LT1395_1 LINER
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FEATURES
Current Feedback Amplifier The LT 1395/LT1396/LT1397 are single/dual/quad 400MHz current feedback amplifiers with an 800V/µs slew rate and the ability to drive up to 80mA of output current. The LT1395/LT1396/LT1397 operate on all supplies from a single 4V to ± 6V. At ± 5V, they draw 4.6mA of supply current per amplifier. The LT1395CS6 also adds a shut- down pin. When disabled, the LT1395CS6 draws virtually zero supply current and its output becomes high imped- ance. The LT1395CS6 will turn on in only 30ns and turn off in 40ns, making it ideal in spread spectrum and portable equipment applications. For space limited applications, the LT1395 is available in TSOT-23 packages, the LT1396 is available in a tiny 3mm × 3mm × 0.75mm dual fine pitch leadless DFN package, and the LT1397 is available in a tiny 4mm × 3mm × 0.75mm DFN package. The LT1395/LT1396/LT1397 are manufactured on Linear Technology’s proprietary complementary bipolar process. They have standard single/dual/quad pinouts and they are optimized for use on supply voltages of ± 5V. ■ 400MHz Bandwidth on ± 5V (AV = 1) ■ 350MHz Bandwidth on ± 5V (AV = 2, –1) ■ 0.1dB Gain Flatness: 100MHz (AV = 1, 2 and –1) ■ High Slew Rate: 800V/µs ■ Wide Supply Range: ± 2V(4V) to ± 6V(12V) ■ 80mA Output Current ■ Low Supply Current: 4.6mA/Amplifier ■ LT1395: SO-8, TSOT23-5 and TSOT23-6 Packages LT1396: SO-8, MSOP and Tiny 3mm × 3mm × 0.75mm DFN-8 Packages LT1397: SO-14, SSOP-16 and Tiny 4mm × 3mm × 0.75mm DFN-14 Packages ■ Cable Drivers ■ Video Amplifiers ■ MUX Amplifiers ■ High Speed Portable Equipment ■ IF Amplifiers Unity-Gain Video Loop-Through Amplifier Loop-Through Amplifier Frequency Response VOUT 1395/6/7 TA01 12.1k0.67pF RF2 255Ω 1% RESISTORS FOR A GAIN OF G: V OUT = G (VIN+ – VIN– ) RF1 = RF2 RG1 = (5G – 1) RF2 RG2 = TRIM CMRR WITH RG1 HIGH INPUT RESISTANCE DOES NOT LOAD CABLE EVEN WHEN POWER IS OFF LT1396 RF2 (5G – 1) RG2 63.4Ω RF1 255Ω RG1 1.02k LT1396 3.01k3.01k 12.1k VIN– VIN+ BNC INPUTS 0.67pF FREQUENCY (Hz) 100 –60 GAIN (dB) –50 –40 –30 –20 –10 1k 10k 100k 1G 1395/6/7 TA02 1M 10M 100M COMMON MODE SIGNAL NORMAL SIGNAL , LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners.
A UGWA WU WARBSOLUTEX I T I S Operating Temperature Range (Note 4) (Note 1) Specified Temperature Range (Note 5) Storage Temperature Range PI CO FIGURATIO UU U V– 2 5 V+ 4 –IN OUT 1 TOP VIEW S5 PACKAGE 5-LEAD PLASTIC TSOT-23 +IN 3 + – TJMAX = 150°C, θJA = 250°C/W OUT A –IN A +IN A V OUT B –IN B +IN B TOP VIEW MS8 PACKAGE 8-LEAD PLASTIC MSOP TJMAX = 150°C, θJA = 250°C/W TOP VIEW DD PACKAGE 8-LEAD (3mm × 3mm) PLASTIC DFN 1OUT A –IN A +IN A V OUT B –IN B +IN B TJMAX = 125°C, θJA = 160°C/W (NOTE 3) UNDERSIDE METAL CONNECTED TO V– (PCB CONNECTION OPTIONAL) TJMAX = 150°C, θJA = 100°C/W TOP VIEW S PACKAGE 14-LEAD PLASTIC SO OUT A –IN A +IN A V +IN B –IN B OUT B OUT D –IN D +IN D V +IN C –IN C OUT C TOP VIEW GN PACKAGE 16-LEAD PLASTIC SSOP OUT A –IN A +IN A V +IN B –IN B OUT B NC OUT D –IN D +IN D V +IN C –IN C OUT C NC TJMAX = 150°C, θJA = 135°C/W OUT D –IN D +IN D V +IN C –IN C OUT C OUT A –IN A +IN A V +IN B –IN B OUT B TOP VIEW DE14 PACKAGE 14-LEAD (4mm × 3mm) PLASTIC DFN TJMAX = 125°C, θJA = 43°C/W, θJC = 4.3°C/W EXPOSED PAD (PIN 15) IS V– MUST BE SOLDERED TO PCB
