LT8330 LINER
Document overview
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Technical content
8330faFor more information www.linear .com/L T8330 Typical applicaTion FeaTures DescripTion Low IQ Boost/SEPIC/ Inverting Converter with 1A, 60V Switch The LT®8330 is a current mode DC/DC converter capable of generating either positive or negative output voltages using a single feedback pin. It can be configured as a boost, SEPIC or inverting converter consuming as low as 6µA of quiescent current. Low ripple Burst Mode opera - tion maintains high efficiency down to very low output currents while keeping the output ripple below 15mV in a typical application. The internally compensated current mode architecture results in stable operation over a wide range of input and output voltages. Integrated soft-start and frequency foldback functions are included to control inductor current during start-up. The 2MHz operation combined with small package options, enables low cost, area efficient solutions. 48V Boost Converter
applicaTions
n 3V to 40V Input Voltage Range n Ultralow Quiescent Current and Low Ripple Burst Mode ® Operation: IQ = 6µA n 1A, 60V Power Switch n Positive or Negative Output Voltage Programming with a Single Feedback Pin n Fixed 2MHz Switching Frequency n Accurate 1.6V EN/UVLO Pin Threshold n Internal Compensation and Soft-Start n Low Profile (1mm) ThinSOT™ Package n Low Profile (0.75mm) 8-Lead (3mm × 2mm) DFN Package n Industrial and Automotive n Telecom n Medical Diagnostic Equipment n Portable Electronics L, LT, LT C, LT M, Linear Technology, the Linear logo and Burst Mode are registered trademarks and ThinSOT is a trademark of Linear Technology Corporation. All other trademarks are the property of their respective owners. Efficiency and Power Loss EFFICIENCY POWER LOSS LOAD CURRENT (mA) 120 160 100 100 200 300 400 500 600 700 800 900 1000 EFFICIENCY (%) POWER LOSS (mW)
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4.7µF 34.8k 4.7µF 1µF 4.7pF V IN SW FBX GND EN/UVLO L T8330 VIN 12V 6.8µH VOUT 48V 135mA V CC INT
8330fa For more information www.linear .com/L T8330 absoluTe MaxiMuM raTings EN/U (Note 1) orDer inForMaTion LEAD FREE FINISH TAPE AND REEL PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE LT8330ES6#PBF LT8330ES6#TRPBF L TGMQ 6-Lead Plastic TSOT-23 –40°C to 125°C LT8330IS6#PBF LT8330IS6#TRPBF L TGMQ 6-Lead Plastic TSOT-23 –40°C to 125°C LT8330HS6#PBF LT8330HS6#TRPBF L TGMQ 6-Lead Plastic TSOT-23 –40°C to 150°C LT8330EDDB#PBF LT8330EDDB#TRPBF LGRC 8-Lead (3mm × 2mm) Plastic DFN –40°C to 125°C LT8330IDDB#PBF LT8330IDDB#TRPBF LGRC 8-Lead (3mm × 2mm) Plastic DFN –40°C to 125°C LT8330HDDB#PBF LT8330HDDB#TRPBF LGRC 8-Lead (3mm × 2mm) Plastic DFN –40°C to 150°C Consult L TC Marketing for parts specified with wider operating temperature ranges. Consult L TC Marketing for information on nonstandard lead based finish parts. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/. Some packages are available in 500 unit reels through designated sales channels with #TRMPBF suffix. TOP VIEW DDB PACKAGE 8-LEAD (3mm × 2mm) PLASTIC DFN
1 FBX
θJA = 60°C/W EXPOSED PAD (PIN 9) IS GND, MUST BE SOLDERED TO PCB TOP VIEW S6 PACKAGE 6-LEAD PLASTIC TSOT-23 V IN INTVCC EN/UVLO SW GND FBX θJA = 125°C/W, θJC = 102°C/W pin conFiguraTion Operating Junction Temperature (Note 3) LT83 40°C to 125°C LT83 40°C to 150°C 65°C to 150°C (http://www.linear.com/product/LT8330#orderinfo)
8330faFor more information www.linear .com/L T8330 elecTrical characTerisTics The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VIN = 12V, EN/UVLO = 12V unless otherwise noted. PARAMETER CONDITIONS MIN TYP MAX UNITS VIN Operating Voltage Range l 3 40 V VIN Quiescent Current at Shutdown V EN/UVLO = 0.2V l 0.9 µA µA VEN/UVLO = 1.5V l 3.6 9.5 µA µA VIN Quiescent Current Sleep Mode, Not Switching l 5.5 8.5 µA µA Active Mode, Not Switching l 780 840 1100 1200 µA µA FBX Regulation FBX Regulation Voltage FBX > 0V FBX < 0V l l 1.568 –0.820 1.6 –0.80 1.632 –0.780 V V FBX Line Regulation FBX > 0V, 3V < VIN < 40V FBX < 0V, 3V < VIN < 40V 0.005 0.005 0.015 0.015 %/V %/V FBX Pin Current FBX = 1.6V, –0.8V l –10 10 nA Oscillator Switching Frequency (fOSC) VIN = 24V l 1.85 2.0 2.15 MHz Minimum On-Time VIN = 24V 65 105 ns Minimum Off-Time VIN = 24V 47 65 ns Switch Maximum Switch Current Limit Threshold l 1.0 1.2 1.4 A Switch RDS(ON) ISW = 0.5A 330 mΩ Switch Leakage Current VSW = 60V 0.1 1 µA EN/UVLO Logic EN/UVLO Pin Threshold (Rising) Start Switching l 1.620 1.68 1.745 V EN/UVLO Pin Threshold (Falling) Stop Switching l 1.556 1.60 1.644 V EN/UVLO Pin Current VEN/UVLO = 1.6V l –40 40 nA Soft-Start Soft-Start Time V IN = 24V 1 ms Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: INTV CC cannot be externally driven. No additional components or loading is allowed on this pin. Note 3: The LT8330E is guaranteed to meet performance specifications from 0°C to 125°C junction temperature. Specifications over the –40°C to 125°C operating junction temperature range are assured by design, characterization and correlation with statistical process controls. The LT8330I is guaranteed over the full –40°C to 125°C operating junction temperature range. The LT8330H is guaranteed over the full –40°C to 150°C operating junction temperature range. High junction temperatures degrade operating lifetimes. Operating lifetime is derated at junction temperatures greater than 125°C. Note 4: The IC includes overtemperature protection that is intended to protect the device during overload conditions. Junction temperature will exceed 150°C when overtemperature protection is active. Continuous operation above the specified maximum operating junction temperature will reduce lifetime.
8330fa For more information www.linear .com/L T8330 Typical perForMance characTerisTics Switching Frequency vs Temperature Switching Frequency vs VIN Normalized Switching Frequency vs FBX Voltage Switch Current Limit vs Duty Cycle Switch Minimum On-Time vs Temperature Switch Minimum Off-Time vs Temperature FBX Positive Regulation Voltage vs Temperature FBX Negative Regulation Voltage vs Temperature EN/UVLO Pin Thresholds vs Temperature V IN = 12V JUNCTION TEMPERATURE (°C) –50 –25 100 125 150 175 1.570 1.580 1.590 1.600 1.610 1.620 1.630 FBX VOL TAGE (V)
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V IN = 12V JUNCTION TEMPERATURE (°C) –50 –25 100 125 150 175 –0.815 –0.810 –0.805 –0.800 –0.795 –0.790 –0.785 FBX VOL TAGE (V)
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V IN = 24V JUNCTION TEMPERATURE (°C) –50 –25 100 125 150 175 1.90 1.92 1.94 1.96 1.98 2.00 2.02 2.04 2.06 2.08 2.10 SWITCHING FREQUENCY (MHz)
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V IN (V) 1.85 1.90 1.95 2.00 2.05 2.10 2.15 SWITCHING FREQUENCY (MHz)
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V IN = 24V FBX VOL TAGE (V) –0.8 –0.4 0.0 0.4 0.8 1.2 1.6 100 125 NORMALIZED SWITCHING FREQUENCY (%)
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V IN = 12V DUTY CYCLE (%) 100 1.00 1.10 1.20 1.30 1.40 SWITCH CURRENT LIMIT (A)
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V IN = 24V JUNCTION TEMPERATURE (°C) –50 –25 100 125 150 175 100 MINIMUM ON–TIME (ns)
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V IN = 24V JUNCTION TEMPERATURE (°C) –50 –25 100 125 150 175 MINIMUM OFF–TIME (ns)
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V IN = 12V EN/UVLO RISING (TURN-ON) EN/UVLO FALLING (TURN-OFF) JUNCTION TEMPERATURE (°C) –50 –25 100 125 150 175 1.54 1.56 1.58 1.60 1.62 1.64 1.66 1.68 1.70 1.72 1.74 EN/UVLO PIN VOL TAGE (V)
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8330faFor more information www.linear .com/L T8330 Typical perForMance characTerisTics Switching Waveforms (in CCM) Switching Waveforms (in DCM/Light Burst Mode) Switching Waveforms (in Deep Burst Mode) V OUT T ransient Response: Load Current T ransients from 67.5mA to 135mA to 67.5mA V IN Pin Current (Sleep Mode, Not Switching) vs Temperature VIN Pin Current (Active Mode, Not Switching) vs Temperature Burst Frequency vs Load Current VOUT T ransient Response: Load Current T ransients from 5mA to 135mA to 5mA V IN = 12V JUNCTION TEMPERATURE (°C) –50 –25 100 125 150 175 1.25 2.50 3.75 5.00 6.25 7.50 8.75 10.00 V IN PIN CURRENT (µA)
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V IN = 12V JUNCTION TEMPERATURE (°C) –50 –25 100 125 150 175 600 650 700 750 800 850 900 950 1000 V IN PIN CURRENT (µA)
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V IN = 12V V OUT = 48V FRONT PAGE APPLICATION LOAD CURRENT (mA) 0.5 1.0 1.5 2.0 2.5 SWITCHING FREQUENCY (MHz)
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V IN = 12V , V OUT = 48V , I LOAD = 135mA 1µs/DIV FRONT PAGE APPLICATION V SW 20V/DIV IL 500mA/DIV
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V IN = 12V , V OUT = 48V , I LOAD = 20mA 1µs/DIV FRONT PAGE APPLICATION V SW 20V/DIV
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V IN = 12V , V OUT = 48V , I LOAD = 2mA 1µs/DIV FRONT PAGE APPLICATION V SW 20V/DIV
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V IN = 12V V OUT = 48V 100µs/DIV V OUT 500mV/DIV IL 100mA/DIV
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V IN = 12V V OUT = 48V 100µs/DIV V OUT 500mV/DIV IL 100mA/DIV
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8330fa For more information www.linear .com/L T8330 pin FuncTions EN/UVLO: Shutdown and Undervoltage Detect Pin. The LT8330 is shut down when this pin is low and active when this pin is high. Below an accurate 1.6V threshold the part enters undervoltage lockout and stops switching. This allows an undervoltage lockout (UVLO) threshold to be programmed for system input voltage by resistively dividing down system input voltage to the EN/UVLO pin. An 80mV pin hysteresis ensures part switching resumes when the pin exceeds 1.68V. EN/UVLO pin voltage below 0.2V reduces V IN current below 1µA. If shutdown and UVLO features are not required, the pin can be tied directly to system input. FBX: Voltage Regulation Feedback Pin for Positive or Negative Outputs. Connect this pin to a resistor divider between the output and GND. FBX reduces the switching frequency during start-up and fault conditions when FBX is close to GND. GND: Ground Connection for the LT8330. The DFN pack- age has the best thermal performance due to an exposed pad (Pin 9) on the bottom of the package. This exposed pad must be soldered to a ground plane. Pin 5 of the DFN package (and Pin 2 of the TSOT package) should also be connected to a ground plane. The ground plane should be connected to large copper layers to spread heat dissipated by the LT8330. INTV CC: Regulated 3V Supply for Internal Loads. The INTVCC pin must be bypassed with a minimum 1µF low ESR ceramic capacitor to ground. No additional components or loading is allowed on this pin. NC: No Internal Connection. Tie directly to local ground. SW: The Output of Internal Power Switch. Minimize the metal trace area connected to this pin to reduce EMI. V IN: Input Supply. This pin must be locally bypassed. Be sure to place the positive terminal of the input capacitor as close as possible to the VIN pin, and the negative terminal as close as possible to the GND pin.
8330faFor more information www.linear .com/L T8330 block DiagraM GND 8330 BD ERROR AMP SELECT FREQUENCY FOLDBACK INTVCC UVLO OSCILLATOR 2MHz SWITCH LOGIC BURST DETECT ERROR AMP ERROR AMP SLOPE VC SLOPE SOFT-START 1.6V FBX VOUT –0.8V UVLO DRIVER ILIMIT RSENSE PWM COMPARATOR INTVCC TJ > 170°C A6 1.68V(+) 1.6V(–) EN/UVLO INTERNAL REFERENCE UVLO VIN CIN SW OPT OPT VIN COUT CVCC DL VOUT UVLO 3V REGULATOR
peak switch current level to keep the output in regulation. performs (non-inverting) amplification from FBX to VC. enters undervoltage lockout (UVLO), and stops switching. Figure 1. Burst Frequency vs Load Current
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capacitance will decrease the output ripple proportionally. defined by the internal oscillator as shown in Figure 1. Figure 2. Burst Mode Operation at which the IC turns on and off (see the Block Diagram). operation. A logic input can also control the EN/UVLO pin. minimize their effect on efficiency at light loads. required by the internal power MOSFET gate driver. (to stop switching and reset soft start) is typically 2.5V. in the Electrical Characteristics table). available output power and reduced efficiency.
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- (VOUT/1.60V – 1) Choose the resistor values for a negative output voltage according to: R1 = R2
- (|VOUT|/0.80V – 1) The locations of R1 and R2 are shown in the Block Dia - gram. 1% resistors are recommended to maintain output voltage accuracy. Higher-value FBX divider resistors result in the lowest input quiescent current and highest light-load efficiency. FBX divider resistors R1 and R2 are usually in the range from 25k to 1M. Most applications use a phase-lead capacitor from V OUT to FBX in combination with high-value FBX divider resistors (see Compensation in the Applications Information section). S OF T-ST ART The LT8330 contains several features to limit peak switch currents and output voltage (V OUT) overshoot during start-up or recovery from a fault condition. The primary purpose of these features is to prevent damage to external components or the load. High peak switch currents during start-up may occur in switching regulators. Since V OUT is far from its final value, the feedback loop is saturated and the regulator tries to charge the output capacitor as quickly as possible, resulting in large peak currents. A large surge current may cause inductor saturation or power switch failure. The LT8330 addresses this mechanism with an internal soft-start function. As shown in the Block Diagram, the soft-start function controls the ramp of the power switch current by controlling the ramp of VC through M2. This allows the output capacitor to be charged gradually toward its final value while limiting the start-up peak currents. Figure 3 shows the output voltage and supply current for the first page T ypical Application. It can be seen that both the output voltage and supply current come up gradually.
Figure 3. Soft-Start Waveforms VC and hence inductor peak current. the part will stop switching and go into thermal lockout.
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frequency and converter efficiency. Table 1. Inductor Manufacturers be provided with a low performance electrolytic capacitor. cerns the maximum input voltage rating of the LT8330. easily avoided (see Application Note 88). be used at the output to minimize the output ripple voltage. capacitor, can affect the stability of the overall system. and can generally be ignored. value for the zero frequency is between 30kHz to 60kHz. across the feedback resistor from output to FBX pin).
when used with the LT8330 due to their piezoelectric nature. eration, the noise is typically very quiet to a casual ear. capacitors are also available. Table 2. Ceramic Capacitor Manufacturers Figure 4. Suggested Layout – (a) ThinSOT, (b) DFN voltage ratings for the target applications. Table 3. Recommended Schottky Diodes mended component placement for the ThinSOT package. . Note the vias under the exposed pad.
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good heat sinking of the LT8330. Inverting converters are analyzed below. in continuous conduction mode (CCM). are specified in the Electrical Characteristics table. Figure 5. LT8330 Configured in a SEPIC Topology
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are applied to L1 and L2 throughout the switching cycle. loop gain (the converter will approach voltage mode).
- DMAX For most SEPIC applications, the equal inductor values will fall in the range of 1µH to 47µH. By making L1 = L2, and winding them on the same core, the value of inductance in the preceding equation is replaced by 2L, due to mutual inductance: L = VIN(MIN) ∆ISW •fOSC
- DMAX This maintains the same ripple current and energy storage in the inductors. The peak inductor currents are: IL1(PEAK) = IL1(MAX) + 0.5 • ∆IL1 IL2(PEAK) = IL2(MAX) + 0.5 • ∆IL2 The maximum RMS inductor currents are approximately equal to the maximum average inductor currents. applicaTions inForMaTion
Figure 6. The Switch Current Waveform of the SEPIC Converter
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margin (a 10V safety margin is usually sufficient). exceed the diode maximum junction temperature rating. SEPIC converter are similar to those of the boost converter. in continuous conduction mode (CCM). OUT) and the input voltage (VIN). Figure 7. A Simplified Inverting Converter
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8330fa For more information www.linear .com/L T8330 Be sure to check that DMAX and DMIN obey : DMAX < 1-Minimum Off-Time(MAX) • fOSC(MAX) and DMIN > Minimum On-Time(MAX) • fOSC(MAX) where Minimum Off-Time, Minimum On-Time and f OSC are specified in the Electrical Characteristics table. Inverting Converter: Inductor, Output Diode and Input Capacitor Selections The selections of the inductor, output diode and input capacitor of an inverting converter are similar to those of the SEPIC converter. Please refer to the corresponding SEPIC converter sections. Inverting Converter: Output Capacitor Selection The inverting converter requires much smaller output capacitors than those of the boost, flyback and SEPIC converters for similar output ripples. This is due to the fact that, in the inverting converter, the inductor L2 is in series with the output, and the ripple current flowing through the output capacitors are continuous. The output ripple voltage is produced by the ripple current of L2 flowing through the ESR and bulk capacitance of the output capacitor: ∆VOUT(P–P) = ∆IL2 • ESRCOUT + 1 8 •f •COUT After specifying the maximum output ripple, the user can select the output capacitors according to the preceding equation. The ESR can be minimized by using high quality X5R or X7R dielectric ceramic capacitors. In many applications, ceramic capacitors are sufficient to limit the output volt- age ripple. The RMS ripple current rating of the output capacitor needs to be greater than: IRMS(COUT) > 0.3 • ∆IL2 Inverting Converter: Selecting the DC Coupling Capacitor The DC voltage rating of the DC coupling capacitor (CDC, as shown in Figure 7) should be larger than the maximum input voltage minus the output voltage (negative voltage): VCDC > VIN(MAX) – VOUT CDC has nearly a rectangular current waveform. During the switch off-time, the current through CDC is IIN, while approximately –I O flows during the on-time. The RMS rating of the coupling capacitor is determined by the fol- lowing equation: IRMS(CDC) >IO(MAX) • DMAX 1−DMAX A low ESR and ESL, X5R or X7R ceramic capacitor works well for CDC. applicaTions inForMaTion
8330faFor more information www.linear .com/L T8330 Typical applicaTions 48V Boost Converter 8V to 16V Input, 24V Boost Converter 3V to 6V Input, 48V Boost Converter 4.7µF 1µF 4.7pF V IN SW FBX GND EN/UVLO L T8330 V CC INT 4.7µF 34.8k 6.8µH D1: NXP PMEG6010CEJ L1: WÜRTH WE-MAPI 3015 74438335068 C3: MURATA GRM32ER71H475k
8330 TA02
71.5k 4.7µF 1µF V OUT V IN SW FBX GND EN/UVLO L T8330 8V TO 16V V IN 24V V CC INT 6.8µH 4.7µF D1: DIODES INC. SBR140S3 L1: WÜRTH WE-MAPI 3015 74438335068 C3: MURATA GRM32ER71H475k 4.7pF 287k 210mA AT V IN = 8V 320mA AT V IN = 12V 450mA AT V IN = 16V
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4.7µF 4.7µF V OUT V IN SW FBX GND EN/UVLO L T8330 3V TO 6V V IN 48V V CC INT 0.68µH 1µF D1: NXP PMEG6010CEJ L1: WÜRTH WE-MAPI 3012 744383340068 C3: MURATA GRM32ER71H475k 34.8k 12mA AT V IN = 3V 13mA AT V IN = 5V 14mA AT V IN = 6V
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V IN = 12V BOOST: V OUT = 48V LOAD CURRENT (mA) 120 160 100 EFFICIENCY (%)
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BOOST : V OUT = 24V V IN = 8V V IN = 12V V IN = 16V LOAD CURRENT (mA) 100 200 300 400 500 100 EFFICIENCY (%)
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BOOST : V OUT = 48V V IN = 3V V IN = 5V V IN = 6V LOAD CURRENT (mA) 100 EFFICIENCY (%)
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8330fa For more information www.linear .com/L T8330 Typical applicaTions 3V to 6V Input, 24V Boost Converter 8V to 30V Input, 24V SEPIC Converter 71.5k 1µF V OUT V IN SW FBX GND EN/UVLO L T8330 3V TO 6V V IN 24V V CC INT 0.68µH 4.7µF 4.7µF D1: NXP PMEG6010CEJ L1: WÜRTH WE-MAPI 3012 744383340068 C3: MURATA GRM32ER71H475k 30mA AT V IN = 3V 34mA AT V IN = 5V 35mA AT V IN = 6V
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4.7µF 71.5k 4.7µF 1µF 4.7pF 1µF 6.8µH 287k V OUT V IN SW FBX GND EN/UVLO L T8330 8V TO 30V 6.8µH V IN 24V V CC INT D1: NXP PMEG6010CEJ L1: WÜRTH WE-TDC 8038 74489440068 C3: MURATA GRM32ER71H475k 160mA AT V IN = 8V 200mA AT V IN = 12V 250mA AT V IN = 24V 250mA AT V IN = 30V
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BOOST : V OUT = 24V V IN = 3V V IN = 5V V IN = 6V LOAD CURRENT (mA) 100 EFFICIENCY (%)
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SEPIC: V OUT = 24V V IN = 8V V IN = 12V V IN = 24V V IN = 30V LOAD CURRENT (mA) 120 180 240 300 100 EFFICIENCY (%)
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8330faFor more information www.linear .com/L T8330 Typical applicaTions 4V to 36V Input, 12V SEPIC Converter 4V to 16V Input, 5V SEPIC Converter 4.7µF 154k 4.7µF 1µF 4.7pF 1µF 4.7µH 4.7µH V OUT V IN SW FBX GND EN/UVLO L T8330 4V TO 36V V IN 12V V CC INT D1: NXP PMEG6010CEJ L1: WÜRTH WE-TDC 8038 74489440047 C3: MURATA GRM31CR61C475k 806k 170mA AT V IN = 4V 270mA AT V IN = 12V 280mA AT V IN = 24V 280mA AT V IN = 36V
