LWT676

LWT676 OSRAM

Document overview

• Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 15

Technical content

Features

 package: white P-LCC-2 package, colored diffused resin  feature of the device: extremely wide viewing angle; ideal for backlighting and coupling in light guides  color coordinates: x = 0.30, y = 0.32 acc. to CIE 1931 (white)  typ. color temperature: 7300 K  color reproduction index: 80  viewing angle: extremely wide (120°)  technology: GaN  optical efficiency: 2 lm/W  grouping parameter: luminous intensity, color coordinates  assembly methods: suitable for all SMT assembly methods s oldering methods: IR reflow soldering and TTW soldering  preconditioning: acc. to JEDEC Level 2  taping: 8 mm tape with 2000/reel, ø180 mm or 8000/reel, ø330 mm  ESD-withstand voltage: up to 2 kV acc. to JESD22-A114-B

Applications

 indoor displays  backlighting (LCD, swit ches, keys, displays, illuminated advertising, general lighting)  interior automotive lighting. (e.g. dashboard backlighting, etc.)  signal and symbol luminaire  marker lights (e.g. steps, exit ways, etc.)  general lighting

Ordering Information

Lichtstärke1) Seite 15 Luminous Intensity 1) page 15 IF = 10 mA IV (mcd) Lichtstrom2) Seite 15 Luminous Flux 2) page 15 IF = 10 mA ΦV (mlm) Bestellnummer Ordering Code LW T676-M1N1-25 LW T676-N1P2-25 77 (typ.) 140 (typ.) Q62703Q5107 Q62703Q6239 2005-04-05 2 LW T676 Anm.: - 25 Farbselektiert nach Farbortgruppen, Lieferung in Einzelgruppen (siehe Seite 5) Note: - 25 Color selection acc. to chromaticity coordinate groups, delivery in single groups (see page 5)

Operating temperature range Top – 40 … + 100 °C Lagertemperatur Storage temperature range Tstg – 40 … + 100 °C Sperrschichttemperatur Junction temperature Tj + 100 °C Durchlassstrom Forward current (TA=25°C) IF 20 mA Stoßstrom Surge current t ≤ 10 µs, D = 0.005, TA=25°C IFM 0.2 A Sperrspannung3) Seite 15 Reverse voltage3) page 15 (TA=25°C) VR 12 V Leistungsaufnahme Power consumption (TA=25°C) Ptot 85 mW Wärmewiderstand Thermal resistance Sperrschicht/Umgebung4) Seite 15 Junction/ambient4) page 15 Sperrschicht/Lötpad Junction/solder point Rth JA Rth JS 500 280 K/W K/W LW T676 2005-04-05 3

(TA = 25 °C) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Farbkoordinate x nach CIE 19315) Seite 15 (typ.) Chromaticity coordinate x acc. to CIE 19315) page 15 IF = 10 mA x 0.30* – Farbkoordinate y nach CIE 19315) Seite 15 (typ.) Chromaticity coordinate y acc. to CIE 19315) page 15 IF = 10 mA y 0.32* – Abstrahlwinkel bei 50 % IV (Vollwinkel) (typ.) Viewing angle at 50 % IV 2ϕ 120 Grad deg. Durchlassspannung6) Seite 15 (typ.) Forward voltage6) page 15 (max.) IF = 10 mA VF VF 3.5 4.1 V V Sperrstrom (typ.) Reverse current (max.) VR = 12 V IR IR 0.01 µA µA Temperaturkoeffizient von x (typ.) Temperature coefficient of x IF = 10 mA; –10°C ≤ T ≤ 100°C TCx 0.07 10-3/K Temperaturkoeffizient von y (typ.) Temperature coefficient of y IF = 10 mA; –10°C ≤ T ≤ 100°C TCy 0.25 10-3/K Temperaturkoeffizient von VF (typ.) Temperature coefficient of VF IF = 10 mA; –10°C ≤ T ≤ 100°C TCV – 3.1 mV/K Optischer Wirkungsgrad (typ.) Optical efficiency IF = 10 mA ηopt 2 lm/W * Einzelgruppen siehe Seite 5 Individual groups on page 5 2005-04-05 4 LW T676