LEAD FREE FINISH TAPE AND REEL PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE LT1396CDD#PBF LT1396CDD#TRPBF LABD 8-Lead (3mm × 3mm) Plastic DFN –40 °C to 85°C LT1397CDE#PBF LT1397CDE#TRPBF 1397 14-Lead (4mm × 3mm) Plastic DFN –40 °C to 85°C LT1397HDE#PBF LT1397HDE#TRPBF 1397 14-Lead (4mm × 3mm) Plastic DFN –40 °C to 125°C LT1397CGN#PBF LT1397CGN#TRPBF 1397 16-Lead Plastic SSOP –40 °C to 85°C LT1396CMS8#PBF LT1396CMS8#TRPBF LTDY 8-Lead Plastic MSOP –40 °C to 85°C LT1397CS#PBF LT1397CS#TRPBF 1397CS 14-Lead Plastic SO –40 °C to 85°C LT1395CS5#PBF LT1395CS5#TRPBF LTMA 5-Lead Plastic SOT-23 –40 °C to 85°C LT1395CS6#PBF LT1395CS6#TRPBF LTMF 6-Lead Plastic SOT-23 –40 °C to 85°C LT1395CS8#PBF LT1395CS8#TRPBF 1395 8-Lead Plastic SO –40 °C to 85°C LT1396CS8#PBF LT1396CS8#TRPBF 1396 8-Lead Plastic SO –40 °C to 85°C LEAD BASED FINISH TAPE AND REEL PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE LT1396CDD LT1396CDD#TR LABD 8-Lead (3mm × 3mm) Plastic DFN –40 °C to 85°C LT1397CDE LT1397CDE#TR 1397 14-Lead (4mm × 3mm) Plastic DFN –40 °C to 85°C LT1397HDE LT1397HDE#TR 1397 14-Lead (4mm × 3mm) Plastic DFN –40 °C to 125°C LT1397CGN LT1397CGN#TR 1397 16-Lead Plastic SSOP –40 °C to 85°C LT1396CMS8 LT1396CMS8#TR LTDY 8-Lead Plastic MSOP –40 °C to 85°C LT1397CS LT1397CS#TR 1397CS 14-Lead Plastic SO –40 °C to 85°C LT1395CS5 LT1395CS5#TR LTMA 5-Lead Plastic SOT-23 –40 °C to 85°C LT1395CS6 LT1395CS6#TR LTMF 6-Lead Plastic SOT-23 –40 ° C to 85°C LT1395CS8 LT1395CS8#TR 1395 8-Lead Plastic SO –40 °C to 85°C LT1396CS8 LT1396CS8#TR 1396 8-Lead Plastic SO –40 °C to 85°C ORDER I FOR ATIOUU W PI CO FIGURATIO UU U Consult LTC Marketing for parts specified with wider operating temperature ranges. Consult LTC Marketing for information on nonstandard lead based finish parts. *Temperature grades are identified by a label on the shipping container. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ TOP VIEW OUT B –IN B +IN B OUT A –IN A +IN A V S8 PACKAGE (1396) 8-LEAD PLASTIC SO TJMAX = 150°C, θJA = 150°C/WTJMAX = 150°C, θJA = 230°C/W OUT 1 V– 2 +IN 3 6 V+ 5 EN 4 –IN TOP VIEW S6 PACKAGE 6-LEAD PLASTIC TSOT-23 + – TOP VIEW NC OUT NC NC –IN +IN V S8 PACKAGE (1395) 8-LEAD PLASTIC SO TJMAX = 150°C, θJA = 150°C/W
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VOS Input Offset Voltage 1 ± 10 mV
- ± 12 mV ∆VOS/∆T Input Offset Voltage Drift ● 15 µV/°C IIN + Noninverting Input Current 10 ± 25 µA
- ± 30 µA IIN– Inverting Input Current 10 ± 50 µA
