LMC7215/25 Micro-Power, R-to-R CMOS Comp w/Push-Pull/Open-Drain Outputs datasheet (Rev. E)

Document overview

  • Manufacturer or author: Texas Instruments, Incorporated [SNOS882,E]
  • PDF pages: 24

Technical content

LMC7215,LMC7225 www.ti.com SNOS882E –SEPTEMBER 1999–REVISED MARCH 2013 LMC7215/LMC7215-Q1/LMC7225Micro-Power,Rail-to-RailCMOS ComparatorswithPush- Pull/Open-DrainOutputs Check forSamples: LMC7215 ,LMC7225 1FEATURES DESCRIPTION The LMC7215/LMC7215-Q1/LMC7225 are ultralow2(TypicalUnless OtherwiseNoted) power comparatorswitha maximum of 1 μA power• UltraLow Power Consumption 0.7μA supplycurrent.They are designedtooperateovera

  • Wide Range ofSupply Voltages2V to8V widerangeofsupplyvoltages,from2V to8V.
  • InputCommon-Mode Range Beyond V+ and V− The LMC7215/LMC7215-Q1/LMC7225 have a
  • Open Collectorand Push-PullOutput greaterthanrail-to-railcommon mode voltagerange. Thisisa realadvantageinsinglesupplyapplications.• High Output CurrentDrive:(@ VS = 5V) 45 mA The LMC7215 featuresa push-pulloutputstage.This• PropagationDelay (@ VS = 5V,10 mV featureallows operationwith absolute minimumOverdrive)25 μs amount ofpower consumptionwhen drivingany load.• Tiny5-PinSOT-23 Package The LMC7225 featuresan open drainoutput.By• Latch-upResistance>300 mA connectingan externalresistor,the outputof the• LMC7215-Q1 isan Automotive Grade Product comparatorcan be used as a levelshifterto anythatisAEC-Q100 Grade 3 Qualified. desiredvoltagetoas highas 15V. The LMC7215/LMC7215-Q1/LMC7225 are designedAPPLICATIONS forsystems where low power consumption is the• Laptop Computers criticalparameter.
  • MobilePhones Ensured operationoverthefullsupplyvoltagerange
  • MeteringSystems of2.7V to5V and rail-to-railperformancemakes this comparatoridealforbattery-poweredapplications.• Hand-held Electronics
  • RC Timers
  • Alarm and MonitoringCircuits
  • Window Comparators,Multivibrators
  • Automotive Connection Diagrams Figure1.8-PinSOIC (Top View) Figure2.5-PinSOT-23 (Top View) Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1999–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

LMC7215,LMC7225 SNOS882E –SEPTEMBER 1999–REVISED MARCH 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings (1)(2) ESD Tolerance(3) 2 kV DifferentialInputVoltage V+ +0.3V,V− −0.3V VoltageatInput/OutputPin V+ +0.3V,V− −0.3V SupplyVoltage(V+–V−) 10V CurrentatInputPin ±5 mA CurrentatOutputPin (4) ±30 mA CurrentatPower SupplyPin 40 mA Lead Temperature (soldering,10 sec) 260°C StorageTemperatureRange −65°C to+150°C JunctionTemperature(5) 150°C (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisintendedtobe functional,butspecificperformanceisnotensured.Forensuredspecificationsand thetest conditions,see theElectricalCharacteristics. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. JEDEC)Field-InducedCharge-DeviceModel,applicablestd.JESD22-C101-C (ESD FICDM std.ofJEDEC). (4) Appliestobothsingle-supplyand split-supplyoperation.Continuousshortcircuitoperationatelevatedambienttemperaturecan resultin exceedingthemaximum allowedjunctiontemperatureof150°C. (5) The maximum power dissipationisa functionofTJ(MAX),θJA,and TA.The maximum allowablepower dissipationatany ambient temperatureisPD = (TJ(MAX) − TA)/θJA.Allnumbers applyforpackagessoldereddirectlyintoa PC board. OperatingRatings (1) SupplyVoltage 2V ≤ VCC ≤ 8V TemperatureRange (2) −40°C to+85°C Package ThermalResistance(θJA) 8-PinSOIC 165°C/W 5-PinSOT-23 325°C/W (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisintendedtobe functional,butspecificperformanceisnotensured.Forensuredspecificationsand thetest conditions,see theElectricalCharacteristics. (2) The maximum power dissipationisa functionofTJ(MAX),θJA,and TA.The maximum allowablepower dissipationatany ambient temperatureisPD = (TJ(MAX) − TA)/θJA.Allnumbers applyforpackagessoldereddirectlyintoa PC board. 2.7Vto5V ElectricalCharacteristics Unlessotherwisespecified,alllimitsspecifiedforTJ = 25°C, V+ = 2.7Vto5V,V− = 0V,VCM = VO = V+/2.Boldfacelimitsapply atthetemperatureextremes. Symbol Parameter Conditions LMC7215 LMC7225 UnitsTyp (1) Limit(2) Limit(2) 1 6 6 mV VOS InputOffsetVoltage 8 8 max InputOffsetVoltageTCV OS 2 μV/°CAverageDrift IB InputCurrent 5 fA IOS InputOffsetCurrent 1 fA Common Mode dBCMRR See (3) 80 60 60RejectionRatio min (1) Typicalvaluesrepresentthemost likelyparametricnorm as determinedatthetimeofcharacterization.Actualtypicalvaluesmay vary overtimeand willalsodepend on theapplicationand configuration.The typicalvaluesarenottestedand arenotspecifiedon shipped productionmaterial. (2) Alllimitsarespecifiedby testingorstatisticalanalysis. eliminatesunitsthathave largeVOS attheVCM extremesand loworoppositeVOS atVCM = VS/2.

