LM2901B-Q1, LM2901x-Q1 Quadruple Automotive Comparator datasheet (Rev. H)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SLCS142,H]
- PDF pages: 36
Technical content
LM2901B-Q1, LM2901x-Q1 Quadruple Automotive Comparator
1 Features
- Qualified for automotive applications
- AEC-Q100 Qualified with the following results: – Device temperature grade 1: –40°C to 125°C ambient operating temperature range – Device HBM ESD classification levels:
- Class 1C for "AV" version
- Class 2 for all other versions – Device CDM ESD classification level C3
- Improved 2kV HBM ESD for "B" device
- Single supply or dual supplies
- Low supply-current independent of supply voltage 200uA typical per comparator ("B" Versions)
- Low input bias current 3.5nA typical ("B" device)
- Low input offset current 0.5nA typical ("B" device)
- Low input offset voltage ±0.37mV typical ("B" device)
- Common-mode input voltage range includes ground
- Differential input voltage range equal to maximum- rated supply voltage ±36V
- Output compatible with TTL, MOS, and CMOS
- For single version in SOT, see the TL331-Q1 (SLVS969)
- For dual version in multiple packages, see the LM2903x-Q1 (SLCS141)
- Functional Safety-Capable – Documentation available to aid functional safety system design
2 Applications
- Automotive – HEV/EV and power train – Infotainment and cluster – Body control module
- Industrial
- Appliances
3 Description
The LM2901B-Q1 device is the next generation version of the industry-standard LM2901x-Q1 comparator family. This next generation family provides outstanding value for cost-sensitive applications, with features including lower offset voltage and higher supply voltage capability. Additionally, lower supply current, lower input bias current, lower propagation delay, and improved 2kV ESD performance with drop-in replacement convenience. All devices consist of four independent voltage comparators that are designed to operate over a wide range of voltages. Operation from dual supplies also is possible as long as the difference between the two supplies is within 2V to 36V, and VCC is at least 1.5V more positive than the input common-mode voltage. The outputs can be connected to other open-collector outputs. The "V" versions operate up to 32V, and the "B" version operates up to 36V. All are qualified for the AEC-Q100 Grade 1 temperature range of -40°C to +125°C. Device Information PART NUMBER PACKAGE (1) BODY SIZE (NOM) LM2901B-Q1 LM2901-Q1 LM2901A-Q1 LM2901AV-Q1 TSSOP (14) 4.40mm × 5.00mm SOIC (14) 3.91mm × 8.65mm LM2901B-Q1 SOT-23 (14) (Preview) 4.20mm x 2.00mm X2QFN (14) (Preview) 2.00mm × 2.00mm WQFN (16) 3.00mm x 3.00mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Family Comparison Table Specification LM2901B-Q1 LM2901-Q1 LM2901V-Q1 LM2901AV-Q1 Units Supply Voltage 2 to 36 2 to 30 2 to 32 2 to 32 V Temperature Range −40 to 125 −40 to 125 −40 to 125 −40 to 125 °C ESD (HBM) 2000 2000 2000 2000 V Offset Voltage (maximum overtemp) ± 5.5 ± 15 ± 15 ± 4 mV Input Bias Current (typical / maximum) 3.5 / 25 25 / 250 25 / 250 25 / 250 nA Response Time (typical) 1 1.3 1.3 1.3 µsec LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
5.4 Recommended Operating Conditions for
5.5 Recommended Operating Conditions for
6.2 Functional Block Diagram Schematic (Each
10 Mechanical, Packaging, and Orderable
LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 www.ti.com
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4 Pin Configuration and Functions
2IN– 2IN+ 1IN– 1IN+ VCC 2OUT 1OUT 4IN– 3IN+ 3IN– GND 4OUT 3OUT 4IN+ Figure 4-1. D, PW and DYY Packages 14-Pin SOIC, TSSOP and SOT-23 Top View
16 OUT15IN2±
15 OUT26IN2+
2IN1± 11 IN4+
14 OUT37IN3±
13 OUT48IN3+
4IN1+ 9 IN4 ± Not to scale Thermal Pad NOTE: Connect exposed thermal pad directly to GND pin. Figure 4-2. RTE Package 16-Pad WQFN With Exposed Thermal Pad Top View 1OUT1 2VCC 3IN1- 4IN1+ 5IN2- 6IN2+ 7IN3-
8 IN3+
9 IN4-
10 IN4+
11 GND
12 OUT413
Figure 4-3. RUC Package 14-Pad X2QFN Top View www.ti.com LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: LM2901-Q1 LM2901V-Q1 LM2901AV-Q1 LM2901B-Q1
Table 4-1. Pin Functions PIN I/O DESCRIPTION NAME(1) SOIC, TSSOP, DYY X2QFN WQFN OUT1 (1) 1 14 16 Output Output pin of the comparator 2 OUT2 (1) 2 1 15 Output Output pin of the comparator 1 VCC 3 2 1 — Positive supply IN2– (1) 4 3 5 Input Negative input pin of the comparator 1 IN2+ (1) 5 4 6 Input Positive input pin of the comparator 1 IN1– (1) 6 5 2 Input Negative input pin of the comparator 2 IN1+ (1) 7 6 4 Input Positive input pin of the comparator 2 IN3– 8 7 7 Input Negative input pin of the comparator 3 IN3+ 9 8 8 Input Positive input pin of the comparator 3 IN4– 10 9 9 Input Negative input pin of the comparator 4 IN4+ 11 10 11 Input Positive input pin of the comparator 4 GND 12 11 12 — Negative supply OUT4 13 12 13 Output Output pin of the comparator 4 OUT3 14 13 14 Output Output pin of the comparator 3 NC — — 3 — No Internal Connection - Leave floating or GND NC — — 10 — No Internal Connection - Leave floating or GND Thermal Pad — — PAD — Connect directly to GND pin (1) Some manufacturers transpose the names of channels 1 & 2. Electrically the pinouts are identical, just a difference in channel naming convention. LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 www.ti.com
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5 Specifications
5.1 Absolute Maximum Ratings for LM2901B-Q1
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Supply voltage: VS = (V+) – (V–) -0.3 38 V Differential input voltage : VID (2) ±38 V Input pins (IN+, IN–) -0.3 38 V Current into input pins (IN+, IN–) -50 mA Output pin (OUT) -0.3 38 V Output sink current 25 mA Output short-circuit duration(3) Unlimited s Junction temperature, TJ 150 °C Storage temperature, Tstg -65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods can affect device reliability. (2) Differential voltages are at IN+ with respect to IN- (3) Short circuits from outputs to V+ can cause excessive heating and eventual destruction.
