LSP-T670

LSG-T670 OSRAM

Document overview

• Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 15

Technical content

Features

 package: white P-LCC-4 package, colorless clear resin  feature of the device: both chips can be controlled separately, high signal efficiency possible by color change of the LED  wavelength: 628 nm (super-red), 606 nm (orange), 590 nm (yellow), 570 nm (green), 560 nm (pure green)  viewing angle: Lambertian Emitter (120°)  technology: GaAlP (super-red, orange, yellow, green), GaP (pure green)  optical efficiency: 1.5 lm/W (super-red, orange, yellow), 2.5 lm/W (green), 0.6 lm/W (pure green)  grouping parameter: luminous intensity  assembly methods: suitable for all SMT assembly methods  soldering methods: IR reflow soldering and TTW soldering  preconditioning: acc. to JEDEC Level 2  taping: 8 mm tape with 2000/reel, ø180 mm or 8000/reel, ø330 mm

Applications

 indoor and outdoor displays  optical indicators  backlighting (switches, keys, displays, illuminated advertising, general lighting)  interior automotive lighting (e.g. dashboard backlighting)  marker lights (e.g. steps, exit ways, etc.)  coupling into light guides  light writing displays  signal and symbol luminaire

LSG T670, LSP T670, LSY T670, LOP T670, LYG T670 Anm.: Streuung der Lichtstärke in einer Verpackungseinheit IV max / IV min ≤ 2.0 Streuung der Lichtstärke in einer LED IV max / IV min ≤ 3.0 (LSG T670, LSY T670), ≤ 4.0 (LSP T670, LOP T670) Note: Luminous intensity ratio in one packaging unit IV max / IV min ≤ 2.0 Luminous intensity ratio in one LED IV max / IV min ≤ 3.0 (LSG T670, LSY T670), ≤ 4.0 (LSP T670, LOP T670) Bestellinformation

Ordering Information

Lichtstärke1) Seite 15 Luminous Intensity1) page 15 IF = 10 mA IV (mcd) Bestellnummer Ordering Code color 1 color 2

LSG T670, LSP T670, LSY T670, LOP T670, LYG T670 2005-04-05 3 Grenzwerte Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit super red pure green orange yellow green Betriebstemperatur Operating temperature range Top – 40 … + 100 °C Lagertemperatur Storage temperature range Tstg – 40 … + 100 °C Sperrschichttemperatur Junction temperature Tj + 100 °C Durchlassstrom Forward current (TA=25°C) IF 30 mA Stoßstrom Surge current t ≤ 10 µs, D = 0.005, TA=25°C IFM 0.5 A Sperrspannung2) Seite 15 Reverse voltage2) page 15 (TA=25°C) VR 12 V Leistungsaufnahme Power consumption (TA=25°C) Ptot 95 90 mW Wärmewiderstand Thermal resistance Sperrschicht / Umgebung3) Seite 15 1 chip on Junction / air3) page 15 2 chips on Sperrschicht / Lötpad 1 chip on Junction / solder point 2 chips on Rth JA Rth JA Rth JS Rth JS 480 650 260 430 K/W K/W K/W K/W

LSG T670, LSP T670, LSY T670, LOP T670, LYG T670 Kennwerte Characteristics (TA = 25 °C) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit super red orange yellow green pure green Wellenlänge des emittierten Lichtes (typ.) Wavelength at peak emission IF = 10 mA λpeak 635 610 586 572 557 nm Dominantwellenlänge4) Seite 15 Dominant wavelength4) page 15 IF = 10 mA λdom 628 ± 6 606 ± 6 590 ± 6 570 ± 6 560 ± 6 nm Spektrale Bandbreite bei 50 % Irel max (typ.) Spectral bandwidth at 50 % Irel max IF = 10 mA ∆λ 45 40 45 25 22 nm Abstrahlwinkel bei 50 % IV (Vollwinkel) (typ.) Viewing angle at 50 % IV 2ϕ 120 120 120 120 120 Grad deg. Durchlassspannung5) Seite 15 (typ.) Forward voltage5) page 15 (max.) IF = 10 mA VF VF 2.0 2.5 2.0 2.5 2.0 2.5 2.0 2.5 2.0 2.5 V V Sperrstrom (typ.) Reverse current (max.) VR = 12 V IR IR 0.01 0.01 0.01 0.01 0.01 µA µA Temperaturkoeffizient von λpeak (typ.) Temperature coefficient of λpeak IF = 10 mA; –10°C ≤ T ≤ 100°C Temperaturkoeffizient von λdom (typ.) Temperature coefficient of λdom IF = 10 mA; –10°C ≤ T ≤ 100°C Temperaturkoeffizient vonVF (typ.) Temperature coefficient of VF IF = 10 mA; –10°C ≤ T ≤ 100°C Optischer Wirkungsgrad (typ.) Optical efficiency IF = 10 mA

