LWE67C OSRAM

Document overview

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Technical content

Features

 package: white P-LCC-4 package  feature of the device: more brightness due to a lower thermal resistance  color coordinates: x = 0.32, y = 0.31 acc. to CIE 1931 (white)  typ. color temperature: 6500 K  color reproduction index: 80  viewing angle: Lambertian Emitter (120°)  technology: InGaN  optical efficiency: 12 lm/W  grouping parameter: luminous intensity, color coordinates  assembly methods: suitable for all SMT assembly methods  soldering methods: IR reflow soldering and TTW soldering  preconditioning: acc. to JEDEC Level 2  taping: 8 mm tape with 2000/reel, ø180 mm or 8000/reel, ø330 mm  ESD-withstand voltage: up to 2 kV acc. to EOS/ESD-5.1-1993

Applications

 traffic signals  backlighting (LCD, switches, keys, displays, illuminated advertising, general lighting)  Interior and exterior automotive lighting (e.g. dashboard backlighting)  substitution of micro incandescent lamps  reading lamps  emergency lighting  signal and symbol luminaire  marker lights (e.g. steps, exit ways, etc.)  scanners

Anm.: -1 Farbselektiert nach Farbortgruppen Die Standardlieferform von Serientypen beinhaltet eine untere bzw. eine obere Familiengruppe, die aus nur 3 bzw. 4 Halbgruppen besteht. Einzelne Halbgruppen sind nicht erhältlich. In einer Verpackungseinheit / Gurt ist immer nur eine Halbgruppe enthalten. Note: -1 Color selection acc. to Chromaticity coordinate groups The standard shipping format for serial types includes a lower or upper family group of 3 or 4 individual groups. Individual half groups are not available. No packing unit / tape ever contains more than one luminous intensity half group. Typ Type Emissions- farbe Color of Emission Farbe der Lichtaustritts- fläche Color of the Light Emitting Area Lichtstärke Luminous Intensity IF = 30 mA IV (mcd) Lichtstrom Luminous Flux IF = 30 mA Φ V (mlm) Bestellnummer Ordering Code LW E67C-T1U1-1 LW E67C-U1V2-1 white colored diffused 280 … 560 450 … 1120 1250 (typ.) 2400 (typ.) Q62703-Q6132 Q62703-Q6133

Operating temperature range Top – 40 … + 100 °C Lagertemperatur Storage temperature range Tstg – 40 … + 100 °C Sperrschichttemperatur Junction temperature Tj + 110 °C Durchlassstrom Forward current IF 30 mA Stoßstrom Surge current t ≤ 10 µs, D = 0.1 IFM 200 mA Sperrspannung Reverse voltage VR 5V Leistungsaufnahme Power consumption Ptot 140 mW W ärmewiderstand Thermal resistance Sperrschicht/Umgebung Junction/ambient Sperrschicht/Lötpad Junction/solder point Montage auf PC-Board FR 4 (Padgröße ≥ 16 mm 2) mounted on PC board FR 4 (pad size ≥ 16 mm 2) Rth JA Rth JS 350 180 K/W K/W

Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Farbkoordinate x nach CIE 1931 1) (typ.) Chromaticity coordinate x acc. to CIE 1931 IF = 30 mA x0 . 3 2 – Farbkoordinate y nach CIE 1931 1) (typ.) Chromaticity coordinate y acc. to CIE 1931 IF = 30 mA y0 . 3 1 – Abstrahlwinkel bei 50 % IV (Vollwinkel) (typ.) Viewing angle at 50 % IV 2ϕ 120 Grad deg. Durchlassspannung 2) (typ.) Forward voltage (max.) IF = 30 mA VF VF 4.1 4.6 V V Sperrstrom (typ.) Reverse current (max.) VR = 5 V IR IR 0.01 µA µA Temperaturkoeffizient von x (typ.) Temperature coefficient of x IF = 30 mA; –10°C ≤ T ≤ 100°C TC x –0.1 10 -3/K Temperaturkoeffizient von y (typ.) Temperature coefficient of y IF = 30 mA; –10°C ≤ T ≤ 100°C TC y –0.2 10 -3/K Temperaturkoeffizient von VF (typ.) Temperature coefficient of VF IF = 30 mA; –10°C ≤ T ≤ 100°C TC V – 3.0 mV/K Optischer Wirkungsgrad (typ.) Optical efficiency IF = 30 mA ηopt 12 lm/W 1) Farbortgruppen werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ±0,01 ermittelt. Chromaticity coordinate groups are tested at a current pulse duration of 25 ms and a tolerance of ±0.01. 2) Spannungswerte werden mit einer Stromeinprägedauer von 1 ms und einer Genauigkeit von ±0.1 V ermittelt. Voltages are tested at a current pulse duration of 1 ms and a tolerance of ±0.1 V.