5.2 Absolute Maximum Ratings for LM2901x-Q1
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Supply voltage, VCC (2) 36 V Differential input voltage, VID (3) ±36 Input voltage range, VI (either input) –0.3 36 Output voltage, VO 36 Output current, IO 20 mA Duration of output short circuit to ground(4) Unlimited Operating virtual junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) Operation outside the Absolute Maximum Ratings can cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this can affect device reliability, functionality, performance, and shorten the device lifetime. (2) All voltage values, except differential voltages, are with respect to network ground. (3) Differential voltages are at IN+ with respect to IN−. (4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction. www.ti.com LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: LM2901-Q1 LM2901V-Q1 LM2901AV-Q1 LM2901B-Q1
5.3 ESD Ratings
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V Charged-device model (CDM), per AEC Q100-011(1) ±1000 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
5.4 Recommended Operating Conditions for LM2901B-Q1
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage: VS = (V+) – (V–) 2 36 V Ambient temperature, TA, LM2901B-Q1 –40 125 °C Input Voltage Range, VIVR (V–) – 0.1 (V+) – 2.0 V
5.5 Recommended Operating Conditions for LM2901x-Q1
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage LM2901-Q1 2 30 V LM2901V-Q1, LM2901AV-Q1 2 32 TA Ambient temperature –40 125 °C IO Output current (per comparator) 0 4 mA
5.6 Thermal Information
THERMAL METRIC(1) All Devices UNITD (SOIC) PW (TSSOP) DDY (SOT-23) RTE (WQFN) RUC (X2QFN)
14 PINS 14 PINS 14 PINS 16 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 111.2 136.6 67.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 66.9 66.6 72.3 RθJB Junction-to-board thermal resistance 67.8 79.8 43.1 ψJT Junction-to-top characterization parameter 28.0 17.8 6.3 ψJB Junction-to-board characterization parameter 67.4 79.3 42.8 RθJC(bot) Junction-to-case (bottom) thermal resistance - - - 26.4 - (1) For more information about traditional and new thermal metrics, see the Semicondctor and IC Package Thermal Metrics report, SPRA953. LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 www.ti.com
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5.7 Electrical Characteristics for LM2901B-Q1
VS = 5V, VCM = (V–) ; TA = 25°C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIO Input offset voltage VS = 5 to 36V –3.5 ±0.37 3.5 mV VS = 5 to 36V, TA = –40°C to +125°C –5.5 5.5 IB Input bias current –3.5 –25 nA TA = –40°C to +125°C –50 nA IOS Input offset current –25 ±0.5 25 nA TA = –40°C to +125°C –50 50 nA VCM Common mode range (1) VS = 3 to 36V (V–) (V+) – 1.5 V VS = 3 to 36V, TA = –40°C to +125°C (V–) (V+) – 2.0 V AVD Large signal differential voltage amplification VS = 15V, VO = 1.4V to 11.4V; RL ≥ 15k to (V+) 50 200 V/mV VOL Low level output Voltage {swing from (V–)} ISINK ≤ 4mA, VID = -1V 110 400 mV ISINK ≤ 4mA, VID = -1V TA = –40°C to +125°C 550 mV IOH-LKG High-level output leakage current (V+) = VO = 5V; VID = 1V 0.1 50 nA (V+) = VO = 36V; VID = 1V 100 nA IOL Low level output current VOL = 1.5V; VID = -1V; VS = 5V 6 21 mA IQ Quiescent current (all comparators) VS = 5V, no load 0.8 1.2 mA VS = 36V, no load, TA = –40°C to +125°C 1 1.6 mA (1) When the voltage at either input goes negative by more than 0.3V, the output can be incorrect and excessive input current can flow. The upper end of the common-mode voltage range is limited by VCC – 2V. However only one input needs to be in the valid common mode range, the other input can go up the maximum VCC level and the comparator provides a proper output state. Either or both inputs can go to maximum VCC level without damage.