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4.7µF 464k 4.7µF 1µF 4.7pF 1µF 2.7µH 2.7µH V OUT V IN SW FBX GND EN/UVLO L T8330 4V TO 16V V IN V CC INT D1: NXP PMEG6010CEJ L1: WÜRTH WE-TDC 8018 74489430027 C3: MURATA GRM21BR71C475k 806k 280mA AT V IN = 4V 300mA AT V IN = 5V 380mA AT V IN = 12V 380mA AT V IN = 16V
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SEPIC: V OUT = 12V V IN = 4V V IN = 12V V IN = 24V V IN = 36V LOAD CURRENT (mA) 120 180 240 300 100 EFFICIENCY (%)
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V IN = 4V V IN = 5V V IN = 12V V IN = 16V SEPIC: V OUT = 5V LOAD CURRENT (mA) 160 240 320 400 100 EFFICIENCY (%)
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8330fa For more information www.linear .com/L T8330 Typical applicaTions 8V to 30V Input, –24V Inverting Converter 4V to 36V Input, –12V Inverting Converter 4V to 16V Input, –5V Inverting Converter 2.2µF 34.8k 4.7µF 1µF 4.7pF 1µF 287k V OUT V IN SW FBX GND EN/UVLO L T8330 8V TO 30V V IN –24V V CC INT D1: NXP PMEG6010CEJ L1: WÜRTH WE-TDC 8038 74489440068 C3: MURATA GRM32ER71H475k 6.8µH 6.8µH 160mA AT V IN = 8V 200mA AT V IN = 12V 250mA AT V IN = 24V 250mA AT V IN = 30V
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4.7µF 71.5k 4.7µF 1µF 4.7pF 1µF 806k V OUT V IN SW FBX GND EN/UVLO L T8330 4V TO 36V V IN –12V V CC INT D1: NXP PMEG6010CEJ L1: Coilcraft LPD5030-472MR C3: MURATA GRM21BR71C475k 4.7µH 4.7µH 170mA AT V IN = 4V 270mA AT V IN = 12V 280mA AT V IN = 24V 280mA AT V IN = 36V
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4.7µF 1µF 4.7pF 1µF 2.7µH 2.7µH 806k V OUT V IN SW FBX GND EN/UVLO L T8330 4V TO 16V V IN –5V V CC INT 4.7µF D1: NXP PMEG6010CEJ L1: WÜRTH WE-TDC 8018 74489430027 C3: MURATA GRM21BR71C475k 280mA AT V IN = 4V 300mA AT V IN = 5V 380mA AT V IN = 12V 380mA AT V IN = 16V
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INVERTING: V OUT = –24V V IN = 8V V IN = 12V V IN = 24V V IN = 30V LOAD CURRENT (mA) 120 180 240 300 100 EFFICIENCY (%)
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INVERTING : V OUT = –12V V IN =4V V IN =12V V IN =24V V IN =36V LOAD CURRENT (mA) 120 180 240 300 100 EFFICIENCY (%)
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INVERTING: V OUT = –5V V IN = 4V V IN = 5V V IN = 12V V IN = 16V LOAD CURRENT (mA) 160 240 320 400 100 EFFICIENCY (%)
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8330faFor more information www.linear .com/L T8330 package DescripTion 8-Lead Plastic DFN (3mm × 2mm) (Reference L TC DWG # 05-08-1702 Rev B) 2.00 ±0.10 (2 SIDES) NOTE: 1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 0.40 ±0.10 BOTTOM VIEW—EXPOSED PAD 0.56 ±0.05 (2 SIDES) 0.75 ±0.05 R = 0.115 TYPR = 0.05 TYP 2.15 ±0.05 (2 SIDES) 3.00 ±0.10 (2 SIDES) PIN 1 BAR TOP MARK (SEE NOTE 6)
0.200 REF
0 – 0.05 (DDB8) DFN 0905 REV B 0.25 ±0.05
0.50 BSC
R = 0.20 OR 0.25 × 45° CHAMFER 0.25 ±0.05 2.20 ±0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 0.61 ±0.05 (2 SIDES) 1.15 ±0.05 0.70 ±0.05 2.55 ±0.05 PACKAGE OUTLINE 8-Lead Plastic DFN (3mm × 2mm) (Reference LTC DWG # 05-08-1702 Rev B) Please refer to http://www.linear.com/product/LT8330#packaging for the most recent package drawings.
