LM6 2 2.7V, 15.6 mV/C SOT-23 Temperature Sensor datasheet (Rev. E)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SNIS105,E]
- PDF pages: 17
Technical content
www.ti.com SNIS105E –JUNE 1999–REVISED MARCH 2013 LM622.7V,15.6mV/°C SOT-23TemperatureSensor Check forSamples: LM62 1FEATURES DESCRIPTION The LM62 is a precision integrated-circuit 2• CalibratedLinearScaleFactorof+15.6mV/ °C temperaturesensorthatcan sense a 0°C to +90°C• Rated forFull0°C to+90°C Range with3.0V temperaturerange while operatingfrom a singleSupply +3.0V supply.The LM62's outputvoltageislinearly
- SuitableforRemote Applications proportionalto Celsius (Centigrade)temperature (+15.6mV/°C) and has a DC offsetof+480 mV. The offsetallows reading temperaturesdown to 0°CAPPLICATIONS withouttheneed fora negativesupply.The nominal• CellularPhones outputvoltageoftheLM62 rangesfrom +480 mV to
- Computers +1884 mV fora 0°C to +90°C temperaturerange. The LM62 is calibratedto provideaccuraciesof• Power Supply Modules ±2.0°C atroom temperatureand +2.5°C/−2.0°C over• BatteryManagement thefull0°C to+90°C temperaturerange.
- FAX Machines The LM62's linearoutput,+480 mV offset,and factory• Printers calibrationsimplifyexternalcircuitryrequiredin a
- HVAC single supply environment where reading temperaturesdown to 0°C isrequired.Because the• Disk Drives LM62's quiescentcurrentislessthan 130 μA, self-• Appliances heatingis limitedto a very low 0.2°C in stillair. Shutdown capabilityfortheLM62 isintrinsicbecauseKEY SPECIFICATIONS itsinherentlow power consumptionallowsitto be powered directlyfromtheoutputofmany logicgates.• Accuracy at25°C ±2.0or ±3.0°C (max)
- Temperature Slope +15.6mV/ °C
- Power Supply VoltageRange +2.7V to+10V
- CurrentDrain@ 25°C 130 μA (max)
- Nonlinearity±0.8°C (max)
- Output Impedance 4.7kΩ (max) TypicalApplicationConnection Diagram See Package Number DBZ VO = (+15.6mV/°C × T°C) + 480 mV Figure1. Full-RangeCentigradeTemp. Sensor (0°C to+90°C) Stabilizinga CrystalOscillator Temperature (T) TypicalVO +90°C +1884 mV +70°C +1572 mV +25°C 870 mV 0°C +480 mV Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1999–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNIS105E –JUNE 1999–REVISED MARCH 2013 www.ti.com AbsoluteMaximum Ratings(1) SupplyVoltage +12V to−0.2V OutputVoltage (+VS + 0.6V)to−0.6V OutputCurrent 10 mA InputCurrentatany pin(2) 5 mA StorageTemperature −65°C to+150°C JunctionTemperature,max (TJMAX ) +125°C ESD Susceptibility(3) Human Body Model 2500V Machine Model 250V (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdo notensurespecificperformancelimits.Forensuredspecificationsand testconditions,see the ElectricalCharacteristics.The ensuredspecificationsapplyonlyforthetestconditionslisted.Some performancecharacteristicsmay degradewhen thedeviceisnotoperatedunderthelistedtestconditions. (2) When theinputvoltage(VI)atany pinexceedspower supplies(VI< GND orVI> +VS),thecurrentatthatpinshouldbe limitedto5 mA. (3) The human body model isa 100 pF capacitordischargedthrougha 1.5kΩ resistorintoeach pin.The machine model isa 200 pF capacitordischargeddirectlyintoeach pin. OperatingRatings(1) SpecifiedTemperatureRange TMIN ≤ TA ≤ TMAX LM62B, LM62C 0°C ≤ TA ≤ +90°C SupplyVoltageRange (+VS) +2.7V to+10V ThermalResistance,θJA (2) 450°C/W Solderingprocessmust complywithTexas Instruments'ReflowTemperatureProfilespecifications. Refertohttp://www.ti.com/packaging(3) (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdo notensurespecificperformancelimits.Forensuredspecificationsand testconditions,see the ElectricalCharacteristics.The ensuredspecificationsapplyonlyforthetestconditionslisted.Some performancecharacteristicsmay degradewhen thedeviceisnotoperatedunderthelistedtestconditions. (2) The junctiontoambientthermalresistance(θJA)isspecifiedwithouta heatsinkinstillair. (3) Reflowtemperatureprofilesaredifferentforlead-freeand non-lead-freepackages.
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www.ti.com SNIS105E –JUNE 1999–REVISED MARCH 2013 ElectricalCharacteristics Unlessotherwisenoted,thesespecificationsapplyfor+VS = +3.0VDC .BoldfacelimitsapplyforTA = TJ = TMIN toTMAX ;all otherlimitsTA = TJ = 25°C. Parameter Conditions Typical(1) LM62B LM62C Units (Limit)Limits(2) Limits(2) Accuracy(3) ±2.0 ±3.0 °C (max) OutputVoltageat0°C +480 mV Nonlinearity(4) ±0.8 ±1.0 °C (max) SensorGain +16.1 +16.3 mV/°C (max)+16(AverageSlope) +15.1 +14.9 mV/°C (min) OutputImpedance +3.0V ≤ +VS ≤ +10V 4.7 4.7 kΩ (max) 0°C ≤ TA ≤ +75°C, +VS= +2.7V 4.4 4.4 kΩ (max) LineRegulation(5) +3.0V ≤ +VS ≤ +10V ±1.13 ±1.13 mV/V (max) QuiescentCurrent +2.7V ≤ +VS ≤ +10V 130 130 μA (max)82 165 165 μA (max) Change ofQuiescentCurrent +2.7V ≤ +VS ≤ +10V ±5 μA TemperatureCoefficientof 0.2 μA/°CQuiescentCurrent Long Term Stability(6) TJ=TMAX =+100°C, ±0.2 °Cfor1000 hours (1) TypicalsareatTJ = TA = 25°C and representmost likelyparametricnorm. (2) LimitsareensuredtoTexas Instruments'AOQL (AverageOutgoingQualityLevel). (3) Accuracyisdefinedas theerrorbetween theoutputvoltageand +15.6mV/°C timesthedevice's case temperatureplus480 mV, at specifiedconditionsofvoltage,current,and temperature(expressedin°C). (4) Nonlinearityisdefinedas thedeviationoftheoutput-voltage-versus-temperaturecurvefromthebest-fitstraightline,overthedevice's ratedtemperaturerange. (5) Regulationismeasured atconstantjunctiontemperature,usingpulsetestingwitha lowdutycycle.Changes inoutputdue toheating effectscan be computed by multiplyingtheinternaldissipationby thethermalresistance. (6) Forbestlong-termstability,any precisioncircuitwillgivebestresultsiftheunitisaged ata warm temperature,and/ortemperature cycledforatleast46 hoursbeforelong-termlifetestbegins.Thisisespeciallytruewhen a small(Surface-Mount)partiswave-soldered; allowtimeforstressrelaxationtooccur.The majorityofthedriftwilloccurinthefirst1000 hoursatelevatedtemperatures.The driftafter 1000 hourswillnotcontinueatthefirst1000 hourrate. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM62
SNIS105E –JUNE 1999–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics To generatethesecurvestheLM62 was mounted toa printedcircuitboardas shown inFigure12. Thermal Resistance JunctiontoAir Thermal Time Constant Figure2. Figure3. Thermal Response Thermal Response in inStirredOilBath StillAirwithHeat Sink withHeat Sink Figure4. Figure5. Thermal Response inStill QuiescentCurrent Airwithouta Heat Sink vs.Temperature Figure6. Figure7.
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www.ti.com SNIS105E –JUNE 1999–REVISED MARCH 2013 TypicalPerformance Characteristics(continued) To generatethesecurvestheLM62 was mounted toa printedcircuitboardas shown inFigure12. Accuracy vs Temperature Noise Voltage Figure8. Figure9. Supply Voltage vs Supply Current Start-UpResponse Figure10. Figure11. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM62
SNIS105E –JUNE 1999–REVISED MARCH 2013 www.ti.com CIRCUIT BOARD ½ ″ Square PrintedCircuitBoard with2 oz.Copper FoilorSimilar. Figure12. PrintedCircuitBoard Used forHeat Sink toGenerate AllCurves Mounting The LM62 can be appliedeasilyinthesame way as otherintegrated-circuittemperaturesensors.Itcan be glued or cemented toa surface.The temperaturethattheLM62 issensingwillbe withinabout+0.2°C ofthesurface temperaturethatLM62's leadsareattachedto. This presumes thatthe ambient airtemperatureis almost the same as the surfacetemperature;ifthe air temperaturewere much higheror lowerthanthesurfacetemperature,theactualtemperaturemeasured would be atan intermediatetemperaturebetween thesurfacetemperatureand theairtemperature. To ensuregood thermalconductivitythebacksideoftheLM62 dieisdirectlyattachedtotheGND pin.The lands and tracestotheLM62 will,ofcourse,be partoftheprintedcircuitboard,whichistheobjectwhose temperature isbeingmeasured.These printedcircuitboardlandsand traceswillnotcause theLM62's temperaturetodeviate fromthedesiredtemperature. Alternatively,theLM62 can be mounted insidea sealed-endmetaltube,and can thenbe dippedintoa bathor screwed intoa threadedholeina tank.As withany IC,theLM62 and accompanyingwiringand circuitsmust be keptinsulatedand dry,toavoidleakageand corrosion.Thisisespeciallytrueifthecircuitmay operateatcold temperatureswhere condensationcan occur.Printed-circuitcoatingsand varnishessuch as Humisealand epoxy paintsordipsareoftenused toensurethatmoisturecannotcorrodetheLM62 oritsconnections. The thermalresistancejunctiontoambient(θJA)istheparameterused tocalculatetheriseofa devicejunction temperaturedue to itspower dissipation.For the LM62 the equationused to calculatethe risein the die temperatureisas follows: TJ = TA + θJA [(+VS IQ )+ (+VS − VO )IL] (1) where IQ isthequiescentcurrentand IListheloadcurrenton theoutput.SincetheLM62's junctiontemperature istheactualtemperaturebeingmeasured careshouldbe takentominimizetheloadcurrentthattheLM62 is requiredtodrive. The tableshown inTable1 summarizes theriseindietemperatureoftheLM62 withoutany loading,and the thermalresistancefordifferentconditions. Table1.Temperature Rise ofLM62 Due toSelf-Heatingand Thermal Resistance(θJA ) SOT-23 SOT-23 no heatsink(1) smallheatfin(2) θJA TJ − TA θJA TJ − TA (°C/W) (°C) (°C/W) (°C) Stillair 450 0.17 260 0.1 Moving air 180 0.07 (1) Partsolderedto30 gauge wire. (2) Heat sinkused is½ ″ squareprintedcircuitboardwith2 oz.foilwithpartattachedas shown inFigure12 .
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www.ti.com SNIS105E –JUNE 1999–REVISED MARCH 2013 CapacitiveLoads The LM62 handlescapacitiveloadingwell.Withoutany specialprecautions,theLM62 can driveany capacitive loadas shown inFigure13.Over thespecifiedtemperaturerangetheLM62 has a maximum outputimpedance of4.7kΩ.Inan extremelynoisyenvironmentitmay be necessarytoadd some filteringtominimizenoisepickup. Itisrecommended that0.1μF be added from +VS to GND to bypass the power supplyvoltage,as shown in Figure14. In a noisyenvironmentitmay be necessaryto add a capacitorfrom the outputto ground.A 1 μF outputcapacitorwiththe4.7kΩ maximum outputimpedance willforma 34 Hz lowpassfilter.Sincethethermal timeconstantoftheLM62 ismuch slowerthanthe30 ms timeconstantformedby theRC, theoverallresponse timeoftheLM62 willnotbe significantlyaffected.For much largercapacitorsthisadditionaltimelagwillincrease theoverallresponsetimeoftheLM62. Figure13. LM62 No Decoupling Required forCapacitiveLoad Figure14. LM62 withFilterforNoisy Environment Figure15. SimplifiedSchematic Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM62
R14.1V R20.1 PFU3LM4040 VOUT VT VTemp LM62V+ (Low = overtemp alarm) VT1 VT2 VTEMP VOUT VT1 = R1 + R2||R3 (4.1)R2 VT2 = R2 + R1||R3 (4.1)R2||R3 LM7211 LM62 SNIS105E –JUNE 1999–REVISED MARCH 2013 www.ti.com ApplicationsCircuits Figure16. CentigradeThermostat Figure17. Conserving Power DissipationwithShutdown
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REVISION HISTORY
Changes from RevisionD (March 2013)toRevisionE Page Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM62
www.ti.com 11-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM62BIM3/NOPB Obsolete Production SOT-23 (DBZ) | 3 - - Call TI Call TI 0 to 90 T7B LM62BIM3X/NOPB Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 90 T7B LM62BIM3X/NOPB.A Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 90 T7B LM62BIM3X/NOPB.B Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 90 T7B LM62CIM3/NOPB Obsolete Production SOT-23 (DBZ) | 3 - - Call TI Call TI 0 to 90 T7C LM62CIM3X/NOPB Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 90 T7C LM62CIM3X/NOPB.A Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 90 T7C LM62CIM3X/NOPB.B Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 90 T7C (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1
www.ti.com 11-Nov-2025 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 20-Feb-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 20-Feb-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM62BIM3X/NOPB SOT-23 DBZ 3 3000 208.0 191.0 35.0 LM62CIM3X/NOPB SOT-23 DBZ 3 3000 208.0 191.0 35.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C 0.20
0.08 TYP
0.25 2.64 2.10
1.12 MAX
0.10
0.01 TYP
3X 0.5 0.3 0.6
0.2 TYP
1.9 0.95 0 -8 TYP 4X 0 -15 4X 4 -15 A 3.04 2.80 B1.4 1.2 (0.95) (0.15) (0.125) SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/F 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length. 4. Support pin may differ or may not be present. 5. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25mm per side
0.2 C A B
0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
3X (1.3) 3X (0.6) (2.1) 2X (0.95) (R0.05) TYP 4214838/F 08/2024 SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE SCALE:15X PKG SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS
www.ti.com EXAMPLE STENCIL DESIGN (2.1) 2X(0.95) 3X (1.3) 3X (0.6) (R0.05) TYP SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/F 08/2024 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X SYMM PKG
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