LMS4684 0.5Ω Low-Voltage, Dual SPDT Analog Switch datasheet (Rev. C)

Document overview

  • Manufacturer or author: Texas Instruments, Incorporated [SNOSAL0,C]
  • PDF pages: 18

Technical content

www.ti.com SNOSAL0C –DECEMBER 2004–REVISED APRIL 2013 LMS46840.5ΩLow-Voltage,DualSPDTAnalogSwitch Check forSamples: LMS4684 1FEATURES DESCRIPTION The LMS4684 is a low on-resistance,low voltage 2• NC Switch R ON 0.5Ω max @ 2.7V

  • 5 nA (typ)Supply CurrentTA = 25°C LMS4684 featuresa 0.5Ω R ON foritsNC switchand digitallogicinputsare 1.8V logic-compatiblewitha• 12-Bump DSBGA Package 2.7V to3.3V supplyand featuresbreak-before-make
  • WSON-10 Package, 3x4mm switchingaction. The LMS4684 is availablein the 12-bump DSBGAAPPLICATIONS and the 10-leadWSON miniaturepackages.These
  • Power Routing PCB real estate saving packages offerextreme performance while saving money with small• Battery-OperatedEquipment footprints.• Communications Circuits
  • Modems
  • CellPhones Connection Diagram CenterBumps B2 and C2 areNot ElectricallyConnected Exposed pad on back ofpackage needs tobe connectedtopin6 on theboard Figure1.10-WSON Package-Top View Figure2.12-Bump DSBGA Package-Top View (Bumped Side Down) Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2004–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

10 NO2

SNOSAL0C –DECEMBER 2004–REVISED APRIL 2013 www.ti.com SCHEMATIC DIAGRAM IN NO NC

0 Off On

1 On Off

Switchesshown forLogic"0"input PIN DESCRIPTIONS Name Pin ID Description WSON DSBGA NC 5,7 D3, D1 Analogswitchnormallyclosedterminal IN 4,8 C3, C1 Digitalcontrolinput COM 3,9 B3,B1 Analogswitchcommon terminal NO 2,10 A3,A1 Analogswitchnormallyopen terminal V+ 1 A2 Positivesupplyvoltage GND 6 D2 Ground Not electricallyconnected.Can be used tohelpdissipateheatby connectingtoGNDB2,C2 pin. These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. ABSOLUTE MAXIMUM RATINGS (1)(2)(3) V+ −0.3Vto6.0V IN −0.3Vto6.0V COM, NO, NC −0.3Vto(V+ + 0.3V) ContinuousSwitchCurrent ±400 mA ESD Tolerance(4) Human Body Model 2000V Machine Model 200V StorageTemperatureRange −65°C to150°C JunctionTemperature(5) 150°C Max (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisintendedtobe functional,butspecificperformanceisnotguaranteed. (2) AllvoltagesarewithrespecttoGND, unlessotherwisespecified. (3) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (4) Human body model:1.5kΩ inserieswith100 pF.Machine model,0Ω inserieswith200 pF. (5) The maximum power dissipationisa functionofTJ(max),θJA and TA.

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www.ti.com SNOSAL0C –DECEMBER 2004–REVISED APRIL 2013 OPERATING RATINGS NominalSupplyVoltage 1.8Vto5.5V IN Voltage(regardlessofsupply) −0.3Vto5.5V TemperatureRange −40°C to85°C (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisintendedtobe functional,butspecificperformanceisnotguaranteed. (2) AllvoltagesarewithrespecttoGND, unlessotherwisespecified. PACKAGE THERMAL RESISTANCE Package θJ-A WSON-10 43°C /W DSBGA-12 57°C /W