8330fa For more information www.linear .com/L T8330 package DescripTion 6-Lead Plastic TSOT-23 (Reference L TC DWG # 05-08-1636) 1.50 – 1.75 (NOTE 4)2.80 BSC 0.30 – 0.45
6 PLCS (NOTE 3)
DATUM ‘A’ 0.09 – 0.20 (NOTE 3) S6 TSOT-23 0302
2.90 BSC
(NOTE 4)
0.95 BSC
1.90 BSC
0.80 – 0.90
1.00 MAX
0.01 – 0.100.20 BSC 0.30 – 0.50 REF PIN ONE ID NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193
3.85 MAX
0.62 MAX 0.95 REF RECOMMENDED SOLDER PAD LAYOUT PER IPC CALCULATOR 1.4 MIN2.62 REF
1.22 REF
(Reference LTC DWG # 05-08-1636) Please refer to http://www.linear.com/product/LT8330#packaging for the most recent package drawings.
8330faFor more information www.linear .com/L T8330 Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
revision hisTory
REV DATE DESCRIPTION PAGE NUMBER A 03/16 Corrected V IN Quiescent Current Corrected Typographic Errors 2, 22, 23
8330fa For more information www.linear .com/L T8330 LINEAR TECHNOLOGY CORPORATION 2015 LT 0316 REV A • PRINTED IN USA Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear .com/L T8330 relaTeD parTs Typical applicaTion 4.7µF 56.2k 4.7µF 1µF 1µF 1µF –VOUT V IN SW FBX GND EN/UVLO L T8330 8V TO 40V V IN –15V V CC INT D1, D2: NXP PMEG6010CEJ L1A, L1B, L1C: COIL TRONICS VP4-0075 C3, C4: MURATA GRM32ER71H475k 287k 4.7µF OUT +15V L1C 6µH L1B 6µH L1A 6µH LOAD 120mA AT V IN = 8V 160mA AT V IN = 24V 170mA AT V IN = 40V
8330 TA12
8V to 40V Input, ±15V Converter PART NUMBER DESCRIPTION COMMENTS LT1930/LT1930A 1A (ISW), 1.2MHz/2.2MHz High Efficiency Step-Up DC/DC Converter VIN = 2.6V to 16V, VOUT(MAX) = 34V, IQ = 4.2mA/5.5mA, ISD < 1µA, ThinSOT Package LT1935 2A (ISW), 40V, 1.2MHz High Efficiency Step-Up DC/DC Converter VIN = 2.3V to 16V, VOUT(MAX) = 38V, IQ = 3mA, ISD < 1µA, ThinSOT Package LT3467 1.1A (ISW), 1.3MHz High Efficiency Step-Up DC/DC Converter VIN = 2.4V to 16V, VOUT(MAX) = 40V, IQ = 1.2mA, ISD < 1µA, ThinSOT, 2mm × 3mm DFN Packages LT3580 2A (ISW), 42V, 2.5MHz, High Efficiency Step-Up DC/DC Converter VIN = 2.5V to 32V, VOUT(MAX) = 42V, IQ = 1mA, ISD = <1µA, 3mm × 3mm DFN-8, MSOP-8E LT8494 70V, 2A Boost/SEPIC 1.5MHz High Efficiency Step-Up DC/DC Converter VIN = 1V to 60V (2.5V to 32V Start-Up), VOUT(MAX) = 70V, IQ = 3µA (Burst Mode operation), ISD = <1µA, 20-Lead TSSOP LT8570/LT8570-1 65V, 500mA/250mA Boost/Inverting DC/DC Converter V IN(MIN) = 2.55V, VIN(MAX) = 40V, VOUT(MAX) = ±60V, IQ = 1.2mA, ISD = <1mA, 3mm × 3mm DFN-8, MSOP-8E LT8580 1A (ISW), 65V 1.5MHz, High Efficiency Step-Up DC/DC Converter VIN: 2.55V to 40V, VOUT(MAX) = 65V, IQ = 1.2mA, ISD = <1µA, 3mm × 3mm DFN-8, MSOP-8E Efficiency OUT = –15V V IN = 8V V IN = 24V V IN = 40V OUT = +15V LOAD CURRENT (mA) 120 160 200 100 EFFICIENCY (%)