LMC8101

LMC8101 Rail-to-Rail I/O, 2.7V Op Amp in DSBGA package w/Shutdown datasheet (Rev. F)

Document overview

• Manufacturer or author: Texas Instruments, Incorporated [SNOS496,F]
• PDF pages: 26

Technical content

www.ti.com SNOS496F –AUGUST 2000–REVISED MARCH 2013 LMC8101Rail-to-RailInputandOutput,2.7VOpAmp in DSBGAPackageWithShutdown Check forSamples: LMC8101 1FEATURES DESCRIPTION The LMC8101 isa Rail-to-RailInputand Outputhigh 2• VS = 2.7V,TA = 25°C, R L toV+/2,TypicalValues performance CMOS operationalamplifier.TheUnless Specified. LMC8101 is idealfor low voltage(2.7V to 10V)• Rail-to-RailInputs applicationsrequiringRail-to-Railinputsand output.

• Rail-to-RailOutput Swing Within35mV of The LMC8101 issuppliedinthediesizedDSBGA as wellas the 8 pin VSSOP packages.The DSBGASupplies(RL =2kΩ) package requires75% lessboardspace as compared• Packages Offered: totheSOT-23 package.The LMC8101 isan upgrade– DSBGA package 1.39mm x 1.41mm totheindustrystandardLMC7101. – VSSOP package 3.0mm x 4.9mm The LMC8101 incorporatesa simpleuser controlled methodologyforshutdown.Thisallowsease of use
• Low Supply Current<1mA (max) whilereducingthetotalsupplycurrentto1nA typical. This extends batterylifewhere power saving is• Shutdown Current1µA (Max) mandated.The shutdown inputthresholdcan be set• VersatileShutdown Feature10µs Turn-On relativeto eitherV+ or V− using the SL pin (see
• Output ShortCircuitCurrent10mA ApplicationNotessectionfordetails).
• OffsetVoltage±5 mV (max) Otherenhancements includeimprovedoffsetvoltage
• Gain-Bandwidth 1MHz limit,threetimesthe outputcurrentdriveand lower 1/fnoise when compared to the industrystandard• Supply VoltageRange 2.7V-10V LMC7101 Op Amp. Thismakes the LMC8101 ideal• THD 0.18% for use in many battery powered, wireless
• VoltageNoise 36nv/√Hz communicationand Industrialapplications.

APPLICATIONS

• PortableCommunication (Voice,Data)
• CellularPhone Power Amp ControlLoop
• BufferAMP
• ActiveFilters
• BatterySense
• VCO Loop Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2000–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SNOS496F –AUGUST 2000–REVISED MARCH 2013 www.ti.com Connection Diagrams Figure1.8-PinVSSOP Top View Figure2.DSBGA Top View These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) 2KV (3) ESD Tolerance 200V (4) VIN differential ±SupplyVoltage OutputShortCircuitDuration See (5)(6) SupplyVoltage(V+ − V−) 12V VoltageatInput/Outputpins V+ +0.8V,V− −0.8V CurrentatInputPin ±10mA CurrentatOutputPin(5)(6) ±80mA CurrentatPower Supplypins ±80mA StorageTemperatureRange −65°C to+150°C JunctionTemperature(7) +150°C InfraredorConvection(20sec.) 235°C SolderingInformation Wave Soldering(10sec.) 260°C (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisintendedtobe functional,butspecificperformanceisnotspecified.Forensuredspecificationsand thetest conditions,see theElectricalCharacteristics. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) Human body model,1.5kΩ inserieswith100pF. (4) Machine Model,0Ω inserieswith200pF. (5) Appliestobothsingle-supplyand split-supplyoperation.Continuousshortcircuitoperationatelevatedambienttemperaturecan resultin exceedingthemaximum allowedjunctiontemperatureat150°C. Outputcurrentsinexcessof40mA overlongtermmay adverselyaffect reliability. (6) Shortcircuittestisa momentary test.OutputshortcircuitdurationisinfiniteforVS < 6V.Otherwise,extendedperiodoutputshortcircuit may damage thedevice. (7) The maximum power dissipationisa functionofTJ(MAX),θJA and TA.The maximum allowablepower dissipationatany ambient temperatureisPD = (TJ(MAX) − TA)/θJA.Allnumbers applyforpackagessoldereddirectlyontoa PC board.