ELECTRICAL CHARACTERISTICS

Boldfacelimitsapplyattemperatureextremes. Symbol Parameter Conditions Min Typ Max Units VNO ,VNC ,VCOM AnalogSignalRange 0 V+ V V+ = 2.7V,ICOM = 100 mA,R ON (NC) NC On-Resistance(1) 0.3 0.5 ΩVNC =0 toV+ NO On-Resistance V+ = 2.7V,ICOM = 100 mA,R ON (NO) 0.45 0.8 Ω(1) VNO =0 toV+ On-ResistanceMatch V+ = 2.7V,ICOM = 100 mA,ΔR ON 1.11 60 m ΩBetween Channels (1),(2) VNC orVNO =1.5V WSON TJ = -40°C to 0.1 0.25 V+ = 2.7V, 85°CNC-On-ResistanceR FLAT(NC) ICOM = 100 mA, ΩFlatness(3) DSBGAVNC = 0 toV+ TJ = -40°C to 0.1 0.25 85°C NO On-Resistance V+ = 2.7V,ICOM = 100 mA,R FLAT(NO) 0.18 0.35 ΩFlatness(3) VNO = 0 toV+ −1 0.014 1NO orNC OffLeakage V+ = 3.3V,VNO orVNC = 3V,INO(OFF) orINC(OFF) nACurrent 0.3V;VCOM = 0.3V,3V −10 10 V+ = 3.3V,VNO orVNC = 3V, −2 2 ICOM (ON) COM On Leakage Current 0.3V,orfloating;VCOM = 3V,or nA −20 20floating Dynamic Characteristics 38 60V+ = 2.7V,VNO orVNC = 1.5V;tON Turn-OnTime nsR L = 50Ω;C L = 35 pF; 70 22 40V+ = 2.7V,VNO orVNC = 1.5V;tOFF Turn-OffTime nsR L = 50Ω;C L = 35 pF; 50 V+ = 2.7V,VNO orVNC = 1.5V;tBBM Break-Before-MakeDelay 2 15 nsR L = 50Ω;C L = 35 pF; Q Charge Injection COM = 0;R S = 0;C L= 1 nF; 200 pC VISO Off-Isolation(4) R L = 50Ω;C L= 5 pF;f= 100 kHz -68 dB VCT Crosstalk -72 dB DigitalI/O VIH InputLogicHigh 1.4 V VIL InputLogicLow 0.5 V (1) Guaranteedby design. (2) ΔR ON isequaltothedifferencebetween NC1/NC2 R ON orNO1/NO2 R ON ata specifiedvoltage. (3) Flatnessisdefinedas thedifferencebetween themaximum and minimum valueofon-resistanceas measured overthespecifiedanalog signalranges. (4) Off-isolation= 20 log10(VCOM /VNO ),where VCOM = output,VNO = inputswitchoff. Copyright© 2004–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LMS4684

0.9 x VOUT 50% VIH VIL LOGIC INPUT tD GNDLOGIC INPUT NO NC IN C L INCLUDES FIXTURE AND STRAY CAPACITANCE COM VOUT R L 50: C L 100pF VIN 0.047PF 50% VIH VIL LOGIC INPUT 0.9 x VOUT SWITCH OUPUT VOUT tOFF tON 0.9 x VOUT VOUT R L 50: VIN GNDLOGIC INPUT C L 100pF NO or NC IN C L INCLUDES FIXTURE AND STRAY CAPACITANCE COM 0.047PF LMS4684 SNOSAL0C –DECEMBER 2004–REVISED APRIL 2013 www.ti.com ELECTRICAL CHARACTERISTICS (continued) Boldfacelimitsapplyattemperatureextremes. Symbol Parameter Conditions Min Typ Max Units IIN IN InputLeakage Current VIN = 0 orV+ −1 1 μA Power Supply V+ Power-SupplyRange 1.8 5.5 V I+ SupplyCurrent V+ = 5.5V 5 nA PARAMETRIC MEASUREMENT INFORMATION Figure3. tON /tOFF Time Figure4. Break-BeforeMake Delay

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f = 1 MHz COM GND IN 0.047 PF NC or NO VIL or VIH VOUT IN IN OFF ON OFF OFF OFF ON Q = ( VOUT )(CL) VOUT or NO NC IN COM VOUT C L GND VIL to VIH R GEN VGEN 0.047PF LMS4684 www.ti.com SNOSAL0C –DECEMBER 2004–REVISED APRIL 2013 Figure5. Charge Injection Figure6. Channel Capacitance Copyright© 2004–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LMS4684

VSUPPLY (V) 0.5 1.5 LOGIC THRESHOLD VOLTAGE (V) VIN RISING VIN FALLING -40 -15 10 35 60 85 tON , t OFF (ns) TEMPERATURE V+ = 3V C L = 100 pF R L = 50: tON (ns) tOFF (ns) 0 1 2 3 4 5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 R ON (:) VCOM (V) V+ = 1.8V V+ = 2.0V V+ = 2.3V V+ = 2.5V V+ = 3.0V V+ = 5.0V 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 R ON (:) VCOM (V) VS = 2.3V VS = 2.5V VS = 2.0V VS = 3.0V VS = 1.8V VS = 5.0V LMS4684 SNOSAL0C –DECEMBER 2004–REVISED APRIL 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS NO ON Resistance NC ON Resistance vs. vs. COM Voltage COM Voltage Figure7. Figure8. Logic ThresholdVoltage Turn-on /Turn-offTimes vs. vs. Supply Voltage Temperature Figure9. Figure10.