) Farbortgruppen Chromaticity coordinate groups OHA01327 520 530 540 550 560 570 580 590 600 610 620 630 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 510 500 490 480 470 450 460 0.28 0.23 0.24 0.30 0.32 0.34 0.36 0.25 0.26 0.27 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37 0.38 0.39 0.40 0.42 0.38 group 3 group 4 group 5 E 0.29 0.31 0.33 0.35 Cy 0.41 Cx Cy 0.37 Cx

Helligkeitswerte werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ± 11% ermittelt. Luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of ± 11%. Gruppenbezeichnung auf Etikett Group Name on Label Beispiel: T2-4 Example: T2-4 Helligkeits-Gruppierungsschema Luminous Intensity Groups Lichtgruppe Luminous Intensity Group Lichtstärke Luminous Intensity IV (mcd) Lichtstrom Luminous Flux Φ V (mlm) 280 … 355 355 … 450 450 … 560 560 … 710 710 … 900 900 … 1120 950 (typ.) 1200 (typ.) 1500 (typ.) 1900 (typ.) 2400 (typ.) 3000 (typ.) Lichtgruppe Luminous Intensity Group Halbgruppe Half Group Farbortgruppe Chromaticity Coordinate Group T 24

Relative spektrale Emission Irel = f (λ), TA = 25 °C, IF = 30 mA Relative Spectral Emission V(λ) = spektrale Augenempfindlichkeit Standard eye response curve Abstrahlcharakteristik Irel = f (ϕ) Radiation Characteristic 400 λ OHL01461 I 100 rel nm Vλ 450 500 550 600 650 700 750 0.2 0.4 1.0 0.8 0.6 ϕ 1.0 0.8 0.6 0.4 50˚ 60˚ 70˚ 80˚ 90˚ 100˚

Durchlassstrom IF = f (VF) Forward Current TA = 25 °C Maximal zulässiger Durchlassstrom IF = f (T) Max. Permissible Forward Current Relative Lichtstärke IV/IV(30 mA) = f (IF) Relative Luminous Intensity TA = 25 °C Maximal zulässiger Durchlassstrom IF = f (T) Max. Permissible Forward Current OHL01462 10-3 2.0 IF VF 10-2 10-1 100 101 102 mA OHL01488 IF T mA AT temp. ambient 20 40 60 80 ˚C 100 Estimated average degradation = -50%V∆ I 5000 h 10000 hMTTF MTTF OHL01497 10-3 10-2 10-1 100 101 10-110 10 01 mA 210 FI (30 mA)IV IV OHL01489 IF T ST temp. solder point S 20 80 40 60 ˚C 100 mA 5000 h 10000 hMTTF MTTF Estimated average degradation = -50%I∆ V

Relative Lichtstärke IV/IV(25 °C) = f (TA) Relative Luminous Intensity IF = 30 mA Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 25 °C Farbortverschiebung x, y = f (IF) Chromaticity Coordinate Shift TA = 25 °C Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 85 °C OHL01637 -20 V(25 ˚C)I AT 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 20 40 60 ˚C 100 IV OHL01580 10-5 FI T Pt Pt T pt FI 0.005 0.01 0.02 0.05 D = 10-4 10-3 10-2 10-1 100 1010 A 210s 0.5 0.05 0.10 0.15 0.20 0.30 0.2 0.1 0.25 0.2950 Cy Cx, Cy Cx IF OHL01490 10 20 30 40 mA 60 0.300 0.305 0.310 0.315 0.320 0.325 0.330 0.335 OHL01579 10-5 FI T Pt Pt T pt FI 0.005 0.01 0.02 0.05 0.1 D = 10-4 10-3 10-2 10-1 100 1010 A 210s 0.50.05 0.10 0.15 0.20 0.30 0.2 0.25

