LM358

Industry-Standard Dual Operational Amplifiers datasheet (Rev. AB)

Document overview

• Manufacturer or author: Texas Instruments, Incorporated [SLOS068,A]
• PDF pages: 68

Technical content

Industry-Standard Dual Operational Amplifiers

1 Features

• Wide supply range of 3V to 36V (B, BA versions)
• Quiescent current: 300µA/ch (B, BA versions)
• Unity-gain bandwidth of 1.2MHz (B, BA versions)
• Common-mode input voltage range includes ground, enabling direct sensing near ground
• 2mV input offset voltage maximum at 25°C (BA version)
• 3mV input offset voltage maximum at 25°C (A, B versions)
• Internal RF and EMI filter (B, BA versions)
• On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

2 Applications

• Merchant network and server power supply units
• Multi-function printers
• Power supplies and mobile chargers
• Motor control: AC induction, brushed DC, brushless DC, high-voltage, low-voltage, permanent magnet, and stepper motor
• Desktop PC and motherboard
• Indoor and outdoor air conditioners
• Washers, dryers, and refrigerators
• AC inverters, string inverters, central inverters, and voltage frequency drives
• Uninterruptible power supplies
• Electronic point-of-sale systems

3 Description

The LM358B and LM2904B devices are the next-generation versions of the industry-standard operational amplifiers (op amps) LM358 and LM2904, which include two high-voltage (36V) op amps. These devices provide outstanding value for cost-sensitive applications, with features including low offset (300µV, typical), common-mode input range to ground, and high differential input voltage capability. The LM358B and LM2904B op amps simplify circuit design with enhanced features such as unity-gain stability, lower offset voltage maximum of 3mV (2mV maximum for LM358BA and LM2904BA), and lower quiescent current of 300µA per amplifier (typical). High ESD (2kV, HBM) and integrated EMI and RF filters enable the LM358B and LM2904B devices to be used in the most rugged, environmentally challenging applications. The LM358B and LM2904B amplifiers are available in micro-sized packaging, such as the SOT23-8, as well as industry standard packages including SOIC, TSSOP, and VSSOP.

Package Information

PART NUMBER(1) PACKAGE PACKAGE SIZE(2) LM358B, LM358BA, LM2904B, LM2904BA, LM358, LM358A, LM2904, LM2904V, LM258, LM258A D (SOIC, 8) 4.9mm × 6mm LM358B, LM358BA, LM2904B, LM2904BA, LM358, LM358A, LM2904, LM2490V PW (TSSOP, 8) 3mm × 6.4mm LM358B, LM358BA, LM2904B, LM2904BA, LM358, LM358A, LM2904, LM2904V, LM258, LM258A DGK (VSSOP, 8) 3mm × 4.9mm LM358B, LM358BA, LM2904B, LM2904BA DDF (SOT-23, 8) 2.9mm × 2.8mm LM358, LM2904 PS (SO, 8) 6.2mm × 7.8mm LM358, LM2904, LM358A, LM258, LM258A P (PDIP, 8) 9.81mm × 9.43mm LM158, LM158A JG (CDIP, 8) 9.6mm × 6.67mm LM158, LM158A FK (LCCC, 20) 8.89mm × 8.89mm Family Comparison Specification LM358B LM358BA LM2904B LM2904BA LM358 LM358A LM2904 LM2904V LM2904AV LM258 LM258A LM158 LM158A Units Supply voltage 3 to 36 3 to 36 3 to 30 3 to 26 3 to 30 3 to 30 3 to 30 V Offset voltage (max, 25°C) ± 3 ± 2 ± 3 ± 2 ± 7 ± 3 ± 7 ± 7 ± 2 ± 5 ± 3 ± 5 ± 2 mV Input bias current (typ / max) 10 / 35 10 / 35 20 / 250 15 / 100 20 / 250 20 / 250 20 / 150 15 / 50 nA ESD (HBM) 2000 2000 500 500 500 500 500 V Operating ambient temperature −40 to 85 −40 to 125 0 to 70 −40 to 125 −40 to 125 −25 to 85 −55 to 125 °C (1) For all available packages, see the orderable addendum at the end of the data sheet. (2) The package size (length × width) is a nominal value and includes pins, where applicable. LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

5.6 Electrical Characteristics: LM2904B and

5.12 Typical Characteristics: LM158, LM158A,

LM258, LM258A, LM358, LM358A, LM2904, and

7.2 Functional Block Diagram: LM358B, LM358BA,

11 Mechanical, Packaging, and Orderable

LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

4 Pin Configuration and Functions

2IN1± 7 OUT2 3IN1+ 6 IN2 ± 4V± 5 IN2+ Not to scale Figure 4-1. D, DDF, DGK, P, PS, PW, and JG Package 8-Pin SOIC, SOT23-8, VSSOP, PDIP, SO, TSSOP, and CDIP Top View 4NC 5IN1± 6NC 7IN1+ 8NC 9NC 10V± 11NC 12IN2+ 13NC 14 NC

15 IN2 ±

17 OUT2

2 OUT1

NC - No internal connection Figure 4-2. FK Package 20-Pin LCCC Top View Table 4-1. Pin Functions PIN I/O DESCRIPTION NAME LCCC(1) SOIC, SOT23-8, VSSOP, CDIP, PDIP, SO, TSSOP, CFP(1) IN1– 5 2 I Negative input IN1+ 7 3 I Positive input IN2– 15 6 I Negative input IN2+ 12 5 I Positive input OUT1 2 1 O Output OUT2 17 7 O Output V– 10 4 — Negative (lowest) supply or ground (for single- supply operation) 13, 14, 16, 18, 19 — — No internal connection V+ 20 8 — Positive (highest) supply (1) For a listing of which devices are available in what packages, see Section 3. www.ti.com LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

5 Specifications

5.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1) MIN MAX UNIT Supply voltage, VS = ([V+] – [V–]) LM358B, LM358BA, LM2904B, LM2904BA ±20 or 40 VLM158, LM258, LM358, LM158A, LM258A, LM358A, LM2904V ±16 or 32 LM2904 ±13 or 26 Differential input voltage, VID (2) LM358B, LM358BA, LM2904B, LM2904BA,LM158, LM258, LM358, LM158A, LM258A, LM358A, LM2904V –32 32 V LM2904 –26 26 Input voltage, VI Either input LM358B, LM358BA, LM2904B, LM2904BA –0.3 40 VLM158, LM258, LM358, LM158A, LM258A, LM358A, LM2904V –0.3 32 LM2904 –0.3 26 Duration of output short circuit (one amplifier) to ground at (or below) TA = 25°C, VS ≤ 15 V(3) Unlimited s Operating ambient temperature, TA LM158, LM158A –55 125 LM258, LM258A –25 85 LM358B, LM358BA –40 85 LM358, LM358A 0 70 LM2904B, LM2904BA, LM2904, LM2904V –40 125 Operating virtual-junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Differential voltages are at IN+, with respect to IN−. (3) Short circuits from outputs to VS can cause excessive heating and eventual destruction.

5.2 ESD Ratings

LM358B, LM358BA, LM2904B, AND LM2904BA V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 LM158, LM258, LM358, LM158, LM258A, LM358A, LM2904, AND LM2904V V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±500 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

5.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted) MIN MAX UNIT VS Supply voltage, VS= ([V+] – [V–]) LM358B, LM358BA, LM2904B, LM2904BA 3 36 VLM158, LM258, LM358, LM158A, LM258A, LM358A, LM2904V 3 30 LM2904 3 26 VCM Common-mode voltage V– V+ – 2 V TA Operating ambient temperature LM358B, LM358BA –40 85 LM2904B, LM2904BA, LM2904, LM2904V –40 125 LM358, LM358A 0 70 LM258, LM258A –20 85 LM158, LM158A –55 125

5.4 Thermal Information

THERMAL METRIC(1) LM258, LM258A, LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V(2) LM158, LM158A UNITD (SOIC) DGK (VSSOP) P (PDIP) PS (SO) PW (TSSOP) DDF (SOT-23) FK (LCCC) JG (CDIP)

8 PINS 8 PINS 8 PINS 8 PINS 8 PINS 8PINS 20 PINS 8 PINS

RθJA Junction-to-ambient RθJC(top) Junction-to-case (top) RθJB Junction-to-board thermal ψJT Junction-to-top characterization parameter ψJB Junction-to-board characterization parameter RθJC(bot) Junction-to-case (bottom) thermal resistance — — — — — — 10.6 22.3 °C/W (1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics. (2) For a listing of which devices are available in what packages, see Section 3. www.ti.com LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