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0.10 0.15 0.20 0.25 0.30 0.35 0.40 R ON (:) VCOM (V) V+ = 5V TA = +85ºC TA = +25ºC TA = -40ºC 0 0.5 1 1.5 2 2.5 3 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 R ON (:) VCOM (V) V+ = 3VTA = +85ºC TA = +25ºC TA = -40ºC 0 0.5 1 1.5 2 2.5 3 VCOM (V) 0.10 0.15 0.20 0.25 0.30 0.35 R ON (:) V+ = 3V TA = +85ºC TA = +25ºC TA = -40ºC 0 1 2 3 4 5 6 VCOM (V) -700 -500 -300 -100 100 300 500 Q (pC) 0 1 2 3 4 5 0.10 0.12 0.14 0.16 0.18 0.20 0.22 0.24 0.26 0.28 0.30 R ON (:) VCOM (V) V+ = 5V TA = +85ºC TA = +25ºC TA = -40ºC LMS4684 www.ti.com SNOSAL0C –DECEMBER 2004–REVISED APRIL 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) Charge Injection NC On-Resistance vs. vs. COM Voltage COM Voltage Figure11. Figure12. NC On-Resistance NO On-Resistance vs. vs. COM Voltage COM Voltage Figure13. Figure14. NO On-Resistance vs. COM Voltage Figure15. Copyright© 2004–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LMS4684

0.047PF Protection Diode Motor or inductive load LMS4684 SNOSAL0C –DECEMBER 2004–REVISED APRIL 2013 www.ti.com FUNCTIONAL DESCRIPTION The LMS4684 isa low voltagedual,extremelylow On-Resistanceanalogswitchthatcan operateovera supply voltagerange of 1.8V to 5.5V.The LMS4684 has been fullycharacterizedto operateinapplicationswith3V nominalsupplyvoltageand featuresverylow on resistanceand fastTurn-Offand Turn-On timeswithbreak- before-makeswitching. The switchoperatesasymmetrically;one terminalisnormallyclosed(NC) and theotherterminalnormallyopen (NO). Both NC and NO terminalsare connected to a common terminal(COM). This configurationis idealfor applicationswithasymmetricloadssuch as speakerhandsetsand internalspeakers. ApplicationsInformation ANALOG INPUT SIGNAL Analoginputsignalscan rangefromGND toV+ and arepassed throughtheswitchwithverylittlechange.Each switchisbidirectionalso any pincan be an inputoroutput. Exercisecarewhen making connectiontoan inductiveload,such as a motor.As istruewithany analogswitch used withan inductiveload,theback emf producedwhen theswitchisturnedoffcan damage theLMS4684 by electricaloverstress.For such applications,a diodeshouldbe connectedacrossthemotortopreventdamage to theswitch,as indicatedinFigure16.Be surethediodehas adequatecurrentcarryingcapabilities. Figure16. InductiveLoad Over-VoltageProtection DIGITAL CONTROL INPUTS The IN pin can be drivento 5.5V regardlessof the voltagelevelof the supplypin V+. For example,ifthe LMS4684 isoperatedwitha supplyof2V, thedigitalcontrolinputcouldstillbe drivento5V. Power consumption isincreasedwhen thecontrolpinisdrivenrail-to-rail. SUPPLY VOLTAGE Itisgood generalpracticetofirstapplythesupplyvoltagetoa CMOS devicebeforesrivingany otherpins.This isalsotruefortheLMS4684 analogswitch,whichisa CMOS device. However,ifitisnecessarytohave an analogsignalappliedbeforethesupplyvoltageisappliedand theanalog signalsourceisnot limitedto 20 mA max, a diodeconnectedbetween the supplyvoltageand the V+ pinas shown inFigure17 willprovideinputprotection.Thiswilllimitthemax analogvoltagetoa diodedropbelow V+. Thisdiode,D1, willalsoprovideprotectionagainstsome overvoltagesituations.