- ± 60 µA en Input Noise Voltage Density f = 1kHz, R F = 1k, RG = 10Ω, RS = 0Ω 4.5 nV/ √Hz +in Noninverting Input Noise Current Density f = 1kHz 6 pA/ √Hz –i n Inverting Input Noise Current Density f = 1kHz 25 pA/ √Hz RIN Input Resistance V IN = ± 3.5V ● 0.3 1 M Ω CIN Input Capacitance 2.0 pF VINH Input Voltage Range, High V S = ± 5V ● 3.5 4.0 V VS = 5V, 0V 4.0 V VINL Input Voltage Range, Low V S = ± 5V ● – 4.0 –3.5 V VS = 5V, 0V 1.0 V VOUTH Output Voltage Swing, High V S = ± 5V 3.9 4.2 V VS = ± 5V ● 3.7 V VS = 5V, 0V 4.2 V VOUTL Output Voltage Swing, Low V S = ± 5V – 4.2 – 3.9 V VS = 5V, 0V 0.8 V VOUTH Output Voltage Swing, High V S = ± 5V, RL = 150Ω 3.4 3.6 V VS = ± 5V, RL = 150Ω ● 3.2 V VS = 5V, 0V; RL = 150Ω 3.6 V VOUTL Output Voltage Swing, Low V S = ± 5V, RL = 150Ω – 3.6 – 3.4 V VS = ± 5V, RL = 150Ω ● – 3.2 V VS = 5V, 0V; RL = 150Ω 0.6 V CMRR Common Mode Rejection Ratio V CM = ± 3.5V ● 42 52 dB –I CMRR Inverting Input Current V CM = ± 3.5V 10 16 µA/V Common Mode Rejection V CM = ± 3.5V ● 22 µA/V PSRR Power Supply Rejection Ratio V S = ± 2V to ± 5V ● 56 70 dB +IPSRR Noninverting Input Current V S = ± 2V to ± 5V 1 2 µA/V Power Supply Rejection ● 3 µA/V –I PSRR Inverting Input Current V S = ± 2V to ± 5V ● 27 µA/V Power Supply Rejection AV Large-Signal Voltage Gain V OUT = ± 2V, RL = 150Ω 50 65 dB ROL Transimpedance, ∆VOUT/∆IIN– VOUT = ± 2V, RL = 150Ω 40 100 k Ω IOUT Maximum Output Current R L = 0Ω ● 80 mA IS Supply Current per Amplifier V OUT = 0V ● 4.6 6.5 mA Disable Supply Current EN Pin Voltage = 4.5V, R L = 150Ω ● 0.1 100 µA (LT1395CS6 only) IEN Enable Pin Current (LT1395CS6 only) 30 110 µA
- 200 µA SR Slew Rate (Note 7) A V = –1, R L = 150Ω 500 800 V/ µs ELECTRICAL C CHARA TERISTICS The ● denotes specifications which apply over the specified operating temperature range, otherwise specifications are at TA = 25°C. For each amplifier: VCM = 0V, VS = ±5V, EN = 0.5V, pulse tested, unless otherwise noted. (Note 5)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS ELECTRICAL C CHARA TERISTICS The ● denotes specifications which apply over the specified operating temperature range, otherwise specifications are at TA = 25°C. For each amplifier: VCM = 0V, VS = ±5V, pulse tested, unless otherwise noted. (Note 5) Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: This parameter is guaranteed to meet specified performance through design and characterization. It has not been tested. Note 3: A heat sink may be required depending on the power supply voltage and how many amplifiers have their outputs short circuited. The θ JA specified for the DD package is with minimal PCB heat spreading metal. Using expanded metal area on all layers of a board reduces this value. Note 4: The LT1395C/LT1396C/LT1397C are guaranteed functional over the operating temperature range of –40 °C to 85°C. The LT1397H is guaranteed functional over the operating temperature range of –40°C to 125°C. Note 5: The LT1395C/LT1396C/LT1397C are guaranteed to meet specified performance from 0°C to 70°C. The LT1395C/LT1396C/LT1397C are designed, characterized and expected to meet specified performance from –40 °C and 85°C but are not tested or QA sampled at these temperatures. The LT1397H is guaranteed to meet specified performance from –40°C to 125°C. For guaranteed I-grade parts, consult the factory. Note 6: TJ is calculated from the ambient temperature TA and the power dissipation PD according to the following formula: LT1395CS5: TJ = TA + (PD • 250°C/W) LT1396CS6: TJ = TA + (PD • 230°C/W) LT1395CS8: TJ = TA + (PD • 150°C/W) LT1396CS8: TJ = TA + (PD • 150°C/W) LT1396CMS8: TJ = TA + (PD • 250°C/W) LT1396CDD: TJ = TA + (PD • 160°C/W) LT1397CS14: TJ = TA + (PD • 100°C/W) LT1397CGN16: TJ = TA + (PD • 135°C/W) LT1397CDE: TJ = TA + (PD • 43°C/W) LT1397HDE: TJ = TA + (PD • 43°C/W) Note 7: Slew rate is measured at ± 2V on a ± 3V output signal. Note 8: Differential gain and phase are measured using a Tektronix TSG120YC/NTSC signal generator and a Tektronix 1780R Video Measurement Set. The resolution of this equipment is 0.1% and 0.1°. Ten identical amplifier stages were cascaded giving an effective resolution of 0.01% and 0.01°. Note 9: For LT1395CS6, turn-on delay time (t ON) is measured from control input to appearance of 1V(50%) at the output, for VIN = 1V and AV = 2. Likewise, turn-off delay time (tOFF) is measured from control input to appearance of 1V(50%) on the output for VIN = 1V and AV = 2. This specification is guaranteed by design and characterization. tON Turn-On Delay Time (Note 9) R F = RG = 255Ω, RL = 100Ω, (LT1395CS6 only) 30 75 ns tOFF Turn-Off Delay Time (Note 9) R F = RG = 255Ω, RL = 100Ω, (LT1395CS6 only) 40 100 ns –3dB BW –3dB Bandwidth A V = 1, RF = 374Ω, RL = 100Ω 400 MHz AV = 2, RF = RG = 255Ω, RL = 100Ω 350 MHz 0.1dB BW 0.1dB Bandwidth A V = 1, RF = 374Ω, RL = 100Ω 100 MHz AV = 2, RF = RG = 255Ω, RL = 100Ω 100 MHz tr, tf Small-Signal Rise and Fall Time R F = RG = 255Ω, RL = 100Ω, VOUT = 1VP-P 1.3 ns tPD Propagation Delay R F = RG = 255Ω, RL = 100Ω, VOUT = 1VP-P 2.5 ns os Small-Signal Overshoot R F = RG = 255Ω, RL = 100Ω, VOUT = 1VP-P 10 % tS Settling Time 0.1%, A V = –1, R F = RG = 280Ω, RL = 150Ω 25 ns dG Differential Gain (Note 8) R F = RG = 255Ω, RL = 150Ω 0.02 % dP Differential Phase (Note 8) R F = RG = 255Ω, RL = 150Ω 0.04 DEG
Large-Signal Transient Response (AV = – 1) Large-Signal Transient Response (AV = 2) Large-Signal Transient Response (AV = 1) CCHARA TERISTICSUWATYPICALP E RFOR CE Closed-Loop Gain vs Frequency (AV = 1) Closed-Loop Gain vs Frequency V = – 1) Closed-Loop Gain vs Frequency V = 2) SMALL SIGNAL SMALL SIGNAL SMALL SIGNAL VS (V) A V RL (Ω)R F (Ω)R G (Ω) –3dB BW (MHz) 0.1dB BW (MHz) PEAKING (dB) ± 5 1 100 374 – 400 100 0.1 ± 5 2 100 255 255 350 100 0.1 ± 5 –1 100 280 280 350 100 0.1 ±5 3 500 221 110 300 100 0.1 ±5 5 500 100 24.9 210 50 0.0 ±5 10 500 90.9 10 65 10 0.0 ±5 10 500 90.9 10 Ω||100pF 100 50 0.1 TYPICAL AC PERFOR A CEW U 1M 10M 1G 100M FREQUENCY (Hz)VS = ± 5V