LMC7221 Tiny CMOS Comparator with Rail-To-Rail Input and Open Drain Output datasheet (Rev. F)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SNOS748,F]
- PDF pages: 24
Technical content
LMC7221 Tiny CMOS Comparator with Rail-To-Rail Input and Open Drain Output
1 Features
- Tiny 5-Pin SOT-23 package saves space
- Package is less than 1.43mm thick
- Ensured specs at 2.7V, 5V, 15V supplies
- Typical supply current 7μA at 5V
- Response time of 420ns at 5V
- LMC7221—open drain output
- Input common-mode range beyond V− and V+
- Low input current
2 Applications
- Mixed voltage battery powered products
- Notebooks and PDAs
- PCMCIA cards
- Mobile communications
- Alarm and security circuits
- Driving low current LEDs
- Direct sensor interface
3 Description
The LM7221 is a micropower CMOS comparator available in the space saving 5-Pin SOT-23 package. This makes this comparator ideal for space and weight critical designs. The LMC7221 is also available in the 8-Pin SOIC package. The LMC7221 is supplied in two offset voltage grades, 5mV and 15mV. The open drain output can be pulled up with a resistor to a voltage which can be higher or lower than the supply voltage—this makes the part useful for mixed voltage systems. For a tiny comparator with a push-pull output, please see the LMC7211 data sheet. Connection Diagram: 8-Pin SOIC – Top View Connection Diagram: 5-Pin SOT-23 – Top View LMC7221 SNOS748F – SEPTEMBER 1999 – REVISED DECEMBER 2025 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
8 Mechanical, Packaging, and Orderable Information..12 LMC7221 SNOS748F – SEPTEMBER 1999 – REVISED DECEMBER 2025 www.ti.com
2 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated
Product Folder Links: LMC7221
4 Specifications
4.1 Absolute Maximum Ratings
See (1) ESD Tolerance (1) 2kV Differential Input Voltage V+ +0.3V, V− −0.3V Voltage at Input V+ +0.3V, V− −0.3V Voltage at Output Pin 15V Supply Voltage (V+–V−) 16V Current at Input Pin (5) ±5mA Current at Output Pin(2) (6) ±30mA Current at Power Supply Pin 40mA Lead Temperature (soldering, 10 sec.) 260°C Junction Temperature (3) 150°C
4.2 Operating Ratings
See (3) Supply Voltage 2.7 ≤ VCC ≤ 15V Temperature Range (3) LMC7221AI, LMC7221BI −40°C to +85°C Thermal Resistance (θJA) 8-Pin SOIC 136°C/W 5-Pin SOT-23 203°C/W 4.3 Electrical Characteristics: 2.7 V Unless otherwise specified, all limits ensured for TJ = 25°C, V+ = 2.7V, V− = 0V, VCM = VO = V+/2. Boldface limits apply at the temperature extremes. Parameter Test Conditions Typ(4) LMC7221AI Limit(5) LMC7221BI Limit(5) Units VOS Input Offset Voltage 3 5 15 mV 8 18 max TCVOS Input Offset Voltage Temperature Drift 1.0 μV/°C IB Input Current 0.04 pA IOS Input Offset Current 0.02 pA CMRR Common Mode Rejection Ratio 0V ≤ VCM ≤ 2.7V 75 dB PSRR Power Supply Rejection Ratio 2.7V ≤ V+ ≤ 15V 80 dB AV Voltage Gain 100 dB CMVR Input Common-Mode Voltage Range CMRR > 55dB 3.0 2.9 2.9 V 2.7 2.7 min CMRR > 55dB −0.3 −0.2 −0.2 V 0.0 0.0 max VOL Output Voltage Low ILOAD = 2.5mA 0.2 0.3 0.3 V 0.4 0.4 max www.ti.com LMC7221 SNOS748F – SEPTEMBER 1999 – REVISED DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: LMC7221
4.3 Electrical Characteristics: 2.7 V (continued) Unless otherwise specified, all limits ensured for TJ = 25°C, V+ = 2.7V, V− = 0V, VCM = VO = V+/2. Boldface limits apply at the temperature extremes. Parameter Test Conditions Typ(4) LMC7221AI Limit(5) LMC7221BI Limit(5) Units IS Supply Current VOUT = Low 7 12 12 μA 14 14 max 4.4 Electrical Characteristics: 5.0 V and 15.0 V Unless otherwise specified, all limits ensured for TJ = 25°C, V+ = 5.0V and 15V, V− = 0V, VCM = VO = V+/2. Boldface limits apply at the temperature extremes. Parameter Test Conditions Typ(4) LMC7221AI Limit(5) LMC7221BI Limit(5) Units VOS Input Offset Voltage 3 5 15 mV 8 18 max TCVOS Input Offset Voltage Temperature Drift V+ = 5V 1.0 μV/°C V+ = 15V 4.0 IB Input Current 0.04 pA IOS Input Offset Current 0.02 pA CMRR Common Mode Rejection Ration V+ = 5.0V 75 dB V+ = 15.0V 82 dB PSRR Power Supply Rejection Ratio 5V ≤ V+ ≤ 10V 80 dB AV Voltage Gain 100 dB CMVR Input Common-Mode Voltage Range V+ = 5.0V CMRR > 55dB 5.3 5.2 5.2 V 5.0 5.0 min V+ = 5.0V CMRR > 55dB −0.3 −0.2 −0.2 V 0.0 0.0 max V+ = 15.0V CMRR > 55dB 15.3 15.2 15.2 V 15.0 15.0 min V+ = 15.0V CMRR > 55dB −0.3 −0.2 −0.2 V 0.0 0.0 max VOL Output Voltage Low V+ = 5V ILOAD = 5mA 0.2 0.40 0.40 mV 0.55 0.55 max V+ = 15V ILOAD = 5mA 0.2 0.40 0.40 mV 0.55 0.55 max IS Supply Current VOUT = Low 7 14 14 μA 18 18 max ISC Short Circuit Current Sinking (6) 45 mA
4.5 Leakage Characteristics
TJ = 25°C Parameter Test Conditions Typ(4) LMC7221AI Limit(5) LMC7221BI Limit(5) Units ILEAKAGE Output Leakage Current V+ = 2.7V VIN(+) = 0.5V VIN(−) = 0V VOUT = 15V 0.1 500 500 nA LMC7221 SNOS748F – SEPTEMBER 1999 – REVISED DECEMBER 2025 www.ti.com
4 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated
Product Folder Links: LMC7221
4.6 AC Electrical Characteristics
Unless otherwise specified, all limits ensured for TJ = 25°C, V+ = 5V, V− = 0V, VCM = VO = V+/2. Boldface limits apply at the temperature extreme. Parameter Test Conditions Typ(4) LMC7221AI Limit(5) LMC7221BI Limit(5) Units trise Rise Time f = 10kHz, CL = 50pF, (7) Overdrive = 10mV, 5kΩ Pullup 15 ns tfall Fall Time f = 10kHz, CL = 50pF, (7) Overdrive = 10mV, 5kΩ Pullup 15 ns tPHL Propagation Delay (High to Low) f = 10kHz, CL = 50pF, 5kΩ Pullup (7) 10mV 900 ns 100mV 450 tPLH Propagation Delay (Low to High) f = 10kHz, CL = 50pF, 5kΩ Pullup (7) 10mV 900 ns 100mV 420 JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (2) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30 mA may adversely affect reliability. (3) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. (4) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. (5) All limits are specified by testing or statistical analysis. (6) Limiting input pin current is only necessary for input voltages which exceed the absolute maximum input voltage rating. (7) Do not short circuit the output to V+ when V+ is greater than 12V or reliability will be adversely affected. www.ti.com LMC7221 SNOS748F – SEPTEMBER 1999 – REVISED DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: LMC7221
4.7 Typical Characteristics
TA = 25°C, VS = 12V, RPULLUP = 2.5k, CL = 20pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. S u p p l y V o l t a g e ( V ) Supply Current per Channel (A) 0 2 4 6 8 1 0 1 2 1 4 1 6 4 . 0 4 . 5 5 . 0 5 . 5 6 . 0 O u t p u t L o w N o L o a d 1 2 5 ° C 2 5 ° C - 4 0 ° C Figure 4-1. Supply Current per Channel vs. Supply Voltage, Output Low S u p p l y V o l t a g e ( V ) Supply Current per Channel (A) 0 2 4 6 8 1 0 1 2 1 4 1 6 4 . 0 4 . 5 5 . 0 5 . 5 6 . 0 O u t p u t L o w N o L o a d 1 2 5 ° C 2 5 ° C - 4 0 ° C Figure 4-2. Supply Current per Channel vs. Supply Voltage, Output High O u t p u t S i n k i n g C u r r e n t ( A ) Output Voltage to V- (V) 1 0 1 0 0 1 m 1 0 m 1 0 0 m 1 m 1 0 m 1 0 0 m 1 0 V S = 5 V 1 2 5 ° C 2 5 ° C - 4 0 ° C Figure 4-3. Output Voltage vs. Output Sinking Current, 5V Figure 4-4. Output Voltage vs. Output Sinking Current, 12V I n p u t O v e r d r i v e ( m V ) Propagation Delay, High to Low (ns) 1 0 2 0 3 0 4 0 5 0 7 0 1 0 0 2 0 0 3 0 0 5 0 0 7 0 0 1 0 0 0 1 0 0 2 0 0 3 0 0 4 0 0 5 0 0 6 0 0 7 0 0 8 0 0 9 0 0 1 0 0 0 V S = 5 V V C M = V S / 2 C L = 2 0 p F 1 2 5 ° C 8 5 ° C 2 5 ° C - 4 0 ° C Figure 4-5. Propagation Delay, High to Low, 5V I n p u t O v e r d r i v e ( m V ) Propagation Delay, High to Low (ns) 1 0 2 0 3 0 4 0 5 0 7 0 1 0 0 2 0 0 3 0 0 5 0 0 7 0 0 1 0 0 0 1 0 0 2 0 0 3 0 0 4 0 0 5 0 0 6 0 0 7 0 0 8 0 0 9 0 0 1 0 0 0 V S = 1 2 V V C M = V S / 2 C L = 2 0 p F 1 2 5 ° C 8 5 ° C 2 5 ° C - 4 0 ° C Figure 4-6. Propagation Delay, High to Low, 12V LMC7221 SNOS748F – SEPTEMBER 1999 – REVISED DECEMBER 2025 www.ti.com
6 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated
Product Folder Links: LMC7221
5 Application and Implementation
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.
5.1 Application Information
5.1.1 Benefits of the LMC7221 Tiny Comparator
5.1.1.1 Size
The small footprint of the 5-Pin SOT-23 packaged Tiny Comparator, (0.120 × 0.118 inches, 3.05 × 3.00mm) saves space on printed circuit boards, and enable the design of smaller electronic products. Because they are easier to carry, many customers prefer smaller and lighter products.
5.1.1.2 Height
The height (0.056 inches, 1.43mm) of the Tiny Comparator makes it possible to use it in PCMCIA type III cards.
5.1.1.3 Simplified Board Layout
The Tiny Comparator can simplify board layout in several ways. First, by placing a comparator where comparators are needed, instead of routing signals to a dual or quad device, long pc traces may be avoided. By using multiple Tiny Comparators instead of duals or quads, complex signal routing and possibly crosstalk can be reduced.
5.1.1.4 Low Supply Current
The typical 7 μA supply current of the LMC7221 extends battery life in portable applications, and may allow the reduction of the size of batteries in some applications.
5.1.1.5 Wide Voltage Range
The LMC7221 is characterized at 15 V, 5 V and 2.7 V. Performance data is provided at these popular voltages. This wide voltage range makes the LMC7221 a good choice for devices where the voltage may vary over the life of the batteries.
5.1.1.6 Digital Outputs Representing Signal Level
Comparators provide a high or low digital output depending on the voltage levels of the (+) and ( −) inputs. This makes comparators useful for interfacing analog signals to microprocessors and other digital circuits. The LMC7221 can be thought of as a one-bit a/d converter.
5.1.1.7 Open Drain Output
The open drain output is like the open collector output of a logic gate. This makes the LMC7221 very useful for mixed voltage systems.
5.1.1.8 Driving LEDs (Light Emitting Diodes)
With a 5 volt power supply, the LMC7221's output sinking current can drive small, high efficiency LEDs for indicator and test point circuits. The small size of the Tiny package makes it easy to find space to add this feature to even compact designs. www.ti.com LMC7221 SNOS748F – SEPTEMBER 1999 – REVISED DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: LMC7221
5.1.1.9 Input Range to Beyond Rail to Rail
The input common mode range of the LMC7221 is slightly larger than the actual power supply range. This wide input range means that the comparator can be used to sense signals close to the power supply rails. This wide input range can make design easier by eliminating voltage dividers, amplifiers, and other front end circuits previously used to match signals to the limited input range of earlier comparators. This is useful to power supply monitoring circuits which need to sense their own power supply, and compare it to a reference voltage which is close to the power supply voltage. The wide input range can also be useful for sensing the voltage drop across a current sense resistor for battery chargers.
5.1.1.10 Zero Crossing Detector
Since the LMC7221's common mode input range extends below ground even when powered by a single positive supply, it can be used with large input resistors as a zero crossing detector.
5.1.1.11 Low Input Currents and High Input Impedance
These characteristics allow the LMC7221 to be used to sense high impedance signals from sensors. They also make it possible to use the LMC7221 in timing circuits built with large value resistors. This can reduce the power dissipation of timing circuits. For very long timing circuits, using high value resistors can reduce the size and cost of large value capacitors for the same R-C time constant.
5.1.1.12 Direct Sensor Interfacing
The wide input voltage range and high impedance of the LMC7221 may make it possible to directly interface to a sensor without the use of amplifiers or bias circuits. In circuits with sensors which can produce outputs in the tens to hundreds of millivolts, the LMC7221 can compare the sensor signal with an appropriately small reference voltage. This may be done close to ground or the positive supply rail. Direct sensor interfacing may eliminate the need for an amplifier for the sensor signal. Eliminating the amplifier can save cost, space, and design time.
5.1.2 Low Voltage Operation
Comparators are the common devices by which analog signals interface with digital circuits. The LMC7221 has been designed to operate at supply voltages of 2.7V without sacrificing performance to meet the demands of 3V digital systems. At supply voltages of 2.7V, the common-mode voltage range extends 200mV (ensured) below the negative supply. This feature, in addition to the comparator being able to sense signals near the positive rail, is extremely useful in low voltage applications. Figure 5-1. Even at Low-Supply Voltage of 2.7V, an Input Signal which Exceeds the Supply Voltages Produces No Phase Inversion at the Output At V+ = 2.7V propagation delays are tPLH = 420ns and tPHL = 450ns with overdrives of 100mV. Please refer to the performance curves for more extensive characterization. LMC7221 SNOS748F – SEPTEMBER 1999 – REVISED DECEMBER 2025 www.ti.com
8 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated
Product Folder Links: LMC7221
5.1.3 Open Drain Output
5.1.3.1 Output Stage
Figure 5-2. LMC7211 Output Stage Figure 5-3. LMC7221 Output Stage Figure 5-2 and Figure 5-3 shows the difference between push-pull output and open drain output. Push pull outputs will have a conventional high or low digital output, the same as a logic gate. Low will be the negative supply rail (usually ground) and high will be the positive supply rail. This is useful if the chips you are interfacing to run on the same supply voltage as the comparator. An example would be an all +5 V system. Open drain outputs will only pull low—for the high output they depend on an external pull-up resistor. This can pull up to a voltage higher or lower than the comparator supply voltage. This voltage can be as high as 15 V. This makes the open drain parts useful in mixed voltage systems. An example would be where the comparator runs at 5 V and the logic circuits are at 3.3 V. The pull-up resistor would go to the 3.3 V supply. Open drain outputs are the CMOS equivalent of open collector outputs.
5.1.4 Output Short Circuit Current
The LMC7221 has short circuit protection of 40 mA. However, it is not designed to withstand continuous short circuits, transient voltage or current spikes, or shorts to any voltage beyond the supplies. A resistor in series with the output should reduce the effect of shorts. For outputs which send signals off PC boards additional protection devices, such as diodes to the supply rails, and varistors may be used.
5.1.5 Input Protection
If input signals are likely to exceed the common mode range of the LMC7221, or it is likely that signals may be present when power is off, damage to the LMC7221 may occur. Large value (100 k Ω to MΩ) input resistors may reduce the likelihood of damage by limiting the input currents. Since the LMC7221 has very low input leakage currents, the effect on accuracy will be small. Additional protection may require the use of diodes, as shown in Figure 5-4. Note that diode leakage current may affect accuracy during normal operation. The R-C time constant of RIN and the diode capacitance may also slow response time. www.ti.com LMC7221 SNOS748F – SEPTEMBER 1999 – REVISED DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: LMC7221
Figure 5-4.
5.1.6 Layout Considerations
The LMC7221 is not an especially fast comparator, so high speed design practices are not required. The LMC7221 is capable of operating with very high impedance inputs, so precautions should be taken to reduce noise pickup with high impedance (≈ 100kΩ and greater) designs and in electrically noisy environments. Keeping high value resistors close to the LMC7221 and minimizing the size of the input nodes is a good practice. With multilayer designs, try to avoid long loops which could act as inductors (coils). Sensors which are not close to the comparator may need twisted pair or shielded connections to reduce noise.
5.1.7 Push-Pull Outputs, Dual Versions
The LMC7211 is a comparator similar to the LMC7221, but with push-pull outputs which can source current. The performance of the LMC7221 is available in a dual device. Please see the LMC6772 data sheet. For a dual device with push-pull outputs, please see the LMC6762 data sheet. Table 5-1. Rail-to-Rail Input Low Power Comparators— Push-Pull Output LMC7221 5-Pin SOT-23, 8-Pin SOIC Single LMC6762 8-Pin SOIC Dual Open Drain Output LMC7221 5-Pin SOT-23, 8-Pin SOIC Single LMC6772 8-Pin SOIC Dual
5.1.8 Additional 5-Pin SOT-23 Tiny Devices
TI has additional parts available in the space saving SOT-23 Tiny package, including amplifiers, voltage references, and voltage regulators, including the following: LMC7101 1 MHz gain-bandwidth rail-to-rail input and output amplifier—high input impedance and high gain 700 μA typical current 2.7 V, 3 V, 5 V and 15 V specifications. LMC7111 Low power 50 kHz gain-bandwidth rail-to-rail input and output amplifier with 25 μA typical current specified at 2.7 V, 3.0 V, 3.3 V, 5 V and 10 V. LM7131 Tiny Video amp with 70 MHz gain bandwidth 3 V, 5 V and ±5 V specifications. LP2980 Micropower SOT 50 mA Ultra Low-Dropout Regulator. LM4041 Precision micropower shut voltage reference 1.225 V and adjustable. LM385 Low current voltage reference. Fixed Voltages of 1.2 V and 2.5 V. Contact your TI representative for the latest information.
5.1.9 Spice Macromodel
A Spice Macromodel is available for the LMC7221 comparator on the TI Amplifier Macromodel disk. Contact your TI representative to obtain the latest version. LMC7221 SNOS748F – SEPTEMBER 1999 – REVISED DECEMBER 2025 www.ti.com
10 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated
Product Folder Links: LMC7221
5.1.10 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.
5.1.10.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
5.1.10.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
5.1.10.3 Trademarks
TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.