5.5 Electrical Characteristics: LM358B and LM358BA

VS = (V+) – (V–) = 5 V – 36 V (±2.5 V – ±18 V), TA = 25°C, VCM = VOUT = VS / 2, RL = 10k connected to VS / 2 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OFFSET VOLTAGE VOS Input offset voltage LM358B ±0.3 ±3.0 mV TA = –40°C to +85°C ±4 mV LM358BA ±2.0 mV TA = –40°C to +85°C ±2.5 mV dVOS/dT Input offset voltage drift TA = -40°C to +85°C(1) ±3.5 11 µV/°C PSRR Power supply rejection ratio ±2 15 µV/V Channel separation, dc f = 1 kHz to 20 kHz ±1 µV/V INPUT VOLTAGE RANGE VCM Common-mode voltage range VS = 3 V to 36 V (V–) (V+) – 1.5 V VS = 5 V to 36 V TA = –40°C to +85°C (V–) (V+) – 2 V CMRR Common-mode rejection ratio (V–) ≤ VCM ≤ (V+) – 1.5 V VS = 3 V to 36 V 20 100 µV/V (V–) ≤ VCM ≤ (V+) – 2.0 V VS = 5 V to 36 V TA = –40°C to +85°C 25 316 INPUT BIAS CURRENT IB Input bias current –10 –35 nA TA = –40°C to +85°C(1) –50 nA IOS Input offset current 0.5 4 nA TA = –40°C to +85°C(1) 5 nA dIOS/dT Input offset current drift TA = –40°C to +85°C 10 pA/℃ NOISE En Input voltage noise f = 0.1 to 10 Hz 3 µVPP en Input voltage noise density f = 1 kHz 40 nV/√/Hz INPUT IMPEDANCE ZID Differential 10 || 0.1 MΩ|| pF ZIC Common-mode 4 || 1.5 GΩ|| pF OPEN-LOOP GAIN AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 10 kΩ, connected to (V–) 70 140 V/mV TA = –40°C to +85°C 35 V/mV FREQUENCY RESPONSE GBW Gain bandwidth product 1.2 MHz SR Slew rate G = + 1 0.5 V/µs Θm Phase margin G = + 1, RL = 10kΩ, CL = 20 pF 56 ° tOR Overload recovery time VIN × gain > VS 10 µs ts Settling time To 0.1%, VS = 5 V, 2-V step , G = +1, CL = 100 pF 4 µs THD+N Total harmonic distortion + noise G = + 1, f = 1 kHz, VO = 3.53 VRMS, VS = 36 V, RL = 100k, IOUT ≤ ±50 µA, BW = 80 kHz 0.001 % OUTPUT VO Voltage output swing from rail Positive rail (V+) IOUT = 50 µA 1.35 1.42 V IOUT = 1 mA 1.4 1.48 V IOUT = 5 mA(1) 1.5 1.61 V Negative rail (V–) IOUT = 50 µA 100 150 mV IOUT = 1 mA 0.75 1 V VS = 5 V, RL ≤ 10 kΩ connected to (V–) TA = –40°C to +85°C 5 20 mV IO Output current VS = 15 V; VO = V–; VID = 1 V Source(1) -20 -30 mA TA = –40°C to +85°C -10 VS = 15 V; VO = V+; VID = –1 V Sink(1) 10 20 TA = –40°C to +85°C 5 VID = –1 V; VO = (V–) + 200 mV 60 100 μA ISC Short-circuit current VS = 20 V, (V+) = 10 V, (V–) = –10 V, VO = 0 V ±40 ±60 mA CLOAD Capacitive load drive 100 pF RO Open-loop output resistance f = 1 MHz, IO = 0 A 300 Ω LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

5.5 Electrical Characteristics: LM358B and LM358BA (continued)

VS = (V+) – (V–) = 5 V – 36 V (±2.5 V – ±18 V), TA = 25°C, VCM = VOUT = VS / 2, RL = 10k connected to VS / 2 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER SUPPLY IQ Quiescent current per amplifier VS = 5 V; IO = 0 A TA = –40°C to +85°C 300 460 µA IQ Quiescent current per amplifier VS = 36 V; IO = 0 A 800 µA (1) Specified by characterization only. www.ti.com LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

5.6 Electrical Characteristics: LM2904B and LM2904BA

VS = (V+) – (V–) = 5 V - 36 V (±2.5 V - ±18 V), TA = 25°C, VCM = VOUT = VS/2, RL = 10k connected to VS/2 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OFFSET VOLTAGE VOS Input offset voltage LM2904B ±0.3 ±3.0 mV TA = –40°C to +125°C ±4 mV LM2904BA ±2.0 mV TA = –40°C to +125°C ±3.0 mV dVOS/dT Input offset voltage drift TA = –40°C to +125°C(1) ±3.5 12 µV/°C PSRR Power Supply Rejection Ratio ±2 15 µV/V Channel separation, dc f = 1 kHz to 20 kHz ±1 µV/V INPUT VOLTAGE RANGE VCM Common-mode voltage range VS = 3 V to 36 V (V–) (V+) – 1.5 V VS = 5 V to 36 V TA = –40°C to +125°C (V–) (V+) – 2 V CMRR Common-mode rejection ratio (V–) ≤ VCM ≤ (V+) – 1.5 V VS = 3 V to 36 V 20 100 µV/V (V–) ≤ VCM ≤ (V+) – 2.0 V VS = 5 V to 36 V TA = –40°C to +125°C 25 316 INPUT BIAS CURRENT IB Input bias current –10 –35 nA TA = –40°C to +125°C(1) –50 nA IOS Input offset current 0.5 4 nA TA = –40°C to +125°C(1) 5 nA dIOS/dT Input offset current drift TA = –40°C to +125°C 10 pA/℃ NOISE En Input voltage noise f = 0.1 to 10 Hz 3 µVPP en Input voltage noise density f = 1 kHz 40 nV/√/Hz INPUT IMPEDANCE ZID Differential 10 || 0.1 MΩ|| pF ZIC Common-mode 4 || 1.5 GΩ|| pF OPEN-LOOP GAIN AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 10 kΩ, connected to (V-) 70 140 V/mV TA = –40°C to +125°C 35 V/mV FREQUENCY RESPONSE GBW Gain bandwidth product 1.2 MHz SR Slew rate G = + 1 0.5 V/µs Θm Phase margin G = + 1, RL = 10kΩ, CL = 20 pF 56 ° tOR Overload recovery time VIN × gain > VS 10 µs ts Settling time To 0.1%, VS = 5 V, 2-V Step , G = +1, CL = 100 pF 4 µs THD+N Total harmonic distortion + noise G = + 1, f = 1 kHz, VO = 3.53 VRMS, VS = 36V, RL = 100k, IOUT ≤ ±50µA, BW = 80 kHz 0.001 % OUTPUT VO Voltage output swing from rail Positive Rail (V+) IOUT = 50 µA 1.35 1.42 V IOUT = 1 mA 1.4 1.48 V IOUT = 5 mA(1) 1.5 1.61 V Negative Rail (V-) IOUT = 50 µA 100 150 mV IOUT = 1 mA 0.75 1 V VS = 5 V, RL ≤ 10 kΩ connected to (V–) TA = –40°C to +125°C 5 20 mV IO Output current VS = 15 V; VO = V-; VID =

1 V Source(1)

-20 -30 mA TA = –40°C to +125°C -10 VS = 15 V; VO = V+; VID = -1 V Sink(1) 10 20 TA = –40°C to +125°C 5 VID = -1 V; VO = (V-) + 200 mV 60 100 μA ISC Short-circuit current VS = 20 V, (V+) = 10 V, (V-) = -10 V, VO = 0 V ±40 ±60 mA CLOAD Capacitive load drive 100 pF RO Open-loop output resistance f = 1 MHz, IO = 0 A 300 Ω POWER SUPPLY LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

VS = (V+) – (V–) = 5 V - 36 V (±2.5 V - ±18 V), TA = 25°C, VCM = VOUT = VS/2, RL = 10k connected to VS/2 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IQ Quiescent current per amplifier VS = 5 V; IO = 0 A TA = –40°C to +125°C 300 460 µA IQ Quiescent current per amplifier VS = 36 V; IO = 0 A 800 µA (1) Specified by characterization only www.ti.com LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