5.8 Switching Characteristics for LM2901B-Q1
VS = 5V, VO_PULLUP = 5V, VCM = VS/2, CL = 15pF, RL = 5.1kOhm, TA = 25°C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tresponse Propagation delay time, high-to-low; Small scale input signal (1) Input overdrive = 5mV, Input step = 100mV 1000 ns tresponse Propagation delay time, high-to-low; TTL input signal (1) TTL input with Vref = 1.4V 300 ns (1) High-to-low and low-to-high refers to the transition at the input. www.ti.com LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: LM2901-Q1 LM2901V-Q1 LM2901AV-Q1 LM2901B-Q1
5.9 Electrical Characteristics for LM2901x-Q1
VCC = 5V, at specified free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS(1) TA (2) MIN TYP MAX UNIT VIO Input offset voltage VIC = VICR(min), VO = 1.4V, VCC = 5V to MAX(3) Non A devices 25°C 2 7 mV Full range 15 A suffix devices 25°C 1 2 Full range 4 IIO Input offset current VO = 1.4V 25°C 5 50 nA Full range 200 IIB Input bias current VO = 1.4V 25°C –25 –250 nA Full range –500 VICR Common-mode input- voltage range(4) 25°C 0 VCC − 1.5 V Full range 0 VCC − 2 AVD Large-signal differential- voltage amplification VCC = 15V, VO = 1.4V to 11.4V, RL ≥ 15kΩ to VCC 25°C 25 100 V/mV IOH High-level output current VID = 1V VOH = 5V 25°C 0.1 50 nA VOH = VCC MAX(3) Full range 1 μA VOL Low-level output voltage VID = –1V IOL = 4mA 25°C 150 400 mV Full range 700 IOL Low-level output current VID = –1V VOL = 1.5V 25°C 6 16 mA ICC Supply current (four comparators) VO = 2.5V, No load VCC = 5V 25°C 0.8 2 VCC = MAX(3) 1 2.5 (1) All characteristics are measured with zero common-mode input voltage, unless otherwise specified. (2) Full range (MIN to MAX) is −40°C to 125°C. All characteristics are measured with zero common-mode input voltage, unless otherwise specified. (3) VCC MAX = 30V for non-V devices and 32V for V-suffix devices. (4) The voltage at either the input or common mode can not be allowed to negative by more that 0.3V. The upper end of the common- mode voltage range is VCC+ – 1.5V; however, one input can exceed VCC, and the comparator can provide a proper output state as long as the other input remains in the common-mode range. Either or both inputs can go to 30V without damage.
5.10 Switching Characteristics for LM2901x-Q1
VCC = 5V, TA = 25°C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Response time(2) RL connected to 5V through 5.1kΩ, CL = 15pF(1) 100mV input step with 5mV overdrive 1.3 μs TTL-level input step 0.3 (1) CL includes probe and jig capacitance. (2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4V. LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 www.ti.com
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5.11 Typical Characteristics
TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. S u p p l y V o l t a g e ( V ) Total Supply Current (uA) 2 4 6 8 1 0 1 2 1 4 1 6 1 8 2 0 2 2 2 4 2 6 2 8 3 0 3 2 3 4 3 6 4 0 0 5 0 0 6 0 0 7 0 0 8 0 0 9 0 0 1 0 0 0 1 1 0 0 N o L o a d , O u t p u t H i g h - 4 0 ° C 2 5 ° C 8 5 ° C 1 2 5 ° C Figure 5-1. Total Supply Current vs. Supply Voltage I n p u t V o l t a g e ( V ) Total Supply Current (A) 1 0 0 2 0 0 3 0 0 4 0 0 5 0 0 6 0 0 7 0 0 8 0 0 9 0 0 1 0 0 0 V S = 3 V - 4 0 ° C 0 ° C 2 5 ° C 8 5 ° C 1 2 5 ° C Figure 5-2. Total Supply Current vs. Input Voltage at 3V I n p u t V o l t a g e ( V ) Total Supply Current (A) 1 0 0 2 0 0 3 0 0 4 0 0 5 0 0 6 0 0 7 0 0 8 0 0 9 0 0 1 0 0 0 V S = 3 . 3 V - 4 0 ° C 0 ° C 2 5 ° C 8 5 ° C 1 2 5 ° C Figure 5-3. Total Supply Current vs. Input Voltage at 3.3V I n p u t V o l t a g e ( V ) Total Supply Current (A) 1 0 0 2 0 0 3 0 0 4 0 0 5 0 0 6 0 0 7 0 0 8 0 0 9 0 0 1 , 0 0 0 V S = 5 V - 4 0 ° C 0 ° C 2 5 ° C 8 5 ° C 1 2 5 ° C Figure 5-4. Total Supply Current vs. Input Voltage at 5V I n p u t V o l t a g e ( V ) Total Supply Current (A) - 1 0 1 2 3 4 5 6 7 8 9 1 0 1 1 1 0 0 2 0 0 3 0 0 4 0 0 5 0 0 6 0 0 7 0 0 8 0 0 9 0 0 1 0 0 0 V S = 1 2 V - 4 0 ° C 0 ° C 2 5 ° C 8 5 ° C 1 2 5 ° C Figure 5-5. Total Supply Current vs. Input Voltage at 12V I n p u t V o l t a g e ( V ) Total Supply Current (A) 0 3 6 9 1 2 1 5 1 8 2 1 2 4 2 7 3 0 3 3 3 6 2 0 0 3 0 0 4 0 0 5 0 0 6 0 0 7 0 0 8 0 0 9 0 0 1 0 0 0 1 1 0 0 V S = 3 6 V - 4 0 ° C 0 ° C 2 5 ° C 8 5 ° C 1 2 5 ° C Figure 5-6. Total Supply Current vs. Input Voltage at 36V www.ti.com LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: LM2901-Q1 LM2901V-Q1 LM2901AV-Q1 LM2901B-Q1
5.11 Typical Characteristics (continued)
TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. Temperature (°C) Input Offset Voltage (mV) -40 -25 -10 5 20 35 50 65 80 95 110 125 -1.5 -0.5 0.5 1.5 VS = 3V
63 Channels
Figure 5-7. Input Offset Voltage vs. Temperature at 3V Temperature (°C) Input Offset Voltage (mV) -40 -25 -10 5 20 35 50 65 80 95 110 125 -1.5 -0.5 0.5 1.5 VS = 5V 62 Channels Figure 5-8. Input Offset Voltage vs. Temperature at 5V Temperature (°C) Input Offset Voltage (mV) -40 -25 -10 5 20 35 50 65 80 95 110 125 -1.5 -0.5 0.5 1.5 VS = 12V
62 Channels
Figure 5-9. Input Offset Voltage vs. Temperature at 12V Temperature (°C) Input Offset Voltage (mV) -40 -25 -10 5 20 35 50 65 80 95 110 125 -1.5 -0.5 0.5 1.5 VS = 36V 62 Channels Figure 5-10. Input Offset Voltage vs. Temperature at 36 Supply Voltage (V) Input Offset Voltage (mV) 3 6 9 12 15 18 21 24 27 30 33 36 -1.5 -0.5 0.5 1.5 TA = -40°C Figure 5-11. Input Offset Voltage vs. Supply Voltage at -40°C Supply Voltage (V) Input Offset Voltage (mV) 3 6 9 12 15 18 21 24 27 30 33 36 -1.5 -0.5 0.5 1.5 TA = 25°C 62 Channels Figure 5-12. Input Offset Voltage vs. Supply Voltage at 25°C LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 www.ti.com
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TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. Supply Voltage (V) Input Offset Voltage (mV) 3 6 9 12 15 18 21 24 27 30 33 36 -1.5 -0.5 0.5 1.5 TA = 85°C Figure 5-13. Input Offset Voltage vs. Supply Voltage at 85°C Supply Voltage (V) Input Offset Voltage (mV) 3 6 9 12 15 18 21 24 27 30 33 36 -1.5 -0.5 0.5 1.5 TA = 125qC 62 Channels Figure 5-14. Input Offset Voltage vs. Supply Voltage at 125°C Supply Voltage (V) Input Bias Current (nA) 3 6 9 12 15 18 21 24 27 30 33 36 -4.5 -3.5 -2.5 -1.5 -0.5 VCM=0V 125°C 85°C 25°C 0°C -40°C Figure 5-15. Input Bias Current vs. Supply Voltage Input Voltage (V) Input Bias Current (nA) -4.5 -3.5 -2.5 -1.5 -0.5 VS=5V 125°C 85°C 25°C 0°C -40°C Figure 5-16. Input Bias Current vs. Input Voltage at 5V Input Voltage (V) Input Bias Current (nA) -4.5 -3.5 -2.5 -1.5 -0.5 VS=12V 125°C 85°C 25°C 0°C -40°C Figure 5-17. Input Bias Current vs. Input Voltage at 12V Input Voltage (V) Input Bias Current (nA) 0 4 8 12 16 20 24 28 32 36 -4.5 -3.5 -2.5 -1.5 -0.5 0.5 VS=36V 125°C 85°C 25°C 0°C -40°C Figure 5-18. Input Bias Current vs. Input Voltage at 36V www.ti.com LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: LM2901-Q1 LM2901V-Q1 LM2901AV-Q1 LM2901B-Q1
TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. Output Sinking Current (A) Output Voltage to GND (V) 10P 100P 1m 10m 100m 10m 100m VS = 3V 125°C 85°C 25°C 0°C -40°C Figure 5-19. Output Low Voltage vs. Output Sinking Current at Output Sinking Current (A) Output Voltage to GND (V) 10P 100P 1m 10m 100m 10m 100m VS = 5V 125°C 85°C 25°C 0°C -40°C Figure 5-20. Output Low Voltage vs. Output Sinking Current at Output Sinking Current (A) Output Voltage to GND (V) 10P 100P 1m 10m 100m 10m 100m VS = 12V 125°C 85°C 25°C 0°C -40°C Figure 5-21. Output Low Voltage vs. Output Sinking Current at 12V Output Sinking Current (A) Output Voltage to GND (V) 10P 100P 1m 10m 100m 10m 100m VS = 36V 125°C 85°C 25°C 0°C -40°C Figure 5-22. Output Low Voltage vs.Output Sinking Current at 36V Temperature (°C) Output High Leakage to GND (nA) -40 -25 -10 5 20 35 50 65 80 95 110 125 0.01 0.02 0.05 0.1 0.2 0.5 100 Output set high VOUT = VS Figure 5-23. Output High Leakage Current vs.Temperature at 5V Temperature (°C) Output High Leakage to GND (nA) -40 -25 -10 5 20 35 50 65 80 95 110 125 0.01 0.02 0.05 0.1 0.2 0.5 100 Output set high VOUT = VS Figure 5-24. Output High Leakage Current vs. Temperature at 36V LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 www.ti.com
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TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. Input Overdrive (mV) Propagation Delay, High to Low (ns) 5 10 100 1000 100 200 300 400 500 600 700 800 900 1000 VS = 5V VCM = 0V CL = 15pF RP = 5.1k 125°C 85°C 25°C -40°C Figure 5-25. High to Low Propagation Delay vs. Input Overdrive Voltage, 5V Input Overdrive (mV) Propagation Delay, Low to High (ns) 5 10 100 1000 100 200 300 400 500 600 700 800 900 1000 VS = 5V VCM = 0V CL = 15pF RP = 5.1k 125°C 85°C 25°C -40°C Figure 5-26. Low to High Propagation Delay vs. Input Overdrive Voltage, 5V Input Overdrive (mV) Propagation Delay, High to Low (ns) 5 10 100 1000 100 200 300 400 500 600 700 800 900 1000 VS = 12V VCM = 0V CL = 15pF RP = 5.1k 125°C 85°C 25°C -40°C Figure 5-27. High to Low Propagation Delay vs. Input Overdrive Voltage, 12V Input Overdrive (mV) Propagation Delay, Low to High (ns) 5 10 100 1000 100 200 300 400 500 600 700 800 900 1000 VS = 12V VCM = 0V CL = 15pF RP = 5.1k 125°C 85°C 25°C -40°C Figure 5-28. Low to High Propagation Delay vs. Input Overdrive Voltage, 12V Input Overdrive (mV) Propagation Delay, High to Low (ns) 5 10 100 1000 100 200 300 400 500 600 700 800 900 1000 VS = 36V VCM = 0V CL = 15pF RP = 5.1k 125°C 85°C 25°C -40°C Figure 5-29. High to Low Propagation Delay vs. Input Overdrive Voltage, 36V Input Overdrive (mV) Propagation Delay, Low to High (ns) 5 10 100 1000 100 200 300 400 500 600 700 800 900 1000 VS = 36V VCM = 0V CL = 15pF RP = 5.1k 125°C 85°C 25°C -40°C Figure 5-30. Low to High Propagation Delay vs. Input Overdrive Voltage, 36V www.ti.com LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: LM2901-Q1 LM2901V-Q1 LM2901AV-Q1 LM2901B-Q1
TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. Time (Ps) Output Voltage (V) VREF = VCC/2 20mV Overdrive 5mV Overdrive 100mV Overdrive Figure 5-31. Response Time for Various Overdrives, High-to- Low Transition Time (Ps) Output Voltage (V) 20mV Overdrive 5mV Overdrive 100mV Overdrive VREF = VCC/2 Figure 5-32. Response Time for Various Overdrives, Low-to- High Transition LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 www.ti.com
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6 Detailed Description
6.1 Overview
The LM2901-Q1 family is a quad comparator with the ability to operate up to 36V on the supply pin. This standard device has proven ubiquity and versatility across a wide range of applications. This is due to it's very wide supply voltages range (2V to 36V), low Iq and fast response. This device is AEC-Q100 qualified and can operate over a wide temperature range of –40°C to 125°C . The open-drain output allows the user to configure the output's logic low voltage (V OL) and can be utilized to enable the comparator to be used in AND functionality. The "B" versions add dedicated ESD protections on all the pins for improved ESD performance as well as improved negative input voltage handling. Please see Application Note SNOAA35 for more information
6.2 Functional Block Diagram Schematic (Each Comparator)
- Input Q9 Q10 Q11 Q5 Q6 D2 D3 Q12 + Input Output VCC Internal Bias Itail I1 I2 Q13 Q14 ESD ESD VCM Clamp Q15
6.3 Feature Description
The comparator consists of a PNP darlington pair input, allowing the device to operate with very high gain and fast response with minimal input bias current. The input Darlington pair creates a limit on the input common mode voltage capability, allowing the comparator to accurately function from ground to V CC– 2V over temperature. On the non-B devices, a clamp was added around Q3 to mimic the both inputs above input voltage range behavior of the original classic silicon. The output consists of an open drain NPN (pull-down or low side) transistor. The output NPN sinks current when the negative input voltage is higher than the positive input voltage and the offset voltage. The V OL is resistive and scales with the output current. Please see the "Output Low Voltage vs. Output Sinking Current" graphs for VOL values with respect to the output current.
6.4 Device Functional Modes
6.4.1 Voltage Comparison
The LM2901-Q1 family of devices operates solely as a voltage comparator, comparing the differential voltage between the positive and negative pins and outputs a logic low or high impedance (logic high with pullup) based on the input differential polarity. www.ti.com LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: LM2901-Q1 LM2901V-Q1 LM2901AV-Q1 LM2901B-Q1
7 Application and Implementation
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.
7.1 Application Information
LM2901-Q1 family is typically used to compare a single signal to a reference or two signals against each other. Many users take advantage of the open drain output to drive the comparison logic output to a logic voltage level to an MCU or logic device. The wide supply range and high voltage capability makes LM2901-Q1 an excellent choice for level shifting to a higher or lower voltage.
7.2 Typical Application
½ LM2901x-Q1 VxIN+ VxIN– CL RPULLUP ½ LM2901x-Q1 VSUP VLOGIC Copyright © 2016, Texas Instruments Incorporated Figure 7-1. Single-Ended and Differential Comparator Configurations
7.2.1 Design Requirements
For this design example, use the parameters listed in Table 7-1 as the input parameters. Table 7-1. Design Parameters PARAMETER EXAMPLE VALUE Input voltage range 0V to VSUP – 1.5V Supply voltage 2V to 36V Logic supply voltage 2V to 36V Output current (RPULLUP) 1µA to 20mA Input overdrive voltage 100mV Reference voltage 2.5V Load capacitance (CL) 15pF
7.2.2 Detailed Design Procedure
7.2.2.1 Input Voltage Range
When choosing the input voltage range, the input common mode voltage range (V ICR) must be taken into account. If temperature operation is above or below 25°C the V ICR can range from 0V to V CC– 2.0V. This limits the input voltage range to as high as V CC– 2.0V and as low as 0V. Operation outside of this range can yield incorrect comparisons. Below is a list of input voltage situation and the outcomes: 1. When both IN- and IN+ are both within the common mode range: LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 www.ti.com
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Product Folder Links: LM2901-Q1 LM2901V-Q1 LM2901AV-Q1 LM2901B-Q1
a. If IN- is higher than IN+ and the offset voltage, the output is low and the output transistor is sinking current b. If IN- is lower than IN+ and the offset voltage, the output is high impedance and the output transistor is not conducting 2. When IN- is higher than common mode and IN+ is within common mode, the output is low and the output transistor is sinking current 3. When IN+ is higher than common mode and IN- is within common mode, the output is high impedance and the output transistor is not conducting 4. When IN- and IN+ are both higher than common mode, see Section 2 of Application Design Guidelines for LM339, LM393, TL331 Family Comparators Including the New B-versions.
7.2.2.2 Minimum Overdrive Voltage
The overdrive voltage is the differential voltage produced between the positive and negative inputs of the comparator over the offset voltage (V IO). To make an accurate comparison the overdrive voltage (V OD) must be higher than the input offset voltage (V IO). The overdrive voltage can also determine the response time of the comparator, with the response time decreasing as the overdrive increases. Figure 7-2 and Figure 7-3 show positive and negative response times with respect to overdrive voltage.
7.2.2.3 Output and Drive Current
Output current is determined by the load/pull-up resistance and logic/pull-up voltage. The output current produces a output low voltage (V OL) which is proportional to the output current. Use Figure 5-19, Figure 5-20, and Figure 5-21 to determine VOL based on the output current. The output current can also effect the transient response. More is explained in the next section.
7.2.2.4 Response Time
The transient response can be determined by the load capacitance (CL), load or pullup resistance (RPULLUP), and equivalent collector-emitter resistance (RCE). Use Equation 1 and Equation 2 to calculate the approximate values of the rise time (tr) and fall time (tf). tP ≈ RPULLUP × CL (1) tN ≈ RCE × CL (2) To find the value of R CE, use the slope of Figure 5-31 in the linear region at the desired temperature, or divide VOL by IO.
7.2.3 Application Curves
The following curves were generated with 5V on VCC and VLOGIC, RPULLUP = 5.1kΩ, and 50pF scope probe. www.ti.com LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: LM2901-Q1 LM2901V-Q1 LM2901AV-Q1 LM2901B-Q1
Output Voltage (V) Time (us) 5mV OD 20mV OD 100mV OD C001 Figure 7-2. Response Time for Various Overdrives Negative Transition Output Voltage (V) Time (us) 5mV OD 20mV OD 100mV OD C001 Figure 7-3. Response Time for Various Overdrives Positive Transition
7.2.4 Application Information Disclaimer
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.
7.3 Power Supply Recommendations
For fast response and comparison applications with noisy or AC inputs, TI recommends using a bypass capacitor on the supply pin to reject any variation on the supply voltage. This variation can take away from some of the input common mode range of the comparator and create an inaccurate comparison.
7.4 Layout
7.4.1 Layout Guidelines
For accurate comparator applications without hysteresis maintaining a stable power supply with minimized noise and glitches is critical. Best practice is to add a bypass capacitor between the supply voltage and ground. This can be implemented on the positive power supply and negative supply (if available). If a negative supply is not being used, do not put a capacitor between the GND pin and system ground. Minimize coupling between outputs and inverting inputs to prevent output oscillations. Do not run output and inverting input traces in parallel unless there is a V CC or GND trace between output and inverting input traces to reduce coupling. When series resistance is added to inputs, place resistor close to the device. LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 www.ti.com
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Product Folder Links: LM2901-Q1 LM2901V-Q1 LM2901AV-Q1 LM2901B-Q1
7.4.2 Layout Example
1IN– 1IN+
3 GND
2IN– 52IN+ 0.1 Fμ Ground Bypass Capacitor Negative Supply or GroundPositive Supply 0.1 Fμ Ground Only needed for dual power supplies 3IN+ 3IN– 4IN+ 4IN– 3OUT 4OUT Figure 7-4. LM2901x-Q1 Layout Example www.ti.com LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: LM2901-Q1 LM2901V-Q1 LM2901AV-Q1 LM2901B-Q1
8 Device and Documentation Support
8.1 Documentation Support
8.1.1 Related Documentation
For related documentation, see the following: TL331-Q1 Single Differential Comparator, SLVS969
8.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 8-1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM2901-Q1 Click here Click here Click here Click here Click here LM2901V-Q1 Click here Click here Click here Click here Click here LM2901AV-Q1 Click here Click here Click here Click here Click here LM2901B-Q1 Click here Click here Click here Click here Click here
8.3 Trademarks
All trademarks are the property of their respective owners.
8.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions. LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 www.ti.com
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Product Folder Links: LM2901-Q1 LM2901V-Q1 LM2901AV-Q1 LM2901B-Q1
9 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision G (March 2023) to Revision H (May 2025) Page
- Updated Functional Block Diagram and renamed to Schematic and updated Description text to include Changes from Revision F (May 2021) to Revision G (March 2023) Page Changes from Revision E (January 2015) to Revision F (May 2021) Page
10 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com LM2901-Q1, LM2901V-Q1, LM2901AV-Q1, LM2901B-Q1 SLCS142H – DECEMBER 2003 – REVISED MAY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: LM2901-Q1 LM2901V-Q1 LM2901AV-Q1 LM2901B-Q1
www.ti.com 5-Aug-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM2901AVQDRG4Q1 Obsolete Production SOIC (D) | 14 - - Call TI Call TI -40 to 125 2901AVQ LM2901AVQDRQ1 Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901AVQ LM2901AVQDRQ1.A Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901AVQ LM2901AVQPWRG4Q1 Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901AVQ LM2901AVQPWRG4Q1.A Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901AVQ LM2901AVQPWRQ1 Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901AVQ LM2901AVQPWRQ1.A Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901AVQ LM2901BQDRQ1 Active Production SOIC (D) | 14 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 LM2901BQ LM2901BQDRQ1.A Active Production SOIC (D) | 14 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 LM2901BQ LM2901BQPWRQ1 Active Production TSSOP (PW) | 14 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901BQ LM2901BQPWRQ1.A Active Production TSSOP (PW) | 14 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901BQ LM2901BWRTERQ1 Active Production WQFN (RTE) | 16 5000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901BQ LM2901BWRTERQ1.A Active Production WQFN (RTE) | 16 5000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901BQ LM2901CQPWRQ1 Active Production TSSOP (PW) | 14 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901Q1 LM2901QDRG4Q1 Obsolete Production SOIC (D) | 14 - - Call TI Call TI -40 to 125 2901Q1 LM2901QDRQ1 Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901Q1 LM2901QDRQ1.A Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901Q1 LM2901QPWRG4Q1 Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901Q1 LM2901QPWRG4Q1.A Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901Q1 LM2901QPWRQ1 Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901Q1 LM2901QPWRQ1.A Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901Q1 LM2901VQDRG4Q1 Obsolete Production SOIC (D) | 14 - - Call TI Call TI -40 to 125 2901VQ1 LM2901VQDRQ1 Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901VQ1 LM2901VQDRQ1.A Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901VQ1 LM2901VQPWRG4Q1 Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 (2901Q1, 2901VQ) LM2901VQPWRG4Q1.A Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 (2901Q1, 2901VQ) LM2901VQPWRQ1 Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901VQ LM2901VQPWRQ1.A Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2901VQ Addendum-Page 1
www.ti.com 5-Aug-2026 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM2901-Q1, LM2901AV-Q1, LM2901B-Q1, LM2901V-Q1 :
- Catalog : LM2901 , LM2901AV , LM2901B , LM2901V NOTE: Qualified Version Definitions:
- Catalog - TI's standard catalog product Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 6-Aug-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 6-Aug-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2901AVQPWRG4Q1 TSSOP PW 14 2000 353.0 353.0 32.0 LM2901AVQPWRQ1 TSSOP PW 14 2000 353.0 353.0 32.0 LM2901AVQPWRQ1 TSSOP PW 14 2000 353.0 353.0 32.0 LM2901BQDRQ1 SOIC D 14 3000 353.0 353.0 32.0 LM2901BQPWRQ1 TSSOP PW 14 3000 353.0 353.0 32.0 LM2901BWRTERQ1 WQFN RTE 16 5000 367.0 367.0 35.0 LM2901CQPWRQ1 TSSOP PW 14 3000 353.0 353.0 32.0 LM2901QDRQ1 SOIC D 14 2500 353.0 353.0 32.0 LM2901QPWRG4Q1 TSSOP PW 14 2000 353.0 353.0 32.0 LM2901QPWRQ1 TSSOP PW 14 2000 353.0 353.0 32.0 LM2901QPWRQ1 TSSOP PW 14 2000 353.0 353.0 32.0 LM2901VQDRQ1 SOIC D 14 2500 353.0 353.0 32.0 LM2901VQPWRG4Q1 TSSOP PW 14 2000 353.0 353.0 32.0 LM2901VQPWRQ1 TSSOP PW 14 2000 353.0 353.0 32.0 LM2901VQPWRQ1 TSSOP PW 14 2000 353.0 353.0 32.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C 12X 0.65 3.9 14X 0.30 0.17 6.6
6.2 TYP
1.2 MAX
0.15 0.05 0.25 GAGE PLANE 0 -8 4X (0 -12 ) B 4.5 4.3 NOTE 4 A 5.1 4.9 NOTE 3 0.75 0.50 (0.15) TYP TSSOP - 1.2 mm max heightPW0014A SMALL OUTLINE PACKAGE 4220202/B 12/2023
0.1 C A B
0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. SEATING PLANE A 20 DETAIL A TYPICAL SCALE 2.500
www.ti.com EXAMPLE BOARD LAYOUT
0.05 MAX
0.05 MIN
14X (1.5) 14X (0.45) 12X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0014A SMALL OUTLINE PACKAGE 4220202/B 12/2023 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SYMM SYMM 7 8 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED
www.ti.com EXAMPLE STENCIL DESIGN 14X (1.5) 14X (0.45) 12X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0014A SMALL OUTLINE PACKAGE 4220202/B 12/2023 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X SYMM SYMM 7 8
www.ti.com GENERIC PACKAGE VIEW This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. WQFN - 0.8 mm max heightRTE 16 PLASTIC QUAD FLATPACK - NO LEAD3 x 3, 0.5 mm pitch 4225944/A
www.ti.com PACKAGE OUTLINE C 16X 0.30 0.18 1.66 0.1 16X 0.5 0.3 0.8 0.7 (0.2) TYP 0.05 0.00 12X 0.5 1.5
0.1 MIN
A 3.1 2.9 B 3.1 2.9 (0.13) (0.16) TYP WQFN - 0.8 mm max heightRTE0016K PLASTIC QUAD FLATPACK - NO LEAD 4224938/C 03/2022 PIN 1 INDEX AREA 0.08 SEATING PLANE 4 9 5 8 16 13 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD
17 SYMM
NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 3.600 A-A 40.000 SECTION A-A TYPICAL
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MIN
0.07 MAX
16X (0.24) 16X (0.6) ( 0.2) TYP VIA 12X (0.5) (2.8) (2.8) (0.58) TYP ( 1.66) (R0.05) ALL PAD CORNERS (0.58) TYP WQFN - 0.8 mm max heightRTE0016K PLASTIC QUAD FLATPACK - NO LEAD 4224938/C 03/2022 SYMM 5 8 1316 SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:20X NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METAL SOLDER MASK OPENINGSOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN 16X (0.6) 16X (0.24) 12X (0.5) (2.8) (2.8) ( 1.51) (R0.05) TYP WQFN - 0.8 mm max heightRTE0016K PLASTIC QUAD FLATPACK - NO LEAD 4224938/C 03/2022 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SYMM ALL AROUND METAL SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 17: 84% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:25X SYMM 5 8 1316
www.ti.com PACKAGE OUTLINE C TYP6.2 5.8
1.75 MAX
12X 1.27 14X 0.51 0.31 7.62 TYP0.25 0.13 0 - 8 0.25 0.10 0.25 GAGE PLANE 1.27 0.40 A NOTE 3 8.75 8.55 B NOTE 4 4.0 3.8 4220718/A 09/2016 SOIC - 1.75 mm max heightD0014A SMALL OUTLINE INTEGRATED CIRCUIT NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm, per side. 5. Reference JEDEC registration MS-012, variation AB. 1 14
0.25 C A B
0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 1.800
www.ti.com EXAMPLE BOARD LAYOUT (5.4) 14X (1.55) 14X (0.6) 12X (1.27) (R0.05) TYP 4220718/A 09/2016 SOIC - 1.75 mm max heightD0014A SMALL OUTLINE INTEGRATED CIRCUIT SYMM SYMM LAND PATTERN EXAMPLE SCALE:8X 7 8 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED
www.ti.com EXAMPLE STENCIL DESIGN (5.4) 12X (1.27) 14X (0.6) 14X (1.55) 4220718/A 09/2016 SOIC - 1.75 mm max heightD0014A SMALL OUTLINE INTEGRATED CIRCUIT NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SYMM SYMM 7 8 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:8X
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