Farbortgruppen5) Seite 15 Chromaticity Coordinate Groups5) page 15 Gruppe Group x y min. max. min. max. 2 0.280 0.305 0.295 0.325 3 0.290 0.315 0.310 0.340 4 0.295 0.320 0.340 0.370 5 0.305 0.330 0.355 0.385 Helligkeits-Gruppierungsschema Brightness Groups Helligkeitshalbgruppe Brightness Half Group Lichtstärke1) Seite 15 Luminous Intensity1) page 15 IV (mcd) Lichtstrom2) Seite 15 Luminous Flux2) page 15 ΦV (mlm) 18.0 … 22.4 22.4 … 28.0 28.0 … 35.5 35.5 … 45.0 45.0 … 56.0 56.0 … 71.0 60 (typ.) 75 (typ.) 95 (typ.) 120 (typ.) 150 (typ.) 190 (typ.) Anm.: Die Standardlieferform von Serientypen beinhaltet eine untere bzw. eine obere Familiengruppe. Diese besteht aus 3 bzw. 4 Helligkeitshalbgruppen. Einzelne Helligkeitshalbgruppen sind nicht bestellbar. Note: The standard shipping format for serial types includes a lower or upper family group of 3 or 4 individual brightness half groups. Individual brightness half groups cannot be ordered. Gruppenbezeichnung auf Etikett Group Name on Label Beispiel: N2-4 Example: N2-4 Helligkeitshalbgruppe Brightness Half Group Farbortgruppe Chromaticity coordinate group N2 4 Anm.: In einer Verpackungseinheit / Gurt ist immer nur eine Gruppe für jede Selektion enthalten. Note: No packing unit / tape ever contains more than group for each selection. LW T676 2005-04-05 5

Relative spektrale Emission2) Seite 15 Relative Spectral Emission2) page 15 V(λ) = spektrale Augenempfindlichkei t / Standard eye response curve Irel = f (λ); TA = 25 °C; IF = 10 mA 3800 430 480 530 580 630 680 730 780 nm 100 relI λ OHL00467 λV Abstrahlcharakteristik2) Seite 15 Radiation Characteristic2) page 15 Irel = f (ϕ); TA = 25 °C 0.2 0.4 1.0 0.8 0.6 ϕ 1.0 0.8 0.6 0.4 50˚ 60˚ 70˚ 80˚ 90˚ 100˚

Durchlassstrom2) 7) Seite 15 Forward Current2) 7) page 15 IF = f (VF); TA = 25 °C V OHL00432 F FI V 1.5 2 2.5 3 3.5 4 4.5 5 610-1 010 110 102 mA Relative Lichtstärke2) 7) Seite 15 Relative Luminous Intensity2) 7) page 15 IV/IV(10 mA) = f (IF); TA = 25 °C I OHL00469 F -110 V (10 mA)I 10 -3 0 10 1 10 2 55 m A IV Relative Lichtstärke2) Seite 15 Relative Luminous Intensity2) page 15 IV/IV(25 °C) = f (Tj); IF = 10 mA OHL00442 VI -20 0 20 40 60 ˚C 100 j IV (25 ˚C) 0.2 0.4 0.6 0.8 1.2 T

Maximal zulässiger Durchlassstrom Max. Permissible Forward Current IF = f (T) T OHL00448 FI 02 0 4 0 6 0 80 ˚C 100 mA temp. solder point temp. ambientT TS A TA TS Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA = 25 °C OHL01433 FI 10 10-5 -4 -3 10 10 -2 10-1 100 s101 102 pt 0.05 0.5 0.2 0.1D 0.02 0.01 0.005 D T t = P t T P IF 0.05 0.10 0.15 0.20 0.25 A Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA = 85 °C OHL01434 FI 10 10-5 -4 -3 10 10 -2 10-1 100 s101 102 pt 0.05 0.5 0.2 0.1D 0.02 0.01 0.005 D T t = P t T P IF 0.05 0.10 0.15 0.20 0.25 A

Maßzeichnung8) Seite 15 Package Outlines8) page 15 GPLY6724 0.7 (0.028) 0.9 (0.035) 1.7 (0.067) 2.1 (0.083) 0.12 (0.005) 0.18 (0.007) 0.5 (0.020) 3.7 (0.146) 0.4 (0.016) 0.6 (0.024) 2.6 (0.102) 3.0 (0.118) 2.1 (0.083) 2.3 (0.091) Cathode marking 3.0 (0.118) 3.4 (0.134) (2.4) (0.095) 0.1 (0.004) (typ.) 4˚±1 A C Kathodenkennung: abgeschrägte Ecke Cathode mark: bevelled edge Gewicht / Approx. weight: 35 mg Gurtung / Polarität und Lage8) Seite 15 Verpackungseinheit 2000/Rolle, ø180 mm oder 8000/Rolle, ø330 mm Method of Taping / Polarity and Orientation8) page 15 Packing unit 2000/reel, ø180 mm or 8000/reel, ø330 mm OHAY2271 3.6 (0.142) 8 (0.315) 3.5 (0.138) 1.75 (0.069) 2.9 (0.114) 4 (0.157) 2 (0.079) Cathode/Collector Marking

Empfohlenes Lötpaddesign8) 9) Seite 15 IR Reflow Löten Recommended Solder Pad8) 9) page 15 IR Reflow Soldering OHLPY970 4.5 (0.177) 2.6 (0.102) 1.5 (0.059) Cu-area > 16 mm Cu-Fläche > 16 mm Solder resist Lötstopplack 4.5 (0.177) 1.5 (0.059) 2.6 (0.102) Padgeometrie für improved heat dissipation verbesserte Wärmeableitung Paddesign for Empfohlenes Lötpaddesign verwendbar für TOPLED® und Power TOPLED® IR Reflow Löten8) Seite 15 Recommended Solder Pad useable for TOPLED® and Power TOPLED® IR Reflow Soldering8) page 15 OHLPY440 Padgeometrie für verbesserte Wärmeableitung improved heat dissipation Paddesign for Lötstoplack Solder resist 0.8 (0.031) 3.7 (0.146) 1.1 (0.043) 2.3 (0.091) 3.3 (0.130) 1.5 (0.059) 11.1 (0.437) Cu Fläche / 16 mm per pad2 Cu-area 3.3 (0.130) Kathode/ Cathode Anode Fläche darf elektrisch nicht beschaltet werden. Do not use this area for electrical contact. 0.7 (0.028) Fläche darf elektrisch nicht beschaltet werden. Do not use this area for electrical contact.

Lötbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Conditions Preconditioning acc. to JEDEC Level 2 IR-Reflow Lötprofil (nach IPC 9501) IR Reflow Soldering Profile (acc. to IPC 9501) OHLY0597 50 100 150 200 250 100 150 200 250 300 T t C s 240-245 C 10-40 s 183 C 120 to 180 s defined for Preconditioning: up to 6 K/s ramp-down rate up to 6 K/s ramp-up rate up to 6 K/s defined for Preconditioning: 2-3 K/s Wellenlöten (TTW) (nach CECC 00802) TTW Soldering (acc. to CECC 00802) OHLY0598 50 100 150 200 250 100 150 200 250 300 T t C s 235 C 10 s C... 260 1. Welle 1. wave 2. Welle 2. wave

5 K/s 2 K/sca 200 K/s

CC... 130100

2 K/s

Zwangskühlung forced cooling Normalkurve standard curve Grenzkurven limit curves

Barcode-Produkt-Etikett (BPL) Barcode-Product-Label (BPL) SampleOHA02043 X - X - X(G) GROUP: Lot Number(1T) LOT NO: (9D) D/C: Date Code (X) PROD NO: Product Code (6P) BATCH NO: Batch Number Lx xxxx Product Name Bin1: Bin Information Color 1 Bin2: Bin3: ML Temp ST