5.7 Electrical Characteristics: LM358, LM358A

For VS = (V+) – (V–) = 5 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT OFFSET VOLTAGE VOS Input offset voltage VS = 5 V to 30 V; VC M = 0 V; VO = 1.4 V LM358 3 7 mV TA = 0°C to 70°C 9 LM358A 2 3 TA = 0°C to 70°C 5 dVOS/dT Input offset voltage drift LM358 TA = 0°C to 70°C 7 µV/°C LM358A TA = 0°C to 70°C 7 20 PSRR Input offset voltage vs power supply (ΔVIO/ΔVS) VS = 5 V to 30 V 65 100 dB VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB INPUT VOLTAGE RANGE VCM Common-mode voltage range VS = 5 V to 30 V LM358 (V–) (V+) – 1.5 V VS = 30 V LM358A VS = 5 V to 30 V LM358 TA = 0°C to 70°C (V–) (V+) – 2 VS = 30 V LM358A CMRR Common-mode rejection ratio VS = 5 V to 30 V; VCM = 0 V 65 80 dB INPUT BIAS CURRENT IB Input bias current VO = 1.4 V LM358 –20 –250 nA TA = 0°C to 70°C –500 LM358A –15 –100 TA = 0°C to 70°C –200 IOS Input offset current VO = 1.4 V LM358 2 50 nA TA = 0°C to 70°C 150 LM358A 2 30 TA = 0°C to 70°C 75 dIOS/dT Input offset current drift pA/°C LM358A TA = 0°C to 70°C 300 NOISE en Input voltage noise density f = 1 kHz 40 nV/√ Hz OPEN-LOOP GAIN AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ 25 100 V/mV TA = 0°C to 70°C 15 FREQUENCY RESPONSE GBW Gain bandwidth product 0.7 MHz SR Slew rate G = +1 0.3 V/µs OUTPUT VO Voltage output swing from rail Positive rail VS = 30 V; RL = 2 kΩ TA = 0°C to 70°C 4 VVS = 30 V; RL ≥ 10 kΩ 2 3 VS = 5 V; RL ≥ 2 kΩ 1.5 Negative rail VS = 5 V; RL ≤ 10 kΩ TA = 0°C to 70°C 5 20 mV IO Output current VS = 15 V; VO = 0 V; VID = 1 V Source –20 –30 mA LM358A –60 TA = 0°C to 70°C –10 VS = 15 V; VO = 15 V; VID = –1 V Sink 10 20 TA = 0°C to 70°C 5 VID = –1 V; VO = 200 mV 12 30 µA ISC Short-circuit current VS = 10 V; VO = VS / 2 ±40 ±60 mA POWER SUPPLY IQ Quiescent current per amplifier VO = 2.5 V; IO = 0 A TA = 0°C to 70°C 350 600 µA VS = 30 V; VO = 15 V; IO = 0 A 500 1000 (1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Maximum VS for testing purposes is 30 V for LM358 and LM358A. (2) All typical values are TA = 25°C. LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

5.8 Electrical Characteristics: LM2904, LM2904V

For VS = (V+) – (V–) = 5 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS(1) MIN TYP (2) MAX UNIT OFFSET VOLTAGE VOS Input offset voltage VS = 5 V to maximum; VC M = 0 V; VO = 1.4 V Non-A suffix devices 3 7 mV TA = –40°C to 125°C 10 A-suffix devices 1 2 TA = –40°C to 125°C 4 dVOS/dT Input offset voltage drift TA = –40°C to 125°C 7 µV/°C PSRR Input offset voltage vs power supply (ΔVIO/ΔVS) VS = 5 V to 30 V 65 100 dB VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB INPUT VOLTAGE RANGE VCM Common-mode voltage range VS = 5 V to maximum (V–) (V+) – 1.5 V CMRR Common-mode rejection ratio VS = 5 V to maximum; VCM = 0 V 65 80 dB INPUT BIAS CURRENT IB Input bias current VO = 1.4 V –20 –250 nA TA = –40°C to 125°C –500 IOS Input offset current VO = 1.4 V Non-V suffix device 2 50 nA TA = –40°C to 125°C 300 V-suffix device 2 50 TA = –40°C to 125°C 150 dIOS/dT Input offset current drift TA = –40°C to 125°C 10 pA/°C NOISE en Input voltage noise density f = 1 kHz 40 nV/√ Hz OPEN-LOOP GAIN AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ 25 100 V/mV TA = –40°C to 125°C 15 FREQUENCY RESPONSE GBW Gain bandwidth product 0.7 MHz SR Slew rate G = +1 0.3 V/µs OUTPUT VO Voltage output swing from rail Positive rail RL ≥ 10 kΩ VS – 1.5 V Non-V suffix device VS = maximum; RL = 2 kΩ TA = –40°C to 125°C VS = maximum; RL ≥ 10 kΩ 2 3 V-suffix device VS = maximum; RL = 2 kΩ 6 VS = maximum; RL ≥ 10 kΩ 4 5 Negative rail VS = 5 V; RL ≤ 10 kΩ TA = –40°C to 125°C 5 20 mV IO Output current VS = 15 V; VO = 0 V; VID = 1 V Source –20 –30 mA TA = –40°C to 125°C –10 VS = 15 V; VO = 15 V; VID = –1 V Sink 10 20 TA = –40°C to 125°C 5 VID = -1 V; VO = 200 mV Non-V suffix device 30 µA V-suffix device 12 40 ISC Short-circuit current VS = 10 V; VO = VS / 2 ±40 ±60 mA POWER SUPPLY IQ Quiescent current per amplifier VO = 2.5 V; IO = 0 A TA = –40°C to 125°C 350 600 µA VS = maximum; VO = maximum / 2; IO = 0 A 500 1000 (1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Maximum VS for testing purposes is 26 V for LM2904 and 32 V for LM2904V. (2) All typical values are TA = 25°C. www.ti.com LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

5.9 Electrical Characteristics: LM158, LM158A

For VS = (V+) – (V–) = 5 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT OFFSET VOLTAGE VOS Input offset voltage VS = 5 V to 30 V; VC M = 0 V; VO = 1.4 V LM158 3 5 mV TA = –55°C to 125°C 7 LM158A TA = –55°C to 125°C 4 dVOS/dT Input offset voltage drift LM158 TA = –55°C to 125°C 7 µV/°C LM158A TA = –55°C to 125°C 7 15(3) PSRR Input offset voltage vs power supply (ΔVIO/ΔVS) VS = 5 V to 30 V 65 100 dB VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB INPUT VOLTAGE RANGE VCM Common-mode voltage range VS = 5 V to 30 V LM158 (V–) (V+) – 1.5 V VS = 30 V LM158A VS = 5 V to 30 V LM158 VS = 30 V LM158A CMRR Common-mode rejection ratio VS = 5 V to 30 V; VCM = 0 V 70 80 dB INPUT BIAS CURRENT IB Input bias current VO = 1.4 V LM158 –20 –150 nA TA = –55°C to 125°C –300 LM158A –15 –50 TA = –55°C to 125°C –100 IOS Input offset current VO = 1.4 V LM158 2 30 nA TA = –55°C to 125°C 100 LM158A 2 10 TA = –55°C to 125°C 30 dIOS/dT Input offset current drift pA/°C LM158A TA = –55°C to 125°C 200 NOISE en Input voltage noise density f = 1 kHz 40 nV/√ Hz OPEN-LOOP GAIN AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ 50 100 V/mV TA = –55°C to 125°C 25 FREQUENCY RESPONSE GBW Gain bandwidth product 0.7 MHz SR Slew rate G = +1 0.3 V/µs OUTPUT VO Voltage output swing from rail Positive rail VS = 30 V; RL = 2 kΩ TA = –55°C to 125°C 4 VVS = 30 V; RL ≥ 10 kΩ 2 3 VS = 5 V; RL ≥ 2 kΩ 1.5 Negative rail VS = 5 V; RL ≤ 10 kΩ TA = –55°C to 125°C 5 20 mV IO Output current VS = 15 V; VO = 0 V; VID = 1 V Source –20 –30 mA LM158A –60 TA = –55°C to 125°C –10 VS = 15 V; VO = 15 V; VID = –1 V Sink 10 20 TA = –55°C to 125°C 5 VID = –1 V; VO = 200 mV 12 30 µA ISC Short-circuit current VS = 10 V; VO = VS / 2 ±40 ±60 mA LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

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5.9 Electrical Characteristics: LM158, LM158A (continued)

For VS = (V+) – (V–) = 5 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT POWER SUPPLY IQ Quiescent current per amplifier VO = 2.5 V; IO = 0 A TA = –55°C to 125°C 350 600 µA VS = 30 V; VO = 15 V; IO = 0 A 500 1000 (1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Maximum VS for testing purposes is 30 V for LM158 and LM158A. (2) All typical values are TA = 25°C. (3) On products compliant to MIL-PRF-38535, this parameter is not production tested. www.ti.com LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

5.10 Electrical Characteristics: LM258, LM258A

For VS = (V+) – (V–) = 5 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT OFFSET VOLTAGE VOS Input offset voltage VS = 5 V to 30 V; VC M = 0 V; VO = 1.4 V LM258 3 5 mV TA = –25°C to 85°C 7 LM258A 2 3 TA = –25°C to 85°C 4 dVOS/dT Input offset voltage drift LM258 TA = –25°C to 85°C µV/°C LM258A 7 15 PSRR Input offset voltage vs power supply (ΔVIO/ΔVS) VS = 5 V to 30 V 65 100 dB VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB INPUT VOLTAGE RANGE VCM Common-mode voltage range VS = 5 V to 30 V LM258 (V–) (V+) – 1.5 V VS = 30 V LM258A VS = 5 V to 30 V LM258 TA = –25°C to 85°C (V–) (V+) – 2 VS = 30 V LM258A CMRR Common-mode rejection ratio VS = 5 V to 30 V; VCM = 0 V 70 80 dB INPUT BIAS CURRENT IB Input bias current VO = 1.4 V LM258 –20 –150 nA TA = –25°C to 85°C –300 LM258A –15 –80 TA = –25°C to 85°C –100 IOS Input offset current VO = 1.4 V LM258 2 30 nA TA = –25°C to 85°C 100 LM258A 2 15 TA = –25°C to 85°C 30 dIOS/dT Input offset current drift pA/°C LM258A TA = –25°C to 85°C 200 NOISE en Input voltage noise density f = 1 kHz 40 nV/√ Hz OPEN-LOOP GAIN AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ 50 100 V/mV TA = –25°C to 85°C 25 FREQUENCY RESPONSE GBW Gain bandwidth product 0.7 MHz SR Slew rate G = +1 0.3 V/µs OUTPUT VO Voltage output swing from rail Positive rail VS = 30 V; RL = 2 kΩ TA = –25°C to 85°C 4 VVS = 30 V; RL ≥ 10 kΩ 2 3 VS = 5 V; RL ≥ 2 kΩ 1.5 Negative rail VS = 5 V; RL ≤ 10 kΩ TA = –25°C to 85°C 5 20 mV IO Output current VS = 15 V; VO = 0 V; VID = 1 V Source –20 –30 mA LM258A –60 TA = –25°C to 85°C –10 VS = 15 V; VO = 15 V; VID = –1 V Sink 10 20 TA = –25°C to 85°C 5 VID = –1 V; VO = 200 mV 12 30 µA ISC Short-circuit current VS = 10 V; VO = VS / 2 ±40 ±60 mA POWER SUPPLY IQ Quiescent current per amplifier VO = 2.5 V; IO = 0 A TA = –25°C to 85°C 350 600 µA VS = 30 V; VO = 15 V; IO = 0 A 500 1000 (1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Maximum VS for testing purposes is 30 V for LM258 and LM258A. (2) All typical values are TA = 25°C. LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

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5.11 Typical Characteristics: LM358B and LM2904B

This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted). Offset Voltage (µV) Amplifiers (%) -1800 -1200 -600 0 600 1200 1800 DC11 Figure 5-1. Offset Voltage Production Distribution Offset Voltage Drift (µV/°C) Amplifiers (%) DC12 Figure 5-2. Offset Voltage Drift Distribution Temperature (°C) Offset Voltage (µV) -40 -20 0 20 40 60 80 100 120 -750 -450 -150 150 450 750 DC10 Figure 5-3. Offset Voltage vs Temperature Common-Mode Voltage (V) Offset Voltage (µV) -18 -12 -6 0 6 12 17 -500 -300 -100 100 300 500 DC10 Figure 5-4. Offset Voltage vs Common-Mode Voltage Frequency (Hz) Open Loop Voltage Gain (dB) Phase () -20 -10 -10 0 0 10 10 20 20 30 30 40 40 50 50 60 60 70 70 80 80 90 90 100 1k 10k 100k 1M D012 Gain (dB) Phase (°) Figure 5-5. Open-Loop Gain and Phase vs Frequency Frequency (Hz) Closed Lopp Voltage Gain (dB) -30 -20 -10 1k 10k 100k 1M D017 G = 1 G = 10 G = 100 G = 1000 G = –1 Figure 5-6. Closed-Loop Gain vs Frequency www.ti.com LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

5.11 Typical Characteristics: LM358B and LM2904B (continued)

This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted). Common-Mode Voltage (V) Input Bias Current (nA) -20 -15 -10 -5 0 5 10 15 20 -15 -12.5 -10 -7.5 DC3I IB+ IB– Figure 5-7. Input Bias Current vs Common-Mode Voltage Common-Mode Voltage (V) Input Offset Current (pA) -20 -15 -10 -5 0 5 10 15 20 -40 -20 100 120 DC3I Figure 5-8. Input Offset Current vs Common-Mode Voltage Temperature (°C) Input Bias Current (nA) -40 -10 20 50 80 110 130 -12 -11 -10 DCIB IB+ IB– Figure 5-9. Input Bias Current vs Temperature Temperature (°C) Input Offset Current (nA) -40 -10 20 50 80 110 130 -0.03 -0.015 0.015 0.03 0.045 0.06 DCIO Figure 5-10. Input Offset Current vs Temperature Output Current (mA) Output Voltage (V) 0 10 20 30 40 50 (V+) – 3 V (V+) – 6 V (V+) – 9 V (V+) – 12 V DC13 –40C 25C 125C Figure 5-11. Output Voltage Swing vs Output Current (Sourcing) Output Current (mA) Output Voltage (V) 0 5 10 15 20 25 30 35 40 (V–) + 3 V (V–) + 6 V (V–) + 9 V (V–) + 12 V (V–) + 15 V (V–) + 18 V DC1- –40C 25C 125C Figure 5-12. Output Voltage Swing vs Output Current (Sinking) LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

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This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted). Frequency (Hz) PSRR and CMRR (dB) 100 1k 10k 100k 1M D001 PSRR+ PSRR- CMRR Figure 5-13. CMRR and PSRR vs Frequency Temperature (°C) Common-Mode Rejection Ratio (dB) -40 -10 20 50 80 110 130 100 105 110 115 120 DC2_ VS = 36V VS = 5V Figure 5-14. Common-Mode Rejection Ratio vs Temperature (dB) Temperature (°C) Power Supply Rejection Ratio (dB) -40 -20 0 20 40 60 80 100 120 140 -123 -122 -121 -120 -119 -118 DC8_ VS = 5 V to 36 V Figure 5-15. Power Supply Rejection Ratio vs Temperature (dB) Time (s) Voltage (µV) 0 1 2 3 4 5 6 7 8 9 10 -1.6 -1.2 -0.8 -0.4 0.4 0.8 1.2 1.6 D011 Figure 5-16. 0.1-Hz to 10-Hz Noise Frequency (Hz) Voltage Noise Spectral Density (nV/—Hz) 100 10 100 1k 10k 100k D010 Figure 5-17. Input Voltage Noise Spectral Density vs Frequency Frequency (Hz) THD+N (dB) -112 -104 -96 -88 -80 -72 -64 -56 -48 -40 -32 100 1k 10k D013 10 k 2 k G = 1, f = 1 kHz, BW = 80 kHz, VOUT = 10 VPP, RL connected to V– Figure 5-18. THD+N Ratio vs Frequency, G = 1 www.ti.com LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted). Frequency (Hz) THD+N (dB) -104 -96 -88 -80 -72 -64 -56 -48 -40 -32 100 1k 10k D014 10 k 2 k G = –1, f = 1 kHz, BW = 80 kHz, VOUT = 10 VPP, RL connected to V– See Figure 6-3 Figure 5-19. THD+N Ratio vs Frequency, G = –1 Amplitude (VPP) THD+N (dB) 0.001 0.01 0.1 1 10 20 20 -120 -110 -100 -90 -80 -70 -60 -50 -40 -30 D015 10 k 2 k G = 1, f = 1 kHz, BW = 80 kHz, RL connected to V– Figure 5-20. THD+N vs Output Amplitude, G = 1 Amplitude (VPP) THD+N (dB) 0.001 0.01 0.1 1 10 20 20 -110 -95 -80 -65 -50 -35 -20 D016 10 k 2 k G = –1, f = 1 kHz, BW = 80 kHz, RL connected to V– See Figure 6-3 Figure 5-21. THD+N vs Output Amplitude, G = –1 Supply Voltage (V) Quiescent Current (µA) 3 9 15 21 27 33 36 280 310 340 370 400 430 460 DC_S Figure 5-22. Quiescent Current vs Supply Voltage Temperature (°C) Quiescent Current per Amplifier (µA) -40 -20 0 20 40 60 80 100 120 240 300 360 420 480 540 600 DC4_ VS = 36V VS = 5V Figure 5-23. Quiescent Current vs Temperature Frequency (Hz) Open Loop Output Impedance () 100 200 300 400 500 1k 10k 100k 1M D006 Figure 5-24. Open-Loop Output Impedance vs Frequency LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

