LM810

LM809/LM810 3-Pin Microprocessor Reset Circuits datasheet (Rev. E)

Document overview

• Manufacturer or author: Texas Instruments, Incorporated [SNVS052,E]
• PDF pages: 20

Technical content

µP Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM809,LM810 SNVS052E –SEPTEMBER 1999–REVISED APRIL 2016 LM809/LM8103-PinMicroprocessorResetCircuits

1 Features

1• Precision Monitoring of Supply Voltages – Available Threshold Options:

• Superior Upgrade to MAX809 and MAX810
• Fully Specified Over Temperature
• 140-ms Minimum Power-On Reset Pulse Width, 240-ms Typical – Active-Low RESET Output (LM809) – Active-High RESET Output (LM810)
• Ensured RESET Output Valid for VCC ≥ 1 V
• Low Supply Current, 15-µA Typical
• Power Supply Transient Immunity

2 Applications

• Factory Automation
• Building Automation
• Programmable Logic Control
• Renewable Energy
• Microprocessor Systems
• Computers
• Controllers
• Intelligent Instruments
• Portable/Battery-Powered Equipment
• Automotive

3 Description

The LM809 and LM810 microprocessors supervisory circuits can be used to monitor the power supplies in microprocessor and digital systems. They provide a reset to the microprocessor during power-up, power- down and brown-out conditions. The function of the LM809 and LM810 are to monitor the VCC supply voltage, and assert a reset signal whenever this voltage declines below the factory- programmed reset threshold. The reset signal remains asserted for 240 ms after VCC rises above the threshold. The LM809 has an active-low RESET output, while the LM810 has an active-high RESET output. Seven standard reset voltage options are available, suitable for monitoring 5-V, 3.3-V, and 3-V supply voltages. With a low supply current of only 15 µA, the LM809 and LM810 are ideal for use in portable equipment. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) LM809, LM810 SOT-23 (3) 2.92 mm × 1.30 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application for Microprocessor Reset Circuit

LM809,LM810 SNVS052E –SEPTEMBER 1999–REVISED APRIL 2016 www.ti.com Product Folder Links: LM809 LM810 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Table of Contents

12 Mechanical, Packaging, and Orderable

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (May 2013) to Revision E Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

3 V CC

3 V CC/UNI2009

LM809,LM810 www.ti.com SNVS052E –SEPTEMBER 1999–REVISED APRIL 2016 Product Folder Links: LM809 LM810 Submit Documentation FeedbackCopyright © 1999–2016, Texas Instruments Incorporated

5 Pin Configuration and Functions

NO. LM809 LM810 RESET 2 — O Active-low output. RESET remains low while VCC is below the reset threshold, and for 240 ms after VCC rises above the reset threshold. RESET — 2 O Active-high output. RESET remains high while VCC is below the reset threshold, and for 240 ms after VCC rises above the reset threshold. VCC 3 3 I Supply voltage GND 1 1 — Ground reference

LM809,LM810 SNVS052E –SEPTEMBER 1999–REVISED APRIL 2016 www.ti.com Product Folder Links: LM809 LM810 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.

6 Specifications

6.1 Absolute Maximum Ratings

see (1)(2) MIN MAX UNIT Input supply voltage VCC –0.3 6 V Output voltage RESET, RESET –0.3 VCC + 0.3 V Input current VCC 20 mA Output current RESET, RESET 20 mA Rate of rise VCC 100 V/µs Continuous power dissipation 320 mW Lead temperature (soldering, 10 s) 300 °C Ambient temperature range, TA –40 105 °C Maximum junction temperature, TJ(MAX) 125 °C Storage temperature, Tstg –65 160 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±200 V may actually have higher performance.

6.2 ESD Ratings

V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±200

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCC Input voltage range TA = 0°C to 70°C 1.0 5.5 V TA = –40°C to 105°C 1.2 5.5 ICC Supply Current VCC < 5.5 V, TA = –40°C to 85°C 18 60 µA TA = 85°C to 105°C 100 VCC < 3.6 V, TA = –40°C to 85°C 15 50 TA = 85°C to 105°C 100 (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1) LM809, LM810 UNITDBZ (SOT-23)

3 PINS

RθJA Junction-to-ambient thermal resistance 252.0 °C/W RθJC(top) Junction-to-case (top) thermal resistance 113.3 °C/W RθJB Junction-to-board thermal resistance 53.5 °C/W ψJT Junction-to-top characterization parameter 9.9 °C/W ψJB Junction-to-board characterization parameter 52.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W

LM809,LM810 www.ti.com SNVS052E –SEPTEMBER 1999–REVISED APRIL 2016 Product Folder Links: LM809 LM810 Submit Documentation FeedbackCopyright © 1999–2016, Texas Instruments Incorporated (1) Production testing done at TA = 25°C, over temperature limits specified by design only. (2) RESET Output for LM809, RESET output for LM810.

6.5 Electrical Characteristics

VCC = full range, TA = –40°C to 105°C, unless otherwise noted. Typical values are at TA = 25°C, VCC = 5 V for 4.63, 4.38, and PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VTH Reset Threshold(2) LM8xx: 4.63 V TA = 25°C 4.56 4.63 4.70 V TA = –40°C to 85°C 4.50 4.75 TA = 85°C to 105°C 4.40 4.86 LM8xx: 4.38 V TA = 25°C 4.31 4.38 4.45 TA = –40°C to 85°C 4.25 4.50 TA = 85°C to 105°C 4.16 4.56 LM8xx: 4.00 V TA = 25°C 3.93 4.00 4.06 TA = –40°C to 85°C 3.89 4.10 TA = 85°C to 105°C 3.80 4.20 LM8xx: 3.08 V TA = 25°C 3.04 3.08 3.11 TA = –40°C to 85°C 3.00 3.15 TA = 85°C to 105°C 2.92 3.23 LM8xx: 2.93 V TA = 25°C 2.89 2.93 2.96 TA = –40°C to 85°C 2.85 3.00 TA = 85°C to 105°C 2.78 3.08 LM8xx: 2.63 V TA = 25°C 2.59 2.63 2.66 TA = –40°C to 85°C 2.55 2.70 TA = 85°C to 105°C 2.50 2.76 LM8xx: 2.45 V TA = 25°C 2.41 2.45 2.49 TA = –40°C to 85°C 2.38 2.52 TA = 85°C to 105°C 2.33 2.57 Reset Threshold Temperature Coefficient 30 ppm/°C VCC to Reset Delay(2) VCC = VTH to (VTH – 100 mV) 20 µs Reset Active Timeout Period TA = –40°C to 85°C 140 240 560 ms TA = 85°C to 105°C 100 840 VOL RESET Output Voltage Low (LM809) V VCC > 1 V, ISINK = 50 µA 0.3 RESET Output Voltage Low (LM810) VOH RESET Output Voltage High (LM809) VVCC > VTH(max), ISOURCE = 800 µA, LM809: 4.63, 4.38, 4.00 VCC – 1.5 RESET Output Voltage High (LM810) 1.8 V < VCC < VTH(min), ISOURCE = 150 μA 0.8 × VCC

6.6 Typical Characteristics

Figure 1. Supply Current vs Temperature Figure 2. Supply Current vs Temperature Figure 3. Power-Down Reset Delay vs Temp Figure 4. Power-Down Reset Delay vs Temperature Figure 5. Power-Up Reset Timeout vs Temperature Figure 6. Normalized Reset Threshold vs Temperature

7 Detailed Description

7.1 Overview

provide precision monitoring of supply voltages.

7.2 Functional Block Diagram

7.3 Feature Description

7.3.1 Benefits of Precision Reset Thresholds

A microprocessor supply supervisor must provide a reset output within a predictable range of the supply voltage. apply to 3-V, 3.3-V, and 5-V nominal supply voltages. Table 1. Reset Thresholds Related to Common Supply Voltages

7.3.1.1 Ensuring a Valid Reset Output Down to VCC = 0 V

resistor should be connected from the RESET output to ground, as shown in Figure 7. Figure 7. RESET Valid to VCC = Ground Circuit

7.3.1.2 Negative-Going VCC Transients

capacitor mounted as close as possible to the VCC pin will provide additional transient rejection. Figure 8. Maximum Transient Duration without Causing a Reset Pulse vs Reset Comparator Overdrive

7.3.1.3 Interfacing to µPs with Bidirectional Reset Pins

in Figure 9. Buffer the LM809 RESET output to other system components. Figure 9. Interfacing to Microprocessors with Bidirectional Reset I/O

7.4 Device Functional Modes

7.4.1 VCC Supply Voltage Low

active-low RESET output is low. For LM810, the active-high RESET output is high.

7.4.2 VCC Supply Voltage High

the active-low RESET output rises high. For LM810, the active-high RESET output drops low.

8 Application and Implementation

validate and test their design implementation to confirm system functionality.

8.1 Application Information

of only 15 µA, the LM809 and LM810 are ideal for use in portable equipment.

8.2 Typical Application

Figure 10. Microprocessor RESET Circuit

8.2.1 Design Requirements

For this design example, use the parameters listed in Table 2 as the input parameters. Table 2. Design Parameters

8.2.2 Detailed Design Procedure

highest expected input voltage.

8.2.3 Application Curve

Figure 11. Reset Active Timeout

9 Power Supply Recommendations

taken. An input capacitor is recommended to avoid false reset output triggers due to noise.

10 Layout

10.1 Layout Guidelines

Place the input capacitor as close as possible to the IC.

10.2 Layout Example

Figure 12. Layout Example

11 Device and Documentation Support

11.1 Related Links

resources, tools and software, and quick access to sample or buy. Table 3. Related Links

11.2 Community Resources

solve problems with fellow engineers. contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com 1-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM809M3-2.63/NOPB Active Production SOT-23 (DBZ) | 3 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 105 S3B LM809M3-2.63/NOPB.A Active Production SOT-23 (DBZ) | 3 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 105 S3B LM809M3-2.93/NOPB Active Production SOT-23 (DBZ) | 3 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 105 S4B LM809M3-2.93/NOPB.A Active Production SOT-23 (DBZ) | 3 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 105 S4B LM809M3-3.08/NOPB Active Production SOT-23 (DBZ) | 3 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 105 S5B LM809M3-3.08/NOPB.A Active Production SOT-23 (DBZ) | 3 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 105 S5B LM809M3-4.38/NOPB Active Production SOT-23 (DBZ) | 3 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 105 S7B LM809M3-4.38/NOPB.A Active Production SOT-23 (DBZ) | 3 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 105 S7B LM809M3-4.63/NOPB Active Production SOT-23 (DBZ) | 3 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 105 S8B LM809M3-4.63/NOPB.A Active Production SOT-23 (DBZ) | 3 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 105 S8B LM809M3X-2.63/NOPB Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 105 S3B LM809M3X-2.63/NOPB.A Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 105 S3B LM809M3X-2.93/NOPB Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 105 S4B LM809M3X-2.93/NOPB.A Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 105 S4B LM809M3X-2.93/NOPB.B Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R - Call TI Call TI -40 to 105 LM809M3X-3.08/NOPB Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 105 S5B LM809M3X-3.08/NOPB.A Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 105 S5B LM809M3X-4.38/NOPB Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM - S7B LM809M3X-4.38/NOPB.A Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 105 S7B LM809M3X-4.63/NOPB Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 105 S8B LM809M3X-4.63/NOPB.A Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 105 S8B LM810M3-4.63/NOPB Active Production SOT-23 (DBZ) | 3 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 105 SEB LM810M3-4.63/NOPB.A Active Production SOT-23 (DBZ) | 3 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 105 SEB LM810M3X-4.63/NOPB Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 105 SEB LM810M3X-4.63/NOPB.A Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 105 SEB (1) Status: For more details on status, see our product life cycle. Addendum-Page 1

www.ti.com 1-Nov-2025 (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 1-May-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 1-May-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM809M3-2.63/NOPB SOT-23 DBZ 3 1000 208.0 191.0 35.0 LM809M3-2.93/NOPB SOT-23 DBZ 3 1000 208.0 191.0 35.0 LM809M3-3.08/NOPB SOT-23 DBZ 3 1000 208.0 191.0 35.0 LM809M3-4.38/NOPB SOT-23 DBZ 3 1000 208.0 191.0 35.0 LM809M3-4.63/NOPB SOT-23 DBZ 3 1000 208.0 191.0 35.0 LM809M3X-2.63/NOPB SOT-23 DBZ 3 3000 208.0 191.0 35.0 LM809M3X-2.93/NOPB SOT-23 DBZ 3 3000 208.0 191.0 35.0 LM809M3X-3.08/NOPB SOT-23 DBZ 3 3000 208.0 191.0 35.0 LM809M3X-4.38/NOPB SOT-23 DBZ 3 3000 208.0 191.0 35.0 LM809M3X-4.63/NOPB SOT-23 DBZ 3 3000 208.0 191.0 35.0 LM810M3-4.63/NOPB SOT-23 DBZ 3 1000 208.0 191.0 35.0 LM810M3X-4.63/NOPB SOT-23 DBZ 3 3000 208.0 191.0 35.0 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C 0.20

0.08 TYP

0.25 2.64 2.10

1.12 MAX

0.10

0.01 TYP

3X 0.5 0.3 0.6

0.2 TYP

1.9 0.95 0 -8 TYP 4X 0 -15 4X 4 -15 A 3.04 2.80 B1.4 1.2 (0.95) (0.15) (0.125) SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/F 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length. 4. Support pin may differ or may not be present. 5. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25mm per side

0.2 C A B

0.1 C SCALE 4.000

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MAX

0.07 MIN

3X (1.3) 3X (0.6) (2.1) 2X (0.95) (R0.05) TYP 4214838/F 08/2024 SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE SCALE:15X PKG SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS

www.ti.com EXAMPLE STENCIL DESIGN (2.1) 2X(0.95) 3X (1.3) 3X (0.6) (R0.05) TYP SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/F 08/2024 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X SYMM PKG

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