LSG T670, LSP T670, LSY T670, LOP T670, LYG T670 2005-04-05 5 Helligkeits-Gruppierungsschema Brightness Groups Helligkeitsgruppe Brightness Group Lichtstärke1) Seite 15 Luminous Intensity1) page 15 IV (mcd) Lichtstrom6) Seite 15 Luminous Flux6) page 15 ΦV (mlm) G H J K L 7 (typ.) 11 (typ.) 17 (typ.) 27 (typ.) 35 (typ.) Anm.: Die Standardlieferform von Serientypen beinhaltet eine Familiengruppe. Einzelne Helligkeitsgruppen sind nicht bestellbar. Note: The standard shipping format for serial types includes a family group. Individual brightness groups cannot be ordered. Gruppenbezeichnung auf Etikett Group Name on Label Beispiel: J-1+K-1 Example: J-1+K-1 Helligkeits- gruppe Brightness Group (yellow) Wellenlänge (keine Gruppierung) Wavelength (no grouping) (yellow) Helligkeits- gruppe Brightness Group (green) Wellenlänge (keine Gruppierung) Wavelength (no grouping) (green) J 1 K 1 Anm.: In einer Verpackungseinheit / Gurt ist immer nur eine Helligkeitsgruppe pro Farbe enthalten. Note: No packing unit / tape ever contains more than one brightness group per color.

LSG T670, LSP T670, LSY T670, LOP T670, LYG T670 Relative spektrale Emission6) Seite 15 Relative Spectral Emission6) page 15 V(λ) = spektrale Augenempfindlichkeit / Standard eye response curve Irel = f (λ); TA = 25 °C; IF = 10 mA Abstrahlcharakteristik6) Seite 15 Radiation Characteristic6) page 15 Irel = f (ϕ); TA = 25 °C rel λ OHL01697 100 0400 450 500 550 600 650 70 0nm I pure-green green yellow orange super-red λV 0.2 0.4 1.0 0.8 0.6 ϕ 1.0 0.8 0.6 0.4 50˚ 60˚ 70˚ 80˚ 90˚ 100˚

LSG T670, LSP T670, LSY T670, LOP T670, LYG T670 2005-04-05 7 Durchlassstrom6) 7) Seite 15 Forward Current6) 7) page 15 IF = f (VF); TA = 25 °C Relative Lichtstärke6) 7) Seite 15 Relative Luminous Intensity6) 7) page 15 IV/IV(10 mA) = f (IF); TA = 25 °C Relative Lichtstärke6) Seite 15 Relative Luminous Intensity6) page 15 IV/IV(25 °C) = f (Tj); IF = 10 mA 10 -1 V pure-green super-red orange/yellow green OHL02145 IF FV 010 110 210 mA V V (10 mA) 10 -1 0 10 10 1 210mA red yellow green super-red orange pure-green 10 -3 OHL02146 FΙ -210 -110 010 110 Ι Ι yellow green orange super-red pure-green 0.0 OHL02150 j 02 0 4 0 6 0 8 0 1 0 0 V VI I 0.4 0.8 1.2 1.6 2.0 (25 ˚C) T