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LMC7215,LMC7225 www.ti.com SNOS882E –SEPTEMBER 1999–REVISED MARCH 2013 2.7Vto5V ElectricalCharacteristics(continued) Unlessotherwisespecified,alllimitsspecifiedforTJ = 25°C, V+ = 2.7Vto5V,V− = 0V,VCM = VO = V+/2.Boldfacelimitsapply atthetemperatureextremes. Symbol Parameter Conditions LMC7215 LMC7225 UnitsTyp (1) Limit(2) Limit(2) Power Supply dBPSRR V+ = 2.2Vto8V 90 60 60RejectionRatio min AV VoltageGain 140 dB CMRR > 50 dB 2.7 2.7 min CMRR > 50 dB 5.0 5.0 min CMRR > 50 dB 0.0 0.0 max V+ = 2.2V 2.05 1.8 NA V IOH = 1.5mA 1.7 min V+ = 2.7V 2.05 2.3 NA V VOH OutputVoltageHigh IOH = 2.0mA 2.2 min V+ = 5.0V 4.8 4.6 NA V IOH = 4.0mA 4.5 min V+ = 2.2V 0.17 0.4 0.4 V IOH = 1.5mA 0.5 0.5 max V+ = 2.7V 0.17 0.4 0.4 V VOL OutputVoltageLow IOH = 2.0mA 0.5 0.5 max IOH = 4.0mA 0.5 0.5 max ISC+ OutputShortCircuitCurrent V+ = 2.7V,Sourcing 15 NA mA (4) V+ = 5.0V,Sourcing 50 NA mA OutputShortCircuitCurrent V+ = 2.7V,Sinking 12 mA ISC − (4) V+ = 5.0V,Sinking 30 mA V+ = 2.2V nA ILeakage OutputLeakage Current VIN+ = 0.1V,VIN− = 0V, 0.01 NA 500 max VOUT = 15V V+ = 5.0V 0.7 1 1 μA IS SupplyCurrent VIN+ = 5V,VIN− = 0V 1.2 1.2 max (4) Do notshorttheoutputoftheLMC7225 tovoltagesgreaterthan10V ordamage may occur. AC ElectricalCharacteristics Unlessotherwisespecified,TJ = 25°C, V+ = 5V,V− = 0V,VCM = V+/2 Symbol Parameter Conditions LMC7215 LMC7225 Units Typ (1) Typ (1)(2) trise RiseTime Overdrive= 10 mV (2) 1 12.2 μs tfall FallTime Overdrive= 10 mV (2) 0.4 0.35 μs (1) Typicalvaluesrepresentthemost likelyparametricnorm as determinedatthetimeofcharacterization.Actualtypicalvaluesmay vary overtimeand willalsodepend on theapplicationand configuration.The typicalvaluesarenottestedand arenotspecifiedon shipped productionmaterial. (2) Allmeasurements made at10 kHz.A 100 kΩ pull-upresistorwas used when measuringtheLMC7225. C LOAD = 50 pF includingthetest jigand scope probe.The risetimesoftheLMC7225 area functionoftheR-C timeconstant. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LMC7215 LMC7225

LMC7215,LMC7225 SNOS882E –SEPTEMBER 1999–REVISED MARCH 2013 www.ti.com AC ElectricalCharacteristics(continued) Unlessotherwisespecified,TJ = 25°C, V+ = 5V,V− = 0V,VCM = V+/2 Symbol Parameter Conditions LMC7215 LMC7225 Units Typ (1) Typ (1)(2) tPHL PropagationDelay See (2)(3) Overdrive= 10 mV 24 24 μs (HightoLow) Overdrive= 100 mV 12 12 V+ = 2.7V(2)(3) Overdrive= 10 mV 17 17 μs Overdrive= 100 mV 11 11 tPLH PropagationDelay See (2)(3) Overdrive= 10 mV 24 29 μs (Low toHigh) Overdrive= 100 mV 12 17 V+ = 2.7V(2)(3) Overdrive= 10 mV 17 22 μs Overdrive= 100 mV 11 16 (3) Inputstepvoltageforthepropagationmeasurements is100 mV.

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LMC7215,LMC7225 www.ti.com SNOS882E –SEPTEMBER 1999–REVISED MARCH 2013 TypicalPerformance Characteristics TA= 25°C unlessotherwisespecified Supply Current Prop Delay vs. vs. Supply Voltage VSUPPLY Figure3. Figure4. Prop Delay ShortCircuitCurrent vs. vs. Overdrive VSUPPLY Figure5. Figure6. Output Voltage vs. Output Voltage Output Current vs. LMC7215 Output Current Figure7. Figure8. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LMC7215 LMC7225

LMC7215,LMC7225 SNOS882E –SEPTEMBER 1999–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics(continued) TA= 25°C unlessotherwisespecified Output Voltage vs. Output Voltage Output Current vs. LMC7215 Output Current Figure9. Figure10. Output Leakage Current Output Leakage Current vs. vs. Output Voltage Output Voltage LMC7225 LMC7225 Figure11. Figure12.

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LMC7215,LMC7225 www.ti.com SNOS882E –SEPTEMBER 1999–REVISED MARCH 2013

APPLICATION INFORMATION

Depending upon theamount ofoverdrive,thedelaywilltypicallybe between 10 μs to200 μs.The curveshowing delayvs.overdriveinthe" TypicalCharacteristics" sectionshows thedelaytimewhen theinputispresetwith 100 mV acrosstheinputsand thenisdriventheotherway by 1 mV to500 mV. The transitionfromhightoloworlowtohighisfast.Typically1 μs riseand 400 ns fall. With a small signalinput,the comparatorswillprovidea square wave outputfrom sine wave inputsat frequenciesas highas 25 kHz.Figure13 shows a worstcase example where a ±5 mV sinewave isappliedto theinput.Note thattheoutputisdelayedby almost180°. Figure13. NOISE Most comparatorshave ratherlow gain.Thisallowstheoutputtospend timebetween highand low when the inputsignalchanges slowly.The resultistheoutputmay oscillatebetween highand low when thedifferential inputisnearzero. The exceptionallyhighgainof thesecomparators,10,000 V/mV, eliminatesthisproblem.Less then 1 μV of change on theinputwilldrivetheoutputfromone railtotheotherrail. Ifthe inputsignalisnoisy,the outputcannotignorethe noiseunlesssome hysteresisisprovidedby positive feedback. Figure14. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LMC7215 LMC7225

LMC7215,LMC7225 SNOS882E –SEPTEMBER 1999–REVISED MARCH 2013 www.ti.com INPUT VOLTAGE RANGE The LMC7215/25 have inputvoltageranges thatare largerthan the supplyvoltageensuresthatsignalsfrom otherpartsofthesystemcannotoverdrivetheinputs.Thisallowssensingsupplycurrentby connectingone input directlytotheV+ lineand theothertotheothersideofa currentsense resistor.The same istrueifthesense resistorisinthegroundreturnline. Sensingsupplyvoltageisalsoeasy by connectingone inputdirectlytothesupply. The inputsof thesecomparatorsare protectedby diodesto both supplies.Thisprotectsthe inputsfrom both ESD as wellas signalsthatgreatlyexceed the supplyvoltages.As a result,currentwillflowthroughthese forwardbiaseddiodeswhenever theinputvoltageismore thana few hundredmillivoltslargerthanthesupplies. Untilthisoccurs,thereisessentiallyno inputcurrent.As a result,placinga largeresistorinserieswithany input thatmay be exposed tolargevoltages,willlimittheinputcurrentbuthave no othernoticeableeffect. Iftheinputcurrentislimitedtolessthan5 mA by a seriesresistor,(seeFigure14),a thresholdorzerocrossing detector,thatworks withinputsfrom as low as a few millivoltsto as highas 5,000V,ismade withonlyone resistorand thecomparator. INPUTS As mentionedabove,thesecomparatorshave nearzeroinputcurrent.Thisallowsveryhighresistancecircuitsto be used withoutany concernformatchinginputresistances.Thisalsoallowstheuse ofverysmallcapacitorsin R-C typetimingcircuits.Thisreducesthecostofthecapacitorsand amount ofboardspace used. CAPACITIVE LOADS The highoutputcurrentdriveallowslargecapacitiveloadswithlittleeffect.Capacitiveloadsas largeas 10,000 pF have no effectupon delayand onlyslowthetransitionby about3 μs. OUTPUT CURRENT Even though thesecomparatorsuse lessthan 1 μA supplycurrent,the outputsare ableto driveverylarge currents. The LMC7215 can sourceup to50 mA when operatedon a 5V supply.Both theLMC7215 and LMC7225 can sinkover20 mA. (See thegraphofMax IO vs.VSUPPLY inthe"TypicalCharacteristics”section.) Thislargecurrenthandlingabilityallowsdrivingheavy loadsdirectly.LEDs, beepers and otherloadscan be driveneasily. The push-pulloutputstage of the LMC7215 isa very importantfeature.This keeps the totalsystem power consumptiontotheabsoluteminimum. The onlycurrentconsumed isthelessthan1 μA supplycurrentand the currentgoing directlyintothe load.No power is wasted in a pull-upresistorwhen the outputis low.The LMC7225 isonlyrecommended where a levelshiftingfunctionfromone logicleveltoanotherisdesired,where theLMC7225 isbeingused as a drop-inlowerpower replacementforan oldercomparatoror incircuitswhere more thanone outputwillbe paralleled. POWER DISSIPATION The largeoutputcurrentabilitymakes itpossibletoexceed themaximum operatingjunctiontemperatureof85°C and possiblyeven theabsolutemaximum junctiontemperatureof150°C. The thermalresistanceofthe8-pinSOIC package is165°C/W. Shortingtheoutputtogroundwitha 2.7V supply willonlyresultinabout5°C riseabove ambient. The thermalresistanceofthemuch smaller5-PinSOT-23 package is325°C/W. Witha 2.7V supply,theraiseis only10.5°C butifthesupplyis5V and theshortcircuitcurrentis50 mA, thiswillcause a raiseof41°C inthe8- PinSOIC and 81°C inthe5-PinSOT-23. Thisshouldbe keptinmind ifdrivingverylowresistanceloads.

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LMC7215,LMC7225 www.ti.com SNOS882E –SEPTEMBER 1999–REVISED MARCH 2013 SHOOT-THROUGH Shoot-throughisa common occurrenceon digitalcircuitsand comparatorswhere thereisa push-pulloutput stage.This occurswhen a signalisappliedat the same time to both the N-channeland P-channeloutput transistorstoturnone offand turntheotheron.(See Figure15.)Ifone oftheoutputdevicesrespondsslightly fasterthantheother,thefastone can be turnedon beforetheotherhas turnedoff.For a veryshorttime,this allowssupplycurrenttoflowdirectlythroughbothoutputtransistors.The resultisa shortspikeofcurrentdrawn fromthesupply. Figure15. Figure16. R S = 100Ω The LMC7215 producesa smallcurrentspikeof300 μA peak forabout400 ns with2.7V supplyand 1.8mA peak for400 ns witha 5V supply.Thisspikeonlyoccurswhen theoutputisgoingfromhightolow.Itdoes not occurwhen goingfromlow tohigh.Figure16 and Figure17 show what thiscurrentpulselookslikeon 2.7V and 5V supplies.The uppertraceistheoutputvoltageand thelowertraceisthesupplycurrentas measured withthe circuitinFigure18. Ifthepower supplyhas a veryhighimpedance,a bypass capacitorof0.01μF shouldbe more thanenough to minimizetheeffectsofthissmallcurrentpulse. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LMC7215 LMC7225

