LT5525 LINER
Document overview
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Technical content
High Linearity, Low Power Downconverting Mixer ■ Wide Input Frequency Range: 0.8GHz to 2.5GHz* ■ Broadband LO and IF Operation ■ High Input IP3: +17.6dBm at 1900MHz ■ Typical Conversion Gain: –1.9dB at 1900MHz ■ High LO-RF and LO-IF Isolation ■ SSB Noise Figure: 15.1dB at 1900MHz ■ Single-Ended 50Ω RF and LO Interface ■ Integrated LO Buffer: –5dBm Drive Level ■ Low Supply Current: 28mA Typ ■ Enable Function ■ Single 5V Supply ■ 16-Lead QFN (4mm × 4mm) Package ■ Point-to-Point Data Communication Systems ■ Wireless Infrastructure ■ High Performance Radios ■ High Linearity Receiver Applications High Signal Level Frequency Downconversion DESCRIPTIO UFEATURES APPLICATIO SU TYPICAL APPLICATIO U The LT 5525 is a low power broadband mixer optimized for high linearity applications such as point-to-point data transmission, high performance radios and wireless infra- structure systems. The device includes an internally 50Ω matched high speed LO amplifier driving a double-bal- anced active mixer core. An integrated RF buffer amplifier provides excellent LO-RF isolation. The RF input balun and all associated 50Ω matching components are integrated. The IF ports can be easily matched across a broad range of frequencies for use in a wide variety of applications. The LT5525 offers a high performance alternative to passive mixers. Unlike passive mixers, which require high LO drive levels, the LT5525 operates at significantly lower LO input levels and is much less sensitive to LO power level variations. IF Output Power and IM3 vs RF Input Power (Two Input Tones) RF+ RF– IF+ IF– LO–
5525 TA01
–5dBm VCC1 VCC 5V DC0.01µF 1.2pF 100pF 150nH 4:1 150nH 1900MHz GND LT5525 140MHz1900MHz LNA VGA ADC RF INPUT POWER (dBm/TONE) –20 –100 OUTPUT POWER (dBm/TONE) –90 –70 –60 –50 –30 –15 –10
5525 TA02
–80 –20 POUT IM3 –10 –40 –5 0 TA = 25°C fRF = 1900MHz fLO = 1760MHz fIF = 140MHz PLO = –5dBm , LTC and LT are registered trademarks of Linear Technology Corporation. *Operation over a wider frequency range is achievable with reduced performance. Consult factory for more information.
(Note 1) LO+ and LO– Common Mode DC Voltage... –0.5V to V CC RF+ and RF– Common Mode DC Voltage ... –0.5V to VCC LT5525EUF TJMAX = 125°C, θJA = 37°C/W EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB. NC PINS SHOULD BE GROUNDED ABSOLUTE MAXIMUM RATINGSW WW U PACKAGE/ORDER INFORMATIONW UU VCC = 5V, EN = 3V, TA = 25°C (Note 3), unless otherwise noted. Test circuit shown in Figure 1. Consult LTC Marketing for parts specified with wider operating temperature ranges. 16 15 14 13 5 6 7 8 TOP VIEW UF PACKAGE 16-LEAD (4mm × 4mm) PLASTIC QFN 1NC RF+ RF– NC GND IF+ IF– GND NC LO LO– NC EN VCC1 VCC2 NC UF PART MARKING 5525 DC ELECTRICAL CHARACTERISTICS AC ELECTRICAL CHARACTERISTICS(Notes 2, 3) PARAMETER CONDITIONS MIN TYP MAX UNITS RF Input Frequency Range (Note 4) Requires RF Matching Below 1300MHz 800 to 2500 MHz LO Input Frequency Range (Note 4) 500 to 3000 MHz IF Output Frequency Range (Note 4) Requires IF Matching 0.1 to 1000 MHz VCC = 5V, EN = 3V, TA = 25°C. Test circuit shown in Figure 1. (Notes 2, 3) PARAMETER CONDITIONS MIN TYP MAX UNITS RF Input Return Loss Z O = 50Ω 15 dB LO Input Return Loss Z O = 50Ω, External DC Blocks 15 dB IF Output Return Loss Z O = 50Ω, External Match 15 dB LO Input Power –10 to 0 dBm PARAMETER CONDITIONS MIN TYP MAX UNITS Power Supply Requirements (VCC) Supply Voltage (Note 6) 3.6 5 5.3 V Supply Current V CC = 5V 28 33 mA Shutdown Current EN = Low 100 µA Enable (EN) Low = Off, High = On EN Input High Voltage (On) 3V EN Input Low Voltage (Off) 0.3 V Enable Pin Input Current EN = 5V 55 µA EN = 0V 0.1 µA Turn-On Time (Note 5) 3 µs Turn-Off Time (Note 5) 6 µs
of a device may be impaired. Figure 1. For 900MHz measurements, C1 = 3.9pF. For all other measurements, C1 is not used. performance. Consult the factory for information and assistance. Note 6: The part is operable below 3.6V with reduced performance.