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0.047 PF LMS4684 www.ti.com SNOSAL0C –DECEMBER 2004–REVISED APRIL 2013 Itisalsogood practiceto provideadequate supplybypassingto allanalog circuits.We recommend a that minimum bypass capacitorvalueof0.047µF be providedfortheLMS4684. An inadequatebypass capacitorcan leadtoexcessivesupplycurrent. Figure17. InputOver VoltageProtectionCircuitry OFF-ISOLATION Analog switchesare composed ofFETs (fieldEffectTransistors).The channelresistanceislow when thepass transistorsare "on"and thatresistanceishighwhen the pass transistorsare "off".However, when the pass transistorsare "off",the source to draincapacitanceof the pass transistorswillpass some energy.This capacitanceisinverselyproportionaltotheswitch"on"resistance,so a switchwitha low"on"resistancemay not be suitableforsome highfrequencyapplications. Figure18 shows the equivalentcircuitof an analog switch.Unless the load impedance afterthe switchis relativelylow, the switchcapacitancewillcouple excessiveenergy across the "open" switchat higher frequencies,degradingoffisolationperformance.Off Isolationof the LMS4684 isspecifiedwitha 50Ω load. Higherloadimpedanceswilldegradeoffisolationperformancecompared withwhat isspecified. Figure18. EquivalentCircuitofan Analog Switch Offisolationmay be improvedby decreasingtheLMS4684 loadimpedance below50Ω.When doingthis,be sure thattheLMS4684 maximum currentratingisnotexceeded.Also,decreasingtheloadimpedance toomuch can resultinexcessivesignaldistortionbecause thechannelresistancevariationwithinputsignalvoltagewould then be a greaterpercentageoftheloadimpedance. Ifitisdesiredto extend the usablebandwidthof the LMS4684 whilemaintainingreasonableoff-isolationis throughtheuse ofthecircuitofFigure19. Copyright© 2004–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LMS4684

0.047 PF LMS4684 SNOSAL0C –DECEMBER 2004–REVISED APRIL 2013 www.ti.com Figure19. Using theLMS4684 athigherfrequencies PCB LAYOUT AND THERMAL CONSIDERATIONS Both the WSON and DSBGA packages offerenhanced board realestatesavingsbecause of theirsmall footprints.These tinypackages are capableof handlinghigh continuouscurrentsbecause of the advanced package thermalhandlingcapabilities. The WSON package has theexposed dieattachpad internallyconnectedtotheinternalcircuitGND. When this pad issolderedtocopperon thePCB boardaccordingtoApplicationNote AN-1187,thefullthermalcapabilityof the WSON package can be achievedwithoutadditionalbulkyheat sinksto dissipatethe heat generated.The DSBGA package has a similarcapabilitytodissipateheatthroughBumps B2 and C2, whicharenotelectrically connected.To enhance heatdissipationoftheDSBGA package B2 and C2 couldbe connectedtotheGND pin throughcoppertraceson theboard. See ApplicationNote AN-1112 forDSBGA package considerations.

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REVISION HISTORY

Changes from RevisionB (April2013)toRevisionC Page Copyright© 2004–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LMS4684

www.ti.com 11-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LMS4684ITL/NOPB Active Production DSBGA (YZR) | 12 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 F09A LMS4684ITL/NOPB.A Active Production DSBGA (YZR) | 12 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 F09A LMS4684ITLX/NOPB Active Production DSBGA (YZR) | 12 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 F09A LMS4684ITLX/NOPB.A Active Production DSBGA (YZR) | 12 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 F09A LMS4684LD/NOPB Active Production WSON (NGZ) | 10 1000 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 85 L4684 LMS4684LD/NOPB.A Active Production WSON (NGZ) | 10 1000 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 85 L4684 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

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PACKAGE MATERIALS INFORMATION www.ti.com 1-Aug-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 1-Aug-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMS4684ITL/NOPB DSBGA YZR 12 250 208.0 191.0 35.0 LMS4684ITLX/NOPB DSBGA YZR 12 3000 208.0 191.0 35.0 LMS4684LD/NOPB WSON NGZ 10 1000 208.0 191.0 35.0 Pack Materials-Page 2

www.ti.com TLA12XXX (Rev C) 0.600±0.075 D E A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994. B. This drawing is subject to change without notice. 4215049/A 12/12 NOTES: D: Max = E: Max = 2.378 mm, Min = 1.641 mm, Min = 2.317 mm 1.581 mm

www.ti.com LDA10B (Rev B)

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