LT5511

LT5511 LINER

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Technical content

eliminating the need for an LO balun. 1dB compression point is typically +6dBm. , LTC and LT are registered trademarks of Linear Technology Corporation. Figure 1. High Signal Level Upmixer for CATV Downlink Infrastructure.

5511 F01a

5511 F01b

TJMAX = 150°C, qJA = 38°C/W EXPOSED PAD IS GROUND (MUST BE SOLDERED TO PRINTED CIRCUIT BOARD) LT5511EFE ABSOLUTE AXI U RATI GSW WW U PACKAGE/ORDER I FOR ATIOUU W (Note 1)

ELECTRICAL CHARACTERISTICS

Consult LTC Marketing for parts specified with wider operating temperature ranges. FE PACKAGE 16-LEAD PLASTIC TSSOP TOP VIEW LO NC GND IF+ IF– GND VCCBIAS GND LO+ VCCLO GND RF RF– GND EN NCPARAMETER CONDITIONS MIN TYP MAX UNITS VCC = 5VDC, EN = High, TA = 25°C IF Input Frequency Range (Note 6) 1 to 300 MHz LO Input Frequency Range (Note 6) 30 to 2700 MHz RF Output Frequency Range (Note 6) 10 to 3000 MHz 950MHz Application: (Test Circuit Shown in Figure 2) VCC = 5VDC, EN = High, TA = 25°C, IF Input = 50MHz at –5dBm, LO Input = 1GHz at –10dBm, RF Output Measured at 950MHz, unless otherwise noted. (Notes 2, 3) IF Input Return Loss With External Matching, Z O = 50W 14 dB LO Input Power –15 to –5 dBm LO Input Return Loss With External Matching, Z O = 50W 14 dB RF Output Return Loss With External Matching, Z O = 50W 17 dB Conversion Gain 0d B LO to RF Leakage –46 dBm Input 1dB Compression 5.9 dBm Input 3rd Order Intercept Two-Tone, –5dBm/Tone, Df = 1MHz 17 dBm Input 2nd Order Intercept Single-Tone, –5dBm 52 dBm SSB Noise Figure 15 dB FE PART MARKING 5511EFE

PARAMETER CONDITIONS MIN TYP MAX UNITS 1.9GHz Application: (Test Circuit Shown in Figure 3) VCC = 5VDC, EN = High, TA = 25°C, IF Input = 50MHz at –5dBm, LO Input = 1.95GHz at –10dBm, RF Output Measured at 1900MHz, unless otherwise noted. (Notes 3, 4) IF Input Return Loss With External Matching, Z O = 50W 14 dB LO Input Power –15 to –5 dBm LO Input Return Loss With External Matching, Z O = 50W 11.5 dB RF Output Return Loss With External Matching, Z O = 50W 11.5 dB Conversion Gain –0.7 dB LO to RF Leakage –47 dBm Input 1dB Compression 5.2 dBm Input 3rd Order Intercept Two-Tone, –5dBm/Tone, Df = 1MHz 15.5 dBm Input 2nd Order Intercept Single-Tone, –5dBm 51 dBm SSB Noise Figure 14 dB Power Supply Requirements: VCC = 5VDC, EN = High, TA = 25°C, unless otherwise noted. Supply Voltage 4.0 to 5.25 V DC Supply Current 56 65 mA Shutdown Current (Chip Disabled) EN = Low 1 30 mA Enable Mode Threshold EN = High 3 V DC Disable Mode Threshold EN = Low 0.5 V DC Turn ON Time (Note 5) 2 ms Turn OFF Time (Note 5) 6 ms Enable Input Current EN = 5V 1 mA Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Note 2: External components on the final test circuit are optimized for operation at fRF = 950MHz, fLO = 1GHz and fIF = 50MHz (Figure 2). Note 3: Specifications over the – 40°C to 85°C temperature range are assured by design, characterization and correlation with statistical process controls. Note 4: External components on the final test circuit are optimized for operation at fRF = 1900MHz, fLO = 1.95GHz and fIF = 50MHz (Figure 3). Note 5: Turn On and Turn Off times are based on rise and fall times of RF output envelope from full power to –40dBm with an IF input power of –5dBm. Note 6: Part can be used over a broader range of operating frequencies. Consult factory for applications assistance.

TYPICAL PERFOR A CE CHARACTERISTICSUW RF Output Power and 3rd Order Intermodulation vs IF Input Power (Two Input Tones) Conversion Gain and IIP3 vs LO Power LO to RF Leakage vs LO Power IIP2 vs LO Power (950MHz Application) VCC = 5VDC, EN = High , TA = 25°C, IF Input = 50MHz at –5dBm, LO Input = 1GHz at –10dBm, RF Output Measured at 950MHz, unless otherwise noted. For 2-Tone Measurements: 2nd IF Input = 51MHz at –5dBm. (Test Circuit Shown in Figure 2). Conversion Gain and LO to RF Leakage vs Output Frequency IIP3 and IIP2 vs Output Frequency SSB Noise Figure vs Output Frequency IF INPUT POWER (dBm/TONE) –15 POUT, IM3 (dBm/TONE) –5 5 –10 –20 –30 –40 –50 –60 –70 –80

5511 G01

–10 0 TA = 25°C TA = –40°C TA = –40°C TA = 85°C TA = 85°C POUT IM3 TA = 25°C IF INPUT POWER (dBm) –15 POUT, IM2 (dBm) –5 5 –10 –20 –30 –40 –50 –60 –70 –80 –10 0 TA = –40°C TA = 85°C TA = 85°C POUT IM2 TA = 25°C TA = –40°C TA = 25°C

5511 G02

IF INPUT POWER (dBm) –15 GAIN (dB)

5511 G03

–10 –5 0 TA = 25°C TA = –40°C TA = 85°C GAIN IIP3 –20 GAIN (dB) IIP3 (dBm)

5511 G04

–15 –10 –5 TA = 25°C TA = 25°C TA = –40°C TA = –40°C TA = 85°C TA = 85°C LO POWER (dBm) LO POWER (dBm) –20 LO TO RF LEAKAGE (dBm)

5511 G05

–15 –10 –5 –15 –25 –35 –45 –55 TA = 25°C TA = –40°C TA = 85°C LO POWER (dBm) –20 IIP2 (dBm) –15 –10 –5 0

5511 G06

TA = 25°C TA = –40°C TA = 85°C RF OUTPUT FREQUENCY (MHz) 300 GAIN (dB) LO TO RF LEAKAGE (dBm) –10 –15 –25 –35 –45 –55 –65 500 700 900 1300 1100

5511 G07

TA = –40°C TA = –40°C TA = 85°C TA = 25°C TA = 25°C IF = 50MHz, LO SWEPT FROM 400MHz TO 1300MHz AT –10dBm TA = 85°C RF OUTPUT FREQUENCY (MHz) 300 IIP3, IIP2 (dBm) 500 700 900 1300 1100

5511 G08

TA = –40°C TA = –40°C TA = 85°C TA = 25°C TA = 25°C IF = 50MHz, LO SWEPT FROM 400MHz TO 1300MHz AT –10dBm TA = 85°C RF OUTPUT FREQUENCY (MHz) 300 NOISE FIGURE (dB) 500 700 900 1300 1100

5511 G09

TA = 25°C IF = 50MHz, LO SWEPT FROM 400MHz TO 1300MHz AT –10dBm RF Output Power and 2nd Order Intermodulation vs IF Input Power (Single Input Tone) Conversion Gain vs IF Input Power (Single Input Tone)

TYPICAL PERFOR A CE CHARACTERISTICSUW (950MHz Application) VCC = 5VDC, EN = High , TA = 25°C, IF Input = 50MHz at –5dBm, LO Input = 1GHz at –10dBm, RF Output Measured at 950MHz, unless otherwise noted. For 2-Tone Measurements: 2nd IF Input = 51MHz at –5dBm. (Test Circuit Shown in Figure 2). (1.9GHz Application) VCC = 5VDC, EN = High , TA = 25°C, IF Input = 50MHz at –5dBm, LO Input = 1.95GHz at –10dBm, RF Output Measured at 1900MHz, unless otherwise noted. For 2-Tone Measurements: 2nd IF Input = 51MHz at –5dBm. (Test Circuit Shown in Figure 3). SUPPLY VOLTAGE (V) 4.0 GAIN (dB) 4.6 5.0 5.6

5511 G11

TA = 25°C TA = –40°C TA = 85°C SUPPLY VOLTAGE (V) 4.0 IIP3 (dBm) IIP2 (dBm) 4.6 5.0 5.6

5511 G12

TA = 25°C TA = –40°C TA = 85°C TA = 25°C TA = –40°C TA = 85°C IIP2 IIP3 IF INPUT POWER (dBm/TONE) –15 POUT, IM3 (dBm/TONE) –5 5 –10 –20 –30 –40 –50 –60 –70 –80

5511 G13

–10 0 TA = –40°C TA = –40°C TA = 85°C TA = 85°C POUT IM3 TA = 25°C TA = 25°C IF INPUT POWER (dBm) –15 POUT, IM2 (dBm) –5 5 –10 –20 –30 –40 –50 –60 –70 –80

5511 G14

–10 0 TA = –40°C TA = –40°C TA = 85°C POUT IM2 TA = 25°C TA = 85°C TA = 25°C IF INPUT POWER (dBm) –15 GAIN (dB)

5511 G15

–10 –5 0 TA = 25°C TA = –40°C TA = 85°C LO and RF Port Return Loss vs Frequency Conversion Gain vs Supply Voltage IIP3 and IIP2 vs Supply Voltage RF Output Power and 3rd Order Intermodulation vs IF Input Power (Two Input Tones) RF Output Power and 2nd Order Intermodulation vs IF Input Power (Single Input Tone) Conversion Gain vs IF Input Power (Single Input Tone) FREQUENCY(MHz) 300 RETURN LOSS (dB) –10 –20 –30 –40 –50 700 1300

5511 G10

TYPICAL PERFOR A CE CHARACTERISTICSUW Conversion Gain and LO to RF Leakage vs RF Output Frequency IIP3 and IIP2 vs Output Frequency SSB Noise Figure vs Output Frequency LO and RF Port Return Loss vs Frequency Conversion Gain vs Supply Voltage IIP3 and IIP2 vs Supply Voltage (1.9GHz Application) VCC = 5VDC, EN = High , TA = 25 ºC, IF Input = 50MHz at –5dBm, LO Input = 1.95GHz at –10dBm. RF Output Measured at 1900MHz, unless otherwise noted. For 2-Tone Measurements: 2nd IF Input = 51MHz at –5dBm. (Test Circuit Shown in Figure 3). GAIN IIP3 –20–25 GAIN (dB) IIP3 (dBm)

5511 G16

–15 –10 –5 TA = 25°C TA = 25°C TA = –40°C TA = –40°C TA = 85°C TA = 85°C LO INPUT POWER (dBm) –20–25 LO TO RF LEAKAGE (dBm)

5511 G17

–15 –10 –5 –15 –25 –35 –45 –55 TA = 25°C TA = –40°C TA = 85°C LO INPUT POWER (dBm) LO INPUT POWER (dBm) –25 –20 IIP2 (dBm) –15 –10 –5 0

5511 G18

TA = 25°C TA = –40°C TA = 85°C Conversion Gain and IIP3 vs LO Input Power LO to RF Leakage vs LO Input Power IIP2 vs LO Input Power RF OUTPUT FREQUENCY (MHz) GAIN (dB) LO TO RF LEAKAGE (dBm) –15 –25 –35 –45 –55 1500 1700 1900 2300 2100

5511 G19

TA = –40°C TA = –40°C TA = 85°C TA = 25°C TA = 25°C IF = 50MHz, LO SWEPT FROM 1600MHz TO 2350MHz TA = 85°C RF OUTPUT FREQUENCY (MHz) IIP3, IIP2 (dBm) 1500 1700 1900 2300 2100

5511 G20

TA = –40°C TA = –40°C TA = 85°C TA = 25°C IF = 50MHz, LO SWEPT FROM 1600MHz TO 2350MHz TA = 85°C TA = 25°C RF OUTPUT FREQUENCY (MHz) NOISE FIGURE (dB) 1500 1700 1900 2300 2100

5511 G21

TA = 25°C IF = 50MHz, LO SWEPT FROM 1600MHz TO 2350MHz SUPPLY VOLTAGE (V) 4.0 GAIN (dB) 4.6 5.0 5.6

5511 G23

TA = 25°C TA = –40°C TA = 85°C SUPPLY VOLTAGE (V) 4.0 IIP3 (dBm) IIP2 (dBm) 4.6 5.0 5.6

5511 G24

TA = 25°C TA = 85°C TA = 25°C TA = –40°C TA = 85°C IIP2 IIP3 TA = –40°C FREQUENCY(MHz) 1500 RETURN LOSS (dB) –10 –15 –20 –25 –30 1900 2300

5511 G22

Table 1. Typical S-Parameters for the IF, RF and LO Ports (referenced to 50W ). VCC = 5VDC, EN = High , TA = 25ºC. For each Port Measurement, the other Ports are Terminated as Shown in Figure 2.

LO–, LO+ (Pins 1, 16): Differential Inputs for the Local Oscillator Signal. They can also be driven single-ended by connecting one to an RF ground through a DC blocking capacitor. For single-ended drive, use LO+ for the signal input, as this results in less interference from unwanted coupling of the LO signal to other pins. These pins are internally biased to about 1.4V; thus, DC blocking capaci- tors are required. An impedance transformation is re- quired to match the LO input to 50W (or 75W ). At frequen- cies below 1.5GHz this input can be resistively matched with a shunt resistor. NC (Pins 2, 9): Not Connected Internally. Connect to ground for improved isolation between pins. GND (Pins 3, 6, 8,11, 14): Internal Grounds. These pins are used to improve isolation and are not intended as DC or RF grounds for the IC. Connect these pins to ground for best performance. IF +, IF– (Pins 4, 5): Differential Inputs for the IF Signal. A differential signal must be applied to these pins. These pins are internally biased to about 1.2V, and thus require DC blocking capacitors. These pins should be DC isolated from each other for best LO suppression. Imbalances in amplitude or phase between these two signals will de- grade the linearity of the mixer. V CCBIAS (Pin 7): Supply Voltage for the LO Buffer Bias and Enable Circuits. This pin should be connected to VCC and have appropriate RF bypass capacitors. Care should be taken to ensure that RF signal leakage to the V CC line is minimized. EN (Pin 10): Chip Enable/Disable. When the applied volt- age is greater than 3V, the IC is enabled. When the applied voltage is less than 0.5V, the IC is disabled and the DC current drops to about 1mA. Under no conditions should the voltage on this pin exceed V CC + 0.3V, even at power on. RF–, RF+ (Pins 12, 13): Differential Outputs for the RF Output Signal. An impedance transformation may be required to match the outputs. These pins are also used to connect the mixer to the DC supply through impedance- matching inductors, RF chokes or transformer center-tap. Care should be taken to ensure that the RF signal leakage to V CCLO and VCCBIAS is minimized. VCCLO (Pin 15): Supply Voltage for the LO Buffer Ampli- fier. This pin should be connected to VCC and have appro- priate RF bypass capacitors. Care should be taken to ensure that RF signal leakage to the VCC line is minimized. GROUND (Backside Contact) (Pin 17): DC and RF Ground Return for the Entire IC. This contact must be connected to a low impedance ground plane for proper operation. UUUPI FU CTIO S 1 16 178 9 BIAS CIRCUITS LO BUFFER LO– LO+ GND GND GND GND (BACKSIDE) NC NC IF+ IF– VCCBIAS GND GND VCCLO RF+ RF– EN 5511 BD

Figure 2. Test Circuit and Evaluation Board Schematic for 950MHz Application.

5511 F03

Figure 3. Test Circuit and Evaluation Board Schematic for 1.9GHz Application.

The LT5511 consists of a double-balanced mixer driven by a high-performance, differential, limiting LO buffer. The mixer has been optimized for high linearity and high signal level operation. The LT5511 is intended for applications with LO frequencies of 0.4GHz to 2.7GHz and IF input frequencies from 10MHz to 300MHz, but can be used at other frequencies with excellent results. The LT5511 can be used in applications using either a low side or high side LO. LO Input Port The LO buffer on the LT5511 consists of differential high speed amplifiers and limiters that are designed to drive the mixer quad to achieve high linearity and performance at high IF input signal levels. The LO + and LO– pins are the differential inputs to the LO buffer. Though the LO signal can be applied differentially, the LO buffer performs well with only one input driven, thus eliminating the need for a balun. In this case, a capacitor should be connected between the unused LO input pin and ground. The LO pins are biased internally to about 1.4V, and thus must be DC isolated from the external LO signal source. The LO input should be matched to 50W . The impedance match can be accomplished through the use of a reactive impedance matching network. However, for lower LO frequencies (below about 1.5GHz), an easier approach is to use a shunt 62W resistor to resistively match the port. (The resistor must be DC isolated from the LO input pin). This method is broadband and requires LO power levels of only –10dBm. At higher frequencies, a better match can be realized with reactive components. Transmission lines and parasitics should be considered when designing the matching circuits. Typical S-parameter data for the LO input is included in Table 1 to facilitate the design of the matching network. IF Input Port The IF + and IF– pins are the differential inputs to the mixer. These inputs drive the emitters of the switching transis- tors, and thus have a low impedance. The DC current through these transistors is set by external resistors from each IF pin to ground. The typical internal voltage on the emitters is 1.2V; thus, the current through each IF pin is approximately: I IF = 1.2/RIF RIF is the value of the external resistors to ground. Best performance is obtained when the IF inputs are perfectly balanced and 0.1% tolerance resistors are recommended here. The LT5511 has been characterized with 75 W resistors on each of the IF inputs. The IF signal to the mixer must be differential. To realize this, an RF balun transformer or lumped element balun can be used. The RF transformer is recommended, as it is easier to realize broadband operation, and also does not have the component sensitivity issues of a lumped ele- ment balun. The differential input impedance of the IF input is approxi- mately 12.5W ; therefore, a 4:1 impedance transformation is required to match to 50W . Selecting a transformer with this impedance ratio will reduce the amount of additional components required, as the full impedance transforma- tion is realized by the transformer. DC-isolating trans- formers or transmission-line transformers can be used, as could lumped element transformation networks. Be- cause the IF ports are internally biased, they must be DC isolated from the IF source. Additionally, IF + and IF– must be DC isolated from each other in order to maintain good LO suppression. APPLICATIO S I FOR ATIOWU UU

Figure 4. Evaluation Board Layout. out the excess inductance to improve the match at 50MHz. (200W ) side of a 4:1 balun. critical, a less expensive and smaller balun can be used.

Figure 5. Test Set-Up for Mixer Measurements

5511 F05

5511 F06

Figure 6. Test Circuit Schematic for 2.4GHz RF Application with 300MHz IF Input Frequency

RF OUTPUT FREQUENCY (MHz) 2200 GAIN (dB) 2600

5511 F06a

–10 –13 –18 –23 –28 –33 –38 –43 –48 –53 –58 GAIN LO LEAKAGE LO TO RF LEAKAGE (–dBm) fIF1 = 300MHz AT –8dBm fIF2 = 301MHz AT –8dBm PLO = –10dBm fLO SWEPT FROM 1900MHz TO 2300MHz RF OUTPUT FREQUENCY (MHz) 2200 IIP3, IIP2 (dBm) 2600 fIF1 = 300MHz AT –8dBm fIF2 = 301MHz AT –8dBm PLO = –10dBm fLO SWEPT FROM 1900MHz TO 2300MHz Conversion Gain and LO to RF Leakage vs Output Frequency (Figure 6) IIP3 and IIP2 vs Output Frequency (Figure 6) Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 l FAX: (408) 434-0507 l www.linear.com ª LINEAR TECHNOLOGY CORPORATION 2001 LT/TP 0503 1K • PRINTED IN USA RELATED PARTS PART NUMBER DESCRIPTION COMMENTS LT5500 1.8GHz to 2.7GHz Receiver-Front End 1.8V to 5.25V Supply, Dual-Gain LNA, Mixer, LO Buffer LT5502 400MHz Quadrature IF Demodulator with RSSI 1.8V to 5.25V Supply, 70MHz to 400MHz IF, 84dB Limiting Gain, 90db RSSI Range LT5503 1.2GHz to 2.7GHz Direct IQ Modulator 1.8V to 5.25V Supply, Four-Step RF Power Control, and Upconverting Mixer 120MHz Modulation Bandwidth LT5504 800MHz to 2.7GHz Measuring Receiver 80dB Dynamic Range, Temperature Compensated, 2.7V to 5.5V Supply LTC 5505 RF Power Detectors with >40dB Dynamic Range 300MHz to 3GHz, Temperature Compensated, 2.7V to 6V Supply LT5506 500MHz Quadrature Demodulator with VGA 1.8V to 5.25V Supply, –4dB to 57dB Linear Power Gain LT5507 100kHz to 1GHz RF Power Detector 48dB Dynamic Range, Temperature Compensated, 2.7V to 6V Supply LTC5508 300MHz to 7GHz RF Power Detector >40dB Dynamic Range, SC70 Package LT5512 High Signal Level Down Converting Mixer Up to 3GHz, 20dBm IIP3, Integrated LO Buffer PACKAGE DESCRIPTIO U 16-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663) Exposed Pad Variation BA FE16 (BA) TSSOP 0203 0.09 – 0.20 (.0036 – .0079) 0° – 8° 0.45 – 0.75 (.018 – .030) 4.30 – 4.50* (.169 – .177) 6.40 BSC 13 4 5 6 7 8 10 9 4.90 – 5.10* (.193 – .201) 16 1514 13 12 11 1.10 (.0433) MAX 0.05 – 0.15 (.002 – .006) 0.65 (.0256) BSC 2.74 (.108) 2.74 (.108) 0.195 – 0.30 (.0077 – .0118) MILLIMETERS (INCHES) *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS 2. DIMENSIONS ARE IN RECOMMENDED SOLDER PAD LAYOUT 3. DRAWING NOT TO SCALE 0.45 –0.05

0.65 BSC

4.50 –0.10 6.60 –0.10 1.05 –0.10 2.74 (.108) 2.74 (.108) SEE NOTE 4 4. RECOMMENDED MINIMUM PCB METAL SIZE FOR EXPOSED PAD ATTACHMENT