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www.ti.com SNOS496F –AUGUST 2000–REVISED MARCH 2013 OperatingRatings SupplyVoltage(V+ -V−) 2.7Vto10V JunctionTemperatureRange (2) −40°C to+85°C DSBGA 220°C/W Package ThermalResistance(θJA)(2) VSSOP package 8 pinSurfaceMount 230°C/W (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisintendedtobe functional,butspecificperformanceisnotspecified.Forensuredspecificationsand thetest conditions,see theElectricalCharacteristics. (2) The maximum power dissipationisa functionofTJ(MAX),θJA and TA.The maximum allowablepower dissipationatany ambient temperatureisPD = (TJ(MAX) − TA)/θJA.Allnumbers applyforpackagessoldereddirectlyontoa PC board. 2.7VElectricalCharacteristics Unlessotherwisespecified,alllimitsspecifiedforTJ = 25°C, V+ = 2.7V,V− = 0V,VCM = VO = V+/2and R L > 1 M Ω toV+/2. Boldfacelimitsapplyatthetemperatureextremes. Symbol Parameter Conditions Typ (1) Limit(2) Units VOS ±0.70 ±5 mVInputOffsetVoltage ±7 max TCV OS InputOffsetVoltageAverageDrift 4 μV/°C IB ±1 ±64 pAInputBiasCurrent See (3) max IOS 0.5 32 pAInputOffsetCurrent max R inCM InputCommon Mode Resistance 10 G Ω C inCM InputCommon Mode Capacitance 10 pF CMRR 0V < = VCM < = 2.7V 78 60 dBCommon Mode RejectionRatio VS = 3V 78 64 min 0V < = VCM < = 3V 60 PSRR VS = 2.7Vto3V 57 50 dBPower SupplyRejectionRatio 48 min CMVR 0.0 0.0 V maxVS = 2.7V CMRR > = 50dB 3.0 2.7 V min InputCommon-Mode VoltageRange −0.2 −0.1 V maxVS = 3V CMRR > = 50dB 3.2 3.1 V min AVOL Sourcing 1000R L = 2kΩ toV+/2 3162 562VO = 1.35Vto2.45V V/V min Sinking 804R L = 2kΩ toV+/2 3162 562VO = 1.35Vto0.25V LargeSignalVoltageGain Sourcing 1778R L = 10kΩ toV+/2 4000 1000VO = 1.35Vto2.65V V/V minSinking 1778R L = 10kΩ toV+/2 4000 1000VO = 1.35Vto0.05V VO R L = 2kΩ toV+/2 2.67 2.64 V VID = 100mV 2.62 min OutputSwing High R L = 10kΩ toV+/2 2.69 2.68 V VID = 100mV 2.67 min R L = 2kΩ toV+/2 32 100 mV VID = −100mV 150 max OutputSwing Low R L = 10kΩ toV+/2 10 30 mV VID = −100mV 70 max (1) TypicalValuesrepresentthemost likelyparametricnorm. (2) Alllimitsarespecifiedby testingorstatisticalanalysis. (3) Positivecurrentcorrespondstocurrentflowingintothedevice. Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LMC8101

SNOS496F –AUGUST 2000–REVISED MARCH 2013 www.ti.com 2.7VElectricalCharacteristics(continued) Unlessotherwisespecified,alllimitsspecifiedforTJ = 25°C, V+ = 2.7V,V− = 0V,VCM = VO = V+/2and R L > 1 M Ω toV+/2. Boldfacelimitsapplyatthetemperatureextremes. Symbol Parameter Conditions Typ (1) Limit(2) Units ISC SourcingtoV+/2 20 14 mA VID = 100mV (4) 6 min OutputShortCircuitCurrent SinkingtoV+/2 10 5 mA VID = −100mV (4) 4 min IS 1.0No load,normaloperation 0.70 mA max1.2SupplyCurrent Shutdown mode 0.001 1 µA max Ton Shutdown Turn-ontime See (5) 10 15 µs Toff Shutdown Turn-offtime See (5) 1 µs Iin "SL"and "SD "InputCurrent(6) ±1 ±64 pA max SR AV = +1,R L = 10kΩ toV+/2 1 0.8 V/µsSlew Rate(7) VI= 1VPP min fu UnityGain-Bandwidth VI= 10mV, R L = 2kΩ toV+/2 750 KHz GBW Gain BandwidthProduct f= 100KHz 1 MHz en Input-ReferredVoltageNoise f= 10KHz, R S = 50Ω 36 nV/√Hz in Input-ReferredCurrentNoise f= 10KHz 1.5 fA/√Hz THD f= 1KHz, AV = +1, TotalHarmonicDistortion VO = 2.2Vpp, 0.18 % R L = 600Ω toV+/2 (4) Shortcircuittestisa momentary test.OutputshortcircuitdurationisinfiniteforVS < 6V.Otherwise,extendedperiodoutputshortcircuit may damage thedevice. (5) Shutdown Turn-onand Turn-offtimesaredefinedas thetimerequiredfortheoutputtoreach90% and 10%, respectively,ofitsfinal peak topeak swingwhen setforRailtoRailoutputswingwitha 100KHz sinewave,2KΩ load,and AV = +10. (6) Limitinginputpincurrentisonlynecessaryforinputvoltagesthatexceed absolutemaximum inputvoltageratings. (7) Slew rateisthesloweroftherisingand fallingslewrates. ±5V ElectricalCharacteristics Unlessotherwisespecified,alllimitsspecifiedforTJ = 25°C, V+ =5V, V− = −5V,VCM = VO = 0V,and R L > 1 M Ω tognd. Boldfacelimitsapplyatthetemperatureextremes. Symbol Parameter Conditions Typ (1) Limit(2) Units VOS ±0.7 ±5 mVInputOffsetVoltage ±7 max TCV os InputOffsetVoltageAverageDrift 4 μV/°C IB InputBiasCurrent See (3) ±1 ±64 pA max IOS InputOffsetCurrent 0.5 32 pA max R inCM InputCommon Mode Resistance 10 G Ω C inCM InputCommon Mode Capacitance 10 pF CMRR 87 70 dBCommon-Mode RejectionRatio −5V < = VCM < = 5V 67 min PSRR 80 76 dBPower SupplyRejectionRatio VS = 5V to10V 72 min CMVR −5.3 −5.2 V −5.0 max InputCommon-Mode VoltageRange CMRR ≥ 50 dB 5.3 5.2 V 5.0 min (1) TypicalValuesrepresentthemost likelyparametricnorm. (2) Alllimitsarespecifiedby testingorstatisticalanalysis. (3) Positivecurrentcorrespondstocurrentflowingintothedevice.

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www.ti.com SNOS496F –AUGUST 2000–REVISED MARCH 2013 ±5V ElectricalCharacteristics(continued) Unlessotherwisespecified,alllimitsspecifiedforTJ = 25°C, V+ =5V, V− = −5V,VCM = VO = 0V,and R L > 1 M Ω tognd. Boldfacelimitsapplyatthetemperatureextremes. Symbol Parameter Conditions Typ (1) Limit(2) Units AVOL Sourcing 17.8R L = 600Ω 34.5 10VO = 0V to4V V/mV minSinking 17.8R L = 600Ω 34.5 3.16VO = 0V to−4V LargeSignalVoltageGain Sourcing 31.6R L = 2kΩ 138 17.8VO = 0V to4.6V V/mV minSinking 31.6R L = 2kΩ 138 10VO = 0V to−4.6V VO R L = 600Ω 4.73 4.60 V VID = 100mV 4.54 min OutputSwing High R L = 2kΩ 4.90 4.85 V VID = 100mV 4.83 min R L = 600Ω −4.85 −4.75 V VID = −100mV −4.65 max OutputSwing Low R L = 2kΩ −4.95 4.90 V VID = −100mV −4.84 max ISC 49 30 mASourcing,VID = 100mV (4)(5) 25 min OutputShortCircuitCurrent 90 60 mASinking,VID = −100mV (4)(5) 52 min IS No load,normaloperation 1.1 1.7 mA 1.9 maxSupplyCurrent Shutdown mode 0.001 1 µA Ton Shutdown Turn-ontime See (6) 10 15 µs Toff Shutdown Turn-offtime See (6) 1 µs Iin "SL"and "SD "InputCurrent ±1 ±64 pA max SR AV = +10,R L = 10kΩ,Slew Rate(7) 1.2 V/µsVO = 10Vpp,C L = 1000pF fu VI= 10mVUnityGain-Bandwidth 840 KHzR L = 2kΩ GBW Gain BandwidthProduct f= 10KHz 1.3 MHz en Input-ReferredVoltageNoise f= 10KHz, R s = 50Ω 33 nV/√Hz in Input-ReferredCurrentNoise f= 10KHz 1.5 fA/√Hz THD f= 10KHz, AV = +1, 0.2 %TotalHarmonicDistortion VO =8Vpp, R L = 600Ω (4) Appliestobothsingle-supplyand split-supplyoperation.Continuousshortcircuitoperationatelevatedambienttemperaturecan resultin exceedingthemaximum allowedjunctiontemperatureat150°C. Outputcurrentsinexcessof40mA overlongtermmay adverselyaffect reliability. (5) Shortcircuittestisa momentary test.OutputshortcircuitdurationisinfiniteforVS < 6V.Otherwise,extendedperiodoutputshortcircuit may damage thedevice. (6) Shutdown Turn-onand Turn-offtimesaredefinedas thetimerequiredfortheoutputtoreach90% and 10%, respectively,ofitsfinal peak topeak swingwhen setforRailtoRailoutputswingwitha 100KHz sinewave,2KΩ load,and AV = +10. (7) Slew rateisthesloweroftherisingand fallingslewrates. Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LMC8101

SNOS496F –AUGUST 2000–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics VS = 2.7V,SingleSupply,VCM = V+/2,TA = 25°C unlessspecified Gain/Phase vs. Gain/Phase vs. Frequency (RL = 2k,VS = ± 1.35V) Frequency (RL = 2k,VS = ± 5V) Figure3. Figure4. Gain/Phase vs. Gain vs.Phase for Frequency (RL = Open) variousC L VS = ±1.35V Figure5. Figure6. UnityGain Frequency vs. Phase Margin vs. Supply Voltage Supply Voltage Figure7. Figure8.

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www.ti.com SNOS496F –AUGUST 2000–REVISED MARCH 2013 TypicalPerformance Characteristics(continued) VS = 2.7V,SingleSupply,VCM = V+/2,TA = 25°C unlessspecified UnityGain Frequency and Phase Margin vs. UnityGain Frequency and Phase Margin Load vs.Load Figure9. Figure10. PSRR vs.Frequency PSRR vs.Frequency Figure11. Figure12. InputBias Currentvs. CMRR vs.Frequency Common Mode Voltage@ 85°C Figure13. Figure14. Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LMC8101

SNOS496F –AUGUST 2000–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics(continued) VS = 2.7V,SingleSupply,VCM = V+/2,TA = 25°C unlessspecified InputCurrentvs. Temperature VS = 10V VIN vs.VOUT Figure15. Figure16. VIN vs.VOUT VIN vs.VOUT Figure17. Figure18. VIN vs.VOUT Supply Currentvs.Supply Voltage Figure19. Figure20.

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www.ti.com SNOS496F –AUGUST 2000–REVISED MARCH 2013 TypicalPerformance Characteristics(continued) VS = 2.7V,SingleSupply,VCM = V+/2,TA = 25°C unlessspecified DeltaVOS vs. DeltaVOS vs. VCM (RefVCM = 1.35V) VCM (RefVCM = 5V) Figure21. Figure22. Output PositiveSwing vs. OffsetVoltagevs.VSUPPLY Supply VoltageR L = 600Ω toV+/2 Figure23. Figure24. Output PositiveSwing vs. Output NegativeSwing vs. Supply VoltageR L = 2k toV+/2 Supply VoltageR L = 600Ω toV+/2 Figure25. Figure26. Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LMC8101

SNOS496F –AUGUST 2000–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics(continued) VS = 2.7V,SingleSupply,VCM = V+/2,TA = 25°C unlessspecified Output NegativeSwing vs. ShortCircuitSinkingCurrentvs. Supply Voltage,R L = 2k toV+/2 Supply Voltage Figure27. Figure28. ShortCircuitSourcing Current UndistortedOutput VoltageSwing vs.Supply Voltage vs.Output Load Resistance Figure29. Figure30. Step Response 1% settlingtimeand % overshoot vs.Cap Load Large SignalStep Response Figure31. Figure32.

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www.ti.com SNOS496F –AUGUST 2000–REVISED MARCH 2013 TypicalPerformance Characteristics(continued) VS = 2.7V,SingleSupply,VCM = V+/2,TA = 25°C unlessspecified Small SignalStep Response Large SignalStep Response Figure33. Figure34. Small SignalStep Response Small SignalStep Response Figure35. Figure36. Large SignalStep Response Large SignalStep Response Figure37. Figure38. Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LMC8101

SNOS496F –AUGUST 2000–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics(continued) VS = 2.7V,SingleSupply,VCM = V+/2,TA = 25°C unlessspecified Small SignalStep Response Slew Rate vs.Supply Voltage Figure39. Figure40. Slew Rate vs.CapacitiveLoad Slew Rate vs.CapacitiveLoad Figure41. Figure42. Slew Rate vs.CapacitiveLoad Slew Rate vs.CapacitiveLoad Figure43. Figure44.

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www.ti.com SNOS496F –AUGUST 2000–REVISED MARCH 2013 TypicalPerformance Characteristics(continued) VS = 2.7V,SingleSupply,VCM = V+/2,TA = 25°C unlessspecified VoltageNoise vs. VoltageNoise vs.Frequency VCM @ VariousFrequencies Figure45. Figure46. THD+N vs.Amplitude THD+N vs.Frequency Figure47. Figure48. Sourcing Currentvs. SinkingCurrentvs. Output Voltage(VS = 2.7V) Output Voltage(VS = 2.7V) Figure49. Figure50. Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LMC8101

SNOS496F –AUGUST 2000–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics(continued) VS = 2.7V,SingleSupply,VCM = V+/2,TA = 25°C unlessspecified Sourcing Currentvs. SinkingCurrentvs. Output Voltage(VS = 10V) Output Voltage(VS = 10V) Figure51. Figure52. Cap Load vs. Cap Load vs.IOUT IsolationResistance Figure53. Figure54.