W UTYPICAL AC PERFOR A CE CHARACTERISTICSVCC = 5V, EN = 3V, TA = 25°C, fRF = 1900MHz, PRF = –15dBm (–15dBm/tone for 2-tone IIP3 tests, ∆f = 1MHz), fLO = fRF – 140MHz, PLO = –5dBm, IF output measured at 140MHz, unless otherwise noted. Test circuit shown in Figure 1. Conversion Gain and IIP3 vs RF Frequency (Low Side LO) Conversion Gain and IIP3 vs LO Input Power Conversion Gain and IIP3 vs Supply Voltage SSB Noise Figure vs LO Input Power RF, LO and IF Port Return Loss vs Frequency SSB NF vs RF Frequency IF Output Power and IM3 vs RF Input Power (Two Input Tones) LO-IF, LO-RF and RF-LO Leakage vs Frequency Conversion Gain and IIP3 vs RF Frequency (High Side LO) RF FREQUENCY (MHz) 900 GAIN (dB), IIP3 (dBm) 1300 1700 2100 2500
5525 G01
25°C 85°C –40°C RF FREQUENCY (MHz) 900 GAIN (dB), IIP3 (dBm) 1300 1700 2100 2500
5525 G02
25°C 85°C –40°C RF FREQUENCY (MHz) 900 NOISE FIGURE (dB) 1300 1700 1900
5525 G03
LO INPUT POWER (dBm) GAIN (dB), IIP3 (dBm) –12 –8 –4 0
5525 G04
25°C 85°C –40°C IIP3 GAIN LO INPUT POWER (dBm) –14 NOISE FIGURE (dB)
5525 G05
25°C 85°C –40°C FREQUENCY (MHz) 500 LEAKAGE (dBm) –40 –20 2500
5525 G06
–60 –80 –50 LO-RF LO-IF –30 –10 –70 –90 –100 1000 1500 2000 3000 RF-LO SUPPLY VOLTAGE (V) 2.8 GAIN (dB), IIP3 (dBm) 4 4.8
5525 G07
25°C 85°C –40°C FREQUENCY (MHz) –30 RETURN LOSS (dB) –25 –20 –15 –10 500 IF LO RF 1000 1500 2000
5525 G08
RF INPUT POWER (dBm/TONE) –20 –100 OUTPUT POWER (dBm/TONE) –90 –70 –60 –50 –30 POUT IM3 –15 –10
5525 G09
–80 –20 –10 –40 –5 0 25°C 85°C –40°C
W UTYPICAL AC PERFOR A CE CHARACTERISTICSVCC = 5V, EN = 3V, TA = 25°C, fRF = 1900MHz, PRF = –15dBm (–15dBm/tone for 2-tone IIP3 tests, ∆f = 1MHz), fLO = fRF – 140MHz, PLO = –5dBm, IF output measured at 140MHz, unless otherwise noted. Test circuit shown in Figure 1. IFOUT, 2 × 2 and 3 × 3 Spurs vs RF Input Power 2 × 2 and 3 × 3 Spurs vs LO Input Power W UTYPICAL DC PERFOR A CE CHARACTERISTICS Supply Current vs Supply Voltage Shutdown Current vs Supply Voltage Test circuit shown in Figure 1. RF INPUT POWER (dBm) –20 –100 OUTPUT POWER (dBm) –80 –60 –40 –20 –15 –5 –10
5525 G10
–90 –70 –50 –30 –10 IF OUT fRF = 1900MHz 3RF-3LO fRF = 1806.67MHz TA = 25°C fLO = 1760MHz fIF = 140MHz 2RF-2LO fRF = 1830MHz LO INPUT POWER (dBm) –16 –50 –40 –30
5525 G11
–60 –70 –12 –8 –4 4 –80 –90 –100 OUTPUT POWER (dBm) 3RF-3LO fRF = 1806.67MHz TA = 25°C fLO = 1760MHz fIF = 140MHz 2RF-2LO fRF = 1830MHz SUPPLY VOLTAGE (V) 2.8 SUPPLY CURRENT (mA) 4.4
5525 G12
25°C 85°C –40°C SUPPLY VOLTAGE (V) 2.8 SHUTDOWN CURRENT (µA) 3.2 3.6 4 4.4
5525 G13
4.8 5.2 5.6 25°C 85°C –40°C
NC (Pins 1, 4, 8, 13, 16): Not Connected Internally. These pins should be grounded on the circuit board for improved LO-to-RF and LO-to-IF isolation. RF+, RF– (Pins 2, 3): Differential Inputs for the RF Signal. One RF input pin may be DC connected to a low impedance ground to realize a 50Ω single-ended input at the other RF pin. No external matching components are required. A DC voltage should not be applied across these pins, as they are internally connected through a transformer winding. EN (Pin 5): Enable Pin. When the input voltage is higher than 3V, the mixer circuits supplied through Pins 6, 7, 10 and 11 are enabled. When the input voltage is less than 0.3V, all