LMC7215,LMC7225 SNOS882E –SEPTEMBER 1999–REVISED MARCH 2013 www.ti.com Figure17. R S = 10Ω Figure18. LATCH-UP In the past,most CMOS IC'swere susceptibleto a damaging phenomena known as latch-up.Thisoccurred when an ESD currentspikeor otherlargesignalwas appliedto any of the pinsof an IC.The LMC7215 and LMC7225 both are designed to make them highlyresistantto thistype of damage. They have passed qualificationtestswithinputcurrentson any leadup to300 mA attemperaturesup to125°C. SPICE MODELS Fora SPICE model oftheLMC7215, LMC7225 and many otherop amps and comparators,visitwww.ti.com.

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LMC7215,LMC7225 www.ti.com SNOS882E –SEPTEMBER 1999–REVISED MARCH 2013

REVISION HISTORY

Changes from RevisionD (March 2013)toRevisionE Page Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LMC7215 LMC7225

www.ti.com 11-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LMC7215IM/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LMC72 15IM LMC7215IM/NOPB.A Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LMC72 15IM LMC7215IM/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LMC72 15IM LMC7215IM5 Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -40 to 85 C02B LMC7215IM5/NOPB Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 85 C02B LMC7215IM5/NOPB.A Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 C02B LMC7215IM5/NOPB.B Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 C02B LMC7215IM5X Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -40 to 85 C02B LMC7215IM5X/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 85 C02B LMC7215IM5X/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 C02B LMC7215IM5X/NOPB.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 C02B LMC7215IMX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LMC72 15IM LMC7215IMX/NOPB.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LMC72 15IM LMC7215IMX/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LMC72 15IM LMC7215QIM5/NOPB Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 85 C02Q LMC7215QIM5/NOPB.A Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 85 C02Q LMC7215QIM5/NOPB.B Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 85 C02Q LMC7215QIM5X/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 C02Q LMC7215QIM5X/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 C02Q LMC7215QIM5X/NOPB.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 C02Q LMC7225IM5 Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -40 to 85 C03B LMC7225IM5/NOPB Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 85 C03B LMC7225IM5/NOPB.A Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 85 C03B LMC7225IM5/NOPB.B Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 85 C03B LMC7225IM5X/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 C03B Addendum-Page 1

www.ti.com 11-Nov-2025 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LMC7225IM5X/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 C03B LMC7225IM5X/NOPB.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 C03B (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LMC7215, LMC7215-Q1 :

  • Catalog : LMC7215
  • Automotive : LMC7215-Q1 Addendum-Page 2

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  • Catalog - TI's standard catalog product
  • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMC7215IM5/NOPB SOT-23 DBV 5 1000 208.0 191.0 35.0 LMC7215IM5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LMC7215IM5X/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LMC7215IM5X/NOPB SOT-23 DBV 5 3000 208.0 191.0 35.0 LMC7215IMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LMC7215QIM5/NOPB SOT-23 DBV 5 1000 208.0 191.0 35.0 LMC7215QIM5X/NOPB SOT-23 DBV 5 3000 208.0 191.0 35.0 LMC7225IM5/NOPB SOT-23 DBV 5 1000 208.0 191.0 35.0 LMC7225IM5X/NOPB SOT-23 DBV 5 3000 208.0 191.0 35.0 Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) LMC7215IM/NOPB D SOIC 8 95 495 8 4064 3.05 LMC7215IM/NOPB.A D SOIC 8 95 495 8 4064 3.05 LMC7215IM/NOPB.B D SOIC 8 95 495 8 4064 3.05 Pack Materials-Page 3

www.ti.com PACKAGE OUTLINE C 0.22

0.08 TYP

0.25 3.0 2.6 2X 0.95 1.9 1.45 0.90 0.15

0.00 TYP

5X 0.5 0.3 0.6

0.3 TYP

0 TYP

1.9 (0.1) (0.15) 4X 0 -15 4X 4 -15 A 3.05 2.75 B1.75 1.45 (1.1) SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25 mm per side. 5. Support pin may differ or may not be present.

0.2 C A B

0.1 C SCALE 4.000

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MAX

0.07 MIN

5X (1.1) 5X (0.6) (2.6) (1.9) 2X (0.95) (R0.05) TYP 4214839/K 08/2024 SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN (2.6) (1.9) 2X(0.95) 5X (1.1) 5X (0.6) (R0.05) TYP SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X SYMM PKG 3 4

www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800

www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM

www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5

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