5.1.10.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
5.1.10.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions. www.ti.com LMC7221 SNOS748F – SEPTEMBER 1999 – REVISED DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: LMC7221
6 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.
6.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
6.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
6.3 Trademarks
TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.
6.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
6.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
7 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (March 2013) to Revision F (December 2025) Page Changes from Revision D (March 2013) to Revision E (March 2013) Page
8 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. LMC7221 SNOS748F – SEPTEMBER 1999 – REVISED DECEMBER 2025 www.ti.com
12 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated
Product Folder Links: LMC7221
www.ti.com 26-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LMC7221AIM/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LMC72 21AIM LMC7221AIM/NOPB.A Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LMC72 21AIM LMC7221AIM/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LMC72 21AIM LMC7221AIM5 Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -40 to 85 C01A LMC7221AIM5X/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 85 C01A LMC7221AIM5X/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 C01A LMC7221AIM5X/NOPB.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R - Call TI Call TI -40 to 85 LMC7221AIMX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LMC72 21AIM LMC7221AIMX/NOPB.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LMC72 21AIM LMC7221AIMX/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LMC72 21AIM LMC7221BIM Obsolete Production SOIC (D) | 8 - - Call TI Call TI -40 to 85 LMC72 21BIM LMC7221BIM/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LMC72 21BIM LMC7221BIM/NOPB.A Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LMC72 21BIM LMC7221BIM/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LMC72 21BIM LMC7221BIM5 Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -40 to 85 C01B LMC7221BIM5/NOPB Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -40 to 85 C01B LMC7221BIM5X/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 C01B LMC7221BIM5X/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 C01B LMC7221BIMX Obsolete Production SOIC (D) | 8 - - Call TI Call TI -40 to 85 LMC72 21BIM LMC7221BIMX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LMC72 21BIM Addendum-Page 1
www.ti.com 26-Nov-2025 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LMC7221BIMX/NOPB.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LMC72 21BIM LMC7221BIMX/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LMC72 21BIM (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMC7221AIM5X/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LMC7221AIM5X/NOPB SOT-23 DBV 5 3000 180.0 180.0 18.0 LMC7221AIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LMC7221BIM5X/NOPB SOT-23 DBV 5 3000 180.0 180.0 18.0 LMC7221BIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) LMC7221AIM/NOPB D SOIC 8 95 495 8 4064 3.05 LMC7221AIM/NOPB.A D SOIC 8 95 495 8 4064 3.05 LMC7221AIM/NOPB.B D SOIC 8 95 495 8 4064 3.05 LMC7221BIM/NOPB D SOIC 8 95 495 8 4064 3.05 LMC7221BIM/NOPB.A D SOIC 8 95 495 8 4064 3.05 LMC7221BIM/NOPB.B D SOIC 8 95 495 8 4064 3.05 Pack Materials-Page 3
www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800
www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM
www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5
www.ti.com PACKAGE OUTLINE C 0.22
0.08 TYP
0.25 3.0 2.6 2X 0.95 1.9 1.45 0.90 0.15
0.00 TYP
5X 0.5 0.3 0.6
0.3 TYP
0 TYP
1.9 (0.1) (0.15) 4X 0 -15 4X 4 -15 A 3.05 2.75 B1.75 1.45 (1.1) SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25 mm per side. 5. Support pin may differ or may not be present.
0.2 C A B
0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
5X (1.1) 5X (0.6) (2.6) (1.9) 2X (0.95) (R0.05) TYP 4214839/K 08/2024 SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (2.6) (1.9) 2X(0.95) 5X (1.1) 5X (0.6) (R0.05) TYP SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X SYMM PKG 3 4
IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you fully indemnify TI and its representatives against any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale, TI’s General Quality Guidelines, or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Unless TI explicitly designates a product as custom or customer-specified, TI products are standard, catalog, general purpose devices. TI objects to and rejects any additional or different terms you may propose. IMPORTANT NOTICE Copyright © 2026, Texas Instruments Incorporated Last updated 10/2025