circuits are disabled. Typical enable pin input current is 55µA for EN = 5V and 0.1µA when EN = 0V. V CC1 (Pin 6): Power Supply Pin for the LO Buffer Circuits. Typical current consumption is 11mA. This pin should be externally connected to the other VCC pins and decoupled with 1µF and 0.01µF capacitors. VCC2 (Pin 7): Power Supply Pin for the Bias Circuits. Typical current consumption is 2.5mA. This pin should be externally connected to the other VCC pins and decoupled with 1µF and 0.01µF capacitors. GND (Pins 9, 12): Ground. These pins are internally connected to the Exposed Pad for better isolation. They should be connected to ground on the circuit board, though they are not intended to replace the primary grounding through the Exposed Pad of the package. IF – and IF+ (Pins 10, 11): Differential Outputs for the IF Signal. An impedance transformation may be required to match the outputs. These pins must be connected to VCC through impedance matching inductors, RF chokes or a transformer center-tap. LO–, LO+ (Pins 14, 15): Differential Inputs for the Local Oscillator Signal. The LO input is internally matched to 50Ω. The LO can be driven with a single-ended source through either LO input pin, with the other LO input pin connected to ground. There is an internal DC resistance across these pins of approximately 480 Ω. Thus, a DC blocking capacitor should be used if the signal source has a DC voltage present. Exposed Pad (Pin 17): Circuit Ground Return for the Entire IC. This must be soldered to the printed circuit board ground plane. BLOCK DIAGRA W 15 14 112 HIGH SPEED LO BUFFER DOUBLE- BALANCED MIXER LINEAR AMPLIFIER LO–EXPOSED PAD LO+ VCC2 VCC1EN IF+ GND IF– 9GND 5525 BD BIAS RF+ RF–
Figure 1. Test Schematic
5526 F01
0.8GHz to 2.5GHz and LO signals from 500MHz to 3GHz. high side LO injection can be used. integrated balun and a high linearity differential amplifier. capacitor must be used in series with the RF input pin.
800MHz by adding a series 3.9pF capacitor at the RF input. components are also shown in Figure 3.
5525 F02
3 RF–
Figure 2. RF Input Schematic
5525 F03
Figure 3. RF Input Return Loss Without and a broadband input matching network. Table 1. RF Port Input Impedance vs Frequency
5525 F04
Figure 4. Typical Gain, IIP3 and NF with
simplified schematic for the LO input is shown in Figure 7. Measured return loss is shown in Figure 8. due to the internal resistive match. + pin with the LO– pin grounded. Table 2. Single-Ended LO Input Impedance Figure 9. The output pins, IF+ and IF–, are internally con- nected to the collectors of the mixer switching transistors. Figure 7. LO Input Schematic Figure 9. IF Output with External Matching Figure 8. LO Input Return Loss Figure 5. Wideband RF Input Matching Figure 6. RF Input Return Loss Using
2 RF+
5525 F05
5525 F06
14 LO–
5525 F07
15 LO+
5525 F08
5525 F09
be combined externally through an IF transformer or balun. Table 3. As an example, at an IF frequency of 140MHz and Table 3. IF Differential Impedance (Parallel Equivalent) L11, L12, C11 and C12 form a narrowband bridge balun. Figure 10. IF Output Small Signal Model
5525 F10
Figure 11. Narrowband Bridge IF Balun
5525 F11
return loss for these examples is shown in Figure 12.