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This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted). Capacitance load (pF) Overshoot (%) 0 40 80 120 160 200 240 280 320 360 D019 Overshoot (+) Overshoot (-) G = 1, 100-mV output step, RL = open Figure 5-25. Small-Signal Overshoot vs Capacitive Load Capacitance load (pF) Overshoot (%) 40 80 120 160 200 240 280 320 360 D020 Overshoot (+) Overshoot (–) G = –1, 100-mV output step, RL = open Figure 5-26. Small-Signal Overshoot vs Capacitive Load Capacitance Load (pF) Phase Margin (°) 0 40 80 120 160 200 240 280 320 360 D018 Figure 5-27. Phase Margin vs Capacitive Load Time (s) Voltage (V) 0 200 400 600 800 1000 -20 -10 D021 Input Output G = –10 Figure 5-28. Overload Recovery Time (s) Voltage (mV) 0 20 40 60 80 100 -10 -7.5 -2.5 2.5 7.5 D022 Input Output G = 1, RL = open Figure 5-29. Small-Signal Step Response, G = 1 Time (s) Voltage (mV) 0 20 40 60 80 100 -10 -7.5 -2.5 2.5 7.5 D023 Input Output G = –1, RL = open, RFB = 10K See Figure 6-3 Figure 5-30. Small-Signal Step Response, G = –1 www.ti.com LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted). Time (s) Output Delta from Final Value (mV) -20 -16 -12 D003 G = 1, RL = open Figure 5-31. Large-Signal Step Response (Rising) Time (s) Output Delta from Final Value (mV) -40 -32 -24 -16 D004 G = 1, RL = open Figure 5-32. Large-Signal Step Response (Falling) Time (µs) Votlage (V) 0 20 40 60 80 100 -2.5 -1.5 -0.5 0.5 1.5 2.5 AC_S Output Input G = 1, RL = open Figure 5-33. Large-Signal Step Response Temp(C) Slew Rate(V/s) -40 -25 -10 5 20 35 50 65 80 95 110 125 0.425 0.475 0.525 0.575 0.625 0.675 D009 Positive Negative Figure 5-34. Slew Rate vs Temperature Temperature (°C) Short-Circuit Current (mA) -40 -25 -10 5 20 35 50 65 80 95 110 125 -60 -40 -20 DC7_ Sinking Sourcing Figure 5-35. Short-Circuit Current vs Temperature Frequency (Hz) Maximum Output Voltage (VPP) 1k 10k 100k 1M D005 VS = 15 V Figure 5-36. Maximum Output Voltage vs Frequency LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

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This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted). Frequency (Hz) Channel Separation (dB) -135 -125 -115 -105 -95 -85 -75 1k 10k 100k 1M D008 Figure 5-37. Channel Separation vs Frequency Frequency (Hz) EMIRR (dB) 1M 10M 100M 1G D007 Figure 5-38. EMIRR (Electromagnetic Interference Rejection Ratio) vs Frequency www.ti.com LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

5.12 Typical Characteristics: LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and

Typical characteristics section is applicable for LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and LM2904V. –55 –35 –15 5 25 45 65 85 105 125 Input Current (nAdc) Temperature (°C) 5Vdc 15Vdc 30Vdc Figure 5-39. Input Current vs Temperature 0.2 0.22 0.24 0.26 0.28 0.3 0.32 0.34 0.36 0 5 10 15 20 25 30 Supply Current (mA) Supply Voltage (Vdc) –55C 125C Figure 5-40. Supply Current vs Supply Voltage 2 0 100 120 140 160 0 5 10 15 20 25 30 35 40 Avol Voltage Gain (dB) V+ Supply Voltage (Vdc) RL=20K RL=2K Figure 5-41. Voltage Gain vs Supply Voltage 100 0.1 1 10 100 1000 CMRR (dB) Frequency (kHz) CMRR C001 Figure 5-42. Common-Mode Rejection Ratio vs Frequency 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 4 8 12 16 20 24 28 32 36 40 Voltage (V) Time ( VOUT C001 Figure 5-43. Voltage Follower Large Signal Response (50 pF) 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0 2 4 6 8 10 Voltage (V) Time ( VOUT C001 Figure 5-44. Voltage Follower Small Signal Response (50 pF) LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

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LM2904V (continued) Typical characteristics section is applicable for LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and LM2904V. 2.5 7.5 12.5 17.5 1 10 100 1k Output Swing (Vp-p) Frequency (kHz) Figure 5-45. Maximum Output Swing vs Frequency (VCC = 15 V) 0.001 0.01 0.1 1 10 100 Output Voltage (Vdc) relative to Vcc Output Sink Current (mAdc) Figure 5-46. Output Sourcing Characteristics 0.01 0.1 0.001 0.01 0.1 1 10 100 Output Voltage (Vdc) Output Sink Current (mAdc) 5Vdc 15Vdc 30Vdc Figure 5-47. Output Sinking Characteristics –55 –35 –15 5 25 45 65 85 105 125 Output Current (mAdc) Temperature (°C) Figure 5-48. Source Current Limiting www.ti.com LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 23 Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

6 Parameter Measurement Information

VCC− Figure 6-1. Unity-Gain Amplifier VO 100 Ω VCC+ VCC− RS 900 Ω VI = 0 V Figure 6-2. Noise-Test Circuit 10 k +18V -18V GNDGND RL VIN Figure 6-3. Test Circuit, G = –1, for THD+N and Small-Signal Step Response LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

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7 Detailed Description

7.1 Overview

These devices consist of two independent, high-gain frequency-compensated operational amplifiers designed to operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the difference between the two supplies is within the supply voltage range specified in Recommended Operating Conditions and VS is at least 1.5 V more positive than the input common-mode voltage. The low supply-current drain is independent of the magnitude of the supply voltage. Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier circuits that now can be implemented more easily in single-supply-voltage systems. For example, these devices can be operated directly from the standard 5-V supply used in digital systems and easily can provide the required interface electronics without additional ±5-V supplies.

7.2 Functional Block Diagram: LM358B, LM358BA, LM2904B, LM2904BA

www.ti.com LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 25 Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

7.3 Feature Description

7.3.1 Unity-Gain Bandwidth

The unity-gain bandwidth is the frequency up to which an amplifier with a unity gain may be operated without greatly distorting the signal. These devices have a 1.2-MHz unity-gain bandwidth (B Version).

7.3.2 Slew Rate

The slew rate is the rate at which an operational amplifier can change its output when there is a change on the input. These devices have a 0.5-V/µs slew rate (B Version).

7.3.3 Input Common-Mode Range

The valid common-mode range is from device ground to V S – 1.5 V (V S – 2 V across temperature). Inputs may exceed V S up to the maximum V S without device damage. At least one input must be in the valid input common-mode range for the output to be the correct phase. If both inputs exceed the valid range, then the output phase is undefined. If either input more than 0.3 V below V– then input current should be limited to 1 mA and the output phase is undefined.

7.4 Device Functional Modes

These devices are powered on when the supply is connected. This device can be operated as a single-supply operational amplifier or dual-supply amplifier, depending on the application. LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

8 Application and Implementation

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

8.1 Application Information

The LMx58 and LM2904 operational amplifiers are useful in a wide range of signal conditioning applications. Inputs can be powered before VSfor flexibility in multiple supply circuits.

8.2 Typical Application

A typical application for an operational amplifier is an inverting amplifier. This amplifier takes a positive voltage on the input, and makes it a negative voltage of the same magnitude. In the same manner, it also makes negative voltages positive. Vsup+ VOUT RF VIN RI Vsup- Figure 8-1. Application Schematic

8.2.1 Design Requirements

The supply voltage must be chosen such that it is larger than the input voltage range and output range. For instance, this application scales a signal of ±0.5 V to ±1.8 V. Setting the supply at ±12 V is sufficient to accommodate this application.

8.2.2 Detailed Design Procedure

Determine the gain required by the inverting amplifier using Equation 1 and Equation 2: V VOUTA VIN (1) V 1.8A 3.6 0.5 (2) Once the desired gain is determined, choose a value for R I or R F. [Subscripts should be fixed in the accompanying figures and equations also.] Choosing a value in the kilohm range is desirable because the amplifier circuit uses currents in the milliampere range. This ensures the part does not draw too much current. This example uses 10 kΩ for RI which means 36 kΩ is used for RF. This was determined by Equation 3. V RFA RI (3) www.ti.com LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 27 Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

8.2.3 Application Curve

-1.5 -0.5 0.5 1.5 0 0.5 1 1.5 2 Volts Time (ms) VIN VOUT Figure 8-2. Input and Output Voltages of the Inverting Amplifier

8.3 Power Supply Recommendations

Supply voltages larger than specified in the recommended operating region can permanently damage the device (see Absolute Maximum Ratings). Place 0.1-µF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high-impedance power supplies. For more detailed information on bypass capacitor placement, see Section 8.4.

8.4 Layout

8.4.1 Layout Guidelines

For best operational performance of the device, use good PCB layout practices, including:

• Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low-impedance power sources local to the analog circuitry. – Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single- supply applications.
• Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital and analog grounds, paying attention to the flow of the ground current.
• To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as opposed to in parallel with the noisy trace.
• Place the external components as close to the device as possible. Keeping RF and RG close to the inverting input minimizes parasitic capacitance, as shown in Layout Examples.
• Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitive part of the circuit.
• Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce leakage currents from nearby traces that are at different potentials. LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

8.4.2 Layout Examples

OUT2IN1í IN1+ Ví IN2í IN2+ RG RIN RF GND VIN VSíGND VS+ GND Run the input traces as far away from the supply lines as possible Only needed for dual-supply operation Place components close to device and to each other to reduce parasitic errors Use low-ESR, ceramic bypass capacitor (or GND for single supply) Ground (GND) plane on another layer Figure 8-3. Operational Amplifier Board Layout for Noninverting Configuration RIN RG RF VOUT VIN Figure 8-4. Operational Amplifier Schematic for Noninverting Configuration www.ti.com LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 29 Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

9 Device and Documentation Support

9.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

9.2 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

9.3 Trademarks

TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

9.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

9.5 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions. NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision AA (March 2022) to Revision AB (October 2024) Page

• Changed the polarity of the LM358B and LM358BA input bias current value from ± to – in the Electrical
• Changed the polarity of the LM2904B and LM2904BA input bias current value from ± to – in the Electrical Changes from Revision Z (July 2021) to Revision AA (March 2022) Page Changes from Revision Y (February 2021) to Revision Z (July 2021) Page LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

30 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

Changes from Revision X (June 2020) to Revision Y (February 2021) Page Changes from Revision W (October 2019) to Revision X (June 2020) Page Changes from Revision V (September 2018) to Revision W (October 2019) Page

• Added test circuit for THD+N and small-signal step response, G = –1 in the Parameter Measurement Changes from Revision U (January 2017) to Revision V (September 2018) Page
• Changed the first three rows of the Device Information table and added a cross-referenced note for
• Changed "free-air temperature" to "ambient temperature" in the Absolute Maximum Ratings
• Changed "free-air temperature" to "ambient temperature" in the Recommended Operating Conditions www.ti.com LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 31 Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

• Changed Operational Amplifier Board Layout for Noninverting Configuration with an image that includes a Changes from Revision T (April 2015) to Revision U (January 2017) Page Changes from Revision S (January 2014) to Revision T (April 2015) Page
• Added Applications section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device Changes from Revision R (July 2010) to Revision S (January 2014) Page

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most- current data available for the designated devices. This data is subject to change without notice and without revision of this document. For browser based versions of this data sheet, see the left-hand navigation pane. LM158, LM158A, LM258, LM258A LM2904, LM2904B, LM2904BA, LM2904V LM358, LM358A, LM358B, LM358BA SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA

www.ti.com 15-Jul-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) 5962-87710012A Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962- 87710012A LM158FKB 5962-8771001PA Active Production CDIP (JG) | 8 50 | TUBE No SNPB N/A for Pkg Type -55 to 125 8771001PA LM158 5962-87710022A Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962- 87710022A LM158AFKB 5962-8771002PA Active Production CDIP (JG) | 8 50 | TUBE No SNPB N/A for Pkg Type -55 to 125 8771002PA LM158A LM158 MW8 Active Production WAFERSALE (YS) | 0 1 | NOT REQUIRED - Call TI Level-1-NA-UNLIM -55 to 125 LM158AFKB Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962- 87710022A LM158AFKB LM158AFKB.A Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962- 87710022A LM158AFKB LM158AJG Active Production CDIP (JG) | 8 50 | TUBE No SNPB N/A for Pkg Type -55 to 125 LM158AJG LM158AJG.A Active Production CDIP (JG) | 8 50 | TUBE No SNPB N/A for Pkg Type -55 to 125 LM158AJG LM158AJGB Active Production CDIP (JG) | 8 50 | TUBE No SNPB N/A for Pkg Type -55 to 125 8771002PA LM158A LM158AJGB.A Active Production CDIP (JG) | 8 50 | TUBE No SNPB N/A for Pkg Type -55 to 125 8771002PA LM158A LM158FKB Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962- 87710012A LM158FKB LM158FKB.A Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962- 87710012A LM158FKB LM158JG Active Production CDIP (JG) | 8 50 | TUBE No SNPB N/A for Pkg Type -55 to 125 LM158JG LM158JG.A Active Production CDIP (JG) | 8 50 | TUBE No SNPB N/A for Pkg Type -55 to 125 LM158JG LM158JGB Active Production CDIP (JG) | 8 50 | TUBE No SNPB N/A for Pkg Type -55 to 125 8771001PA LM158 Addendum-Page 1

www.ti.com 15-Jul-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM158JGB.A Active Production CDIP (JG) | 8 50 | TUBE No SNPB N/A for Pkg Type -55 to 125 8771001PA LM158 LM258ADGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -25 to 85 (M3L, M3P, M3S, M3 LM258ADGKR.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 (M3L, M3P, M3S, M3 LM258ADGKR.B Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 (M3L, M3P, M3S, M3 LM258ADR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A LM258ADR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A LM258ADR.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A LM258ADRG4 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A LM258ADRG4.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A LM258ADRG4.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A LM258AP Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -25 to 85 LM258AP LM258AP.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -25 to 85 LM258AP LM258AP.B Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -25 to 85 LM258AP LM258APE4 Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -25 to 85 LM258AP LM258APE4.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -25 to 85 LM258AP LM258APE4.B Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -25 to 85 LM258AP LM258DGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -25 to 85 (M2L, M2P, M2S, M2 LM258DGKR.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -25 to 85 (M2L, M2P, M2S, M2 LM258DGKR.B Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -25 to 85 (M2L, M2P, M2S, M2 LM258DR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 LM258 LM258DR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 LM258 LM258DR.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 LM258 LM258DRG3 Obsolete Production SOIC (D) | 8 - - Call TI Call TI -25 to 85 LM258 LM258DRG4 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 LM258 LM258DRG4.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 LM258 Addendum-Page 2

www.ti.com 15-Jul-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM258DRG4.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 LM258 LM258P Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU | SN N/A for Pkg Type -25 to 85 LM258P LM258P.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -25 to 85 LM258P LM258P.B Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -25 to 85 LM258P LM258PE4 Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -25 to 85 LM258P LM258PE4.B Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -25 to 85 LM258P LM2904AVQDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQDR.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQDRG4 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQDRG4.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQDRG4.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQPWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQPWR.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQPWR.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQPWRG4 Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQPWRG4.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQPWRG4.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904BAIDDFR Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2904A LM2904BAIDDFR.A Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2904A LM2904BAIDDFR.B Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2904A LM2904BAIDGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 28CB LM2904BAIDGKR.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 28CB LM2904BAIDGKR.B Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 28CB LM2904BAIDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2904BA LM2904BAIDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2904BA LM2904BAIDR.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2904BA LM2904BAIPWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2904BA LM2904BAIPWR.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2904BA LM2904BAIPWR.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2904BA LM2904BIDDFR Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 Addendum-Page 3

www.ti.com 15-Jul-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM2904BIDDFR.A Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 LM2904BIDDFR.B Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 LM2904BIDGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 28BB LM2904BIDGKR.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 28BB LM2904BIDGKR.B Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 28BB LM2904BIDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904B LM2904BIDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904B LM2904BIDR.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904B LM2904BIDRG4 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904B LM2904BIDRG4.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904B LM2904BIDRG4.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904B LM2904BIPWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904B LM2904BIPWR.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904B LM2904BIPWR.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904B LM2904DE4 NRND Production null (null) | 75 | TUBE - Call TI Call TI -40 to 125 LM2904DGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 (MBL, MBP, MBS, MB LM2904DGKR.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 (MBL, MBP, MBS, MB LM2904DGKR.B Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 (MBL, MBP, MBS, MB LM2904DR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DR.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DRG3 Obsolete Production SOIC (D) | 8 - - Call TI Call TI -40 to 125 LM2904 LM2904DRG4 Obsolete Production SOIC (D) | 8 - - Call TI Call TI -40 to 125 LM2904 LM2904P Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 125 LM2904P LM2904P.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 125 LM2904P LM2904P.B Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 125 LM2904P LM2904PE4 Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 125 LM2904P LM2904PE4.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 125 LM2904P Addendum-Page 4

www.ti.com 15-Jul-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM2904PE4.B Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 125 LM2904P LM2904PSR Active Production SO (PS) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 LM2904PSR.A Active Production SO (PS) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 LM2904PW Obsolete Production TSSOP (PW) | 8 - - Call TI Call TI -40 to 125 L2904 LM2904PWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 L2904 LM2904PWR.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 LM2904PWRG3 Obsolete Production TSSOP (PW) | 8 - - Call TI Call TI -40 to 125 L2904 LM2904PWRG4-JF Obsolete Production TSSOP (PW) | 8 - - Call TI Call TI -40 to 125 L2904 LM2904QDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1 LM2904QDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1 LM2904QDR.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1 LM2904QDRG4 Obsolete Production SOIC (D) | 8 - - Call TI Call TI -40 to 125 LM2904VQDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQDR.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQDRG4 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQDRG4.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQDRG4.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQPWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQPWR.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQPWR.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQPWRG4 Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQPWRG4.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQPWRG4.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM358ADE4 NRND Production null (null) | 75 | TUBE - Call TI Call TI 0 to 70 LM358ADGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 (M6L, M6P, M6S, M6 LM358ADGKR.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 (M6L, M6P, M6S, M6 LM358ADGKR.B Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 (M6L, M6P, M6S, M6 Addendum-Page 5

www.ti.com 15-Jul-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM358ADR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM358A LM358ADR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A LM358ADR.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A LM358AP Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM358AP LM358AP.B Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM358AP LM358APE4 Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM358AP LM358APE4.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM358AP LM358APE4.B Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM358AP LM358APW Obsolete Production TSSOP (PW) | 8 - - Call TI Call TI 0 to 70 L358A LM358APWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM 0 to 70 L358A LM358APWR.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L358A LM358BAIDDFR Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 358BA LM358BAIDDFR.A Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 358BA LM358BAIDDFR.B Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 358BA LM358BAIDDFRG4 Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 358BA LM358BAIDDFRG4.A Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 358BA LM358BAIDDFRG4.B Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 358BA LM358BAIDGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 28DB LM358BAIDGKR.B Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 28DB LM358BAIDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 L358BA LM358BAIDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 L358BA LM358BAIDR.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 L358BA LM358BAIDRG4 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 L358BA LM358BAIDRG4.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 L358BA LM358BAIDRG4.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 L358BA LM358BAIPWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 L358BA LM358BAIPWR.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 L358BA LM358BAIPWR.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 L358BA LM358BIDDFR Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM358 LM358BIDDFR.B Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM358 LM358BIDGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 85 (1TKR, 358B) Addendum-Page 6

www.ti.com 15-Jul-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM358BIDGKR.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 (1TKR, 358B) LM358BIDGKR.B Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 (1TKR, 358B) LM358BIDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B LM358BIDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B LM358BIDR.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B LM358BIDRG4 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B LM358BIDRG4.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B LM358BIDRG4.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B LM358BIPWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B LM358BIPWR.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B LM358BIPWR.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B LM358BIPWRG4 Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B LM358BIPWRG4.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B LM358BIPWRG4.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B LM358D Obsolete Production SOIC (D) | 8 - - Call TI Call TI 0 to 70 LM358 LM358DGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 (M5L, M5P, M5S, M5 LM358DGKR.B Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 (M5L, M5P, M5S, M5 LM358DR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 LM358 LM358DR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 LM358 LM358DR.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 LM358 LM358DRG3 Obsolete Production SOIC (D) | 8 - - Call TI Call TI 0 to 70 LM358 LM358DRG4 Obsolete Production SOIC (D) | 8 - - Call TI Call TI 0 to 70 LM358 LM358P Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM358P LM358P.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM358P LM358P.B Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM358P LM358PE3 Obsolete Production PDIP (P) | 8 - - Call TI Call TI 0 to 70 LM358P LM358PE4 Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM358P LM358PE4.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM358P LM358PE4.B Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM358P Addendum-Page 7

www.ti.com 15-Jul-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM358PSR Active Production SO (PS) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L358 LM358PSR.A Active Production SO (PS) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L358 LM358PW Obsolete Production TSSOP (PW) | 8 - - Call TI Call TI 0 to 70 L358 LM358PWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM 0 to 70 L358 LM358PWR.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L358 LM358PWRG3 Obsolete Production TSSOP (PW) | 8 - - Call TI Call TI 0 to 70 L358 LM358PWRG4-JF Obsolete Production TSSOP (PW) | 8 - - Call TI Call TI 0 to 70 L358 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 8

www.ti.com 15-Jul-2026 OTHER QUALIFIED VERSIONS OF LM258A, LM2904, LM2904B, LM2904BA :

• Automotive : LM2904-Q1 , LM2904B-Q1 , LM2904BA-Q1
• Enhanced Product : LM258A-EP , LM2904-EP NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 9

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant LM2904BAIDDFR SOT-23- THIN LM2904BIDDFR SOT-23- THIN LM358BAIDDFR SOT-23- THIN LM358BAIDDFRG4 SOT-23- THIN Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant LM358BIDDFR SOT-23- THIN Pack Materials-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM258ADGKR VSSOP DGK 8 2500 356.0 356.0 35.0 LM258ADGKR VSSOP DGK 8 2500 366.0 364.0 50.0 LM258ADGKR VSSOP DGK 8 2500 353.0 353.0 32.0 LM258ADR SOIC D 8 2500 353.0 353.0 32.0 LM258ADR SOIC D 8 2500 340.5 336.1 25.0 LM258ADRG4 SOIC D 8 2500 340.5 338.1 20.6 LM258ADRG4 SOIC D 8 2500 340.5 338.1 20.6 LM258DGKR VSSOP DGK 8 2500 366.0 364.0 50.0 LM258DGKR VSSOP DGK 8 2500 356.0 356.0 35.0 LM258DR SOIC D 8 2500 340.5 336.1 25.0 LM258DR SOIC D 8 2500 353.0 353.0 32.0 LM258DR SOIC D 8 2500 340.5 338.1 20.6 LM258DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM258DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM2904AVQDR SOIC D 8 2500 353.0 353.0 32.0 LM2904AVQDR SOIC D 8 2500 340.5 338.1 20.6 LM2904AVQDRG4 SOIC D 8 2500 353.0 353.0 32.0 LM2904AVQDRG4 SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2904AVQPWR TSSOP PW 8 2000 353.0 353.0 32.0 LM2904AVQPWRG4 TSSOP PW 8 2000 353.0 353.0 32.0 LM2904BAIDDFR SOT-23-THIN DDF 8 3000 210.0 185.0 35.0 LM2904BAIDGKR VSSOP DGK 8 2500 366.0 364.0 50.0 LM2904BAIDR SOIC D 8 2500 340.5 336.1 25.0 LM2904BAIDR SOIC D 8 2500 353.0 353.0 32.0 LM2904BAIPWR TSSOP PW 8 2000 353.0 353.0 32.0 LM2904BIDDFR SOT-23-THIN DDF 8 3000 210.0 185.0 35.0 LM2904BIDGKR VSSOP DGK 8 2500 353.0 353.0 32.0 LM2904BIDR SOIC D 8 2500 353.0 353.0 32.0 LM2904BIDR SOIC D 8 2500 353.0 353.0 32.0 LM2904BIDR SOIC D 8 2500 353.0 353.0 32.0 LM2904BIPWR TSSOP PW 8 2000 353.0 353.0 32.0 LM2904DGKR VSSOP DGK 8 2500 356.0 356.0 35.0 LM2904DGKR VSSOP DGK 8 2500 366.0 364.0 50.0 LM2904DR SOIC D 8 2500 340.5 336.1 25.0 LM2904DR SOIC D 8 2500 340.5 338.1 20.6 LM2904DR SOIC D 8 2500 353.0 353.0 32.0 LM2904PSR SO PS 8 2000 353.0 353.0 32.0 LM2904PWR TSSOP PW 8 2000 353.0 353.0 32.0 LM2904QDR SOIC D 8 2500 353.0 353.0 32.0 LM2904VQDR SOIC D 8 2500 353.0 353.0 32.0 LM2904VQDRG4 SOIC D 8 2500 340.5 338.1 20.6 LM2904VQPWR TSSOP PW 8 2000 353.0 353.0 32.0 LM2904VQPWRG4 TSSOP PW 8 2000 353.0 353.0 32.0 LM358ADGKR VSSOP DGK 8 2500 366.0 364.0 50.0 LM358ADR SOIC D 8 2500 340.5 338.1 20.6 LM358ADR SOIC D 8 2500 353.0 353.0 32.0 LM358ADR SOIC D 8 2500 353.0 353.0 32.0 LM358ADR SOIC D 8 2500 340.5 336.1 25.0 LM358APWR TSSOP PW 8 2000 353.0 353.0 32.0 LM358BAIDDFR SOT-23-THIN DDF 8 3000 210.0 185.0 35.0 LM358BAIDDFRG4 SOT-23-THIN DDF 8 3000 210.0 185.0 35.0 LM358BAIDGKR VSSOP DGK 8 2500 366.0 364.0 50.0 LM358BAIDR SOIC D 8 2500 353.0 353.0 32.0 LM358BAIDR SOIC D 8 2500 353.0 353.0 32.0 LM358BAIDR SOIC D 8 2500 340.5 336.1 25.0 LM358BAIPWR TSSOP PW 8 2000 353.0 353.0 32.0 LM358BIDDFR SOT-23-THIN DDF 8 3000 210.0 185.0 35.0 LM358BIDGKR VSSOP DGK 8 2500 353.0 353.0 32.0 LM358BIDR SOIC D 8 2500 340.5 336.1 25.0 LM358BIDR SOIC D 8 2500 353.0 353.0 32.0 LM358BIDR SOIC D 8 2500 353.0 353.0 32.0 Pack Materials-Page 5

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM358BIDRG4 SOIC D 8 2500 340.5 336.1 25.0 LM358BIDRG4 SOIC D 8 2500 353.0 353.0 32.0 LM358BIPWR TSSOP PW 8 2000 353.0 353.0 32.0 LM358BIPWRG4 TSSOP PW 8 2000 353.0 353.0 32.0 LM358DGKR VSSOP DGK 8 2500 356.0 356.0 35.0 LM358DGKR VSSOP DGK 8 2500 366.0 364.0 50.0 LM358DR SOIC D 8 2500 340.5 336.1 25.0 LM358DR SOIC D 8 2500 340.5 338.1 20.6 LM358DR SOIC D 8 2500 353.0 353.0 32.0 LM358PSR SO PS 8 2000 353.0 353.0 32.0 LM358PWR TSSOP PW 8 2000 353.0 353.0 32.0 Pack Materials-Page 6