VIN = –10dBm RF = 374Ω RL = 100Ω 1395/6/7 G01 GAIN (dB) GAIN (dB) VS = ± 5V VIN = –10dBm RF = RG = 255Ω RL = 100Ω 1M 10M 1G 100M FREQUENCY (Hz) 1395/6/7 G02 GAIN (dB) V S = ± 5V VIN = –10dBm RF = RG = 280Ω RL = 100Ω 1M 10M 1G 100M FREQUENCY (Hz) 1395/6/7 G03 OUTPUT (1V/DIV) TIME (10ns/DIV)VS = ± 5V VIN = ± 2.5V RF = 374Ω RL = 100Ω 1395/6/7 G04 OUTPUT (1V/DIV) TIME (10ns/DIV)VS = ± 5V VIN = ± 1.25V RF = RG = 255Ω RL = 100Ω 1395/6/7 G05 OUTPUT (1V/DIV) TIME (10ns/DIV)VS = ± 5V VIN = ± 2.5V RF = RG = 280Ω RL = 100Ω 1395/6/7 G06
vs Output Series Resistor Supply Current vs Supply Voltage CAPACITIVE LOAD (pF) OUTPUT SERIES RESISTANCE (Ω) 100 1000 1395/6/7 G14 RF = RG = 255Ω VS = ± 5V OVERSHOOT < 2% CCHARA TERISTICSUWATYPICALP E RFOR CE Input Voltage Noise and Current Noise vs Frequency FREQUENCY (Hz) INPUT NOISE (nV/√Hz OR pA/√Hz) 100 1000 30 100 300 1k 3k 10k 30k 100k 1395/6/7 G10 –i n +in en FREQUENCY (Hz) 10k
0.01 OUTPUT IMPEDANCE (Ω)
0.1 RF = RG = 255Ω RL = 50Ω AV = +2 VS = ± 5V Output Impedance vs Frequency Maximum Capacitive Load vs Feedback Resistor FEEDBACK RESISTANCE (Ω) 300 CAPACITIVE LOAD (pF) 100 1000 900 1500 2100 2700 3300 1395/6/7 G13 RF = RG AV = +2 VS = ± 5V PEAKING ≤ 5dB FREQUENCY (Hz) 100k
100 OUTPUT IMPEDANCE (DISABLED) (Ω)
RF = 374Ω AV = +1 VS = ± 5V SUPPLY VOLTAGE (± V) SUPPLY CURRENT (mA) 2 4 59 1395/6/7 G15 13 6 7 8 EN = V– EN = 0V, ALL NON-DISABLE DEVICES LT1395CS6 Output Impedance (Disabled) vs Frequency PSRR vs Frequency Maximum Undistorted Output Voltage vs Frequency 2nd and 3rd Harmonic Distortion vs Frequency FREQUENCY (Hz) DISTORTION (dB) 1k 100k 1M 100M 1395/6/7 G07 100 10k 10M 110 HD2HD3 TA = 25°C RF = RG = 255Ω RL = 100Ω VS = ± 5V VOUT = 2VPP FREQUENCY (Hz) OUTPUT VOLTAGE (VP-P) 10M 100M 1395/6/7 G08 AV = +1 A V = +2 TA = 25°C RF = 374Ω (AV = 1) RF = RG = 255Ω (AV = 2) RL = 100Ω VS = ± 5V FREQUENCY (Hz) PSRR (dB) 10k 1M 10M 100M 1395/6/7 G09 100k + PSRR– PSRR TA = 25°C RF = RG = 255Ω RL = 100Ω AV = +2
Propagation Delay Rise Time and OvershootSquare Wave Response CCHARA TERISTICSUWATYPICALP E RFOR CE Input Offset Voltage vs Temperature AMBIENT TEMPERATURE (°C) –5 0 INPUT OFFSET VOLTAGE (mV) 2.5 1395/6/7 G19 1.0 –2 5 0 5 0 – 0.5 –1.0 3.0 2.0 1.5 0.5 75 100 125 VS = ± 5V AMBIENT TEMPERATURE (°C) –50 IB+ IB– 25 75 1395/6/7 G20 –25 0 50 100 125 INPUT BIAS CURRENT (µA) VS = ± 5V Output Voltage Swing vs Temperature Positive Supply Current per Amplifier vs Temperature AMBIENT TEMPERATURE (°C) –50 OUTPUT VOLTAGE SWING (V) 0 50 75 1395/6/7 G16 –25 25 100 125 RL = 150ΩRL = 100k RL = 150ΩRL = 100k VS = ± 5V AMBIENT TEMPERATURE (°C) –50 POSITIVE SUPPLY CURRENT PER AMPLIFIER (mA) 4.75 1395/6/7 G18 4.00 3.50 –25 0 50 3.25 3.00 5.00 4.50 4.25 3.75 75 100 125 EN = – 5V EN = 0V, ALL NON-DISABLE DEVICES VS = ± 5V LT1395CS6 Enable Pin Current vs Temperature AMBIENT TEMPERATURE (°C) –5 0 –4 0 –3 0 –1 0 25 75 1395/6/7 G17 –5 0 –6 0 –2 5 0 50 100 125 –7 0 –8 0 –2 0ENABLE PIN CURRENT (µA) VS = ± 5V EN = 0V EN = –5V OUTPUT (200mV/DIV) TIME (10ns/DIV) 1395/6/7 G21 RL = 100Ω RF = RG = 255Ω f = 10MHz VOUT (200mV/DIV) OS = 10% tr = 1.3ns TIME (500ps/DIV)AV = +2 RL = 100Ω RF = RG = 255Ω 1395/6/7 G23 OUTPUT (200mV/DIV) INPUT (100mV/DIV) tPD = 2.5ns TIME (500ps/DIV)AV = +2 RL = 100Ω RF = RG = 255Ω 1395/6/7 G22