LSG T670, LSP T670, LSY T670, LOP T670, LYG T670 2005-04-05 8 Maximal zulässiger Durchlassstrom Max. Permissible Forward Current IF = f (T) Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA = 25 °C Maximal zulässiger Durchlassstrom Max. Permissible Forward Current IF = f (T) 1 chip on2 chips on mA ˚C0 IF OHL00241 20 40 60 80 10 0 TA temp. ambient T OHL01686 s10-5 10-4 10-3 10-2 10-1 100 101 t D I T T P F tP= D = 0.005 0.01 0.02 0.05 0.2 0.5 DC 10 1 IF t 210 0.1 p 10 3 mA OHL00956 ˚C02 0 4 0 6 0 8 0 1 0 0 1 chip on 2 chips on temp. solder pointTS T FI

LSG T670, LSP T670, LSY T670, LOP T670, LYG T670 2005-04-05 9 Maßzeichnung8) Seite 15 Package Outlines8) page 15 Kathodenkennung: abgeschrägte Ecke Cathode mark: bevelled edge Gewicht / Approx. weight: 35 mg Gurtung / Polarität und Lage8) Seite 15 Verpackungseinheit 2000/Rolle, ø180 mm oder 8000/Rolle, ø330 mm Method of Taping / Polarity and Orientation8) page 15 Packing unit 2000/reel, ø180 mm or 8000/reel, ø330 mm marking Package GPLY6837 0.8 (0.031) 0.6 (0.024) 2.6 (0.102) 2.1 (0.083) 2.3 (0.091) 3.0 (0.118) 3.4 (0.134) 3.0 (0.118) (2.4 (0.094)) 2.1 (0.083) 1.7 (0.067) 0.9 (0.035) 0.7 (0.028) 4˚±1 0.1 (0.004) typ 1.1 (0.043) 3.3 (0.130) 3.7 (0.146) 0.6 (0.024) CA Circuit Diagram C A L Color 1 Color 2 T670 LED Emission color 1 Emission color 2 Package Cathode: pin 1 Cathode: pin 3 OHAY0093 3.6 (0.142) 3.5 (0.138) 2 (0.079) 1.75 (0.069) 8 (0.315) CA AC

LSG T670, LSP T670, LSY T670, LOP T670, LYG T670 Empfohlenes Lötpaddesign8) Seite 15 IR Reflow Löten Recommended Solder Pad8) page 15 IR Reflow Soldering Empfohlenes Lötpaddesign8) Seite 15 Wellenlöten (TTW) Recommended Solder Pad8) page 15 TTW Soldering OHLPY439 Padgeometrie für verbesserte Wärmeableitung improved heat dissipation Paddesign for Lötstoplack Solder resist 1.1 (0.043) 4.5 (0.177) 1.5 (0.059) 2.6 (0.102) 3.3 (0.130) 0.5 (0.020) 7.5 (0.295) 0.4 (0.016) Cathode marking Kathoden Markierung / Cu Fläche / 12 mm per pad2 Cu-area 3.3 (0.130) OHAY0583 6.1 (0.240) 2.8 (0.110) 2 (0.079) 3 (0.118) 6 (0.236) 3.5 (0.138) 1.5 (0.059) 2 (0.079) 8 (0.315) 7.5 (0.295) Solder resist Lötstoplack PCB-direction Bewegungsrichtung der Platine 2 (0.079) Padgeometrie für improved heat dissipation verbesserte Wärmeableitung Paddesign for 2Cu Fläche / > 12 mm per pad Cu-area

LSG T670, LSP T670, LSY T670, LOP T670, LYG T670 2005-04-05 11 Lötbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Conditions Preconditioning acc. to JEDEC Level 2 IR-Reflow Lötprofil (nach IPC 9501) IR Reflow Soldering Profile (acc. to IPC 9501) Wellenlöten (TTW) (nach CECC 00802) TTW Soldering (acc. to CECC 00802) OHLY0597 50 100 150 200 250 100 150 200 250 300 T t C s 240-245 C 10-40 s 183 C 120 to 180 s defined for Preconditioning: up to 6 K/s ramp-down rate up to 6 K/s ramp-up rate up to 6 K/s defined for Preconditioning: 2-3 K/s OHLY0598 50 100 150 200 250 100 150 200 250 300 T t C s 235 C 10 s C... 260 1. Welle 1. wave 2. Welle 2. wave

5 K/s 2 K/sca 200 K/s

CC... 130100

2 K/s

Zwangskühlung forced cooling Normalkurve standard curve Grenzkurven limit curves

LSG T670, LSP T670, LSY T670, LOP T670, LYG T670 Barcode-Produkt-Etikett (BPL) Barcode-Product-Label (BPL) Gurtverpackung Tape and Reel Tape dimensions in mm (inch) W P0 P1 P2 D0 E F 4 ± 0.1 (0.157 ± 0.004) 4 ± 0.1 (0.157 ± 0.004) 2 ± 0.05 (0.079 ± 0.002) 1.5 + 0.1 (0.059 + 0.004) 1.75 ± 0.1 (0.069 ± 0.004) 3.5 ± 0.05 (0.138 ± 0.002) Reel dimensions in mm (inch) A W Nmin W1 W2 max Sam ple OHA02043 X - X - X(G) GROUP: Lot Number(1T) LOT NO: (9D) D/C: Date Code (X) PROD NO: Product Code (6P) BATCH NO: Batch Number Lx xxxx Product Name Bin1: Bin Information Color 1 Bin2: Bin3: ML Temp ST

245 C R

260 C T2

PACKVAR: Packing Type Product Quantity per Reel(Q)QTY: Semiconductors OSRAM Opto Wavelength Rank Forward Voltage Rank Brightness Rank Bar Code Bar Code Bar Code W FE Direction of unreeling N A OHAY0324 Label Gurtvorlauf: Leader: Trailer: Gurtende: 13.0 Direction of unreeling ±0.25 160 mm 160 mm 400 mm 400 mm 8 + 0.3 – 0.1

LSG T670, LSP T670, LSY T670, LOP T670, LYG T670 2005-04-05 13 Trockenverpackung und Materialien Dry Packing Process and Materials Anm.: Feuchteempfindliche Produkte sind verpackt in einem Trockenbeutel zusammen mit einem Trockenmittel und einer Feuchteindikatorkarte Bezüglich Trockenverpackung finden Sie weitere Hinweise im Internet und in unserem Short Form Catalog im Kapitel “Gurtung und Verpackung” unter dem Punkt “Trockenverpackung”. Hier sind Normenbezüge, unter anderem ein Auszug der JEDEC-Norm, enthalten. Note: Moisture-senisitve product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet and in the Short Form Catalog in chapter “Tape and Reel” under the topic “Dry Pack”. Here you will also find the normative references like JEDEC. Kartonverpackung und Materialien Transportation Packing and Materials OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparator check dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, M oistu re Lev el 3 Flo or tim e

168 Hours Moi

s a) Humidi ty Ind ica tor Car d is > 1 0% when rea d at ˚C ± 5 ˚C , or ref low, vap or hase reflow, or eq uiva lent p roces sing (peak pa ckage 2. Aft er this bag is op ene devices th at will be subject ed to inf rared She lf l ife in seal ed b ag: mon th s at ˚C a nd < 90 relati ve h um idi ty (R H). Mois tur e L ev el 5a at fa ctor y conditions of (if b lank , seal date i s identical with date code). a) M ounted within Sto red atbo dy temp. Dev ices re quire ba king , bef ore mo unt ing, if: Bag sea l d ate M oist ure Lev el 1 M oist ur e Level 2 Mo isture L evel 2a4. If baki ng is re quire b) 2 a or is not m et. Dat e and tim e op ened: refere nc e IPC /JEDEC J -STD-033 for b ake procedu re. Floo r tim e s ee be low If bl an k, se e ba r cod e labe l Flo or tim e > 1 Ye ar Floor time

1 Yea

r Floor time 4 W eeks10% R Moi sture L ev el 4 M oistur e Level 5 OPT O SEM ICONDUCTORS MOISTURE SENSI TIVE Thi s bag contai ns CAUTION Flo or t im e H ours Fl oor time Hou rs Flo or tim e 2 4 H our s 30 ˚C /60% RH LEVEL If blank , see ba r code label OHA02044 PACKVAR: R077Additional TEXT P-1+Q-1Multi TOPLED Muster OSRAM OptoSemiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 11(1T) LOT NO: 210021998 123GH1234 0 245 (Q)QTY: 2000 0144 (G) GROUP:

260 C RT240 C R

220 C RML

Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY PACKVAR: R077Additional TEXT P-1+Q-1Multi TOPLED Muster OSRAM OptoSemiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 11(1T) LOT NO: 210021998 123GH1234 0 245 (Q)QTY: 2000 0144 (G) GROUP: Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY OSRAM Barcode label Packing Sealing label Barcode label Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH). Moisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) Mounted within b) Stored at body temp. 3. Devices require baking, before mounting, if: Bag seal date Moisture Level 1 Moisture Level 2 Moisture Level 2a 4. If baking is required, b) 2a or 2b is not met. Date and time opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor time see below If blank, see bar code label Floor time > 1 Year Floor time 1 Year Floor time 4 Weeks 10% RH._< Moisture Level 4 Moisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag containsCAUTION Floor time 72 Hours Floor time 48 Hours Floor time 24 Hours 30 ˚C/60% RH. LEVEL If blank, seebar code label

LSG T670, LSP T670, LSY T670, LOP T670, LYG T670 Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components9) page 15 may only be used in life-support devices or systems 10) page 15 with the express written approval of OSRAM OS. Revision History: 2005-04-05 Previous Version: 2004-08-13 Page Subjects (major changes since last revision) Date of change 3 note changed 3 luminous Intensity of LOP T670 for pure green 5 dominant wavelength (yellow) 13 graphic (taping) 5 value (wavelength yellow) 14 annotations 2002-07-23 4, 5 value (reverse voltage from 5 V to 12 V) 2002-09-18 3 ambient temperature 2003-09-09 all new template 2004-03-11 all Discontinuation of non-RoHS compliant product versions 2005-04-05

LSG T670, LSP T670, LSY T670, LOP T670, LYG T670 2005-04-05 15 Fußnoten: 1) Helligkeitswerte werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ± 11% ermittelt. 2) Die LED kann kurzzeitig in Sperrichtung betrieben werden. 3) RthJA ergibt sich bei Montage auf PC-Board FR 4 (Padgröße ≥ 16 mm2 je Pad) 4) Wellenlängen werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ±1 nm ermittelt. 5) Spannungswerte werden mit einer Stromeinprägedauer von 1 ms und einer Genauigkeit von ±0,1 V ermittelt. 6) Wegen der besonderen Prozessbedingungen bei der Herstellung von LED können typische oder abgeleitete technische Parameter nur aufgrund statistischer Werte wiedergegeben werden. Diese stimmen nicht notwendigerweise mit den Werten jedes einzelnen Produktes überein, dessen Werte sich von typischen und abgeleiteten Werten oder typischen Kennlinien unterscheiden können. Falls erforderlich, z.B. aufgrund technischer Verbesserungen, werden diese typischen Werte ohne weitere Ankündigung geändert. 7) Im gestrichelten Bereich der Kennlinien muss mit erhöhten Helligkeitsunterschieden zwischen Leuchtdioden innerhalb einer Verpackungseinheit gerechnet werden. 8) Maße werden wie folgt angegeben: mm (inch) 9) Ein kritisches Bauteil ist ein Bauteil, das in lebenserhaltenden Apparaten oder Systemen eingesetzt wird und dessen Defekt voraussichtlich zu einer Fehlfunktion dieses lebenserhaltenden Apparates oder Systems führen wird oder die Sicherheit oder Effektivität dieses Apparates oder Systems beeinträchtigt. 10) Lebenserhaltende Apparate oder Systeme sind für (a) die Implantierung in den menschlichen Körper oder (b) für die Lebenserhaltung bestimmt. Falls sie versagen, kann davon ausgegangen werden, dass die Gesundheit und das Leben des Patienten in Gefahr ist. Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. Remarks: 1) Brightness groups are tested at a current pulse duration of 25 ms and a tolerance of ± 11%. 2) Driving the LED in reverse direction is suitable for short term application. 3) RthJA results from mounting on PC board FR 4 (pad size ≥ 16 mm2 per pad) 4) Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of ±1 nm. 5) Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of ±0.1 V. 6) Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 7) In the range where the line of the graph is broken, you must expect higher brightness differences between single LEDs within one packing unit. 8) Dimensions are specified as follows: mm (inch) 9) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. 10) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered.