LM61 2.7-V, SOT-23 or TO-92 Temperature Sensor datasheet (Rev. J)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SNIS121,J]
- PDF pages: 25
Technical content
Sample & Buy T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM61 SNIS121J –JUNE 1999–REVISED NOVEMBER 2016 LM612.7-V,SOT-23orTO-92TemperatureSensor
1 Features
1• Calibrated Linear Scale Factor of 10 mV/°C
- Rated for Full Temperature Range (–30° to 100°C)
- Suitable for Remote Applications
- UL Recognized Component
- ±2°C or ±3°C Accuracy at 25°C (Maximum)
- ±3°C Accuracy for –25°C to 85°C (Maximum)
- ±4°C Accuracy for –30°C to 100°C (Maximum)
- 10 mV/°C Temperature Slope (Maximum)
- 2.7-V to 10-V Power Supply Voltage Range
- 125-µA Current Drain at 25°C (Maximum)
- ±0.8°C Nonlinearity (Maximum)
- 800-Ω Output Impedance (Maximum)
2 Applications
- Cellular Phones
- Computers
- Power Supply Modules
- Battery Management
- FAX Machines
- Printers
- HVAC
- Disk Drives
- Appliances
3 Description
The LM61 device is a precision, integrated-circuit temperature sensor that can sense a –30°C to 100°C temperature range while operating from a single 2.7‑V supply. The output voltage of the LM61 is linearly proportional to temperature (10 mV/°C) and has a DC offset of 600 mV. The offset allows reading negative temperatures without the need for a negative supply. The nominal output voltage of the LM61 ranges from 300 mV to 1600 mV for a –30°C to 100°C temperature range. The LM61 is calibrated to provide accuracies of ±2°C at room temperature and ±3°C over the full –25°C to 85°C temperature range. The linear output of the LM61, 600-mV offset, and factory calibration simplify external circuitry required in a single supply environment where reading negative temperatures is required. Because the quiescent current is less than 125 µA, self-heating is limited to a very low 0.2°C in still air. Shutdown capability for the LM61 is intrinsic because its inherent low power consumption allows it to be powered directly from the output of many logic gates. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) LM61 SOT-23 (3) 1.30 mm × 2.92 mm TO-92 (3) 4.30 mm × 4.30 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application VO = (10 mV/°C × T°C) + 600 mV Key Specifications VALUE Accuracy at 25°C ±2°C or ±3°C Accuracy for –25°C to 85°C ±3°C Accuracy for –30°C to 100°C ±4°C Temperature slope 10 mV/°C Power supply voltage 2.7 V to 10 V Current drain at 25°C 125 µA Nonlinearity ±0.8°C Output impedance 800 Ω
SNIS121J –JUNE 1999–REVISED NOVEMBER 2016 www.ti.com Product Folder Links: LM61 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Table of Contents
11.2 Receiving Notification of Documentation Updates 14
12 Mechanical, Packaging, and Orderable
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision I (February 2013) to Revision J Page
- Added Device Information table, Device Comparison Table, Pin Configuration and Functions section, Specifications section, ESD Ratings table, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,
- Changed RθJA values for DBZ (SOT-23) From: 450°C/W To: 286.3°C/W and for LP (TO-92) From: 180°C/W To: Changes from Revision H (February 2013) to Revision I Page
www.ti.com SNIS121J –JUNE 1999–REVISED NOVEMBER 2016 Product Folder Links: LM61 Submit Documentation FeedbackCopyright © 1999–2016, Texas Instruments Incorporated
5 Pin Configuration and Functions
NAME NO. +VS 1 Power Positive power supply pin. VOUT 2 Output Temperature sensor analog output. GND 3 Ground Device ground pin, connected to power supply negative terminal. (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > VS), the current at that pin must be limited to 5 mA.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Supply voltage 12 –0.2 V Output voltage (+VS + 0.6) –0.6 V Output current 10 mA Input current at any pin(2) 5 mA Maximum junction temperature, TJ 125 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. (3) The machine model is a 200-pF capacitor discharged directly into each pin.
6.2 ESD Ratings
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2500 V Machine Model (MM)(3) ±250
6.3 Recommended Operating Conditions
+VS Supply voltage 2 10 V T Operating temperature LM61C –30 100 LM61B –25 85
SNIS121J –JUNE 1999–REVISED NOVEMBER 2016 www.ti.com Product Folder Links: LM61 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. (2) The junction-to-ambient thermal resistance is specified without a heat sink in still air.
6.4 Thermal Information
THERMAL METRIC(1) LM61 UNITDBZ (SOT-23) LP (TO-92)
3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance(2) 286.3 162.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 96 85 °C/W RθJB Junction-to-board thermal resistance 57.1 — °C/W ψJT Junction-to-top characterization parameter 5.3 29.2 °C/W ψJB Junction-to-board characterization parameter 55.8 141.4 °C/W (1) Limits are specified to TI's AOQL (Average Outgoing Quality Level). (2) Typical limits represent most likely parametric norm. (3) Maximum and minimum limits apply for TA = TJ = TMIN to TMAX. (4) Typical limits apply for TA = TJ = 25°C. (5) Accuracy is defined as the error between the output voltage and 10 mV/°C multiplied by the device's case temperature plus 600 mV, at specified conditions of voltage, current, and temperature (expressed in °C). (6) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's rated temperature range. (7) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. (8) For best long-term stability, any precision circuit gives best results if the unit is aged at a warm temperature, or temperature cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered; allow time for stress relaxation to occur. The majority of the drift occurs in the first 1000 hours at elevated temperatures. The drift after 1000 hours does not continue at the first 1000-hour rate.
6.5 Electrical Characteristics
+VS = 3 V (DC)(1)(2) PARAMETER TEST CONDITIONS MIN(3) TYP(4) MAX(3) UNIT Accuracy(5) TA = 25°C LM61B –2 2 LM61C –3 3 LM61B –3 3 LM61C –4 4 Output voltage at 0°C 600 mV Nonlinearity(6) LM61B –0.6 0.6 LM61C –0.8 0.8 Sensor gain (average slope) LM61B 9.7 10 10.3 mV/°C LM61C 9.6 10 10.4 Output impedance +VS = 3 V to 10 V 0.8 kΩTA = –30°C to 85°C, +VS = 2.7 V 2.3 TA = 85°C to 100°C, +VS = 2.7 V 5 Line regulation(7) +VS = 3 V to 10 V –0.7 0.7 mV/V +VS = 2.7 V to 3.3 V –5.7 5.7 mV Quiescent current +VS = 2.7 V to 10 V TA = 25°C 82 125 µA 155 Change of quiescent current +VS = 2.7 V to 10 V ±5 µA Temperature coefficient of quiescent current 0.2 µA/°C Long term stability(8) TJ = TMAX = 100°C, for 1000 hours ±0.2 °C
6.6 Typical Characteristics
Figure 1. Junction-to-Ambient Thermal Resistance Figure 2. Thermal Time Constant Figure 3. Thermal Response in Still Air with Heat Sink Figure 4. Thermal Response in Stirred Oil Bath Figure 5. Thermal Response in Still Air without Heat Sink Figure 6. Quiescent Current vs Temperature
2 V/Div
0.2 V/Div
Figure 7. Accuracy vs Temperature Figure 8. Noise Voltage Figure 9. Supply Voltage vs Supply Current Figure 10. Start-Up Response
www.ti.com SNIS121J –JUNE 1999–REVISED NOVEMBER 2016 Product Folder Links: LM61 Submit Documentation FeedbackCopyright © 1999–2016, Texas Instruments Incorporated
7 Detailed Description
7.1 Overview
The LM61 is a precision integrated-circuit temperature sensor that can sense a –30°C to 100°C temperature range using a single positive supply. The output voltage of the LM61 has a positive temperature slope of 10 mV/°C. A 600-mV offset is included, enabling negative temperature sensing when biased by a single supply. The temperature-sensing element is comprised of a delta-VBE architecture. The temperature-sensing element is then buffered by an amplifier and provided to the VOUT pin. The amplifier has a simple class A output stage as shown in Functional Block Diagram.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 LM61 Transfer Function
The LM61 follows a simple linear transfer function to achieve the accuracy as listed in Electrical Characteristics. Use Equation 1 to calculate the value of VO. VO = 10 mV/°C × T°C + 600 mV where
- T is the temperature in °C
- VO is the LM61 output voltage (1)
7.4 Device Functional Modes
The only functional mode of the LM61 device is an analog output directly proportional to temperature.
8 Application and Implementation
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.2 Typical Applications
8.2.1 Typical Temperature Sensing Circuit
Figure 11. Typical Temperature Sensing Circuit Diagram
8.2.1.1 Design Requirements
For this design example, use the parameters listed in Table 1 as the input parameters. Table 1. Design Parameters
8.2.1.2 Detailed Design Procedure
to layout outweigh other requirements in importance. See Layout for more information.
8.2.1.2.1 Capacitive Loads
overall response time of the LM61. Figure 12. LM61 No Decoupling Required for Capacitive Load Figure 13. LM61 with Filter for Noisy Environments
8.2.1.3 Application Curve
Figure 14. Accuracy vs Temperature
8.2.2 Other Application Circuits
design procedures in Typical Temperature Sensing Circuit are applicable. Figure 15. Centigrade Thermostat Figure 16. Conserving Power Dissipation with Shutdown
9 Power Supply Recommendations
a 0.1-µF capacitor be added between +VS to GND to bypass the power-supply voltage, as shown in Figure 13.
10 Layout
10.1 Layout Guidelines
10.1.1 Mounting
temperature that LM61's leads are attached to. an intermediate temperature between the surface temperature and the air temperatures. paints or dips are often used to ensure that moisture cannot corrode the device or connections.
10.2 Layout Examples
Figure 17. Recommended Solder Pads for SOT-23 Package
A. 1/2 in.2 printed-circuit board with 2 oz copper foil or similar. Figure 18. Printed-Circuit Board Used for Heat Sink to Generate All Curves Figure 19. PCB Layout
10.3 Thermal Considerations
- IQ is the quiescent current
- ILis the load current on the output (2) Table 2 summarizes the rise in die temperature of the LM61 without any loading with a 3.3-V supply, and the thermal resistance for different conditions.
(1) Part soldered to 30 gauge wire. (2) Heat sink used is 1/2 in.2 printed -circuit board with 2-oz foil with part attached as shown in Figure 18. (3) Part glued and leads soldered to 1 in.2 of 1/16 in. printed circuit board with 2-oz foil or similar. Table 2. Temperature Rise of LM61 Due to Self-Heating and Thermal Resistance Table 3. Temperature and Typical VO Values
SNIS121J –JUNE 1999–REVISED NOVEMBER 2016 www.ti.com Product Folder Links: LM61 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated
11 Device and Documentation Support
11.1 Related Documentation
For related documentation see the following:
- TO-92 Packing Options / Ordering Instructions (SNOA072)
- Tiny Temperature Sensors for Remote Systems (SNIA009)
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
www.ti.com 15-Jul-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM61BIM3 NRND Production SOT-23 (DBZ) | 3 1000 | LARGE T&R No Call TI Call TI -25 to 85 T1B LM61BIM3.B NRND Production SOT-23 (DBZ) | 3 1000 | LARGE T&R No Call TI Call TI -25 to 85 T1B LM61BIM3/NOPB Obsolete Production SOT-23 (DBZ) | 3 - - Call TI Call TI -25 to 85 T1B LM61BIM3X/NOPB Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -25 to 85 T1B LM61BIM3X/NOPB.A Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -25 to 85 T1B LM61BIM3X/NOPB.B Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -25 to 85 T1B LM61BIZ/LFT3 Active Production TO-92 (LP) | 3 2000 | LARGE T&R Yes SN N/A for Pkg Type -25 to 85 LM61 BIZ LM61BIZ/LFT3.B Active Production TO-92 (LP) | 3 2000 | LARGE T&R Yes SN N/A for Pkg Type -25 to 85 LM61 BIZ LM61BIZ/NOPB Active Production TO-92 (LP) | 3 1800 | SMALL T&R Yes SN N/A for Pkg Type -25 to 85 LM61 BIZ LM61BIZ/NOPB.A Active Production TO-92 (LP) | 3 1800 | SMALL T&R Yes SN N/A for Pkg Type -25 to 85 LM61 BIZ LM61BIZ/NOPB.B Active Production TO-92 (LP) | 3 1800 | SMALL T&R Yes SN N/A for Pkg Type -25 to 85 LM61 BIZ LM61CIM3 NRND Production SOT-23 (DBZ) | 3 1000 | LARGE T&R No Call TI Call TI -30 to 100 T1C LM61CIM3.B NRND Production SOT-23 (DBZ) | 3 1000 | LARGE T&R No Call TI Call TI -30 to 100 T1C LM61CIM3/NOPB Obsolete Production SOT-23 (DBZ) | 3 - - Call TI Call TI -30 to 100 T1C LM61CIM3X/NOPB Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -30 to 100 T1C LM61CIM3X/NOPB.A Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -30 to 100 T1C LM61CIM3X/NOPB.B Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -30 to 100 T1C LM61CIZ/LFT2 Active Production TO-92 (LP) | 3 2000 | LARGE T&R Yes SN N/A for Pkg Type -30 to 100 LM61 CIZ LM61CIZ/LFT2.B Active Production TO-92 (LP) | 3 2000 | LARGE T&R Yes SN N/A for Pkg Type -30 to 100 LM61 CIZ LM61CIZ/NOPB Active Production TO-92 (LP) | 3 1800 | SMALL T&R Yes SN N/A for Pkg Type -30 to 100 LM61 CIZ LM61CIZ/NOPB.A Active Production TO-92 (LP) | 3 1800 | SMALL T&R Yes SN N/A for Pkg Type -30 to 100 LM61 CIZ LM61CIZ/NOPB.B Active Production TO-92 (LP) | 3 1800 | SMALL T&R Yes SN N/A for Pkg Type -30 to 100 LM61 CIZ Addendum-Page 1
www.ti.com 15-Jul-2026 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 5-Jul-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 5-Jul-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM61BIM3X/NOPB SOT-23 DBZ 3 3000 208.0 191.0 35.0 LM61CIM3X/NOPB SOT-23 DBZ 3 3000 208.0 191.0 35.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE 3X 2.67 2.03 5.21 4.44 5.34 4.32
12.7 MIN
2X 1.27 0.13 3X 0.55 0.38 4.19 3.17
3.43 MIN
3X 0.43 0.35 (2.54) NOTE 3 2X 2.9 2.4
4 MAX
0.076 MAX
(0.51) TYP (1.5) TYP TO-92 - 5.34 mm max heightLP0003A TO-92 4215214/C 04/2025 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Lead dimensions are not controlled within this area. 4. Reference JEDEC TO-226, variation AA. 5. Shipping method: a. Straight lead option available in bulk pack only. b. Formed lead option available in tape and reel or ammo pack. c. Specific products can be offered in limited combinations of shipping medium and lead options. d. Consult product folder for more information on available options. EJECTOR PIN OPTIONAL PLANE SEATING STRAIGHT LEAD OPTION 3 2 1 SCALE 1.200 FORMED LEAD OPTION OTHER DIMENSIONS IDENTICAL TO STRAIGHT LEAD OPTION SCALE 1.200
www.ti.com EXAMPLE BOARD LAYOUT
0.05 MAX
(1.07) (1.5) 2X (1.5) 2X (1.07) (1.27) (2.54) FULL R TYP ( 1.4)0.05 MAX ALL AROUND TYP (2.6) (5.2) (R0.05) TYP 3X ( 0.9) HOLE 2X ( 1.4) METAL 3X ( 0.85) HOLE (R0.05) TYP 4215214/C 04/2025 TO-92 - 5.34 mm max heightLP0003A TO-92 LAND PATTERN EXAMPLE FORMED LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING 1 2 3 LAND PATTERN EXAMPLE STRAIGHT LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X METAL TYP SOLDER MASK OPENING SOLDER MASK OPENING METAL 1 2 3
www.ti.com TAPE SPECIFICATIONS 19.0 17.5 13.7 11.7 11.0 8.5
0.5 MIN
3.7-4.3 TYP 9.75 8.50 2.9
2.4 TYP
6.75 5.95 13.0 12.4 (2.5) TYP 16.5 15.5 4215214/C 04/2025 TO-92 - 5.34 mm max heightLP0003A TO-92 FOR FORMED LEAD OPTION PACKAGE
www.ti.com PACKAGE OUTLINE C 0.20
0.08 TYP
0.25 2.64 2.10
1.12 MAX
0.10
0.01 TYP
3X 0.5 0.3 0.6
0.2 TYP
1.9 0.95 0 -8 TYP 4X 0 -15 4X 4 -15 A 3.04 2.80 B1.4 1.2 (0.95) (0.15) (0.125) SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/F 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length. 4. Support pin may differ or may not be present. 5. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25mm per side
0.2 C A B
0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
3X (1.3) 3X (0.6) (2.1) 2X (0.95) (R0.05) TYP 4214838/F 08/2024 SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE SCALE:15X PKG SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS
www.ti.com EXAMPLE STENCIL DESIGN (2.1) 2X(0.95) 3X (1.3) 3X (0.6) (R0.05) TYP SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/F 08/2024 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X SYMM PKG
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