LT5503

LT5503_15 LINER

Document overview

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Technical content

FEATURES

MODOUT0° 90° CONTROL LOGIC GC1 GC2GND MX– MX+ LO2 2.45GHz BPF VCC1 2VVCC2 2.45GHz MODULATED RFOUTBI+ BI– BQ+ BQ– VCCMODVCCRFVCCLO1VCCLO2 MODIN LT5503 VCCVGA LO1 LO1IN (2075MHz) LO2IN (750MHz) DMODE MIXEN MODEN MIXER ENABLE MODULATOR ENABLE

5503 TA01

■ IEEE 802.11 DSSS and FHSS ■ High Speed Wireless LAN (WLAN) ■ Wireless Local Loop (WLL) ■ PCS Wireless Data ■ MMDS ■ Single 1.8V to 5.25V Supply ■ Direct IQ Modulator with Integrated 90° Phase Shifter* ■ Four Step RF Power Control ■ 120MHz Modulation Bandwidth ■ Independent Double-Balanced Mixer ■ Modulation Accuracy Insensitive to Carrier Input Power ■ Modulator I/Q Inputs Internally Biased ■ Available in 20-Lead FE Package 1.2GHz to 2.7GHz Direct IQ Modulator and Mixer The LT 5503 is a front-end transmitter IC designed for low voltage operation. The IC contains a high frequency quadra- ture modulator with a variable gain amplifier (VGA) and a balanced mixer. The modulator includes a precision 90 ° phase shifter which allows direct modulation of an RF signal by the baseband I and Q signals. In a superheterodyne system, the mixer can be used to generate the high-frequency RF input for the modulator by mixing the system’s 1st and 2nd local oscillators. The LT5503 modulator output P 1dB is –3dBm at 2.5GHz. The VGA allows output power reduction in three steps up to 13dB with digital control. The baseband inputs are internally biased for maximum input voltage swing at low supply voltage. If needed, they can be driven with external bias voltages. 2.45GHz Transmitter Application, Carrier for Modulator Generated by Upmixer SSB Output Power vs I, Q Amplitude I, Q DIFFERENTIAL INPUT VOLTAGE (VP-P) 0.01 SSB OUTPUT POWER (dBm) –10 –15 –20 –25 –30 –35 –40 –45

5503 G04

0.1 10

5.25 VDC 3 VDC

1.8 VDC

, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. *Patent Pending

BI– BI+ GC2 MODOUT V CCVGA VCCLO2 LO2 MODEN MIXEN MX FE PACKAGE 20-LEAD PLASTIC TSSOP TJMAX = 150°C, θJA = 38°C/W EXPOSED PAD IS GND (PIN 21) MUST BE SOLDERED TO PCB ABSOLUTE AXI U RATI GSW WW U (Note 1) ORDER I FOR ATIOUU W PI CO FIGURATIO UU U LEAD FREE FINISH TAPE AND REEL PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE LT5503EFE#PBF LT5503EFE#TRPBF 5503 20-Lead Plastic TSSOP –40°C to 85°C Consult LTC Marketing for parts specified with wider operating temperature ranges. Consult LTC Marketing for information on nonstandard lead based finish parts. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/

ELECTRICAL CHARACTERISTICS

VCC1 = 3VDC, 2.4GHz matching, MODEN = High, GC1 = GC2 = Low, TA = 25°C, MODRFIN = 2.45GHz at –16dBm, [I – I B] and [Q – QB] = 100kHz CW signal at 1VP-P differential, Q leads I by 90°, unless otherwise noted. (Test circuit shown in Figure 2.) (Note 3) (I/Q Modulator) PARAMETER CONDITIONS MIN TYP MAX UNITS RF Carrier Input (MODRFIN) Frequency Range2 Requires Appropriate Matching 1.2 to 2.7 GHz Input VSWR Z O = 50Ω 1.3:1 Input Power –20 to -10 dBm Baseband Inputs (BI+, BI–, BQ+, BQ–) Frequency Bandwidth (3dB) 120 MHz Differential Input Voltage for 1dB Compressed Output 1 V P-P DC Common-Mode Voltage Internally Biased 1.4 VDC Differential Input Resistance 18 k Ω Input Capacitance 0.8 pF Gain Error ±0.2 dB Phase Error ±1 DEG Modulated RF Carrier Output (MODRFOUT) Output Power, Max Gain –6 –3 dBm Output VSWR Z O = 50Ω 1.5:1 Image Suppression –26 –34 dBc Carrier Suppression –24 –32 dBc Output 1dB Compression –3 dBm Output 3rd Order Intercept f I = 100kHz, fQ = 120kHz 2 dBm Output 2rd Order Intercept f I = 100kHz, fQ = 120kHz 16 dBm Broadband Noise 20MHz Offset –142 dBm/Hz VGA Control Logic (GC2, GC1) Switching Time 100 ns Input Current 2 μA Input Low Voltage 0.4 VDC Input High Voltage 1.7 VDC Output Power Attenuation GC2 = Low, GC1 = High 4.5 dB Output Power Attenuation GC2 = High, GC1 = Low 9 dB Output Power Attenuation GC2 = High, GC1 = High 13.5 dB Modulator Enable (MODEN) Low = Off, High = On Turn ON/OFF Time 1 μs Input Current 105 μA Enable VCC – 0.4 VDC Disable 0.4 VDC Modulator Power Supply Requirements Supply Voltage 1.8 5.25 VDC Modulator Supply Current MODEN = High 29 38 mA Modulator Shutdown Current MODEN = Low 50 μA

Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: External component values on the final test circuit shown in Figure 2 are optimized for operation in the 2.4GHz to 2.5GHz band. Note 3: Specifications over the –40°C to 85°C temperature range are assured by design, characterization and correlation with statistical process controls. VCC2 = 3VDC, 2.4GHz matching, MIXEN = High, DMODE = Low (LO2 ÷ 2 mode), TA = 25°C, LO2IN = 750MHz at –18dBm, LO1IN = 2075MHz at –12dBm. MIXRFOUT measured at 2450MHz, unless otherwise noted. (Test circuit shown in Figure 2.) (Note 3) PARAMETER CONDITIONS MIN TYP MAX UNITS Mixer 2nd LO Input (LO2IN) Frequency Range Internally Matched 50 to 1000 MHz Input VSWR Z O = 50Ω 1.4:1 Input Power –20 to –12 dBm Mixer 1st LO Input (LO1IN) Frequency Range2 Requires Appropriate Matching 1400 to 2400 MHz Input VSWR Z O = 50Ω 1.5:1 Input 3rd Order Intercept –30dBm/Tone, Δf = 200kHz –12 dBm Mixer RF Output (MIXRFOUT) Frequency Range2 Requires Appropriate Matching 1700 to 2700 MHz Output VSWR Z O = 50Ω 1.5:1 Small-Signal Conversion Gain P LO1 = –30dBm 5 dB Output Power –14.7 –12.7 dBm LO1 Suppression – 22 – 29 dBc Output 1dB Compression –15 dBm Broadband Noise 20MHz Offset –152 dBm/Hz LO2 Divider Mode Control (DMODE) Low = fLO2 ÷ 2, High = fLO2 ÷ 1 Input Current 1 μA Input Low Voltage (÷2) 0.4 VDC Input High Voltage (÷1) VCC – 0.4 VDC Mixer Enable (MIXEN) Low = Off, High = On Turn ON/OFF Time 1 μs Input Current 130 μA Enable VCC – 0.4 VDC Disable 0.4 VDC Mixer Power Supply Requirements Supply Voltage 1.8 5.25 VDC Supply Current (÷2 mode) DMODE = Low, MIXEN = High 11.9 15.5 mA Supply Current (÷1 mode) DMODE = High, MIXEN = High 10.8 mA Shutdown Current MIXEN = Low 10 μA (Mixer)

TYPICAL PERFOR A CE CHARACTERISTICSUW Modulator Supply Current vs Supply Voltage Modulator Shutdown Current vs Supply Voltage MODEN Current vs Enable Voltage Baseband Frequency Response I/Q Amplitude = 1VP-P MODRFIN and MODRFOUT Return Loss 2.4GHz Matching Typical SSB Spectrum VCC1 SUPPLY VOLTAGE (V) 1.8 SUPPLY CURRENT (mA) 3.2 4.6 5.3