OUT (Pin 1): Output. V– (Pin 2): Negative Supply Voltage, Usually –5V. +IN (Pin 3): Noninverting Input. –IN (Pin 4): Inverting Input. V+ (Pin 5): Positive Supply Voltage, Usually 5V. LT1395CS6 OUT (Pin 1): Output. V– (Pin 2): Negative Supply Voltage, Usually –5V. +IN (Pin 3): Noninverting Input. –IN (Pin 4): Inverting Input. EN (Pin 5): Enable Pin. Logic low to enable. V+ (Pin 6): Positive Supply Voltage, Usually 5V. LT1395CS8 NC (Pin 1): No Connection. – IN (Pin 2): Inverting Input. + IN (Pin 3): Noninverting Input. V– (Pin 4): Negative Supply Voltage, Usually – 5V. NC (Pin 5): No Connection. OUT (Pin 6): Output. V+ (Pin 7): Positive Supply Voltage, Usually 5V. NC (Pin 8): No Connection. LT1396CMS8, LT1396CS8, LT1396CDD OUT A (Pin 1): A Channel Output. – IN A (Pin 2): Inverting Input of A Channel Amplifier. + IN A (Pin 3): Noninverting Input of A Channel Amplifier. V– (Pin 4): Negative Supply Voltage, Usually – 5V. + IN B (Pin 5): Noninverting Input of B Channel Amplifier. – IN B (Pin 6): Inverting Input of B Channel Amplifier. OUT B (Pin 7): B Channel Output. V+ (Pin 8): Positive Supply Voltage, Usually 5V. LT1397CS, LT1397CDE, LT1397HDE OUT A (Pin 1): A Channel Output. – IN A (Pin 2): Inverting Input of A Channel Amplifier. + IN A (Pin 3): Noninverting Input of A Channel Amplifier. V+ (Pin 4): Positive Supply Voltage, Usually 5V. + IN B (Pin 5): Noninverting Input of B Channel Amplifier. – IN B (Pin 6): Inverting Input of B Channel Amplifier. OUT B (Pin 7): B Channel Output. OUT C (Pin 8): C Channel Output. – IN C (Pin 9): Inverting Input of C Channel Amplifier. + IN C (Pin 10): Noninverting Input of C Channel Amplifier. V– (Pin 11): Negative Supply Voltage, Usually – 5V. + IN D (Pin 12): Noninverting Input of D Channel Amplifier. – IN D (Pin 13): Inverting Input of D Channel Amplifier. OUT D (Pin 14): D Channel Output. LT1397CGN OUT A (Pin 1): A Channel Output. – IN A (Pin 2): Inverting Input of A Channel Amplifier. + IN A (Pin 3): Noninverting Input of A Channel Amplifier. V+ (Pin 4): Positive Supply Voltage, Usually 5V. + IN B (Pin 5): Noninverting Input of B Channel Amplifier. – IN B (Pin 6): Inverting Input of B Channel Amplifier. OUT B (Pin 7): B Channel Output. NC (Pin 8): No Connection. NC (Pin 9): No Connection. OUT C (Pin 10): C Channel Output. – IN C (Pin 11): Inverting Input of C Channel Amplifier. + IN C (Pin 12): Noninverting Input of C Channel Amplifier. V– (Pin 13): Negative Supply Voltage, Usually – 5V. + IN D (Pin 14): Noninverting Input of D Channel Amplifier. – IN D (Pin 15): Inverting Input of D Channel Amplifier. OUT D (Pin 16): D Channel Output.