245 C R

260 C T2

PACKVAR: Packing Type Product Quantity per Reel(Q)QTY: Semiconductors OSRAM Opto Wavelength Rank Forward Voltage Rank Brightness Rank Bar Code Bar Code Bar Code Gurtverpackung Tape and Reel Tape dimensions in mm (inch) W P0 P1 P2 D0 E F 8 + 0.3 – 0.1 4 ± 0.1 (0.157 ± 0.004) 4 ± 0.1 (0.157 ± 0.004) 2 ± 0.05 (0.079 ± 0.002) 1.5 + 0.1 (0.059 + 0.004) 1.75 ± 0.1 (0.069 ± 0.004) 3.5 ± 0.05 (0.138 ± 0.002) W FE Direction of unreeling N A OHAY0324 Label Gurtvorlauf: Leader: Trailer: Gurtende: 13.0 Direction of unreeling ±0.25 160 mm 160 mm 400 mm 400 mm Reel dimensions in mm (inch) A W Nmin W1 W2 max

Trockenverpackung und Materialien Dry Packing Process and Materials OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparator check dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, M oisture Level 3 Floor tim e 168 Hours M oisture Level 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 m onths at < 40 ˚C and < 90% relative hum idity (RH). M oisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) M ounted within b) Stored at body tem 3. Devices require baking, before m ounting, if: Bag seal date M oisture Level 1 M oisture Level 2 M oisture Level 2a4. If baking is required, b) 2a or 2b is not m et. Date and tim e opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor tim e see below If blank, see bar code label Floor tim e > 1 Year Floor tim e 1 Year Floor tim e 4 W eeks10% RH. M oisture Level 4 M oisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag contains CAUTIO N Floor tim e 72 Hours Floor tim e 48 Hours Floor tim e 24 Hours 30 ˚C/60% RH. LEVEL If blank, see bar code label Anm.: Feuchteempfindliche Produkte sind verpackt in ei nem Trockenbeutel zusammen mit einem Trockenmittel und einer Feuchteindikatorkarte Bezüglich Trockenverpackung finden Sie weitere Hinweise im Internet und in unserem Short Form Catalog im Kapitel “Gurtung und Verpackung” unter dem Punkt “T rockenverpackung”. Hier sind Normenbezüge, unter anderem ein Auszug der JEDEC-Norm, enthalten. Note: Moisture-senisitve product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet and in the Short Form Catalog in chapter “Tape and Reel” under the topic “Dry Pack”. Here you will also find the normative references like JEDEC. Kartonverpackung und Materialien Transportation Packing and Materials OHA02044 PACKVAR: R077Additional TEXT P-1+Q-1 Multi T OPLED Muster OSRAM Opto Semiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 11(1T) LOT NO: 210021998 123GH1234 0 245 (Q)QTY: 2000 0144 (G) GROUP:

260 C RT

240 C R

220 C R

MLBin3:Bin2: Q-1-20 Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY PACKVAR: R077Additional TEXT P-1+Q-1 Multi T OPLED Muster OSRAM Opto Semiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 11(1T) LOT NO: 210021998 123GH1234 0 245 (Q)QTY: 2000 0144 (G) GROUP: MLBin3:Bin2: Q-1-20 Bin1: P-1-20 LSY T676 22a Temp ST R18 DEMY OSRAM Barcode label Packing Sealing label Barcode label M oisture Level 3 Floor tim e 168 Hours M oisture Level 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 m onths at < 40 ˚C and < 90% relative hum idity (RH). M oisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) M ounted within b) Stored at body tem 3. Devices require baking, before m ounting, if: Bag seal date M oisture Level 1 M oisture Level 2 M oisture Level 2a4. If baking is required, b) 2a or 2b is not m et. Date and tim e opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor tim e see below If blank, see bar code label Floor tim e > 1 Year Floor tim e 1 Year Floor tim e 4 W eeks10% RH. M oisture Level 4 M oisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag contains CAUTIO N Floor tim e 72 Hours Floor tim e 48 Hours Floor tim e 24 Hours 30 ˚C/60% RH. LEVE L If blan k, see bar cod e lab el