5503 G01

2.5 3.9 TA = 85°C TA = 25°C TA = –40°C VCC1 SUPPLY VOLTAGE (V) 1.8 SHUTDOWN CURRENT (μA) 3.2 4.6 5.3 100 0.1

5503 G02

2.5 3.9 TA = 85°C TA = 25°C TA = –40°C MODEN = LOW MODEN VOLTAGE (V) 1.8 INPUT CURRENT (μA) 3.2 4.6 5.3 220 200 180 160 140 120 100

5503 G03

2.5 3.9 TA = 85°C TA = –40°C MODEN = VCC1 TA = 25°C I, Q INPUT FREQUENCY (MHz) OUTPUT POWER (dBm) –10 –15 –20 –25 –30 –35 –40

5503 G05

0.1 10 IMAGE CARRIER DESIRED SIDEBAND FREQUENCY (MHz) 2050 RETURN LOSS (dB) –20 –10 2850

5503 G06

–30 –40 2250 2450 2650 MODRFOUT MODRFIN VCC1 = 3VDC, 2.4GHz matching, MODEN = high, GC1 = GC2 = low (max gain), TA = 25°C, MODRFIN = 2.45GHz at –16dBm, (I–I B) and (Q–Q B) = 100kHz sine at 1VP-P differential, Q leads I by 90°, unless otherwise noted. (Test circuit shown in Figure 2.) (I/Q Modulator) FREQUENCY (MHz) –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 POUT (dBm)

5503 G07

SUPPLY VOLTAGE (V) 1.8 OUTPUT POWER (dBm) 2.4 3.0 3.6 4.2

5503 TA01b

4.8 5.4 PLO1 = –12dBm PLO2 = –18dBm BASEBAND = 1VP-P TA = 25°C 2.45GHz Modulated Output Power vs Supply Voltage

TYPICAL PERFOR A CE CHARACTERISTICSUW SSB Output Power vs Input Power VCC1 = 1.8V Carrier Suppression vs Input Power VCC1 = 1.8V SSB Output Power vs Input Power VCC1 = 3V Carrier Suppression vs Input Power VCC1 = 3V Image Suppression vs Input Power VCC1 = 3V SSB Output Power vs Input Power VCC1 = 5.25V Carrier Suppression vs Input Power VCC1 = 5.25V Image Suppression vs Input Power VCC1 = 5.25V MODRFIN INPUT POWER (dBm) SSB OUTPUT POWER (dBm) –10 –12 –14 –16 –18 –20

5503 G08

TA = 85°C TA = 25°C TA = –40°C MODRFIN INPUT POWER (dBm) CARRIER SUPPRESSION (dBc) –20 –30 –40 –50

5503 G09

TA = 85°C TA = 25°C TA = –40°C MODRFIN INPUT POWER (dBm) IMAGE SUPPRESSION (dBc) –20 –30 –40 –50

5503 G10

TA = 85°C TA = 25°C TA = –40°C MODRFIN INPUT POWER (dBm) SSB OUTPUT POWER (dBm) –10 –12 –14 –16 –18

5503 G11

TA = 85°C TA = 25°C TA = –40°C MODRFIN INPUT POWER (dBm) CARRIER SUPPRESSION (dBc) –20 –30 –40 –50

5503 G12

TA = 85°C TA = 25°C TA = –40°C MODRFIN INPUT POWER (dBm) IMAGE SUPPRESSION (dBc) –20 –30 –40 –50

5503 G13

TA = 85°C TA = 25°C TA = –40°C MODRFIN INPUT POWER (dBm) SSB OUTPUT POWER (dBm) –10 –12 –14 –16 –18

5503 G14

TA = 85°C TA = 25°C TA = –40°C MODRFIN INPUT POWER (dBm) CARRIER SUPPRESSION (dBc) –20 –30 –40 –50

5503 G15

TA = 85°C TA = 25°C TA = –40°C MODRFIN INPUT POWER (dBm) IMAGE SUPPRESSION (dBc) –20 –30 –40 –50

5503 G16

TA = 85°C TA = 25°C TA = –40°C Image Suppression vs Input Power VCC1 = 1.8V 2.4GHz matching, MODEN = high, GC1 = GC2 = low (max gain), MODRFIN = 2.45GHz, (I–I B) and (Q–Q B) = 100kHz sine at 1VP-P differential, Q leads I by 90°, unless otherwise noted. (Test circuit shown in Figure 2.) (I/Q Modulator)

TYPICAL PERFOR A CE CHARACTERISTICSUW Output Power vs Frequency 1.2GHz Matching Carrier Feedthrough vs Frequency 1.2GHz Matching SSB Image vs Frequency 1.2GHz Matching Output Power vs Frequency 1.9GHz Matching Carrier Feedthrough vs Frequency 1.9GHz Matching SSB Image vs Frequency 1.9GHz Matching Output Power vs Frequency 2.4GHz Matching Carrier Feedthrough vs Frequency 2.4GHz Matching SSB Image vs Frequency 2.4GHz Matching MODRFIN FREQUENCY (MHz) 1000 1100 1200 1300 1400 SSB OUTPUT POWER (dBm) –10 –12 –14 –16 –18 –20

5503 G17

GC2, GC1 = 00 MODRFIN FREQUENCY (MHz) 1000 1100 1200 1300 1400

5503 G18

CARRIER (dBm) –30 –40 –50 –60 GC2, GC1 = 00 MODRFIN FREQUENCY (MHz) 1000 1100 1200 1300 1400

5503 G19

IMAGE (dBm) –30 –40 –50 –60 GC2, GC1 = 00 MODRFIN FREQUENCY (MHz) 1650 1750 1850 2050 1950 2150 SSB OUTPUT POWER (dBm) –10 –12 –14 –16 –18

5503 G20

GC2, GC1 = 00 MODRFIN FREQUENCY (MHz) 1650 1750 1850 2050 1950 2150

5503 G21

CARRIER (dBm) –30 –40 –50 –60 GC2, GC1 = 00 MODRFIN FREQUENCY (MHz) 1650 1750 1850 2050 1950 2150

5503 G22

IMAGE (dBm) –30 –40 –50 –60 GC2, GC1 = 00 MODRFIN FREQUENCY (MHz) 2250 2350 2450 2650 2550 SSB OUTPUT POWER (dBm) –10 –12 –14 –16 –18

5503 G23

GC2, GC1 = 00 MODRFIN FREQUENCY (MHz) 2250 2350 2450 2650 2550

5503 G24

GC2, GC1 = 00 CARRIER (dBm) –30 –40 –50 –60 MODRFIN FREQUENCY (MHz) 2250 2350 2450 2650 2550

5503 G25

GC2, GC1 = 00 IMAGE (dBm) –30 –40 –50 –60 VCC1 = 3VDC, MODEN = high, TA = 25°C, PMODRFIN = –16dBm, (I–I B) and (Q–Q B) = 100kHz sine at 1VP-P differential, Q leads I by 90°, unless otherwise noted. (Test circuit shown in Figure 2.) (I/Q Modulator)

TYPICAL PERFOR A CE CHARACTERISTICSUW Mixer Supply Current vs Supply Voltage (LO2 ÷ 2 Mode) Mixer Supply Current vs Supply Voltage (LO2 ÷ 1 Mode) Mixer Shutdown Current vs Supply Voltage RF Output Power vs LO1 Input Power (VCC2 = 1.8V) RF Output Power vs LO1 Input Power (VCC2 = 3V) RF Output Power vs LO1 Input Power (VCC2 = 5.25V) LO1 Feedthrough vs LO1 Input Power (VCC2 = 1.8V) LO1 Feedthrough vs LO1 Input Power (VCC2 = 3V) LO1 Feedthrough vs LO1 Input Power (VCC2 = 5.25V) VCC2 SUPPLY VOLTAGE (V) 1.8 SUPPLY CURRENT (mA) 2.5 3.2 4.6 3.9

5503 G26

5.3 TA = 85°C TA = 25°C TA = –40°C VCC2 SUPPLY VOLTAGE (V) 1.8 SUPPLY CURRENT (mA) 2.5 3.2 4.6 3.9

5503 G27

5.3 TA = 85°C TA = 25°C TA = –40°C DMODE = HIGH VCC2 SUPPLY VOLTAGE (V) 1.8 SHUTDOWN CURRENT (μA) 100 0.1 2.5 3.2 4.6 3.9

5503 G28

5.3 TA = 85°C TA = 25°C TA = –40°C MIXEN = LOW LO1IN POWER (dBm) –30 MIXRFOUT POWER (dBm)

1195 G29

–12 –14 –16 –18 –20 –22 –24 –26 –28 TA = 85°C TA = –40°C TA = 25°C LO1IN POWER (dBm) –30 MIXRFOUT POWER (dBm)

1195 G30

–12 –14 –16 –18 –20 –22 –24 –26 –28 TA = 85°C TA = –40°C TA = 25°C LO1IN POWER (dBm) –30 MIXRFOUT POWER (dBm)

1195 G31

–12 –14 –16 –18 –20 –22 –24 –26 –28 TA = 85°C TA = –40°C TA = 25°C LO1IN POWER (dBm) –30 LO1 FEEDTHROUGH (dBc)

1195 G32

–20 –25 –30 –35 –40 TA = 85°C TA = –40°C TA = 25°C LO1IN POWER (dBm) –30 LO1 FEEDTHROUGH (dBc)

1195 G33

–20 –25 –30 –35 –40 TA = 85°C TA = –40°C TA = 25°C LO1IN POWER (dBm) –30 LO1 FEEDTHROUGH (dBc)

1195 G34

–20 –25 –30 –35 –40 TA = 85°C TA = –40°C TA = 25°C 2.4GHz matching, MIXEN = high, DMODE = low (LO2 ÷ 2 mode), LO2IN = 750MHz at –18dBm, LO1IN = 2075MHz. MIXRFOUT measured at 2450MHz, unless otherwise noted. (Test circuit shown in Figure 2.) (Mixer)

TYPICAL PERFOR A CE CHARACTERISTICSUW RF Output Power and LO1 Feedthrough 1.9GHz Matching Small-Signal Conversion Gain and IIP3 1.9GHz Matching LO1IN and MIXRFOUT Return Loss 1.9GHz Matching RF Output Power and LO1 Feedthrough 2.4GHz Matching Small-Signal Conversion Gain and IIP3 2.4GHz Matching LO1 and MIXRFOUT Return Loss 2.4GHz Matching MIXEN Input Current vs Enable Voltage (MIXEN = VCC2) RF OUTPUT FREQUENCY (MHz) 1650 RF OUTPUT (dBm) –12 –14 –16 –18 –20 –22 –10 –20 –30 –40 –50 2050

5503 G35

LO2IN = 480MHz AT –18dBm LO1IN = f RF –240MHz AT –12dBm LO1 (dBc) RF OUTPUT FREQUENCY (MHz) 1650 CONVERSION GAIN (dB) –12 –15 –18 2050

5503 G36

LO2IN = 480MHz AT –18dBm LO1IN = f RF –240MHz AT –30dBm/TONE IIP3 (dBm) FREQUENCY (MHz) 1100 RETURN LOSS (dB) –10 –15 –20 –25 –30 1700 2100

5503 G37

RF OUTPUT FREQUENCY (MHz) 2250 RF OUTPUT (dBm) –12 –14 –16 –18 –20 –22 –10 –20 –30 –40 –50 2650

5503 G38

LO2IN = 750MHz AT –18dBm LO1IN = fRF –375MHz AT –12dBm LO1 (dBc) RF OUTPUT FREQUENCY (MHz) 2250 CONVERSION GAIN (dB) –12 –15 –18 2650

5503 G39

LO2IN = 750MHz AT –18dBm LO1IN = f RF –375MHz AT –30dBm/TONE IIP3 (dBm) FREQUENCY (MHz) 1450 RETURN LOSS (dB) –10 –15 –20 –25 –30 2050 2450

5503 G40

MIXEN VOLTAGE (V) 1.8 INPUT CURRENT (μA) 3.2 4.6 5.3 300 270 240 210 180 150 120

5503 G41

2.5 3.9 TA = 85°C TA = –40°C TA = 25°C VCC2 = 3VDC, MIXEN = high, DMODE = low (LO2 ÷ 2mode), TA = 25°C, unless otherwise noted. (Test circuit shown in Figure 2.) (Mixer)

BQ– (Pin 1): Negative Baseband Input Pin of the Modulator Q-Channel. This pin is internally biased to 1.4V, but can also be overdriven with an external DC voltage greater than 1.4V, but less than VCC – 0.4V. BQ+ (Pin 2): Positive Baseband Input Pin of Modulator Q- Channel. This pin is internally biased to 1.4V, but can also be overdriven with an external DC voltage greater than 1.4V, but less than V CC – 0.4V. GC1 (Pin 3): Gain Control Pin. This pin is the least significant bit of the four-step modulator gain control. MODIN (Pin 4): Modulator Carrier Input Pin. This pin is internally biased and should be AC-coupled. An external matching network is required for a 50Ω source. VCCMOD (Pin 5): Power Supply Pin for the I/Q Modulator. This pin should be externally connected to the other VCC pins and decoupled with 1000pF and 0.1μF capacitors. VCCRF (Pin 6): Power Supply Pin for the I/Q Modulator Input RF Buffer and Phase Shifter. This pin should be externally connected to the other VCC pins and decoupled with 1000pF and 0.1μF capacitors. LO1 (Pin 7): Mixer 1st LO Input Pin. This pin is internally biased and should be AC-coupled. An external matching network is required for a 50Ω source. V CCLO1 (Pin 8): Power Supply Pin for the Mixer LO1 Circuits. This pin should be externally connected to the other V CC pins and decoupled with 1000pF and 0.1 μF capacitors. DMODE (Pin 9): Mixer 2nd LO Divider Mode Control Pin. Low = divide-by-2, High = divide-by-1. MX+ (Pin 10): Mixer Positive RF Output Pin. This pin must be connected to V CC through an external matching net- work. MX– (Pin 11): Mixer Negative RF Output Pin. This pin must be connected to V CC through an external matching net- work. MIXEN (Pin 12): Mixer Enable Pin. When the input voltage is higher than V CC – 0.4V, the mixer circuits supplied through pins 8, 10, 11 and 15 are enabled. When the input voltage is less than 0.4V, these circuits are disabled. MODEN (Pin 13): Modulator Enable Pin. When the input voltage is higher than VCC – 0.4V, the modulator circuits supplied through pins 5, 6, 16 and 17 are enabled. When the input voltage is less than 0.4V, these circuits are disabled. LO2 (Pin 14): Mixer 2nd LO Input Pin. This pin is internally biased and should be AC-coupled. An external matching network is not required, but can be used for improved matching to a 50Ω source. V CCLO2 (Pin 15): Power Supply Pin for the Mixer LO2 Circuits. This pin should be externally connected to the other V CC pins and decoupled with 1000pF and 0.1 μF capacitors. VCCVGA (Pin 16): Power Supply Pin for the Modulator Variable Gain Amplifier. This pin should be externally connected to the other V CC pins through a 47 Ω resistor and decoupled with a good high frequency capacitor (2pF typical) placed close to the pin. MODOUT (Pin 17): Modulator RF Output Pin. This pin must be externally biased to VCC through a bias choke. An external matching network is required to match to 50Ω. GC2 (Pin 18): Gain Control Pin. This pin is the most significant bit of the four-step modulator gain control. BI+ (Pin 19): Positive Baseband Input Pin of the Modulator I-Channel. This pin is internally biased to 1.4V, but can also be overdriven with an external DC voltage greater than 1.4V, but less than VCC – 0.4V. BI– (Pin 20): Negative Baseband Input Pin of the Modula- tor I-Channel. This pin is internally biased to 1.4V, but can also be overdriven with an external DC voltage greater than 1.4V, but less than V CC – 0.4V. Exposed Pad (Pin 21): Circuit Ground Return for the Entire IC. This must be soldered to the printed circuit board ground plane

90° 5503 BD MIXER BIAS CIRCUITS MODULATOR BIAS CIRCUITS LO1 BUFFER RF BUFFER CONTROL LOCIC VGA V-I V-I ÷2LIM LIM ÷1 21 10 11 9 2 1 20 19 BQ+ BI+BQ– MX+ MX– DMODEGND (BACKSIDE) BI– VCCMOD VCCVGA MODOUT GC2 GC1 MODEN MIXEN VCCLO2 LO2 VCCRF MODIN VCCLO1 LO1

Figure 1. Test Schematic for 1.2GHz, 1.9GHz and 2.4GHz Applications

5503 F01

Figure 2. Example System Block Diagram for a Dual Conversion System

5503 F02

MODRFIN will be driven from an external frequency source.

5505 F03

Figure 3. AC-Coupled Baseband Interface voltage can be overdriven with an external bias circuit.

5505 F04

Figure 4. DC-Coupled Baseband Interface

Figure 1. The amplifier is designed to operate in Class A for draw about 2μA each when high. The mixer LO1 input port is the linear input to the mixer. –20dBm. After that, the mixer output begins to compress. turn creates a stable output level for the modulator input. biased, therefore an AC-coupling capacitor is required. produce broadband noise if the LO2 signal level is too low. an external AC-coupling capacitor. to 25Ω for the balun’s 50Ω input impedance.

5503 F05

Figure 5. 50Ω Mixer Output Matching Without a Balun

Figure 6. Evaluation Circuit Schematic for 1.2GHz, 1.9GHz and 2.4GHz Applications

5503 F06

Figure 7. LT5503 Evaluation Board Layout

5503 F07

Figure 8. Test Set-Up for Upconverting Mixer and I/Q Modulator Transmit Chain Measurements.

5503 F08

Information furnished by Linear Technology Corporation is believed to be accurate and reliable. tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com © LINEAR TECHNOLOGY CORPORATION 2001 LT 1107 • PRINTED IN USA RELATED PARTS PART NUMBER DESCRIPTION COMMENTS LT5500 RF Front End Dual LNA Gain Setting +13.5dB/–14dB at 2.5GHz, Double-Balanced Mixer, 1.8V ≤ VSUPPLY ≤ 5.25V LT5502 400MHz Quadrature Demodulator with RSSI 1.8V to 5.25V Supply, 70MHz to 400MHz IF, 84dB Limiting Gain, 90dB RSSI Range LT5504 800MHz to 2.7GHz RF Measuring Reciever 80dB Dynamic Range, Temperature Compensated, 2.7V to 5.5V Supply LT5505 300MHz to 3.5GHz RF Power Detector >40dB Dynamic Range, Temperature Compensated, 2.7V to 6V Supply LT5506 500MHz Quadrature IF Demodulator with VGA 1.8V to 5.25V Supply, 40MHz to 500MHz IF, –4dB to 57dB Linear Power Gain LTC5507 100kHz to 1GHz RF Power Detector 48dB Dynamic Range, Temperature Compensated, 2.7V to 6V Supply LTC5508 300MHz to 7GHz RF Power Detector SC70 Package LTC5509 300MHz to 3GHz RF Power Detector 36dB Dynamic Range, SC70 Package LT5511 High Signal Level Up Converting Mixer RF Output to 3GHz, 17dBm IIP3, Integrated LO Buffer LT5512 High Signal Level Down Converting Mixer DC-3GHz, 20dBm IIP3, Integrated LO Buffer LT5515 1.5GHz to 2.5GHz Direct Conversion Demodulator 20dBm IIP3, Integrated LO Quadrature Generator LT5516 0.8GHz to 1.5GHz Direct Conversion Quadrature 21.5dBm IIP3, Integrated LO Quadrature Generator Demodulator LT5522 600MHz to 2.7GHz High Signal Level Mixer 25dBm IIP3 at 900MHz, 21.5dBm IIP3 at 1.9GHz, Matched 50 Ω RF and LO Ports, Integrated LO Buffer LTC5532 300MHz to 7GHz Precision RF Power Detector Precision V OUT Offset Control, Adjustable Gain and Offset Voltage PACKAGE DESCRIPTIO U 20-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663) Exposed Pad Variation CB FE20 (CB) TSSOP 0204 0.09 – 0.20 (.0035 – .0079) 0° – 8° 0.25 REF RECOMMENDED SOLDER PAD LAYOUT 0.50 – 0.75 (.020 – .030) 4.30 – 4.50* (.169 – .177) 13 4 5 6 7 89 1 0 111214 13 6.40 – 6.60* (.252 – .260) 3.86 (.152) 2.74 (.108) 20 1918 17 16 15 1.20 (.047) MAX 0.05 – 0.15 (.002 – .006) 0.65 (.0256) BSC 0.195 – 0.30 (.0077 – .0118) TYP 2.74 (.108) 0.45 ±0.05

0.65 BSC

4.50 ±0.10 6.60 ±0.10 1.05 ±0.10 3.86 (.152) MILLIMETERS (INCHES) *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS 2. DIMENSIONS ARE IN 3. DRAWING NOT TO SCALE SEE NOTE 4 4. RECOMMENDED MINIMUM PCB METAL SIZE FOR EXPOSED PAD ATTACHMENT 6.40 (.252) BSC