from the output to the inverting input for stable operation. response (and overshoot in the transient response). mance Characteristics curves. typically change about 10µA per volt of supply mismatch. the overall slew rate is limited by the input stage. supply current mode which is controlled by the EN pin. Figure 1. + IS vs (V+ – VEN)
input impedance when considered in parallel with R10. results in the color-difference output B-Y. 0.59G and 0.11B that are used to create the Y signal. input. The remaining R signal is then amplified by A1. remaining B signal is then amplified by A3. contribution at the output of A2 of 0.37Y – 0.37B. of A2 resulting in the G output. Figure 5. Buffered Color-Difference to RGB Matrix
(each amplifier) PACKAGE DESCRIPTIOU +IN EN (LT1395CS6 ONLY) –IN OUT V – 1395/6/7 SS FOR ALL NON-DISABLE DEVICES 8-Lead Plastic DFN (3mm × 3mm) (Reference LTC DWG # 05-08-1698) 3.00 ±0.10 (4 SIDES) NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON TOP AND BOTTOM OF PACKAGE 0.38 ± 0.10 BOTTOM VIEW—EXPOSED PAD 1.65 ± 0.10 (2 SIDES) 0.75 ±0.05 R = 0.115 TYP 2.38 ±0.10 (2 SIDES) PIN 1 TOP MARK (NOTE 6)
0.200 REF
0.00 – 0.05 (DD) DFN 1203 0.25 ± 0.05 2.38 ±0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 1.65 ±0.05 (2 SIDES)2.15 ±0.05 0.50 BSC 0.675 ±0.05 3.5 ±0.05 PACKAGE OUTLINE 0.25 ± 0.05
0.50 BSC
GN16 (SSOP) 0204 12 3 4 5 6 7 8 .229 – .244 (5.817 – 6.198) .150 – .157** (3.810 – 3.988) 16 15 14 13 .189 – .196* (4.801 – 4.978) 12 11 10 9 .016 – .050 (0.406 – 1.270) .015 ± .004 (0.178 – 0.249) .0532 – .0688 (1.35 – 1.75) .008 – .012 (0.203 – 0.305) TYP .004 – .0098 (0.102 – 0.249) .0250 (0.635) BSC .009 (0.229) REF .254 MIN RECOMMENDED SOLDER PAD LAYOUT .150 – .165 .0250 BSC.0165 ± .0015 .045 ±.005 INCHES (MILLIMETERS) NOTE: 1. CONTROLLING DIMENSION: INCHES 2. DIMENSIONS ARE IN 3. DRAWING NOT TO SCALE *DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE **DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE PACKAGE DESCRIPTIOU 16-Lead Plastic SSOP (Narrow .150 Inch) (Reference LTC DWG # 05-08-1641) 3.00 ±0.10 (2 SIDES) 4.00 ±0.10 (2 SIDES) NOTE: 1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC PACKAGE OUTLINE MO-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 0.40 ± 0.10 BOTTOM VIEW—EXPOSED PAD 1.70 ± 0.05 (2 SIDES) 0.75 ±0.05 R = 0.115 TYP R = 0.05 TYP 3.30 ±0.05 (2 SIDES) 148 (SEE NOTE 6) PIN 1 TOP MARK 0.00 – 0.05 (DE14) DFN 0905 REV A 0.25 ± 0.05 PIN 1 NOTCH R = 0.20 OR 0.35 × 45° CHAMFER 3.30 ±0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 1.70 ±0.05 (2 SIDES)2.20 ±0.05 0.50 BSC 0.70 ±0.05 3.60 ±0.05 PACKAGE OUTLINE 0.25 ± 0.05 14-Lead Plastic DFN (4mm × 3mm) (Reference LTC DWG # 05-08-1708 Rev B)
