LWQH8G-Q2OO-3K5L-1

LWQH8G OSRAM

Document overview

• Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 23

Technical content

1 Version 1.3 | 2018-03-29 Produktdatenblatt | Version 1.1 www.osram-os.com LW QH8G CHIPLED ® 0402

Applications

—Electronic Equipment —Gaming, Amusement, Gambling —Textile illumination —White Goods Features: —Package: SMT package 0402, colored diffused resin —Chip technology: InGaN on Sapphire —Typ. Radiation: 115° (horizontal), 160° (vertical) —Color: Cx = 0.29, Cy = 0.27 acc. to CIE 1931 ( ● white) —Optical efficacy: 40 lm/W —Corrosion Robustness Class: 3B —ESD: ESD sensitive device acc. ANSI/ESDA/JEDEC JS-001 (HBM, Class 0)

2 Version 1.3 | 2018-03-29

Ordering Information

Type Luminous Intensity 1) Ordering Code IF = 5 mA Iv LW QH8G-Q2OO-3K5L-1 ≥ 90 mcd Q65110A8029

3 Version 1.3 | 2018-03-29 Maximum Ratings Parameter Symbol Values Operating Temperature Top min. max. -40 °C 85 °C Storage Temperature Tstg min. max. -40 °C 85 °C Junction Temperature T j max. 95 °C Forward current TA = 25 °C IF max. 15 mA Surge Current t ≤ 10 µs; D = 0.005 ; TA = 25 °C IFS max. 100 mA Reverse voltage 2) TA = 25 °C VR max. 5 V ESD withstand voltage acc. ANSI/ESDA/JEDEC JS-001 (HBM, Class 0) VESD ESD sensitive device

4 Version 1.3 | 2018-03-29 Characteristics IF = 5 mA; TA = 25 °C Parameter Symbol Values Chromaticity Coordinate 3) Cx Cy typ. typ. 0.29 0.27 Viewing angle at 50 % I V values for 0°, 90° 2φ typ. typ. 115 ° 160 ° Forward Voltage IF = 5 mA VF min. typ. max. 2.60 V 2.80 V 3.10 V Reverse current VR = 5 V IR typ. max. 0.01 µA 10 µA Real thermal resistance junction/ambient 5), 6) RthJA real typ. max.

570 K / W

700 K / W

Real thermal resistance junction/solderpoint 5) RthJS real typ. max.

350 K / W

480 K / W

5 Version 1.3 | 2018-03-29 Brightness Groups Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7) IF = 5 mA IF = 5 mA IF = 5 mA min. max. typ. Iv Iv ΦV Q2 90 mcd 112 mcd 300 mlm R1 112 mcd 140 mcd 380 mlm R2 140 mcd 180 mcd 480 mlm S1 180 mcd 224 mcd 610 mlm S2 224 mcd 280 mcd 760 mlm T1 280 mcd 355 mcd 950 mlm T2 355 mcd 450 mcd 1210 mlm Forward Voltage Groups Group Forward Voltage 4) Forward Voltage 4) IF = 5 mA IF = 5 mA min. max. VF VF 3X 2.60 V 2.70 V 3Y 2.70 V 2.80 V 3Z 2.80 V 2.90 V 4X 2.90 V 3.00 V 4Y 3.00 V 3.10 V

6 Version 1.3 | 2018-03-29 OHA03593 520 530 540 550 560 570 580 590 600 610 620 630 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 510 500 490 480 470 450 460 0.25 0.20 E Cy Cx Cx Cy 0.22 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.21 0.23 0.25 0.27 0.29 0.31 0.33 0.35 0.37 0.39 0.41 0.26 0.27 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37 Chromaticity Coordinate Groups 3) Color Chromaticity Groups Group Cx Cy 3K 0.2730 0.2270 0.2660 0.2320 0.2800 0.2520 0.2860 0.2440 3L 0.2660 0.2320 0.2580 0.2390 0.2730 0.2610 0.2800 0.2520 Group Cx Cy 4K 0.2860 0.2440 0.2800 0.2520 0.2910 0.2680 0.2960 0.2590 4L 0.2800 0.2520 0.2730 0.2610 0.2850 0.2790 0.2910 0.2680 Group Cx Cy 5K 0.2960 0.2590 0.2910 0.2680 0.3100 0.2970 0.3130 0.2840 5L 0.2910 0.2680 0.2850 0.2790 0.3070 0.3120 0.3100 0.2970

7 Version 1.3 | 2018-03-29 Group Name on Label Example: Q2-3K-3X Brightness Color chromaticity Forward Voltage Q2 3K 3X

8 Version 1.3 | 2018-03-29 LW QH8G 350 400 450 500 550 600 650 700 750 800 λ [nm] 0.0 0.2 0.4 0.6 0.8 1.0 Irel :V λ :w hite Relative Spectral Emission 7) Irel = f (λ); IF = 5 mA; TA = 25 °C LW QH8G -100° -90° -80° -70° -60° -50° -40° -30° -20° ϕ [°] 0.0 0.2 0.4 0.6 0.8

1.0 Irel

:0 ° : 90° Radiation Characteristics 7) Irel = f (ϕ); TA = 25 °C

9 Version 1.3 | 2018-03-29 OHL03549 (5 mA) V VI I IF 110 10-1 100 21010 51 0m A1 0 Relative Luminous Intensity 7), 8) Iv/Iv(5 mA) = f(IF); TA = 25 °C 2.5 110 102 OHL02359 100 3 3.5 4 4.5 V 5 mA VF FI Forward current 7), 8) IF = f(VF); TA = 25 °C LW QH8G 1 152 4 6 8 10 12 IF [mA] -0.03 -0.02 -0.01 0.00 0.01 0.02 0.03∆Cx ∆Cy : ∆ Cx : ∆ Cy Chromaticity Coordinate Shift 7) ∆Cx,∆Cy = f(IF); TA = 25 °C

10 Version 1.3 | 2018-03-29 LW QH8G -40- 20 02 04 06 08 0 Tj [°C] 0.0 0.2 0.4 0.6 0.8 1.0 1.2Iv Iv(25°C) Relative Luminous Intensity 7) Iv/Iv(25 °C) = f(Tj); IF = 5 mA OHL03548 Tj -40-0.20 -200 20 40 ˚C60 100-60 VVF∆ -0.15 -0.10 -0.05 0.05 0.10 0.15 0.20 0.30 Forward Voltage 7) ∆VF = VF - VF(25 °C) = f(Tj); IF = 5 mA LW QH8G -40- 20 02 04 06 08 0 Tj [°C] -0.03 -0.02 -0.01 0.00 0.01 0.02 0.03∆Cx ∆Cy :C x :C y Chromaticity Coordinate Shift 7) ∆Cx,∆Cy = f(Tj); IF = 5 mA

11 Version 1.3 | 2018-03-29 LW QH8G 02 04 06 08 0 T [°C] 16IF [mA] :T a Max. Permissible Forward Current IF = f(T) Permissible Pulse Handling Capability IF = f(tp); D: Duty cycle; TA = 85 °C Permissible Pulse Handling Capability IF = f(tp); D: Duty cycle; TA = 25 °C

12 Version 1.3 | 2018-03-29 Dimensional Drawing 9) Approximate Weight: 0.4 mg Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC 60068-2-43)

13 Version 1.3 | 2018-03-29 For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Recommended Solder Pad 9)

14 Version 1.3 | 2018-03-29 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS 60 100 120 s Ramp-up rate to peak*) TSmax to TP 2 3 K/s Liquidus temperature TL 217 °C Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 10 20 30 s Ramp-down rate* T P to 100 °C 3 6 K/s Time 25 °C to TP 480 s All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

15 Version 1.3 | 2018-03-29 Taping 9)

16 Version 1.3 | 2018-03-29 Tape and Reel 10) Reel dimensions [mm] A W Nmin W1 W2 max Pieces per PU 180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 4000

17 Version 1.3 | 2018-03-29 Barcode-Product-Label (BPL) Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. Dry Packing Process and Materials 9) OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparator check dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, M oisture Level 3 Floor tim e 168 Hours M oisture Level 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 m onths at < 40 ˚C and < 90% relative hum idity (RH). M oisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) M ounted within b) Stored at body tem 3. Devices require baking, before m ounting, if: Bag seal date M oisture Level 1 M oisture Level 2 M oisture Level 2a4. If baking is required, b) 2a or 2b is not m et. Date and tim e opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor tim e see below If blank, see bar code label Floor tim e > 1 Year Floor tim e 1 Year Floor tim e 4 W eeks10% RH. M oisture Level 4 M oisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag contains CAUTION Floor tim e 72 Hours Floor tim e 48 Hours Floor tim e 24 Hours 30 ˚C/60% RH. LEVEL If blank, see bar code label

18 Version 1.3 | 2018-03-29 Transportation Packing and Materials 9) OHA02044 PACKVAR:R077Additional TEXT P-1+Q-1 Multi TOPLED Muster OSRAM Opto Semiconductors (6P) BATCH NO (X) PROD NO (9D) D/C: 11(1T) LO T NO 210021998 123GH1234 0 24 5 (Q)QTY : 2000 0144 (G) GROUP

260 C RT240 C

R 220 C R ML Bin3 :Bin2: Q-1-2 Bin1: P-1-20 LSY T676 2 2a Tem p ST R18 DEMY PACKVAR: R077Additional TEXT P-1+Q-1 Multi TOPLED Muster OSRAM Opto Semiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 11(1T) LOT NO: 210021998 123GH1234 0 24 5 (Q)QTY: 2000 0144 (G) GROUP:

260 C RT

240 C R

220 C R

MLBin3:Bin2: Q-1-20 Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY OSRAM Packing Sealing label Barcode label M oisture Leve l 3 Fl oo r tim e 16

8 Hours

M oisture Level 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C , or reflow, vapor- pha se ref low, or equiva lent proce ssing (peak packa ge 2. After this bag is opened, device s that will be subjecte d to infrared 1. Sh elf life in sealed bag: 24 m on th s at 40 ˚C and < 90% relative hu mi dity (R H). M oisture L evel 5a at factory co nditions of (if blank, seal date is identica l with da te co de) M ounte d within b) St ore d at body tem 3. Devic es re quire baking, bef ore m ounting, if: Bag seal date M oisture Leve l 1 M oisture Leve l 2 M oisture Leve l 2a4. If baking is require b) 2a or 2b is not me Date and tim e op ened re fere nce IPC/JED EC ST D-033 for bake procedur Floor tim e se e below If blan k, see ba r co de label Floor tim e >

1 Year

eeks10% RH. M oisture Le ve l 4 M oisture Level 5 ˚C). OPT O SE MICONDUCT ORS MO ISTU RE SE NSITIVE This ba g contains CA UTIO N Floo r tim e 72 Hours Floor time

48 Hours

24 Hours

/60% RH. LE VE L If blank, see bar code label Barcode label Dimensions of transportation box in mm Width Length Height 200 ± 5 mm 195 ± 5 mm 30 ± 5 mm

19 Version 1.3 | 2018-03-29 Chip Technology: 1: TSN 3: standard InGaN 4: AlGaAs 6: standard InGalP E: ThinGaN & package with 8 kV ESD stability G: NOTA, Powerflip, ThinGaN Encapsulant Type / Lens Properties 1: focusing lens (=20°) 7: clear resin or white volume conversion 8: white volume conversion 9: clear resin Wavelength Emission Color Color coordinates according (λdom typ.) CIE 1931/Emission color: B: 470 nm blue W: white S: 633 nm super red T: 528 nm true green Y: 587 nm yellow A: 617 nm amber R/J: 625 nm red H: 645 nm hyper-red O: 606 nm orange G: 570 nm green L: Light emitting diode Package Type Q: CHIPLED 0603 / 0402 R: CHIPLED 0805 N: CHIPLED 1206 / CHIPLED with lens Lead / Package Properties 1: footprint: 0603 / height: 0.6 mm 3: footprint: 0603 / height: 0.35 mm 9: standard H: footprint: 0402 / height: 0.35 mm Type Designation System L B Q H 9 G

20 Version 1.3 | 2018-03-29 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo- sure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. As is also true when viewing other bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita- tion, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this LED contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There- fore, we recommend that customers minimize LED exposure to aggressive substances during storage, pro- duction, and use. LEDs that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. Based on very short life cycle times in chip technology this component is subject to frequent adaption to the latest chip technology. For further application related informations please visit www.osram-os.com/appnotes

21 Version 1.3 | 2018-03-29 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language word- ings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS webside. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi- nate the customer-specific request between OSRAM OS and Buyer and/or Customer.

22 Version 1.3 | 2018-03-29 Glossary 1) Brightness: Brightness groups are tested at a current pulse duration of 25 ms and a tolerance of ±11 %. 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera- tion is not allowed. 3) Chromaticity coordinate groups: Chromaticity coordinate groups are tested at a current pulse duration of 25 ms and a tolerance of ±0.01. 4) Forward Voltage: Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of ±0.1 V. 5) Thermal Resistance: Rth max is based on statistic values (6σ). 6) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size ≥ 5 mm² per pad) 7) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not nec- essarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ- ences between single LEDs within one packing unit. 9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 10) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

23 Version 1.3 | 2018-03-29 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.