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) 5962-87710012A FK LCCC 20 55 506.98 12.06 2030 NA 5962-87710022A FK LCCC 20 55 506.98 12.06 2030 NA LM158AFKB FK LCCC 20 55 506.98 12.06 2030 NA LM158AFKB.A FK LCCC 20 55 506.98 12.06 2030 NA LM158FKB FK LCCC 20 55 506.98 12.06 2030 NA LM158FKB.A FK LCCC 20 55 506.98 12.06 2030 NA LM258AP P PDIP 8 50 506 13.97 11230 4.32 LM258AP.A P PDIP 8 50 506 13.97 11230 4.32 LM258AP.B P PDIP 8 50 506 13.97 11230 4.32 LM258APE4 P PDIP 8 50 506 13.97 11230 4.32 LM258APE4.A P PDIP 8 50 506 13.97 11230 4.32 LM258APE4.B P PDIP 8 50 506 13.97 11230 4.32 LM258P P PDIP 8 50 506.1 9 600 5.4 LM258P P PDIP 8 50 506 13.97 11230 4.32 LM258P.A P PDIP 8 50 506 13.97 11230 4.32 LM258P.A P PDIP 8 50 506.1 9 600 5.4 LM258P.B P PDIP 8 50 506 13.97 11230 4.32 LM258P.B P PDIP 8 50 506.1 9 600 5.4 LM258PE4 P PDIP 8 50 506 13.97 11230 4.32 LM258PE4.B P PDIP 8 50 506 13.97 11230 4.32 LM2904P P PDIP 8 50 506 13.97 11230 4.32 LM2904P.A P PDIP 8 50 506 13.97 11230 4.32 LM2904P.B P PDIP 8 50 506 13.97 11230 4.32 LM2904PE4 P PDIP 8 50 506 13.97 11230 4.32 LM2904PE4.A P PDIP 8 50 506 13.97 11230 4.32 LM2904PE4.B P PDIP 8 50 506 13.97 11230 4.32 LM358AP P PDIP 8 50 506 13.97 11230 4.32 LM358AP P PDIP 8 50 506 13.97 11230 4.32 LM358AP.B P PDIP 8 50 506 13.97 11230 4.32 Pack Materials-Page 7

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) LM358AP.B P PDIP 8 50 506 13.97 11230 4.32 LM358APE4 P PDIP 8 50 506 13.97 11230 4.32 LM358APE4 P PDIP 8 50 506 13.97 11230 4.32 LM358APE4.A P PDIP 8 50 506 13.97 11230 4.32 LM358APE4.A P PDIP 8 50 506 13.97 11230 4.32 LM358APE4.B P PDIP 8 50 506 13.97 11230 4.32 LM358APE4.B P PDIP 8 50 506 13.97 11230 4.32 LM358P P PDIP 8 50 506 13.97 11230 4.32 LM358P P PDIP 8 50 506 13.97 11230 4.32 LM358P.A P PDIP 8 50 506 13.97 11230 4.32 LM358P.A P PDIP 8 50 506 13.97 11230 4.32 LM358P.B P PDIP 8 50 506 13.97 11230 4.32 LM358P.B P PDIP 8 50 506 13.97 11230 4.32 LM358PE4 P PDIP 8 50 506 13.97 11230 4.32 LM358PE4 P PDIP 8 50 506 13.97 11230 4.32 LM358PE4.A P PDIP 8 50 506 13.97 11230 4.32 LM358PE4.A P PDIP 8 50 506 13.97 11230 4.32 LM358PE4.B P PDIP 8 50 506 13.97 11230 4.32 LM358PE4.B P PDIP 8 50 506 13.97 11230 4.32 Pack Materials-Page 8

www.ti.com GENERIC PACKAGE VIEW This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. LCCC - 2.03 mm max heightFK 20 LEADLESS CERAMIC CHIP CARRIER8.89 x 8.89, 1.27 mm pitch 4229370\\/A\\

www.ti.com PACKAGE OUTLINE C 2.95

2.65 TYP

1.1 MAX 6X 0.65 8X 0.38 0.22 1.95 0.20

0.08 TYP

0 - 8 0.1 0.0 0.25 GAGE PLANE 0.6 0.3 4X 0 -15 4X 4 -15 A 2.95 2.85 NOTE 3 B 1.65 1.55 4222047/E 07/2024 SOT-23-THIN - 1.1 mm max heightDDF0008A PLASTIC SMALL OUTLINE NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 1 8

0.1 C A B

0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 4.000

www.ti.com EXAMPLE BOARD LAYOUT (2.6)

0.05 MAX

ALL AROUND 0.05 MIN ALL AROUND 8X (1.05) 8X (0.45) 6X (0.65) (R0.05) TYP 4222047/E 07/2024 SOT-23-THIN - 1.1 mm max heightDDF0008A PLASTIC SMALL OUTLINE SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X 4 5 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN (2.6) 6X (0.65) 8X (0.45) 8X (1.05) (R0.05) TYP 4222047/E 07/2024 SOT-23-THIN - 1.1 mm max heightDDF0008A PLASTIC SMALL OUTLINE NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. SYMM SYMM 4 5 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X

www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800

www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM

www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5

www.ti.com PACKAGE OUTLINE C TYP6.6 6.2

1.2 MAX

6X 0.65 8X 0.30 0.19 1.95 0.15 0.05 (0.15) TYP 0 - 8 0.25 GAGE PLANE 0.75 0.50 A NOTE 3 3.1 2.9 B NOTE 4 4.5 4.3 4221848/A 02/2015 TSSOP - 1.2 mm max heightPW0008A SMALL OUTLINE PACKAGE NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153, variation AA. 1 8 0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800

www.ti.com EXAMPLE BOARD LAYOUT (5.8)

0.05 MIN

8X (1.5) 8X (0.45) 6X (0.65) (R ) TYP 0.05 4221848/A 02/2015 TSSOP - 1.2 mm max heightPW0008A SMALL OUTLINE PACKAGE SYMM SYMM LAND PATTERN EXAMPLE SCALE:10X 4 5 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN (5.8) 6X (0.65) 8X (0.45) 8X (1.5) (R ) TYP0.05 4221848/A 02/2015 TSSOP - 1.2 mm max heightPW0008A SMALL OUTLINE PACKAGE NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SYMM SYMM 4 5 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X

www.ti.com PACKAGE OUTLINE 10.16 9.00 7.11 6.22 1.60 0.38 6X 2.54 8X 0.58 0.38 4X 1.65 1.14 0.51 MIN 3.30 MIN

5.08 MAX

7.87 7.37 0.36

0.20 TYP

4X (0.94) CDIP - 5.08 mm max heightJG0008A CERAMIC DUAL IN-LINE PACKAGE 4230036/A 09/2023 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This package can be hermetically sealed with a ceramic lid using glass frit. 4. Index point is provided on cap for terminal identification. 5. Falls within MIL STD 1835 GDIP1-T8 SEATING PLANE

0.25 C A B

A B C

www.ti.com EXAMPLE BOARD LAYOUT (7.62) 6X (2.54) 8X ( 1) THRU 7X ( 1.6) (1.6) (R0.05) TYP CDIP - 5.08 mm max heightJG0008A CERAMIC DUAL IN-LINE PACKAGE 4230036/A 09/2023 LAND PATTERN EXAMPLE NON SOLDER MASK DEFINED SCALE: 9X SOLDER MASK OPENING TYP METAL TYP SYMM SYMM 4 5

www.ti.com PACKAGE OUTLINE C 6X 0.65 1.95 8X 0.38 0.25 5.05

4.75 TYP

0.15 0.05 0.25 GAGE PLANE 0 -8

1.1 MAX

0.23 0.13 B 3.1 2.9 NOTE 4 A 3.1 2.9 NOTE 3 0.7 0.4 VSSOP - 1.1 mm max heightDGK0008A SMALL OUTLINE PACKAGE 4214862/A 04/2023

0.13 C A B

0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-187. PowerPAD is a trademark of Texas Instruments. A 20 DETAIL A TYPICAL SCALE 4.000

www.ti.com EXAMPLE BOARD LAYOUT 8X (1.4) 8X (0.45) 6X (0.65) (4.4) (R0.05) TYP VSSOP - 1.1 mm max heightDGK0008A SMALL OUTLINE PACKAGE 4214862/A 04/2023 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 8. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. 9. Size of metal pad may vary due to creepage requirement. TM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 15X SYMM SYMM SEE DETAILS 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN 8X (1.4) 8X (0.45) 6X (0.65) (4.4) (R0.05) TYP VSSOP - 1.1 mm max heightDGK0008A SMALL OUTLINE PACKAGE 4214862/A 04/2023 NOTES: (continued) 11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 12. Board assembly site may have different recommendations for stencil design. TM SOLDER PASTE EXAMPLE SCALE: 15X SYMM SYMM

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