(Reference LTC DWG # 05-08-1660) MSOP (MS8) 0204 0.53 ± 0.152 (.021 ± .006) SEATING PLANE NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 0.18 (.007) 0.254 (.010) 1.10 (.043) MAX 0.22 – 0.38 (.009 – .015) TYP 0.127 ± 0.076 (.005 ± .003) 0.86 (.034) REF 0.65 (.0256) BSC 0° – 6° TYP DETAIL “A” DETAIL “A” GAUGE PLANE 12 3 4 4.90 ± 0.152 (.193 ± .006) 8 7 6 5 3.00 ± 0.102 (.118 ± .004) (NOTE 3) 3.00 ± 0.102 (.118 ± .004) (NOTE 4) 0.52 (.0205) REF 5.23 (.206) MIN 3.20 – 3.45 (.126 – .136) 0.889 ± 0.127 (.035 ± .005) RECOMMENDED SOLDER PAD LAYOUT 0.42 ± 0.038 (.0165 ± .0015) TYP 0.65 (.0256) BSC PACKAGE DESCRIPTIOU
(Reference LTC DWG # 05-08-1633) 1.50 – 1.75 (NOTE 4)2.80 BSC 0.30 – 0.45 TYP
5 PLCS (NOTE 3)
DATUM ‘A’ 0.09 – 0.20 (NOTE 3) S5 TSOT-23 0302 REV B PIN ONE
2.90 BSC
(NOTE 4)
0.95 BSC
1.90 BSC
0.80 – 0.90
1.00 MAX
0.01 – 0.100.20 BSC 0.30 – 0.50 REF NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193
3.85 MAX
0.62 MAX 0.95 REF RECOMMENDED SOLDER PAD LAYOUT PER IPC CALCULATOR 1.4 MIN2.62 REF
1.22 REF
(Reference LTC DWG # 05-08-1634) 1.50 – 1.75 (NOTE 4)2.80 BSC 0.30 – 0.45
6 PLCS (NOTE 3)
DATUM ‘A’ 0.09 – 0.20 (NOTE 3) S6 TSOT-23 0302 REV B (NOTE 4) 0.80 – 0.90 0.01 – 0.100.20 BSC 0.30 – 0.50 REF PIN ONE ID NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 0.62 MAX 0.95 REF RECOMMENDED SOLDER PAD LAYOUT PER IPC CALCULATOR 1.4 MIN2.62 REF
8-Lead Plastic Small Outline (Narrow .150 Inch) (Reference LTC DWG # 05-08-1610) .016 – .050 (0.406 – 1.270) .010 – .020 0°– 8° TYP .008 – .010 (0.203 – 0.254) SO8 0303 .053 – .069 (1.346 – 1.752) .014 – .019 (0.355 – 0.483) TYP .004 – .010 (0.101 – 0.254) .050 (1.270) BSC 1 2 3 4 .150 – .157 (3.810 – 3.988) NOTE 3 8 7 6 5 .189 – .197 (4.801 – 5.004) NOTE 3 .228 – .244 (5.791 – 6.197) .245 MIN .160 ±.005 RECOMMENDED SOLDER PAD LAYOUT .045 ±.005 .050 BSC .030 ±.005 TYP INCHES (MILLIMETERS) NOTE: 1. DIMENSIONS IN 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) PACKAGE DESCRIPTIOU
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. S Package 14-Lead Plastic Small Outline (Narrow .150 Inch) (Reference LTC DWG # 05-08-1610) N 2 3 4 .150 – .157 (3.810 – 3.988) NOTE 3 14 13 .337 – .344 (8.560 – 8.738) NOTE 3 .228 – .244 (5.791 – 6.197) 12 11 10 9 5 6 7 N/2 .016 – .050 (0.406 – 1.270) .010 – .020 0° – 8° TYP .008 – .010 (0.203 – 0.254) S14 0502 .053 – .069 (1.346 – 1.752) .014 – .019 (0.355 – 0.483) TYP .004 – .010 (0.101 – 0.254) .050 (1.270) BSC .245 MIN N
123 N / 2
.160 ±.005 RECOMMENDED SOLDER PAD LAYOUT .045 ±.005 .050 BSC .030 ±.005 TYP INCHES (MILLIMETERS) NOTE: 1. DIMENSIONS IN 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)