Ma ßzeichnung Package Outlines Ma ße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). Gewicht / Approx. weight: 31 mg marking Package 4˚±1 GPLY6991 AC CC 0.8 (0.031) 0.6 (0.024) 2.6 (0.102) 2.1 (0.083) 2.3 (0.091) 3.0 (0.118) 3.4 (0.134) 3.0 (0.118) (2.4 (0.094)) 0.5 (0.020) 1.1 (0.043) 3.7 (0.146) 3.3 (0.130) 0.12 (0.005) 0.18 (0.007) 0.1 (0.004) typ 0.4 (0.016) 0.6 (0.024) 0.9 (0.035) 0.7 (0.028) 2.1 (0.083) 1.7 (0.067)

Lötbedingungen Vorbehandlung nach JEDEC Level 2 Soldering ConditionsPreconditioning acc. to JEDEC Level 2 IR-Reflow Lötprofil (nach IPC 9501) IR Reflow Soldering Profile(acc. to IPC 9501) OHLY0597 50 100 150 200 250 100 150 200 250 300 T t s 240-245 ˚C 10-40 s 183 ˚C 120 to 180 s Defined for Preconditioning: up to 6 K/s Ramp-down rate up to 6 K/s Ramp-up rate up to 6 K/s Defined for Preconditioning: 2-3 K/s

Wellenlöten (TTW) (nach CECC 00802) TTW Soldering (acc. to CECC 00802) OHLY0598 50 100 150 200 250 100 150 200 250 300 T t C s 235 C 10 s C... 260 1. Welle 1. wave 2. Welle 2. wave

5 K/s 2 K/sca 200 K/s

CC... 130100

2 K/s

Zwangskühlung forced cooling Normalkurve standard curve Grenzkurven limit curves

Empfohlenes Lötpaddesign IR Reflow Löten Recommended Solder Pad IR Reflow Soldering Ma ße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch) OHLPY439 Padgeometrie für verbesserte Wärmeableitung improved heat dissipation Paddesign for Lötstoplack Solder resist 1.1 (0.043) 4.5 (0.177) 1.5 (0.059) 2.6 (0.102) 3.3 (0.130) 0.5 (0.020) 7.5 (0.295) 0.4 (0.016) Cathode marking Kathoden Markierung / Cu Fl äche / 12 mm per pad2 Cu-area 3.3 (0.130)

Empfohlenes Lötpaddesign Wellenlöten (TTW) Recommended Solder Pad TTW Soldering Ma ße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch) Gurtung / Polarität und Lage Verpackungseinheit 2000/Rolle, ø180 mm oder 8000/Rolle, ø330 mm Method of Taping / Polarity and OrientationPacking unit 2000/reel, ø180 mm or 8000/reel, ø330 mm Ma ße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch) OHAY0583 6.1 (0.240) 2.8 (0.110) 2 (0.079) 3 (0.118) 6 (0.236) 3.5 (0.138) 1.5 (0.059) 2 (0.079) 8 (0.315) 7.5 (0.295) Solder resist Lötstoplack PCB-direction Bewegungsrichtung der Platine 2 (0.079) Padgeometrie für improved heat dissipation verbesserte Wärmeableitung Paddesign for 2Cu Fläche / > 12 mm per pad Cu-area OHAY0536 CC C A 3.6 (0.142) 3.5 (0.138) 2 (0.079) 1.75 (0.069) 8 (0.315)

Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg © All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. Revision History: 2001-06-07 Previous Version: 2001-02-06 Page Subjects (major changes since last revision) 9Z u l ässige Impulsbelastbarkeit / Permissible Pulse Handling Capability Patent List Patent No. US 6 066 861