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www.ti.com SNOS496F –AUGUST 2000–REVISED MARCH 2013 APPLICATION NOTES SHUTDOWN FEATURES The LMC8101 iscapableofbeingturnedoffinordertoconservepower.Once inshutdown,thedevicesupply currentisdrasticallyreduced(1µA maximum) and theoutputwillbe "Tri-stated". The shutdown featureof the LMC8101 isdesignedforflexibility.The thresholdlevelof the SD inputcan be referencedtoeitherV-or V+ by settingthelevelon theSL input.When theSL inputisconnectedtoV-,theSD thresholdlevelisreferencedtoV-and viceversa.Thisthresholdwillbe about1.5V fromthesupplytiedtotheSL pin.So, forthisexample,thedevicewillbe inshutdown as longas theSD pinvoltageiswithin1V ofV-.Inorder toensurethatthedevicewould not"chatter"between activeand shutdown states,hysteresisisbuiltintotheSD pintransition(seeFigure55 foran illustrationofthisfeature).The shutdown thresholdand hysteresislevelare independentofthesupplyvoltage.Figure55 illustrationappliesequallywelltothecase when SL istiedtoV+ and thehorizontalaxisisreferencedtoV+ instead.The SD pinshouldnotbe setwithinthevoltagerangefrom 1.1V to 1.9V of the selectedsupplyvoltagesincethisis a transitionregionand the devicestatuswillbe undetermined. Figure55. Supply Currentvs."SD " Voltage Table1 summarizesthestatusofthedevicewhen theSL and SD pinsareconnecteddirectlytoV-orV+: Table1.LMC8101 StatusSummary SL SD LMC8101 Status V− V− Shutdown V− V+ Active V+ V+ Shutdown V+ V− Active In case shutdown operationisnot needed, as can be seen above, the two pinsSL and SD can simplybe connectedtooppositesupplynodes toachieve"Active"operation.The SL and SD shouldalwaysbe tiedtoa node;ifleftunconnected,thesehighimpedance inputswillfloattoan undeterminedstateand thedevicestatus willbe undeterminedas well. With thedeviceinshutdown,once "Active"operationisinitiated,therewillbe a finiteamount oftimerequired beforethedeviceoutputissettledtoitsfinalvalue.Thistimeislessthan15µs.Inaddition,theremay be some outputspikeduringthistimewhilethedeviceistransitioningintoa fullyoperationalstate.Some applicationsmay be sensitivetothisoutputspikeand properprecautionsshouldbe takeninordertoensureproperoperationatall times. TINY PACKAGE The LMC8101 isavailableinthe DSBGA package as wellthe 8 pinVSSOP package.The DSBGA package requiresapproximately1/4theboardareaofa SOT-23. Thispackage islessthan1mm inheightallowingittobe placedinabsoluteminimum heightclearanceareassuch as cellularhandsets,LCD panels,PCMCIA cards,etc. More informationabouttheDSBGA package can be foundat:http://www.ti.com/packaing. Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:LMC8101

SNOS496F –AUGUST 2000–REVISED MARCH 2013 www.ti.com CONVERSION BOARDS In order to ease the evaluationof tinypackages such as the DSBGA, there is a conversionboard (LMC8101CONV) availabletoboarddesigners.Thisboardconvertsa DSBGA deviceintoan 8 pinDIP package (see Figure56) foreasierhandlingand evaluation.This board can be orderedfrom Texas Instrumentsby contactinghttp://www.ti.com. Figure56. DSBGA Conversion Board pin-out INCREASED OUTPUT CURRENT Compared to the LMC7101, the LMC8101 has an improvedoutputstagecapableof up to threetimeslarger outputsourcingand sinkingcurrent.This improvement would allowa largeroutputvoltageswing range compared totheLMC7101 when connectedtorelativelyheavy loads.For lowersupplyvoltagesthisisan added benefitsinceitincreasesthe outputswing range.For example,the LMC8101 can typicallyswing 2.5Vpp with 2mA sourcingand sinkingoutputcurrent(Vs = 2.7V)whereas theLMC7101 outputswing would be limitedto 1.9Vpp underthesame conditions.Also,compared totheLMC7101 intheSOT-23 package,theLMC8101 can dissipatemore power because both the VSSOP and the DSBGA packages have 40% betterheat dissipation capability. LOWER 1/fNOISE The dominantinputreferrednoiseterm fortheLMC8101 istheinputnoisevoltage.Inputnoisecurrentforthis deviceisofno practicalsignificanceunlesstheequivalentresistanceitlooksintois5M Ω orhigher. The LMC8101's low frequencynoiseissignificantlylowerthanthatoftheLMC7101. For example,at10Hz, the inputreferredspotnoisevoltagedensityis85 nV√Hz as compared toabout200nV√Hz fortheLMC7101. Over a frequencyrangeof0.1Hz to100Hz, thetotalnoiseoftheLMC8101 willbe approximately60% lessthanthatof theLMC7101. LOWER THD When connectedtoheavierloads,theLMC8101 has lowerTHD compared totheLMC7101. For example,with 5V supplyat10KHz and 2Vpp swing(Av = −2),theLMC8101 THD (0.2%)is60% lessthantheLMC7101's.The LMC8101 THD can be kept below 0.1% with 3Vpp at the outputforup to 10KHz (referto the Typical PerformanceCharacteristicsplots). IMPROVING THE CAP LOAD DRIVE CAPABILITY Thiscan be accomplishedinseveralways:

• Outputresistiveloadingincrease: The Phase Marginincreaseswithincreasingload(refertotheTypicalPerformanceCharacteristicsplots).When drivingcapacitiveloads,stabilitycan generallybe improvedby allowingsome outputcurrenttoflowthrougha load.For example,thecap loaddrivecapabilitycan be increasedfrom8200pF to16000pF iftheoutputloadis increasedfrom5kΩ to600Ω (AV = +10,25% overshootlimit,10V supply).
• Isolationresistorbetween outputand cap load:

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www.ti.com SNOS496F –AUGUST 2000–REVISED MARCH 2013 Thisresistorwillisolatethefeedbackpath(whereexcessivephase shiftdue tooutputcapacitancecan cause instability)fromthecapacitiveload.Witha 10V supply,a 100Ω isolationresistorallowsunlimitedcapacitiveload withoutoscillationcompared toonly300pF withoutthisresistor(AV = +1).

• Highersupplyvoltage: OperatingtheLMC8101 athighersupplyvoltagesallowshighercap loadtolerance.At 10V, theLMC8101's low supplyvoltagecap loadlimitof300pF improvestoabout600pF (AV = +1).
• Closedloopgainincrease: As withallOp Amps, thecapacitiveloadtoleranceoftheLMC8101 increaseswithincreasingclosedloopgain.In applicationswhere the loadismostlycapacitiveand the resistiveloadingislight,stabilityincreaseswhen the LMC8101 isoperatedata closedloopgainlargerthan+1. Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:LMC8101

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REVISION HISTORY

Changes from RevisionE (March 2013)toRevisionF Page

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www.ti.com 11-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LMC8101TP/NOPB Active Production DSBGA (YPB) | 8 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 A LMC8101TP/NOPB.A Active Production DSBGA (YPB) | 8 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 A LMC8101TP/NOPB.B Active Production DSBGA (YPB) | 8 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 A LMC8101TPX/NOPB Active Production DSBGA (YPB) | 8 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 A LMC8101TPX/NOPB.A Active Production DSBGA (YPB) | 8 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 A LMC8101TPX/NOPB.B Active Production DSBGA (YPB) | 8 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 A (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Addendum-Page 1

www.ti.com 11-Nov-2025 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 26-Oct-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 26-Oct-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMC8101TP/NOPB DSBGA YPB 8 250 208.0 191.0 35.0 LMC8101TPX/NOPB DSBGA YPB 8 3000 208.0 191.0 35.0 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C0.575 MAX 0.15 0.11 TYP TYP 8X 0.18 0.16 0.5 TYP 0.5 TYP B E A D 4215100/B 07/2016 DSBGA - 0.575 mm max heightYPB0008 DIE SIZE BALL GRID ARRAY NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. SYMM SYMM BALL A1 CORNER SEATING PLANE BALL TYP 0.05 C 1 2

0.015 C A B

A B C SCALE 9.000 D: Max = E: Max = 1.464 mm, Min = 1.464 mm, Min = 1.403 mm 1.403 mm

www.ti.com EXAMPLE BOARD LAYOUT 8X ( 0.16) ( 0.16) METAL

0.05 MAX

( 0.16) SOLDER MASK OPENING

0.05 MIN

(0.5) TYP (0.5) TYP 4215100/B 07/2016 DSBGA - 0.575 mm max heightYPB0008 DIE SIZE BALL GRID ARRAY NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). SOLDER MASK DETAILS NOT TO SCALE 1 2 A B SYMM SYMM LAND PATTERN EXAMPLE SCALE:40X C NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN METAL TYP (0.5) TYP (0.5) TYP 4215100/B 07/2016 DSBGA - 0.575 mm max heightYPB0008 DIE SIZE BALL GRID ARRAY NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. 1 2 A B C SYMM SYMM SOLDER PASTE EXAMPLE BASED ON 0.125mm THICK STENCIL SCALE:50X

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