chip Terminals: Solder plated,solderable per J-STD-002B and JESD22-B102D Polarity: Polarity symbols marked on body I F V RRM I FSM I R V F T j max.
50 V to 1000 V
5 μA 1.0V 150 °C Maximum Ratings & Thermal Characteristics (TA = 25 °C unless otherwise noted) Items Peak Repetitive Reverse Voltage Workin g Peak Reverse Volta g e MB MB 10S MB 800 Symbol MB 05S MB MB MB 1000 V RRM V RWM 100 200 400 60050 UNIT V gg DC Blocking Voltage RMS Reverse Voltage Maximum average forward output rectified current 420 700560 0.5 /0.8 Peak Forward Surge Current 8.3ms Single half sine-wave superimposed on rated load(JEDEC Method) I FSM I F(AV) V R V R(RMS) 70 140 28035 V A A
Electrical Characteristics
A = 25 °C unless otherwise noted) –55 to +150 Thermal resistance from junction to lead Thermal resistance from junction to ambient (2) Operating junction and storage temperature range R θJL R θJA ℃/ W ℃/ W J , T STG p FC J -1 3 UNIT I R μA V F V
4.0 V ,1MHz
1.0 100 Type MaxSymbol Min Items Maximum instantaneous forwad voltage drop per leg Test conditions Reverse current I F =0.4A V R DC T A =25℃ T A =125℃ Typical junction capacitance RoHS 2011/65/EU and WEEE 2002/96/EC 0.5A (1) (2) (see Fig.1) (1) (1) ?(AV) Rev : 01.06.2014 1/3 www.leiditech.com
A =25 ℃ unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Maximum Non-Repetitive Peak Forward Surge Current 0.6 0.8 rward Current(A) S urge current(A) 0.2 0 30 60 90 120 150 Average Fo 1 10 100 peak Forward S Number of Cycles 60 HZ Number of Cycles HZ A Fig.3 Typical Instantaneous Forward Characteristics 100 e Fig.4 Typicl Reverse Leakage Characteristics 0.1 t aneous Forward Current( A 00 1 0.1 a ntaneous Reverse Leakag e Current(mA) 0.01 Instan t Instantaneous Forward Voltage(V) 0.001 0 2 04 06 08 0 1 0 0 Inst a Percent Reted Peak Reverse Voltage(%) T J = 125 °C T J = 25 °C Aluminum Substrate Glass Epoxy P. C . B . Ambient Temperature (°C) MB05S~MB10S
0.031 (0.8) 0.019 (0.5) 0.014 (0.35) 0.006 (0.15) 0.008 (0.20) 0.004 (0.10) 0.161 (4.1) 0.142 (3.6) 0.252 (6.4) 0.275 (7.0) 0.106 (2.70) 0.090 (2.30) 0.108 (2.74) 0.090 (2.30) 0.195 (4.95) 0.177 (4.50) 0.043 (1.1) 0.020 (0.5) 0.272 MAX. (6.91 MAX.) 0.030 MIN. (0.76 MIN.) 0.023 MIN. (0.58 MIN.) 0.105 (2.67) 0.095 (2.41) TO-269AA (MBS) Mounting Pad Layout Dimensions in millimeters and (inches) MB05S~MB10S Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : 01.06.2014 3/3 www.leiditech.com