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
- These results show that the usable IF bandwidth for the
for applications assistance with this circuit. Table 4. Component Values for Lumped Balun Figure 12. Typical IF Return Loss
5525 F12
5525 F13
5525 F14
Figure 13. Typical Gain and IIP3 vs Figure 14. Typical IIP3 vs RF
© LINEAR TECHNOLOGY CORPORATION 2004 LT/TP 1004 1K • PRINTED IN THE USA Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com 16-Lead Plastic QFN (4mm × 4mm) (Reference LTC DWG # 05-08-1692) UPACKAGE DESCRIPTIO 4.00 ± 0.10 (4 SIDES) NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE PIN 1 TOP MARK (NOTE 6) 0.55 ± 0.20 1615 BOTTOM VIEW—EXPOSED PAD 2.15 ± 0.10 (4-SIDES) 0.75 ± 0.05 R = 0.115 TYP 0.30 ± 0.05
0.65 BSC
0.200 REF
0.00 – 0.05 (UF) QFN 1103 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 0.72 ±0.05 0.30 ±0.05 2.15 ± 0.05 (4 SIDES) 2.90 ± 0.05 4.35 ± 0.05 PACKAGE OUTLINE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE RELATED PARTS PART NUMBER DESCRIPTION COMMENTS Infrastructure LT5512 DC-3GHz High Signal Level Down Converting Mixer 21dBm IIP3, Integrated LO Buffer LT5514 Ultralow Distortion, IF Amplifier/ADC Driver with Digitally 850MHz Bandwidth, 47dBm OIP3 at 100MHz, 10.5dB to 33dB Gain Controlled Gain Control Range LT5519 0.7GHz to 1.4GHz High Linearity Upconverting Mixer 17.1dBm IIP3 at 1GHz, Integrated RF Output Transformer with 50 Ω Matching, Single-Ended LO and RF Ports Operation LT5520 1.3GHz to 2.3GHz High Linearity Upconverting Mixer 15.9dBm IIP3 at 1.9GHz, Integrated RF Output Transformer with 50 Ω Matching, Single-Ended LO and RF Ports Operation LT5521 3.7GHz Very High Linearity Mixer 24.2dBm IIP3 at 1.95GHz, 12.5dB SSBNF, –42dBm LO Leakage, Supply Voltage = 3.15V to 5.25V LT5522 600MHz to 2.7GHz High Signal Level Downconverting Mixer 4.5V to 5.25V Supply, 25dBm IIP3 at 900MHz, NF = 12.5dB, 50Ω Single-Ended RF and LO Ports LT5526 High Linearity, Low Power Downconverting Mixer 16.5dBm IIP3 at 900MHz, NF = 11dB, Supply Current = 28mA, 3.6V to 5.3V Supply RF Power Detectors LTC5508 300MHz to 7GHz RF Power Detector 44dB Dynamic Range, Temperature Compensated, SC70 Package LTC5532 300MHz to 7GHz Precision RF Power Detector Precision V OUT Offset Control, Adjustable Gain and Offset LT5534 50MHz to 3GHz RF Power Detector with 60dB Dynamic Range ±1dB Output Variation over Temperature, 38ns Response Time LTC5535 600MHz to 7GHz RF Power Detector 12MHz Baseband BW, Precision Offset with Adjustable Gain and Offset Wide Bandwidth ADCs LTC1749 12-Bit, 80Msps ADC 500MHz BW S/H, 71.8dB SNR, 87dB SFDR LTC1750 14-Bit, 80Msps ADC 500MHz BW S/H, 75.5dB SNR, 90dB SFDR, 2.25V P-P or 1.35VP-P Input Ranges LTC2222/ 12-Bit, 105Msps/80Msps ADC Low Power 775MHz BW S/H, 61dB SNR, 75dB SFDR ±0.5V or ±1V LTC2223 Input LTC2224/ 10-Bit/12-Bit, 135Msps ADC Low Power 775MHz BW S/H, 61dB SNR, 75dB SFDR ±0.5V or ±1V LTC2234 Input