Revision History: 2005-04-05 Previous Version: 2004-03-29 Page Subjects (changes since last revision) Date of change 2 luminous intensity 5 chromaticity coordinate groups 3 power consumption from 90 to 85 mW 2 wavelength grouping for white 9 change of weight from 40 mg to 35 mg 2002-07-05 14 annotations 2002-07-25 13 recomm. solder pad for TOPLED® and Power TOPLED® (OHLPY440) 2002-08-05 3, 4 value (reverse voltage from 5 V to 12 V) 2002-09-18

2 Ordering Code 2002-09-16

3 ambient temperature 2003-09-17

1 ESD-withstand voltage 2003-09-17

15 new patent no. 2003-09-17 all new template 2003-12-22 all Discontinuation of non-RoHS compliant product versions 2005-04-05 Patent List Patent No. US 6 066 861 US 6 277 301 US 6 245 259 US 6 576 930 2005-04-05 14 LW T676 Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components10) page 15 may only be used in life-support devices or systems 11) page 15 with the express written approval of OSRAM OS.

Fußnoten: 1) Helligkeitswerte werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ± 11% ermittelt. 2) Wegen der besonderen Prozessbedingungen bei der Herstellung von LED können typische oder abgeleitete technische Parameter nur aufgrund statistischer Werte wiedergegeben werden. Diese stimmen nicht notwendigerweise mit den Werten jedes einzelnen Produktes überein, dessen Werte sich von typischen und abgeleiteten Werten oder typischen Kennlinien unterscheiden können. Falls erforderlich, z.B. aufgrund technischer Verbesserungen, werden diese typischen Werte ohne weitere Ankündigung geändert. 3) Die LED kann kurzzeitig in Sperrichtung betrieben werden. 4) RthJA ergibt sich bei Montage auf PC-Board FR 4 (Padgröße ≥ 16 mm 2 je Pad) 5) Farbortgruppen werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ±0,01 ermittelt. 6) Spannungswerte werden mit einer Stromeinprägedauer von 1 ms und einer Genauigkeit von ±0,1 V ermittelt. 7) Im gestrichelten Bereich der Kennlinien muss mit erhöhten Helligkeitsunterschieden zwischen Leuchtdioden innerhalb einer Verpackungseinheit gerechnet werden 8) Maße werden wie folgt angegeben: mm (inch) 9) Gehäuse für Wellenlöten (TTW) geeignet. 10) Ein kritisches Bauteil ist ein Bauteil, das in lebenserhaltenden Apparaten oder Systemen eingesetzt wird und dessen Defekt voraussichtlich zu einer Fehlfunktion dies es lebenserhaltenden Apparates oder Systems führen wird oder die Sicherheit oder Effektivität dieses Apparates oder Systems beeinträchtigt. 11) Lebenserhaltende Apparate oder Systeme sind für (a) die Implantierung in den menschlichen Körper oder (b) für die Lebenserhaltung bestimmt. Falls sie versagen, kann davon ausgegangen werden, dass die Gesundheit und das Leben des Patienten in Gefahr ist. Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. Remarks: 1) Brightness groups are tested at a current pulse duration of 25 ms and a tolerance of ± 11%. 2) Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 3) Driving the LED in reverse direction is suitable for short term application. 4) RthJA results from mounting on PC board FR 4 (pad size ≥ 16 mm 2 per pad) 5) Chromaticity coordinate groups are tested at a current pulse duration of 25 ms and a tolerance of ±0.01. 6) Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of ±0.1 V. 7) In the range where the line of the graph is broken, you must expect higher brightness differences between single LEDs within one packing unit. 8) Dimensions are specified as follows: mm (inch) 9) Package suitable for TTW-soldering. 10) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. 11) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered.