LM64 ±1°C Remote Diode Temperature Sensor with PWM Fan Control and 5 GPIO's datasheet (Rev. B)

Document overview

  • Manufacturer or author: Texas Instruments, Incorporated [SNAS207,B]
  • PDF pages: 42

Technical content

LM64 ±1°C Remote Diode Temperature Sensor with PWM Fan Control and 5 GPIO's

1 Features

  • Accurately Senses Remote and Local Diode Temperatures
  • Integrated PWM Fan Speed Control Output
  • Programmable 8-step Lookup Table for Quieting Fans
  • ALERT and T_Crit Open-drain Outputs
  • Tachometer Input for Measuring Fan RPM
  • 10 bit Plus Sign Remote Diode Temperature Data Format, with 0.125°C Resolution
  • SMBus 2.0 Compatible Interface, Supports TIMEOUT
  • 5 General Purpose Input/Output pins
  • 5 General Purpose Default input pins
  • 24-pin WQFN Package
  • Key Specifications: – Remote Diode Temperature Accuracy (includes quantization error)
  • Ambient Temp – 30°C to 50°C – 0°C to 85°C
  • Diode Temp – 120°C to 140°C – 25°C to 140°C
  • Max Error – ±1.0°C (max) – ±3.0°C (max) – Local Temp Accuracy (includes quantization error)
  • Ambient Temp 25°C to 125°C
  • Max Error ±3.0°C (max) – Power Supply Requirements
  • Supply DC Voltage 3.0 V to 3.6 V
  • Supply DC Current 1.1 mA (typ)

2 Applications

  • Computer Processor Thermal Management
  • Graphics Processor Thermal Management
  • Voltage Regulator Modules
  • Electronic Instrumentation
  • Power Supplies
  • Projectors

3 Description

The LM64 is a remote diode temperature sensor with PWM fan control. The LM64 accurately measures its own temperature and that of a remote diode. The LM64 remote temperature accuracy is factory trimmed for a MMBT3904 diode-connected transistor with a 16°C offset for high temperatures. TACTUAL DIODE JUNCTION = TLM64 + 16°C The LM64 features a PWM, open-drain, fan control output, 5 GPIO (General Purpose Input/Output) and 5 GPD (General Purpose Default) pins. The 8-step Lookup Table allows for a non-linear fan speed vs. temperature transfer function often used to quiet acoustic fan noise. LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

10.2 Receiving Notification of Documentation Updates..36

12 Mechanical, Packaging, and Orderable

SNAS207B – MAY 2004 – REVISED JANUARY 2024 www.ti.com

2 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM64

4 Pin Configuration and Functions

V GPD5 GPD4 GPD3 T_Crit 234567 10 22 19181716151413 N/C N/C GPIO2 N/C GPD2 GPD1 LM64 DD Figure 4-1. 24-pin WQFN Package Table 4-1. Pin Descriptions Pin Name Input/Output Function and Connection

1 GPIO1 Digital Input/

General Purpose Open-Drain Digital Output or Digital Input. Typical pull-up resistor is 10 kΩ to VDD.

2 GPIO2 Digital Input/

General Purpose Open-Drain Digital Output or Digital Input. Typical pull-up resistor is 10 kΩ to VDD.

3 GPIO3 Digital Input/

General Purpose Open-Drain Digital Output or Digital Input. Typical pull-up resistor is 10 kΩ to VDD.

4 PWM Open-Drain

Open-Drain Digital Output. Connect to fan drive circuitry. The power-on default for this pin is low (pin 4 pulled to ground).

5 VDD Power Supply Input

Connect to a low-noise +3.3 ± 0.3 VDC power supply, and bypass to GND with a 0.1 µF ceramic capacitor in parallel with a 100 pF ceramic capacitor. A bulk capacitance of 10 µF needs to be in the vicinity of the LM64's VDD pin. 6 D+ Analog Input Connect to the anode (positive side) of the remote diode. A 2.2 nF ceramic capacitor must be connected between pins 6 and 7. 7 D- Analog Input Connect to the cathode (negative side) of the remote diode. A 2.2 nF ceramic capacitor must be connected between pins 6 and 7.

8 T_Crit Open-Drain

Open-Drain Digital Output. Typical pull-up resistor is 3 kΩ to VDD. 9 N/C N/A No Connection. 10 N/C N/A No Connection. 11 N/C N/A No Connection. 12 A0 Digital Input SMBus Address Select pin. If High, the SMBus address is 0x4E or, if Low, the SMBus address is 0x18. Typical pull-up resistor is 10 kΩ to VDD. 13 GND Ground This is the analog and digital ground return.

14 ALERT Open-Drain

This pin is an open-drain ALERT Output. Typical pull-up resistor is 3 kΩ to VDD. 15 TACH Digital Input This pin is a digital tachometer input. Typical pull-up resistor is 3 kΩ to VDD.

16 SMBDAT Digital Input/

This is the bi-directional SMBus data line. Typical pull-up resistor is 1.5 kΩ to VDD. 17 SMBCLK Digital Input This is the SMBus clock input. Typical pull-up resistor is 1.5 kΩ to VDD.

18 GPIO5 Digital Input/

General Purpose Open-Drain Digital Output or Digital Input. Typical pull-up resistor is 10 kΩ to VDD. www.ti.com LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: LM64

Table 4-1. Pin Descriptions (continued) Pin Name Input/Output Function and Connection

19 GPIO4 Digital Input/

General Purpose Open-Drain Digital Output or Digital Input. Typical pull-up resistor is 10 kΩ to VDD. 20 GPD1 Digital Input General Purpose Default Input Pin. Typical pull-up resistor is 10 kΩ to VDD. Always connect to a logical High or Low level. 21 GPD2 Digital Input General Purpose Default Input Pin. Typical pull-up resistor is 10 kΩ to VDD. Always connect to a logical High or Low level. 22 GPD3 Digital Input General Purpose Default Input Pin. Typical pull-up resistor is 10 kΩ to VDD. Always connect to a logical High or Low level. 23 GPD4 Digital Input General Purpose Default Input Pin. Typical pull-up resistor is 10 kΩ to VDD. Always connect to a logical High or Low level. 24 GPD5 Digital Input General Purpose Default Input Pin. Typical pull-up resistor is 10 kΩ to VDD. Always connect to a logical High or Low level. LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 www.ti.com

4 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM64

5 Specifications

5.1 Absolute Maximum Ratings

See(1) (2) (3) Supply Voltage, VDD −0.3 V to 6.0 V Voltage on SMBDAT, SMBCLK, ALERT, T_Crit, PWM Pins −0.5 V to 6.0 V Voltage on Other Pins −0.3 V to (VDD + 0. 3 V) Input Current, D− Pin ±1 mA Input Current at All Other Pins (4) 5 mA Package Input Current (4) 30 mA Package Power Dissipation SMBDAT, ALERT, T_Crit, PWM pins See (5) Output Sink Current 10 mA Storage Temperature −65°C to +150°C ESD Susceptibility (6) Human Body Model 2000 V Machine Model 200 V SMT Soldering Information See AN-1187 (SNOA401Q), "Leadless Leadframe Package" for information on SMT Assembly using LLP Packages. (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. (2) All voltages are measured with respect to GND, unless otherwise noted. (3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. (4) When the input voltage (VIN) at any pin exceeds the power supplies (VIN < GND or VIN > V+), the current at that pin should be limited to 5 mA. Parasitic components and/or ESD protection circuitry are shown in the Table 5-1, for the LM64's pins, by an "X" when it exists. Care should be taken not to forward bias the parasitic diode, D1, present on pins D+ and D−. Doing so by more than 50 mV may corrupt temperature measurements. (5) See AN-1187 SNOA401 for Thermal Resistance Junction-to-Ambient Temperature. (6) Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin. See Figure 5-2 for the ESD Protection Input Structure.

5.2 Operating Ratings

See (1) (2) LM64 Operating Temperature Range 0°C ≤ TA ≤ +85°C Remote Diode Temperature Range 25°C ≤ TD ≤ +140°C Electrical Characteristics TMIN ≤ TA ≤ TMAX Supply Voltage Range (VDD) +3.0 V to +3.6 V (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. (2) All voltages are measured with respect to GND, unless otherwise noted. www.ti.com LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: LM64

5.3 DC Electrical Characteristics

TEMPERATURE-TO-DIGITAL CONVERTER CHARACTERISTICS The following specifications apply for VDD = 3.0 VDC to 3.6 VDC, and all analog source impedance RS = 50 Ω unless otherwise specified in the conditions. Boldface limits apply for TA = TMIN to TMAX; all other limits TA = +25°C. Parameter Conditions Typical (1) Limits (2) Units (Limits) Temperature Error using a diode-connected MMBT3904 transistor. TD is the Remote Diode Junction Temperature. TD = TLM64 + 16°C TA = +30°C to +50°C TD = +120°C to +140°C ±1 °C (max) TA = +0°C to +85°C TD = +25°C to +140°C ±3 °C (max) Temperature Error Using the Local Diode TA = +25°C to +125°C (3) ±1 ±3 °C (max) Remote Diode Resolution 11 Bits 0.125 °C Local Diode Resolution 8 Bits 1 °C Conversion Time of All Temperatures Fastest Setting 31.25 34.4 ms (max) D− Source Voltage 0.7 V Diode Source Current (VD+ − VD−) = +0.65 V; High Current 160 315 µA (max) 110 µA (min) Low Current 13 20 µA (max) 7 µA (min) (1) “Typicals” are at TA = 25°C and represent most likely parametric norm. They are to be used as general reference values not for critical design calculations. (2) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level). (3) Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the internal power dissipation of the LM64 and the thermal resistance. See AN-1187 (SNOA401) for the thermal resistance to be used in the self-heating calculation.

5.4 Operating Electrical Characteristics

(1) Limits (2) Units ALERT, T_Crit and PWM Output Saturation Voltage ALERT, T_Crit PWM IOUT 4 mA 6 mA 0.4 V (max) IOUT 6 mA 0.55 Power-On-Reset Threshold Voltage 2.4 V (max)

1.8 V (min)

Supply Current (3) SMBus Inactive, 16 Hz Conversion Rate 1.1 2.0 mA (max) STANDBY Mode 320 µA (1) “Typicals” are at TA = 25°C and represent most likely parametric norm. They are to be used as general reference values not for critical design calculations. (2) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level). (3) The supply current will not increase substantially with an SMBus transaction. LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 www.ti.com

6 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM64

5.5 AC Electrical Characteristics

The following specifications apply for VDD = 3.0 VDC to 3.6 VDC, and all analog source impedance RS = 50Ω unless otherwise specified in the conditions. Boldface limits apply for TA = TMIN to TMAX; all other limits TA= +25°C. Symbol Parameter Conditions Typical (1) Limits (2) Units (Limit) TACHOMETER ACCURACY Fan Control Accuracy ±10 % (max) Fan Full-Scale Count 65535 (max) Fan Counter Clock Frequency 90 kHz Fan Count Update Frequency 1.0 Hz FAN PWM OUTPUT Frequency Accuracy ±10 % (max) (1) “Typicals” are at TA = 25°C and represent most likely parametric norm. They are to be used as general reference values not for critical design calculations. (2) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).

5.6 Digital Electrical Characteristics

Symbol Parameter Conditions Typical (1) Limits (2) Units (Limit) VIH Logical High Input Voltage 2.1 V (min) VIL Logical Low Input Voltage 0.8 V (max) IIH Logical High Input Current VIN = VDD 0.005 +10 µA (max) IIL Logical Low Input Current VIN = GND −0.005 −10 µA (max) CIN Digital Input Capacitance 20 pF (1) “Typicals” are at TA = 25°C and represent most likely parametric norm. They are to be used as general reference values not for critical design calculations. (2) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).

5.7 SMBus Logical Electrical Characteristics

The following specifications apply for VDD = 3.0 VDC to 3.6 VDC, and all analog source impedance RS = 50 Ω unless otherwise specified in the conditions. Boldface limits apply for TA = TMIN to TMAX; all other limits TA = +25°C. Symbol Parameter Conditions Typical (1) Limits (2) Units (Limit) SMBDAT OPEN-DRAIN OUTPUT VOL Logic Low Level Output Voltage IOL = 4 mA 0.4 V (max) IOH High Level Output Current VOUT = VDD 0.03 10 µA (max) SMBDAT, SMBCLK INPUTS VIH Logical High Input Voltage 2.1 V (min) VIL Logical Low Input Voltage 0.8 V (max) VHYST Logic Input Hysteresis Voltage 400 mV (1) “Typicals” are at TA = 25°C and represent most likely parametric norm. They are to be used as general reference values not for critical design calculations. (2) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level). www.ti.com LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: LM64

5.8 SMBus Digital Switching Characteristics

Unless otherwise noted, these specifications apply for VDD = +3.0 VDC to +3.6 VDC, CL (load capacitance) on output lines = 80 pF. Boldface limits apply for TA = TJ; TMIN ≤ TA ≤ TMAX; all other limits TA = TJ = +25°C, unless otherwise noted. The switching characteristics of the LM64 fully meet or exceed the published specifications of the SMBus version 2.0. The following parameters are the timing relationships between SMBCLK and SMBDAT signals related to the LM64. They adhere to but are not necessarily the same as the SMBus bus specifications. Symbol Parameter Conditions Limits (1) Units (Limit) fSMB SMBus Clock Frequency 10 100 kHz (min) kHz (max) tLOW SMBus Clock Low Time From VIN(0) max to VIN(0) max 4.7 µs (min) tHIGH SMBus Clock High Time From VIN(1) min to VIN(1) min 4.0 µs (min) µs (max) tR SMBus Rise Time See (2) 1 µs (max) tF SMBus Fall Time See (3) 0.3 µs (max) tOF Output Fall Time CL = 400 pF, IO = 3 mA 250 ns (max) tTIMEOUT SMBData and SMBCLK Time Low for Reset of Serial Interface See (4) ms (min) ms (max) tSU:DAT Data In Setup Time to SMBCLK High 250 ns (min) tHD:DAT Data Out Hold Time after SMBCLK Low 300 930 ns (min) ns (max) tHD:STA Hold Time after (Repeated) Start Condition. After this period the first clock is generated. 4.0 µs (min) tSU:STO Stop Condition SMBCLK High to SMBDAT Low (Stop Condition Setup) 100 ns (min) tSU:STA SMBus Repeated Start-Condition Setup Time, SMBCLK High to SMBDAT Low 4.7 µs (min) tBUF SMBus Free Time between Stop and Start Conditions 4.7 µs (min) (1) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level). (2) The output rise time is measured from (VIL max - 0.15 V) to (VIH min + 0.15 V). (3) The output fall time is measured from (VIH min + 0.15 V) to (VIL min - 0.15 V). (4) Holding the SMBData and/or SMBCLK lines Low for a time interval greater than tTIMEOUT will reset the LM64’s SMBus state machine, therefore setting SMBDAT and SMBCLK pins to a high impedance state. VIH VIL SMBCLK P S VIH VIL SMBDAT tBUF tHD;STA tLOW tR tHD;DAT tHIGH tF tSU;DAT tSU;STA tSU;STO P Figure 5-1. SMBus Timing Diagram for SMBCLK and SMBDAT Signals LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 www.ti.com

8 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM64

Table 5-1. Pin Name Pin # D1 D2 D3 D4 D5 D6 R1 SNP ESD CLAMP GPIO1 1 X X X GPIO2 2 X X X GPIO3 3 X X X PWM 4 X X X VDD 5 X D+ 6 X X X X X X D− 7 X X X X X X T_Crit 8 X X X X A0 12 X ALERT 14 X X X X TACH 15 X X X SMBDAT 16 X X X SMBCLK 17 X GPIO5 18 X X X GPIO4 19 X X X GPD1 20 X GPD2 21 X GPD3 22 X GPD4 23 X GPD5 24 X SNP GND R1ESD Clamp I/O SNP = NMOS Snapback Figure 5-2. ESD Protection Input Structure www.ti.com LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: LM64

6 Detailed Description

6.1 Overview

The LM64 Remote Diode Temperature Sensor with Integrated Fan Control incorporates a ΔVBE-based temperature sensor using a Local or Remote diode and a 10-bit plus sign ΔΣ ADC (Delta-Sigma Analog-to- Digital Converter). The pulse-width modulated (PWM) open-drain output, with a pull-up resistor, can drive a switching transistor to modulate the fan. The LM64 can measure the fan speed on the pulses from the fan’s open-collector tachometer output, pulled up by a 1.5 k Ω resistor to V DD. The ALERT open-drain output will be pulled low under certain conditions descibed in the sections below. The T_Crit open-drain output will be pulled low when the T_Crit setpoint temperature limit is exceeded. This behaves as a typical comparator function without any latching. The LM64's two-wire interface is compatible with the SMBus Specification 2.0 . For more information the reader is directed to www.smbus.org. In the LM64, digital comparators are used to compare the measured Local Temperature (LT) to the Local High Setpoint user-programmable temperature limit register. The measured Remote Temperature (RT) is digitally compared to the Remote High Setpoint (RHS), the Remote Low Setpoint (RLS), and the Remote T_CRIT Setpoint (RCS) user-programmable temperature limits. An ALERT output will occur when the measured temperature is: (1) higher than either the High Setpoint or the T_CRIT Setpoint, or (2) lower than the Low Setpoint. The ALERT Mask register allows the user to prevent the generation of these ALERT outputs. The temperature hysteresis is set by the value placed in the Hysteresis Register (TH). The LM64 may be placed in a low power Standby mode by setting the Standby bit found in the Configuration Register. In the Standby mode continuous conversions are stopped. In Standby mode the user may choose to allow the PWM output signal to continue, or not, by programming the PWM Disable in Standby bit in the Configuration Register. The Local Temperature reading and setpoint data registers are 8-bits wide. The format of the 11-bit remote temperature data is a 16-bit left justified word. Two 8-bit registers, high and low bytes, are provided for each setpoint as well as the temperature reading. Two Remote Temperature Offset (RTO) Registers: High Byte and Low Byte (RTOHB and RTOLB) may be used to correct the temperature readings by adding or subtracting a fixed value based on a different non-ideality factor of the thermal diode if different from the graphics processor LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 www.ti.com

10 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM64

6.2 Functional Block Diagram

Temp Reading, Temp Limit, Hysteresis, and Temp Sensor Filter Registers Status and Status Mask Registers Comparators PWM Fan Control Registers PWM Fan Control PWM ALERT Tachometer Detection GPD1 GPD2 GPD3 GPD4 GPD5 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 T_Crit TACH GPIO Registers SMBus Address ALERT Control Logic www.ti.com LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: LM64

6.3 Feature Description

6.3.1 Conversion Sequence

The LM64 takes approximately 31.25 ms to convert the Local Temperature (LT), Remote Temperature (RT), and to update all of its registers. The Conversion Rate may be modified using the Conversion Rate Register. When the conversion rate is modified a delay is inserted between conversions, the actual conversion time remains at 31.25 ms. Different Conversion Rates will cause the LM64 to draw different amounts of supply current as shown in Figure 6-1. 0.01 0.1 1.0 10 100 CONVERSION RATE (Hz) 200 500 800 1100 1400 1700 2000 2300 2600 SUPPLY CURRENT (PA Figure 6-1. Supply Current vs Conversion Rate

6.3.2 The ALERT Output

When the ALERT Mask bit in the Configuration register is written as zero the ALERT interrupts are enabled. The LM64's ALERT pin is versatile and can produce three different methods of use to best serve the system designer: (1) as a temperature comparator (2) as a temperature-based interrupt flag, and (3) as part of an SMBus ALERT System. The three methods of use are further described below. The ALERT and interrupt methods are different only in how the user interacts with the LM64. The remote temperature (RT) reading is associated with a T_CRIT Setpoint Register, and both local and remote temperature (LT and RT) readings are associated with a HIGH setpoint register (LHS and RHS). The RT is also associated with a LOW setpoint register (RLS). At the end of every temperature reading a digital comparison determines whether that reading is above its HIGH or T_CRIT setpoint or below its LOW setpoint. If so, the corresponding bit in the ALERT Status Register is set. If the ALERT mask bit is low, any bit set in the ALERT Status Register, with the exception of Busy or Open, will cause the ALERT output to be pulled low. Any temperature conversion that is out of the limits defined in the temperature setpoint registers will trigger an ALERT. Additionally, the ALERT Mask Bit must be cleared to trigger an ALERT in all modes. The three different ALERT modes will be discussed in the following sections.

6.3.2.1 ALERT Output as a Temperature Comparator

When the LM64 is used in a system in which does not require temperature-based interrupts, the ALERT output could be used as a temperature comparator. In this mode, once the condition that triggered the ALERT to go low is no longer present, the ALERT is negated (Figure 6-2). For example, if the ALERT output was activated by the comparison of LT > LHS, when this condition is no longer true, the ALERT will return HIGH. This mode allows operation without software intervention, once all registers are configured during set-up. In order for the ALERT to be used as a temperature comparator, the Comparator Mode bit in the Remote Diode Temperature Filter and Comparator Mode Register must be asserted. This is not the power-on default state. LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 www.ti.com

12 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM64

Status Register: RTDS High TIME TEMPERATURE Figure 6-2. ALERT Output as Temperature Comparator Response Diagram

6.3.2.2 ALERT Output as an Interrupt

The LM64's ALERT output can be implemented as a simple interrupt signal when it is used to trigger an interrupt service routine. In such systems it is desirable for the interrupt flag to repeatedly trigger during or before the interrupt service routine has been completed. Under this method of operation, during the read of the ALERT Status Register the LM64 will set the ALERT Mask bit in the Configuration Register if any bit in the ALERT Status Register is set, with the exception of Busy and Open. This prevents further ALERT triggering until the master has reset the ALERT Mask bit, at the end of the interrupt service routine. The ALERT Status Register bits are cleared only upon a read command from the master (see Figure 6-2 ) and will be re-asserted at the end of the next conversion if the triggering condition(s) persist(s). In order for the ALERT to be used as a dedicated interrupt signal, the Comparator Mode bit in the Remote Diode Temperature Filter and Comparator Mode Register must be set low. This is the power-on default state. The following sequence describes the response of a system that uses the ALERT output pin as an interrupt flag: 1. Master senses ALERT low. 2. Master reads the LM64 ALERT Status Register to determine what caused the ALERT. 3. LM64 clears ALERT Status Register, resets the ALERT HIGH and sets the ALERT Mask bit in the Configuration Register. 4. Master attends to conditions that caused the ALERT to be triggered. The fan is started, setpoint limits are adjusted, etc. 5. Master resets the ALERT Mask bit in the Configuration Register. Remote High Limit RDTS Measurement TIME TEMPERATURE ALERT mask set in response to reading of status register by master LM64 ALERT pin Status Register: RTDS High End of Temperature conversion Figure 6-3. ALERT Output as an Interrupt Temperature Response Diagram

6.3.2.3 ALERT Output as an SMBus ALERT

An SMBus alert line is created when the ALERT output is connected to: (1) one or more ALERT outputs of other SMBus compatible devices, and (2) to a master. Under this implementation, the LM64's ALERT should be operated using the ARA (Alert Response Address) protocol. The SMBus 2.0 ARA protocol, defined in the SMBus specification 2.0, is a procedure designed to assist the master in determining which part generated an interrupt and to service that interrupt. www.ti.com LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: LM64

The SMBus alert line is connected to the open-drain ports of all devices on the bus, thereby AND'ing them together. The ARA method allows the SMBus master, with one command, to identify which part is pulling the SMBus alert line LOW. It also prevents the part from pulling the line LOW again for the same triggering condition. When an ARA command is received by all devices on the bus, the devices pulling the SMBus alert line LOW: (1) send their address to the master and (2) release the SMBus alert line after acknowledgement of their address. The SMBus Specifications 1.1 and 2.0 state that in response to and ARA (Alert Response Address) “after acknowledging the slave address the device must disengage its ALERT pulldown”. Furthermore, “if the host still sees ALERT low when the message transfer is complete, it knows to read the ARA again.” This SMBus “disengaging ALERT requirement prevents locking up the SMBus alert line. Competitive parts may address the “disengaging of ALERT” differently than the LM64 or not at all. SMBus systems that implement the ARA protocol as suggested for the LM64 will be fully compatible with all competitive parts. The LM64 fulfills “disengaging of ALERT” by setting the ALERT Mask Bit in the Configuration Register after sending out its address in response to an ARA and releasing the ALERT output pin. Once the ALERT Mask bit is activated, the ALERT output pin will be disabled until enabled by software. In order to enable the ALERT the master must read the ALERT Status Register, during the interrupt service routine and then reset the ALERT Mask bit in the Configuration Register to 0 at the end of the interrupt service routine. The following sequence describes the ARA response protocol. 1. Master senses SMBus alert line low 2. Master sends a START followed by the Alert Response Address (ARA) with a Read Command. 3. Alerting Device(s) send ACK. 4. Alerting Device(s) send their address. While transmitting their address, alerting devices sense whether their address has been transmitted correctly. (The LM64 will reset its ALERT output and set the ALERT Mask bit once its complete address has been transmitted successfully.) 5. Master/slave NoACK 6. Master sends STOP 7. Master attends to conditions that caused the ALERT to be triggered. The ALERT Status Register is read and fan started, setpoints adjusted, etc. 8. Master resets the ALERT Mask bit in the Configuration Register. The ARA, 000 1100, is a general call address. No device should ever be assigned to this address. The ALERT Configuration bit in the Remote Diode Temperature Filter and Comparator Mode Register must be set low in order for the LM64 to respond to the ARA command. The ALERT output can be disabled by setting the ALERT Mask bit in the Configuration Register. The power-on default is to have the ALERT Mask bit and the ALERT Configuration bit low. Remote High Limit RDTS Measurement TIME TEMPERATURE ALERT mask set in response to ARA from master LM64 ALERT Pin Status Register: Remote High Figure 6-4. ALERT Output as an SMBus ALERT Temperature Response Diagram LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 www.ti.com

14 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM64

6.3.3 SMBus Interface

Since the LM64 operates as a slave on the SMBus, the SMBCLK line is an input and the SMBDAT line is bi-directional. The LM64 never drives the SMBCLK line and it does not support clock stretching. The LM64 has two hardware-selectable 7-bit slave addresses. The user may input a logical High or Low on the A0 Address pin to select one of the two pre-programmed SMBus slave addresses. The options are as follows: Pin SMBus Address 0x[Hex] SMBus Slave Address Bits A6 A5 A4 A3 A2 A1 A0 0 18 0 0 1 1 0 0 0 1 4E 1 0 0 1 1 1 0

6.3.4 Power-On Reset (POR) Default States

For information on the POR default states see Section 7.1.2.

6.3.5 Temperature Data Format

Temperature data can only be read from the Local and Remote Temperature registers. The High, Low and T_CRIT setpoint registers are Read/Write. Remote temperature data is represented by an 11-bit, two's complement word with a Least Significant Bit (LSB) equal to 0.125°C. The data format is a left justified 16-bit word available in two 8-bit registers. Some examples of temperature conversions are shown below. Table 6-1. Actual vs. LM64 Remote Temperature Conversion(1) Actual Remote Diode Temperature,°C LM64 Remote Diode Temperature Register, °C Binary Results in LM64 Remote Temperature Register Hex Remote Temperature Register 120 +104 0110 1000 0000 0000 6800h 125 +109 0110 1101 0000 0000 6D00h 126 +110 0110 1110 0000 0000 6E00h 130 +114 0111 0010 0010 0000 7200h 135 +119 0111 0111 0000 0000 7700h 140 +124 0111 1100 0000 0000 7C00h (1) Output is 11-bit two's complement word. LSB = 0.125 °C. Table 6-2. Actual vs. Remote T_Crit Setpoint Example Actual Remote Diode T_Crit Setpoint,°C Remote T_CRIT High Setpoint, °C Binary Remote T_CRIT High Setpoint Value Hex Remote T_CRIT High Setpoint Value 126 +110 0110 1110 6Eh Local Temperature data is represented by an 8-bit, two's complement byte with an LSB equal to 1°C: Temperature Digital Output Binary Hex +125°C 0111 1101 7D +25°C 0001 1001 19 +1°C 0000 0001 01 0°C 0000 0000 00 −1°C 1111 1111 FF −25°C 1110 0111 E7 −55°C 1100 1001 C9 www.ti.com LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: LM64

6.3.6 Open-Drain Outputs, Inputs, and Pull-Up Resistors

The SMBDAT, ALERT, T_Crit, GPIO and PWM open-drain outputs and the GPD, TACH, and A0 inputs are pulled-up by pull-up resistors to VDDas suggested in the table below. Pin Name Pin Number Suggested Pull-up Resistor Range Typical SMBCLK 17 1 kΩ to 2 kΩ 1.5 kΩ SMBDAT 16 1 kΩ to 2 kΩ 1.5 kΩ ALERT 14 1 kΩ to 5 kΩ 3 kΩ T_Crit 8 1 kΩ to 5 kΩ 3 kΩ A0 12 5 kΩ to 20 kΩ 10 kΩ GPIOx 1-3;18,19 5 kΩ to 20 kΩ 10 kΩ GPDx 20-24 5 kΩ to 20 kΩ 10 kΩ PWM 4 See (1) See (1) TACH 15 1 kΩ to 5 kΩ 3 kΩ (1) Depends on the fan drive circuitry connected to this pin. In the absence of fan control circuitry use a 1 kΩ pull-up resistor to VDD.

6.3.7 Diode Fault Detection

The LM64 can detect fault conditions caused by the remote diode. If the D+ pin is detected to be shorted to VDD, or open: (1) the Remote Temperature High Byte (RTHB) register is loaded with 127°C, (2) the Remote Temperature Low Byte (RTLB) register is loaded with 0, and (3) the OPEN bit (D2) in the status register is set. Therefore, if the Remote T_CRIT setpoint register (RCS): (1) is set to a value less than +127°C and (2) the ALERT Mask is disabled, then the ALERT output pin will be pulled low. If the Remote High Setpoint High Byte (RHSHB) is set to a value less than +127°C and (2) the ALERT Mask is disabled, then the ALERT and T_Crit outputs will be pulled low. The OPEN bit by itself will not trigger an ALERT. If the D+ pin is shorted to either ground or D −, then the Remote Temperature High Byte (RTHB) register is loaded with −128°C (1000 0000) and the OPEN bit in the ALERT Status Register will not be set. A temperature reading of −128°C indicates that D+ is shorted to either ground or D-. If the value in the Remote Low Setpoint High Byte (RLSHB) Register is more than −128°C and the ALERT Mask is Disabled, ALERT will be pulled low.

6.3.8 Communicating with the LM64

Each data register in the LM64 falls into one of four types of user accessibility: 1. Read Only 2. Write Only 3. Read/Write same address 4. Read/Write different address A Write to the LM64 is comprised of an address byte and a command byte. A write to any register requires one data byte. Reading the LM64 Registers can take place after the requisite register setup sequence takes place. See Section 7.1.3.1. The data byte has the Most Significant Bit (MSB) first. At the end of a read, the LM64 can accept either Acknowledge or No-Acknowledge from the Master. Note that the No-Acknowledge is typically used as a signal for the slave indicating that the Master has read its last byte.

6.3.9 Digital Filter

The LM64 incorporates a user-configured digital filter to suppress erroneous Remote Temperature readings due to noise. The filter is accessed in the Remote Diode Temperature Filter and Comparator Mode Register. The filter can be set according to the following table. LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 www.ti.com

16 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM64

Level 2 is maximum filtering. Table 6-3. Digital Filter Selection Table D2 D1 Filter 0 0 No Filter 0 1 Level 1 1 0 Level 1 1 1 Level 2 0 5 10 15 20 25 TEMPERATURE (°C) NUMBER OF SAMPLES No Filter Filter Level 1 Filter Level 2 Figure 6-5. Step Response of the Digital Filter 0 5 10 15 20 25 TEMPERATURE (°C) NUMBER OF SAMPLES No Filter Filter Level 1 Filter Level 2 Figure 6-6. Impulse Response of the Digital Filter 0 50 100 150 200 SAMPLE NUMBER TEMPERATURE (oC) LM64 with Filter On LM64 with Filter Off The Filter on and off curves were purposely offset to better show noise performance. Figure 6-7. Digital Filter Response in an Intel Pentium 4 processor System

6.3.10 Fault Queue

The LM64 incorporates a Fault Queue to suppress erroneous ALERT triggering . The Fault Queue prevents false triggering by requiring three consecutive out-of-limit HIGH, LOW, or T_CRIT temperature readings. See Figure 6-8. The Fault Queue defaults to OFF upon power-up and may be activated by setting the RDTS Fault Queue bit in the Configuration Register to a 1. www.ti.com LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: LM64

Status Register: RTDS High Figure 6-8. Fault Queue Temperature Response Diagram

6.3.11 One-Shot Register

The One-Shot Register is used to initiate a single conversion and comparison cycle when the device is in standby mode, after which the data returns to standby. This is not a data register. A write operation causes the one-shot conversion. The data written to this address is irrelevant and is not stored. A zero will always be read from this register.

6.3.12 Serial Interface Reset

In the event that the SMBus Master is reset while the LM64 is transmitting on the SMBDAT line, the LM64 must be returned to a known state in the communication protocol. This may be done in one of two ways: 1. When SMBDAT is Low, the LM64 SMBus state machine resets to the SMBus idle state if either SMBData or SMBCLK are held Low for more than 35 ms (tTIMEOUT). All devices are to timeout when either the SMBCLK or SMBDAT lines are held Low for 25 ms – 35 ms. Therefore, to insure a timeout of all devices on the bus, either the SMBCLK or the SMBData line must be held Low for at least 35 ms. 2. With both SMBDAT and SMBCLK High, the master can initiate an SMBus start condition with a High to Low transition on the SMBDAT line. The LM64 will respond properly to an SMBus start condition at any point during the communication. After the start the LM64 will expect an SMBus Address address byte. LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 www.ti.com

18 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM64

7 Registers

7.1 LM64 Registers

The following pages include: Section 7.1.1 a Register Map in Hexadecimal Order, which shows a summary of all registers and their bit assignments, Section 7.1.2, a Register Map in Functional Order, and Section 7.1.3, a detailed explanation of each register. Do not address the unused or manufacturer’s test registers.

7.1.1 LM64 Register Map in Hexadecimal Order

The following is a Register Map grouped in hexadecimal address order. Some address locations have been left blank to maintain compatibility with LM86. Addresses in parenthesis are mirrors of “Same As” address for backwards compatibility with some older software. Reading or writing either address will access the same 8-bit register. Register 0x[HEX] Register Name DATA BITS D7 D6 D5 D4 D3 D2 D1 D0

00 Local

LT7 LT6 LT5 LT4 LT3 LT2 LT1 LT0

01 Rmt Temp

RTHB± RTHB14 RTHB13 RTHB12 RTHB11 RTHB10 RTHB9 RTHB8

02 ALERT

BUSY LHIGH 0 RHIGH RLOW RDFA RCRIT TACH

03 Configuratio

n ALTMSK STBY PWMDIS 0 0 ALT/TCH TCRITOV FLTQUE

04 Conversion

0 0 0 0 CONV3 CONV2 CONV1 CONV0

05 Local High

LHS7 LHS6 LHS5 LHS4 LHS3 LHS2 LHS1 LHS0 06 [Reserved] Not Used

07 Rmt High

RHSHB15 RHSHB14 RHHBS13 RHSHB12 RHSHB11 RHSHB10 RHSHB9 RHSHB8

08 Rmt Low

RLSHB15 RLSHB14 RLSHB13 RLSHB12 RLHBS11 RLSHB10 RLSHB9 RLSHB8 (09) Same as 03 (0A) Same as 04 (0B) Same as 05 0C [Reserved] Not Used (0D) Same as 07 (0E) Same as 08 0F One Shot Write Only. Write command triggers one temperature conversion cycle.

10 Rmt Temp

RTLB7 RTLB6 RTLB5 0 0 0 0 0

11 Rmt Temp

RTOHB15 RTOHB14 RTOHB13 RTOHB12 RTOHB11 RTOHB10 RTOHB9 RTOHB8

12 Rmt Temp

RTOLB7 RTOLB6 RTOLB5 0 0 0 0 0

13 Rmt High

RHSLB7 RHSLB6 RHSLB5 0 0 0 0 0

14 Rmt Low

RLSLB7 RLSLB6 RLSLB5 0 0 0 0 0 15 [Reserved] Not Used www.ti.com LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: LM64

0x[HEX] Register Name DATA BITS D7 D6 D5 D4 D3 D2 D1 D0

16 ALERT

1 ALTMSK6 1 ALTMSK4 ALTMSK3 1 ALTMSK1 ALTMSK0

17 [Reserved] Not Used 18 [Reserved] Not Used

19 Rmt TCRIT

RCS7 RCS6 RCS5 RCS4 RCS3 RCS2 RCS1 RCS0 1A General Purpose Input 0 0 0 GPI5 GPI4 GPI3 GPI2 GPI1 1B General Purpose Output 0 0 0 GPO5 GPO4 GPO3 GPO2 GPO1 1C–1F [Reserved] Not Used 20 [Reserved] Not Used

21 Rmt TCRIT

RTH7 RTH6 RTH5 RTH4 RTH3 RTH2 RTH1 RTH0 22–2F [Reserved] Not Used 30–3F [Reserved] Not Used 40–45 [Reserved] Not Used

46 Tach Count

TCLB5 TCLB4 TCLB3 TCLB2 TCLB1 TCLB0 TEDGE1 TEDGE0

47 Tach Count

TCHB13 TCHB12 TCHB11 TCHB10 TCHB9 TCHB8 TCHB7 TCHB6

48 Tach Limit

TLLB7 TLLB6 TLLB5 TLLB4 TLLB3 TLLB2 Not Used Not Used

49 Tach Limit

TLHB15 TLHB14 TLHB13 TLHB12 TLHB11 TLHB10 TLHB9 TLHB8 4A PWM and RPM 0 0 PWPGM PWOUT± PWCKSL 0 TACH1 TACH0 4B Fan Spin-Up Config 0 0 SPINUP SPNDTY1 SPNDTY0 SPNUPT2 SPNUPT1 SPNUPT0 4C PWM Value 0 0 PWVAL5 PWVAL4 PWVAL3 PWVAL2 PWVAL1 PWVAL0 4D PWM Frequency 0 0 0 PWMF4 PWMF3 PWMF2 PWMF1 PWMF0 4E [Reserved] Not Used 4F Lookup Table Hystersis 0 0 0 LOOKH4 LOOKH3 LOOKH2 LOOKH1 LOOKH0 50–5F Lookup Table Lookup Table of up to 8 PWM and Temp Pairs in 8-bit Registers 60–BE [Reserved] Not Used BF Rmt Diode Temp Filter 0 0 0 0 0 RDTF1 RDTF0 ALTCOMP C0–FD [Reserved] Not Used FE Manufacture r’s ID 0 0 0 0 0 0 0 1 FF Stepping/Di e Rev. ID 0 1 0 1 0 0 0 1 LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 www.ti.com

20 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM64

7.1.2 LM64 Register Map in Functional Order

The following is a Register Map grouped in Functional Order. Some address locations have been left blank to maintain compatibility with LM86. Addresses in parenthesis are mirrors of named address. Reading or writing either address will access the same 8-bit register. The Fan Control and Configuration Registers are listed first, as there is a required order to setup these registers first and then setup the others. The detailed explanations of each register will follow the order shown below. POR = Power-On-Reset. Register [HEX] Register Name Read/Write POR Default [HEX] FAN CONTROL REGISTERS 4A PWM and RPM R/W 20 4B Fan Spin-Up Configuration R/W 3F 4D PWM Frequency R/W 17 4C PWM Value Read Only (R/W if Override Bit is Set) 00 50–5F Lookup Table R/W See Table 4F Lookup Table Hysteresis R/W 04 CONFIGURATION REGISTER 03 (09) Configuration R/W 00 TACHOMETER COUNT AND LIMIT REGISTERS

46 Tach Count LSB Read Only N/A

47 Tach Count MSB Read Only N/A

48 Tach Limit LSB R/W FF

49 Tach Limit MSB R/W FF

LOCAL TEMPERATURE AND LOCAL SETPOINT REGISTERS

00 Local Temperature Read Only N/A

05 (0B) Local High Setpoint R/W 46 (70°) REMOTE DIODE TEMPERATURE AND SETPOINT REGISTERS

01 Remote Temperature MSB Read Only N/A

10 Remote Temperature LSB Read Only N/A

11 Remote Temperature Offset MSB R/W 00

12 Remote Temperature Offset LSB R/W 00

07 (0D) Remote High Setpoint MSB R/W 46 (70°C)

13 Remote High Setpoint LSB R/W 00

08 (0E) Remote Low Setpoint MSB R/W 00 (0°C)

14 Remote Low Setpoint LSB R/W 00

19 Remote TCRIT Setpoint R/W 55 (85°C)

21 Remote TCRIT Hys R/W 0A (10°C)

BF Remote Diode Temperature Filter R/W 00 CONVERSION AND ONE-SHOT REGISTERS 04 (0A) Conversion Rate R/W 08 0F One-Shot Write Only N/A ALERT STATUS AND MASK REGISTERS

02 ALERT Status Read Only N/A

16 ALERT Mask R/W A4

FE Manufacturer's ID Read Only 01 FF Stepping/Die Rev. ID Read Only 51 www.ti.com LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: LM64

[HEX] Register Name Read/Write POR Default [HEX] GENERAL PURPOSE REGISTERS 1A General Purpose Input Read Only See (1) 1B General Purpose Output R/W See (2) [RESERVED] REGISTERS—NOT USED

06 Not Used N/A N/A

15 Not Used N/A N/A

17 Not Used N/A N/A

18 Not Used N/A N/A

1C–1F Not Used N/A N/A

20 Not Used N/A N/A

22–2F Not Used N/A N/A 30–3F Not Used N/A N/A 40–45 Not Used N/A N/A 4E Not Used N/A N/A 60–BE Not Used N/A N/A C0–FD Not Used N/A N/A (1) For Register 0x1A the Power-On-Reset for the five LSB's are the logic states present on the 5 GPIOx pins. (2) For Register 0x1B the Power-On-Reset for the five LSB's are the logic states present on the 5 GPDx pins.

7.1.3 LM64 Initial Register Sequence and Register Descriptions in Functional Order

The following is a Register Map grouped in functional and sequence order. Some address locations have been left blank to maintain compatibility with LM86. Addresses in parenthesis are mirrors of named address for backwards compatibility with some older software. Reading or writing either address will access the same 8-bit register.

7.1.3.1 LM64 Required Initial Fan Control Register Sequence

Important! The BIOS must follow the sequence below to configure the following Fan Registers for the LM64 before using any of the Fan or Tachometer or PWM registers: Step [Register]HEX and Setup Instructions(1) 1 [4A] Write bits 0 and 1; 3 and 4. This includes tach settings if used, PWM internal clock select (1.4 kHz or 360 kHz) and PWM Output Polarity. 2 [4B] Write bits 0 through 5 to program the spin-up settings. 3 [4D] Write bits 0 through 4 to set the frequency settings. This works with the PWM internal clock select.

4 Choose, then write, only one of the following:

A. [4F–5F] the Lookup Table, or B. [4C] the PWM value bits 0 through 5. 5 If Step 4A, Lookup Table, was chosen and written then write [4A] bit 5 = 0. (1) All other registers can be written at any time after the above sequence. LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 www.ti.com

22 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM64

7.1.4 LM64 Register Descriptions in Functional Order

7.1.4.1 Fan Control Registers

4AHEX PWM AND RPM REGISTER 4A R/W 7:6 00 PWM Program These bits are unused and always set to 0. 5 1 0: the PWM Value (register 4C) and the Lookup Table (50–5F) are read-only. The PWM value (0 to 100%) is determined by the current remote diode temperature and the Lookup Table, and can be read from the PWM value register. 1: the PWM value (register 4C) and the Lookup Table (Register 50–5F) are read/write enabled. Writing the PWM Value register will set the PWM output. This is also the state during which the Lookup Table can be written. 4 0 PWM Output Polarity 0: the PWM output pin will be 0 V for fan OFF and open for fan ON. 1: the PWM output pin will be open for fan OFF and 0 V for fan ON. 3 0 PWM Clock Select if 0, the master PWM clock is 360 kHz if 1, the master PWM clock is 1.4 kHz. 2 0 [Reserved] Always write 0 to this bit. 1:0 00 Tachometer Mode 00: Traditional tach input monitor, false readings when under minimum detectable RPM. 01: Traditional tach input monitor, FFFF reading when under minimum detectable RPM. 10: Most accurate readings, FFFF reading when under minimum detectable RPM. 11: Least effort on programmed PWM of fan, FFFF reading when under minimum detectable RPM. Note: If the PWM Clock is 360 kHz, mode 00 is used regardless of the setting of these two bits. 4BHEX FAN SPIN-UP CONFIGURATION REGISTER 4B R/W 7:6 0 Fast Tachometer Spin-Up These bits are unused and always set to 0 5 1 If 0, the fan spin-up uses the duty cycle and spin-up time, bits 0–4. If 1, the LM64 sets the PWM output to 100% until the spin-up times out (per bits 0–2) or the minimum desired RPM has been reached (per the Tachometer Setpoint setting) using the tachometer input, whichever happens first. This bit overrides the PWM Spin-Up Duty Cycle register (bits 4:3)—PWM output is always 100%. If PWM Spin-Up Time (bits 2:0) = 000, the Spin-Up cycle is bypassed, regardless of the state of this bit. 4:3 11 PWM Spin-Up Duty Cycle 00: Spin-Up cycle bypassed (no Spin-Up), unless Fast Tachometer Terminated Spin- Up (bit 5) is set. 01: 50% 10: 75%–81% Depends on PWM Frequency. See Applications Notes. 11: 100% 2:0 111 PWM Spin-Up Time 000: Spin-Up cycle bypassed (No Spin-Up) 001: 0.05 seconds 010: 0.1 s 011: 0.2 s 100: 0.4 s 101: 0.8 s 110: 1.6 s 111: 3.2 s 4DHEX FAN PWM FREQUENCY REGISTER 4D R/W 7:5 000 PWM Frequency These bits are unused and always set to 0 4:0 10111 The PWM Frequency = PWM_Clock / 2n, where PWM_Clock = 360 kHz or 1.4 kHz (per the PWM Clock Select bit in Register 4A), and n = value of the register. Note: n = 0 is mapped to n = 1. See the Applications Notes at the end of this datasheet. 4CHEX PWM VALUE REGISTER www.ti.com LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 23 Product Folder Links: LM64

(Write only if reg 4A bit 5 = 1.) 7:6 00 PWM Value These bits are unused and always set to 0 5:0 000000 If PWM Program (register 4A, bit 5) = 0 this register is read only and reflects the LM64’s current PWM value from the Lookup Table. If PWM Program (register 4A, bit 5) = 1, this register is read/write and the desired PWM value is written directly to this register, instead of from the Lookup Table, for direct fan speed control. This register will read 0 during the Spin-Up cycle. See Application Notes section at the end of this datasheet for more information regarding the PWM Value and Duty Cycle in %. 50HEX to 5FHEX LOOKUP TABLE (7 Bits for Temperature and 6 Bits for PWM for each Temperature/PWM Pair) Read. (Write only if reg 4A bit 5 = 1.) 7 0 Lookup Table Temperature Entry 1 This bit is unused and always set to 0. 6:0 0x7F If the remote diode temperature exceeds this value, the PWM output will be the value in Register 51. 7:6 00 Lookup Table PWM Entry 1 These bits are unused and always set to 0. 5:0 0x3F The PWM value corresponding to the temperature limit in register 50. 7 0 Lookup Table Temperature Entry 2 This bit is unused and always set to 0. 6:0 0x7F If the remote diode temperature exceeds this value, the PWM output will be the value in Register 53. 7:6 00 Lookup Table PWM Entry 2 These bits are unused and always set to 0. 5:0 0x3F The PWM value corresponding to the temperature limit in register 52. 7 0 Lookup Table Temperature Entry 3 This bit is unused and always set to 0. 6:0 0x7F If the remote diode temperature exceeds this value, the PWM output will be the value in Register 55. 7:6 00 Lookup Table PWM Entry 3 These bits are unused and always set to 0. 5:0 0x3F The PWM value corresponding to the temperature limit in register 54. 7 0 Lookup Table Temperature Entry 4 This bit is unused and always set to 0. 6:0 0x7F If the remote diode temperature exceeds this value, the PWM output will be the value in Register 57. 7:6 00 Lookup Table PWM Entry 4 These bits are unused and always set to 0. 5:0 0x3F The PWM value corresponding to the temperature limit in register 56. 7 0 Lookup Table Temperature Entry 5 This bit is unused and always set to 0. 6:0 0x7F If the remote diode temperature exceeds this value, the PWM output will be the value in Register 59. 7:6 00 Lookup Table PWM Entry 5 These bits are unused and always set to 0. 5:0 0x3F The PWM value corresponding to the temperature limit in register 58. 7 0 Lookup Table Temperature Entry 6 This bit is unused and always set to 0. 6:0 0x7F If the remote diode temperature exceeds this value, the PWM output will be the value in Register 5B. 7:6 00 Lookup Table PWM Entry 6 These bits are unused and always set to 0. 5:0 0x3F The PWM value corresponding to the temperature limit in register 5A. 7 0 Lookup Table Temperature Entry 7 This bit is unused and always set to 0. 6:0 0x7F If the remote diode temperature exceeds this value, the PWM output will be the value in Register 5D. 7:6 00 Lookup Table PWM Entry 7 These bits are unused and always set to 0. 5:0 0x3F The PWM value corresponding to the temperature limit in register 5C. 7 0 Lookup Table Temperature Entry 8 This bit is unused and always set to 0. 6:0 0x7F If the remote diode temperature exceeds this value, the PWM output will be the value in Register 5F. 7:6 00 Lookup Table PWM Entry 8 These bits are unused and always set to 0. 5:0 0x3F The PWM value corresponding to the temperature limit in register 5E. LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 www.ti.com

24 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM64

4FHEX LOOKUP TABLE HYSTERESIS 4F R/W 7:5 000 Lookup Table Hysteresis These bits are unused and always set to 0 4:0 00100 The amount of hysteresis applied to the Lookup Table. (1 LSB = 1°C).

7.1.4.2 Configuration Register

03 (09)HEX CONFIGURATION REGISTER 03 (09) R/W 7 0 ALERT Mask When this bit is a 0, ALERT interrupts are enabled. When this bit is set to a 1, ALERT interrupts are masked, and the ALERT pin is always in a high impedance (open) state. 6 0 STANDBY When this bit is a 0, the LM64 is in operational mode, converting, comparing, and updating the PWM output continuously. When this bit is a 1, the LM64 enters a low power standby mode. In STANDBY, continuous conversions are stopped, but a conversion/comparison cycle may be initiated by writing any value to register 0x0F. Operation of the PWM output in STANDBY depends on the setting of bit 5 in this register. 5 0 PWM Disable in STANDBY When this bit is a 0, the LM64’s PWM output continues to output the current fan control signal while in STANDBY. When this bit is a 1, the PWM output is disabled (as defined by the PWM polarity bit) while in STANDBY. 4:1 0000 These bits are unused and always set to 0. 0 0 RDTS Fault Queue 0: an ALERT will be generated if any Remote Diode conversion result is above the Remote High Set Point or below the Remote Low Setpoint. 1: an ALERT will be generated only if three consecutive Remote Diode conversions are above the Remote High Set Point or below the Remote Low Setpoint.

7.1.4.3 Tachometer Count And Limit Registers

47HEX TACHOMETER COUNT (MSB) and 46HEX TACHOMETER COUNT (LSB) REGISTERS (16 bits: Read LSB first to lock MSB and ensure MSB and LSB are from the same reading)

47 Read Only 7:0 N/A Tachometer

Count (MSB) These registers contain the current 16-bit Tachometer Count, representing the period of time between tach pulses. Note that the 16-bit tachometer MSB and LSB are reversed from the 16-bit temperature readings Read Only 7:2 N/A Tachometer Count (MSB) Read Only 1:0 00 Tachometer Edge Count Bits: Edges Used Tach_Count_Multiple 00: Reserved - do not use 01: 2 4 10: 2 2 11: 5 1 Note: If PWM_Clock_Select = 360 kHz, then Tach_Count_Multiple = 1 regardless of the setting of these bits. 49HEX TACHOMETER LIMIT (MSB) and 48HEX TACHOMETER LIMIT (LSB) REGISTERS www.ti.com LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 25 Product Folder Links: LM64

49 R/W 7:0 0xFF Tachometer

Limit (MSB) These registers contain the current 16-bit Tachometer Count, representing the period of time between tach pulses. Fan RPM = (f * 5,400,000) / (Tachometer Count), where f = 1 for 2 pulses/rev fan; f = 2 for 1 pulse/rev fan; and f = 2/3 for 3 pulses/rev fan. See the Application Notes section for more tachometer information. Note that the 16-bit tachometer MSB and LSB are reversed from the 16 bit temperature readings. R/W 7:2 0xFF Tachometer Limit (LSB) R/W 1:0 [Reserved] Not Used.

7.1.4.4 Local Temperature And Local High Setpoint Registers

S Hex Read/ Write Bits POR Value Name Description 00HEX LOCAL TEMPERATURE REGISTER (8-bits)

00 Read

Only 7:0 N/A Local Temperature Reading (8-bit) 8-bit temperature of the LM64. 05 (0B)HEX LOCAL HIGH SETPOINT REGISTER (8-bits)

05 R/W 7:0 0x46

(70°) Local HIGH Setpoint High Setpoint for the internal diode.

7.1.4.5 Remote Diode Temperature, Offset And Setpoint Registers

01 Read

Only 7:0 N/A Remote Diode Temperature Reading (MSB) This is the MSB of the LM64 remote diode temperature value, 2’s complement. Bit 7 is the sign bit, bit 6 has a weight 64°C, and bit 0 has a weight of 1°C. Read this byte first. The actual remote diode temperature is 16°C higher than the values in registers 0x01 and 0x10.

10 Read

7:5 N/A Remote Diode Temperature Reading (LSB) This is the LSB of the LM64 remote diode temperature value, in 2’s complement. Bit 7 has a weight 0.5°C, bit 6 has a weight of 0.25°C, and bit 5 has a weight of 0.125°C. The actual remote diode temperature is 16°C higher than the values in registers 0x01 and 0x10. 4:0 00 Always 00.

11 R/W 7:5 00

OFFSET (MSB) These registers contain the offset value added to, or subtracted from, the remote diode’s reading to compensate for the different non-ideality factors of different processors, diodes, etc. The 2’s complement value, in these registers is added to the output of the LM64’s ADC to form the temperature reading contained in registers 01 and 10.12 R/W 7:5 00 Remote Temperature OFFSET (LSB)4:0 00 Always 00. 07 (0D) R/W 7:0 0x46 (70°C) Remote HIGH Setpoint (MSB) High setpoint temperature for remote diode. Same format as Remote Temperature Reading (registers 01 and 10).

13 R/W

7:5 00 Remote HIGH Setpoint (LSB)4:0 00 Always 00. 08 (0E) R/W 7:0 00 (0°C) Remote LOW Setpoint (MSB) Low setpoint temperature for remote diode. Same format as Remote Temperature Reading (registers 01 and 10).

14 R/W

7:5 00 Remote LOW Setpoint (LSB)4:0 00 Always 00.

19 R/W 7:0 0x55

(85°C) Remote Diode T_CRIT Limit This 8-bit integer storing the T_CRIT limit is initially 85°C (101°C actual remote T_Crit limit). This value can be changed at any time after power-up.

21 R/W 7:0 0x0A

(10°C) Remote Diode T_CRIT Hysteresis 8-bit integer storing T_CRIT hysteresis. T_CRIT stays activated until the remote diode temperature goes below [(T_CRIT Limit)—(T_CRIT Hysteresis)]. LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 www.ti.com

26 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM64

7:3 00000 These bits are unused and should always set to 0. 2:1 00 Remote Diode Temperature Filter 00: Filter Disabled 01: Filter Level 1 (minimal filtering, same as 10) 10: Filter Level 1 (minimal filtering, same as 01) 11: Filter Level 2 (maximum filtering) 0 0 Comparator Mode 0: the ALERT pin functions as an Interrupt or ARA mode. 1: the ALERT pin behaves as a comparator, asserting itself when an ALERT condition exists, de-asserting itself when the ALERT condition goes away.

7.1.4.6 ALERT Status And Mask Registers

02HEX ALERT STATUS REGISTER (8-bits) (All Alarms are latched until read, then cleared if alarm condition was removed at the time of the read.) 0x02 Read Only 7 0 Busy When this bit is a 0, the ADC is not converting. When this bit is set to a 1, the ADC is performing a conversion. This bit does not affect ALERT status. 6 0 Local High Alarm When this bit is a 0, the internal temperature of the LM64 is at or below the Local High Setpoint. When this bit is a 1, the internal temperature of the LM64 is above the Local High Setpoint, and an ALERT is triggered. 5 0 This bit is unused and always read as 0. 4 0 Remote High Alarm When this bit is a 0, the temperature of the Remote Diode is at or below the Remote High Setpoint. When this bit is a 1, the temperature of the Remote Diode is above the Remote High Setpoint, and an ALERT is triggered. 3 0 Remote Low Alarm When this bit is a 0, the temperature of the Remote Diode is at or above the Remote Low Setpoint. When this bit is a 1, the temperature of the Remote Diode is below the Remote Low Setpoint, and an ALERT is triggered. 2 0 Remote Diode Fault Alarm When this bit is a 0, the Remote Diode appears to be correctly connected. When this bit is a 1, the Remote Diode may be disconnected or shorted. This Alarm does not trigger an ALERT. 1 0 Remote T_CRIT Alarm When this bit is a 0, the temperature of the Remote Diode is at or below the T_CRIT Limit. When this bit is a 1, the temperature of the Remote Diode is above the T_CRIT Limit, and an ALERT is triggered. 0 0 Tach Alarm When this bit is a 0, the Tachometer count is lower than or equal to the Tachometer Limit (the RPM of the fan is greater than or equal to the minimum desired RPM). When this bit is a 1, the Tachometer count is higher than the Tachometer Limit (the RPM of the fan is less than the minimum desired RPM), and an ALERT is triggered. 16HEX ALERT MASK REGISTER (8-bits) www.ti.com LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 27 Product Folder Links: LM64

16 R/W

7 1 This bit is unused and always read as 1. 6 0 Local High Alarm Mask When this bit is a 0, a Local High Alarm event will generate an ALERT. When this bit is a 1, a Local High Alarm will not generate an ALERT 5 1 This bit is unused and always read as 1. 4 0 Remote High Alarm Mask When this bit is a 0, Remote High Alarm event will generate an ALERT. When this bit is a 1, a Remote High Alarm event will not generate an ALERT. 3 0 Remote Low Alarm Mask When this bit is a 0, a Remote Low Alarm event will generate an ALERT. When this bit is a 1, a Remote Low Alarm event will not generate an ALERT. 2 1 This bit is unused and always read as 1. 1 0 Remote T_CRIT Alarm Mask When this bit is a 0, a Remote T_CRIT event will generate an ALERT. When this bit is a 1, a Remote T_CRIT event will not generate an ALERT. 0 0 Tach Alarm Mask When this bit is a 0, a Tach Alarm event will generate an ALERT. When this bit is a 1, a Tach Alarm event will not generate an ALERT.

7.1.4.7 Conversion Rate And One-Shot Registers

04 (0A)HEX CONVERSION RATE REGISTER (8-bits) 04 (0A) R/W 7:0 0x08 Conversion Rate Sets the conversion rate of the LM64. 00000000 = 0.0625 Hz 00000001 = 0.125 Hz 00000010 = 0.25 Hz 00000011 = 0.5 Hz 00000100 = 1 Hz 00000101 = 2 Hz 00000110 = 4 Hz 00000111 = 8 Hz 00001000 = 16 Hz 00001001 = 32 Hz All other values = 32 Hz 04 (0A)HEX ONE-SHOT REGISTER (8-bits) 0F Write Only 7:0 N/A One Shot Trigger With the LM64 in the STANDBY mode a single write to this register will initiate one complete temperature conversion cycle.

7.1.4.8 ID Registers

FFHEX STEPPING / DIE REVISION ID REGISTER (8-bits) FF Read Only 7:0 0x51 Stepping/Die FEHEX MANUFACTURER’S ID REGISTER (8-bits) FE Read Only 7:0 0x01 Manufacturer’s ID 0x01 = Texas Instruments LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 www.ti.com

28 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM64

7.2 General Purpose Registers

1AHEX GENERAL PURPOSE INPUT REGISTER (8-bits) 1A Read Only 7:5 000 These bits are unused and always set to 0. 4:0 See (1) General Purpose Input These 5 bits reflect the logic states of the GPIOx pins. 1BHEX GENERAL PURPOSE OUTPUT REGISTER (8-bits) 1B R/W 7:5 000 These bits are unused and always set to 0. 4:0 See (2) General Purpose Output These 5 bits reflect the GPI register bits [4:0] except for Power-On-Default when they are the 5 logic states of the General Pupose Default (GPD) input pins. (1) For Register 0x1A the Power-On-Reset for the five LSB's are the logic states present on the 5 GPIOx pins. (2) For Register 0x1B the Power-On-Reset for the five LSB's are the logic states present on the 5 GPDx pins. www.ti.com LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 29 Product Folder Links: LM64

8 Application and Implementation

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

8.1 Application Information

8.1.1 Fan Control Duty Cycle VS. Register Settings and Frequency PWM Freq [4:0] Step Resolution, PWM Value 4D [5:0] for 100% PWM Value 4C [5:0] for about 75% PWM Value 4C [5:0] for 50% PWM Freq at 360 kHz Internal Clock, kHz PWM Freq at 1.4 kHz Internal Clock, Hz Actual Duty Cycle, % When 75% is Selected

0 Address 0 is mapped to Address 1

1 50 2 1 1 180.0 703.1 50.0 2 25 4 3 2 90.00 351.6 75.0 3 16.7 6 5 3 60.00 234.4 83.3 4 12.5 8 6 4 45.00 175.8 75.0 5 10.0 10 8 5 36.00 140.6 80.0 6 8.33 12 9 6 30.00 117.2 75.0 7 7.14 14 11 7 25.71 100.4 78.6 8 6.25 16 12 8 22.50 87.9 75.0 9 5.56 18 14 9 20.00 78.1 77.8 10 5.00 20 15 10 18.00 70.3 75.0 11 4.54 22 17 11 16.36 63.9 77.27 12 4.16 24 18 12 15.00 58.6 75.00 13 3.85 26 20 13 13.85 54.1 76.92 14 3.57 28 21 14 12.86 50.2 75.00 15 3.33 30 23 15 12.00 46.9 76.67 16 3.13 32 24 16 11.25 43.9 75.00 17 2.94 34 26 17 10.59 41.4 76.47 18 2.78 36 27 18 10.00 39.1 75.00 19 2.63 38 29 19 9.47 37.0 76.32 20 2.50 40 30 20 9.00 35.2 75.00 21 2.38 42 32 21 8.57 33.5 76.19 22 2.27 44 33 22 8.18 32.0 75.00 23 2.17 46 35 23 7.82 30.6 76.09 24 2.08 48 36 24 7.50 29.3 75.00 25 2.00 50 38 25 7.20 28.1 76.00 26 1.92 52 39 26 6.92 27.0 75.00 27 1.85 54 41 27 6.67 26.0 75.93 28 1.79 56 42 28 6.42 25.1 75.00 29 1.72 58 44 29 6.21 24.2 75.86 30 1.67 60 45 30 6.00 23.4 75.00 31 1.61 62 47 31 5.81 22.7 75.81 LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 www.ti.com

30 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM64

8.1.1.1 Computing Duty Cycles for a Given Frequency

Select a PWM Frequency from the first column corresponding to the desired actual frequency in columns 6 or 7. Note the PWM Value for 100% Duty Cycle. Find the Duty Cycle by taking the PWM Value of Register 4C and computing: %100 %100___ __(%) u= forValuePWM ValuePWMDutyCycle (1) Example: For a PWM Frequency of 24, a PWM Value at 100% = 48 and PWM Value actual = 28, then the Duty

8.1.2 Use of the Lookup Table for Non-Linear PWM Values VS Temperature

The Lookup Table, Registers 50 through 5F, can be used to create a non-linear PWM vs Temperature curve that could be used to reduce the acoustic noise from processor fan due to linear or step transfer functions. An example is given below: EXAMPLE: In a particular system it was found that the best acoustic fan noise performance was found to occur when the PWM vs Temperature transfer function curve was parabolic in shape. From 25°C to 105°C the fan is to go from 20% to 100%. Since there are 8 steps to the Lookup Table we will break up the Temperature range into 8 separate temperatures. For the 80°C over 8-steps = 10°C per step. This takes care of the x-axis. For the PWM Value, we first select the PWM Frequency. In this example we will make the PWM Frequency (Register 4C) 20. For 100% Duty Cycle then, the PWM value is 40. For 20% the minimum is 40 x (0.2) = 8. We can then arrange the PWM, Temperature pairs in a parabolic fashion in the form of y = 0.005 • (x −25)2 + 8 Temperature PWM Value Calculated Closest PWM Value 25 8.0 8 35 8.5 9 45 10.0 10 55 12.5 13 65 16.0 16 75 20.5 21 85 26.0 26 95 32.5 33 105 40.0 40 We can then program the Lookup Table with the temperature and Closest PWM Values required for the curve required in our example.

8.1.3 NON-Ideality Factor and Temperature Accuracy

The LM64 can be applied to remote diode sensing in the same way as other integrated-circuit temperature sensors. It can be soldered to a printed-circuit board, and because the path of best thermal conductivity is between the die and the pins, its temperature will effectively be that of the printed-circuit board lands and traces soldered to its pins. This presumes that the ambient air temperature is nearly the same as the surface temperature of the printed-circuit board. If the air temperature is much higher or lower than the surface temperature, the actual temperature of the LM64 die will be an intermediate temperature between the surface www.ti.com LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 31 Product Folder Links: LM64

and air temperatures. Again, the primary thermal conduction path is through the leads, so the circuit board surface temperature will contribute to the die temperature much more than the air temperature. To measure the temperature external to the die use a remote diode. This diode can be located on the die of the target IC, such as a CPU processor chip, allowing measurement of the IC’s temperature, independent of the LM64’s temperature. The LM64 has been optimized for use with a MMBT3904 diode-connected transistor. A discrete diode can also be used to sense the temperature of external objects or ambient air. Remember that a discrete diode’s temperature will be affected, and often dominated by, the temperature of its leads. Most silicon diodes do not lend themselves well to this application. It is recommended that a diode-connected MMBT3904 transistor be used. The base of the transistor is connected to the collector and becomes the anode. The emitter is the cathode.

8.1.3.1 Diode Non_Ideality

When a transistor is connected to a diode the following relationship holds for Vbe, T, and IF: SF II ˜ e ˜ T be V V K 1 ª º (2) where VT = q kT (3)

  • q = 1.6x10−19 Coulombs (the electron charge)
  • T = Absolute Temperature in Kelvin
  • k = 1.38x10−23 joules/K (Boltzmann’s constant)
  • η is the non-ideality factor of the manufacturing process used to make the thermal diode
  • Is = Saturation Current and is process dependent
  • If = Forward Current through the base emitter junction
  • Vbe = Base Emitter Voltage Drop In the active region, the −1 term is negligible and may be eliminated, yielding the following equation SF II ˜ e ˜ T be V V K ª º (4) In the above equation, η and Is are dependent upon the process that was used in the fabrication of the particular diode. By forcing two currents with a very controlled ratio (N) and measuring the resulting voltage difference, it is possible to eliminate the Is term. Solving for the forward voltage difference yields the relationship: N q kTVbe ln˜¸¨ ' K ¸ (5) The non-ideality factor, η, is the only other parameter not accounted for and depends on the diode that is used for measurement. Since ΔVbe is proportional to both η and T, the variations in η cannot be distinguished from variations in temperature. Since the temperature sensor does not control the non-ideality factor, it will directly add to the inaccuracy of the sensor. LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 www.ti.com

32 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM64

For example, if a processor manufacturer specifies a ±0.1% variation in η from part to part. As an example, assume that a temperature sensor has an accuracy specification of ±1°C at room temperature of 25°C. The resulting accuracy will be: The additional inaccuracy in the temperature measurement caused by η, can be eliminated if each temperature sensor is calibrated with the remote diode that it will be paired with. Refer to the processor datasheet for the non-ideality factor.

8.1.3.2 Compensating for Diode Non-Ideality

In order to compensate for the errors introduced by non-ideality, the temperature sensor is calibrated for a particular processor. Texas Instruments temperature sensors are always calibrated to the typical non-ideality of a particular processor type. The LM64 is calibrated for a MMBT3904 diode-connected transistor. When a temperature sensor, calibrated for a specific type of processor is used with a different processor type or a given processor type has a non-ideality that strays form the typical value, errors are introduced. Temperature errors associated with non-ideality may be introduced in a specific temperature range of concern through the use of the Temperature Offset Registers 11HEX and 12HEX. The user is encouraged to send an e-mail to hardware.monitor.team@nsc.com to further request information on our recommended setting of the offset register for different processor types.

8.1.4 Computing RPM of the Fan from the TACH Count

The Tach Count Registers 46 HEX and 47 HEX count the number of periods of the 90 kHz tachometer clock in the LM64 for the tachometer input from the fan assuming a 2 pulse per revolution fan tachometer, such as the fans supplied with the Pentium 4 boxed processors. The RPM of the fan can be computed from the Tach Count Registers 46HEX and 47HEX. This can best be shown through an example. Example: Given: the fan used has a tachometer output with 2 per revolution. Let: Register 46 (LSB) is BFHEX = Decimal (11 x 16) + 15 = 191 and Register 47 (MSB) is 7HEX = Decimal (7 x 256) = 1792. The total Tach Count, in decimal, is 191 + 1792 = 1983. The RPM is computed using the formula )_(__ 000,400, 5_ DecimalCountTachTotal fRPMFan u= (6) where f = 1 for 2 pulses/rev fan tachometer output; f = 2 for 1 pulse/rev fan tachometer output, and f = 2 / 3 for 3 pulses/rev fan tachometer output For our example RPMRPMFan _2723 1983 (7) www.ti.com LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 33 Product Folder Links: LM64

8.2 Typical Application

T_CRIT VDD VDD N/C N/C To SMBus interface control circuitry Fan V+ Fan V- R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 GPD5 GPD4 GPD3 GPD2 GPD1 8 9 10 11 12

2021222324 C4 C5

T_CRIT R15 R16 R17 R18 Thermal Diode on-board Processor Die R1 - R10; R15 = 10 k: R17 = 430: R18 = 10: R11, R12 = 1.5 k: C1 = 10 PF electrolytic C2, C5 = 0.1 PF ceramic C3 = 100 pF ceramic C4 = 2.2 PF electrolytic C3C1 C2 Q2 = MMBT3904 S5 S4 S3 S2 S1 S1 - S5 = SPST Switch C6 = 2.2 nF ceramic R13, R14, R16 = 3 k: LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 www.ti.com

34 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM64

9 Layout

9.1 PCB Layout for Minimizing Noise

Figure 9-1. Ideal Diode Trace Layout In a noisy environment, such as a processor mother board, layout considerations are very critical. Noise induced on traces running between the remote temperature diode sensor and the LM64 can cause temperature conversion errors. Keep in mind that the signal level the LM64 is trying to measure is in microvolts. The following guidelines should be followed: 1. Place a 0.1 µF power supply bypass capacitor as close as possible to the VDD pin and the recommended 2.2 nF capacitor as close as possible to the LM64's D+ and D− pins. Make sure the traces to the 2.2 nF capacitor are matched. 2. Ideally, the LM64 should be placed within 10 cm of the Processor diode pins with the traces being as straight, short and identical as possible. Trace resistance of 1 Ω can cause as much as 1°C of error. This error can be compensated by using the Remote Temperature Offset Registers, since the value placed in these registers will automatically be subtracted from or added to the remote temperature reading. 3. Diode traces should be surrounded by a GND guard ring to either side, above and below if possible. This GND guard should not be between the D+ and D− lines. In the event that noise does couple to the diode lines it would be ideal if it is coupled common mode. That is equally to the D+ and D− lines. 4. Avoid routing diode traces in close proximity to power supply switching or filtering inductors. 5. Avoid running diode traces close to or parallel to high speed digital and bus lines. Diode traces should be kept at least 2 cm apart from the high speed digital traces. 6. If it is necessary to cross high speed digital traces, the diode traces and the high speed digital traces should cross at a 90 degree angle. 7. The ideal place to connect the LM64's GND pin is as close as possible to the Processor's GND associated with the sense diode. 8. Leakage current between D+ and GND should be kept to a minimum. One nano-ampere of leakage can cause as much as 1°C of error in the diode temperature reading. Keeping the printed circuit board as clean as possible will minimize leakage current. Noise coupling into the digital lines greater than 400 mVp-p (typical hysteresis) and undershoot less than 500 mV below GND, may prevent successful SMBus communication with the LM64. SMBus no acknowledge is the most common symptom, causing unnecessary traffic on the bus. Although the SMBus maximum frequency of communication is rather low (100 kHz max), care still needs to be taken to ensure proper termination within a system with multiple parts on the bus and long printed circuit board traces. An RC lowpass filter with a 3 dB corner frequency of about 40 MHz is included on the LM64's SMBCLK input. Additional resistance can be added in series with the SMBData and SMBCLK lines to further help filter noise and ringing. Minimize noise coupling by keeping digital traces out of switching power supply areas as well as ensuring that digital lines containing high speed data communications cross at right angles to the SMBData and SMBCLK lines. www.ti.com LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 35 Product Folder Links: LM64

10 Device and Documentation Support

10.1 Documentation Support

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

10.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

10.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

10.4 Trademarks

TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

10.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

10.6 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions. LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 www.ti.com

36 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM64

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (March 2013) to Revision B (January 2024) Page

  • Updated format to match new TI layout and flow. Tables, figures and cross-references use a new numbering Changes from Revision * (May 2004) to Revision A (March 2013) Page

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com LM64 SNAS207B – MAY 2004 – REVISED JANUARY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 37 Product Folder Links: LM64

www.ti.com 9-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM64CILQ-F/NOPB Active Production WQFN (NHW) | 24 1000 | SMALL T&R Yes SN Level-3-260C-168 HR 0 to 125 64CILQF LM64CILQ-F/NOPB.A Active Production WQFN (NHW) | 24 1000 | SMALL T&R Yes SN Level-3-260C-168 HR 0 to 125 64CILQF (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 1-Aug-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 1-Aug-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM64CILQ-F/NOPB WQFN NHW 24 1000 208.0 191.0 35.0 Pack Materials-Page 2

www.ti.com LQA24A (Rev B)

IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you fully indemnify TI and its representatives against any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale, TI’s General Quality Guidelines, or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Unless TI explicitly designates a product as custom or customer-specified, TI products are standard, catalog, general purpose devices. TI objects to and rejects any additional or different terms you may propose. IMPORTANT NOTICE Copyright © 2025, Texas Instruments Incorporated Last updated 10/2025