LM2833

LM2833 1.5MHz/3MHz 3.0A Step-Down DC-DC Switching Regulator datasheet (Rev. E)

Document overview

• Manufacturer or author: Texas Instruments, Incorporated [SNVS505,E]
• PDF pages: 32

Technical content

www.ti.com SNVS505E –MAY 2008–REVISED APRIL 2013 LM28331.5MHz/3MHz3.0AStep-DownDC-DCSwitchingRegulator Check forSamples: LM2833 1FEATURES DESCRIPTION The LM2833 regulatorisa monolithic,highfrequency, 2• InputVoltageRange of3.0Vto5.5V PWM step-downDC/DC converteravailableina 10-• Output VoltageRange of0.6Vto4.5V pinWSON orMSOP-PowerPAD package.Itcontains

• TinyMSOP-PowerPAD 10 or WSON-10 allthe activefunctionsto provide localDC/DC Package conversionwithfasttransientresponseand accurate regulationinthesmallestpossiblePCB area.With a• 3.0A Steady-StateOutput Current minimum of externalcomponents, the LM2833 is• High SwitchingFrequencies easy to use.The abilityto drive3.0A loadswithan – 1.5MHz (LM2833X) internal56 m Ω PMOS switchusing state-of-the-art 0.5µm BiCMOS technologyresultsinthebestpower– 3.0MHz (LM2833Z) densityavailable.The world-classcontrolcircuitry• Enable Pin allowson-timesas low as 30ns, thus supporting
• 56m Ω PMOS Switch exceptionallyhigh frequencyconversionover the entire3V to 5.5V inputoperatingrange down to the• 0.6V,2% InternalVoltageReferenceOver Line minimum outputvoltageof0.6V.Switchingfrequencyand Temperature isinternallyset to 1.5MHz or 3.0MHz, allowingthe• InternalSoft-Start use of extremelysmallsurfacemount inductorsand
• InternallyCompensated Peak Current-Mode capacitors.Even though the operatingfrequencyis Control high,efficienciesup to 93% are easy to achieve. Externalshutdown isincluded,featuringan ultra-low• Cycle-by-CycleCurrentLimitand Thermal stand-bycurrentof300nA. The LM2833 utilizespeakShutdown current-modecontroland internalcompensation to• Frequency Foldback Protection provide high-performanceregulationover a wide
• InputVoltageUVLO (Under-VoltageLockout) range of operatingconditions.Additionalfeatures includeinternalsoft-startcircuitryto reduce inrush• Output Over-VoltageProtection current,cycle-by-cyclecurrent limit,frequency foldback,thermalshutdown,and outputover-voltageAPPLICATIONS protection.
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• DSL Modems Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2008–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

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7,89,10 C3 4NC LM2833 SNVS505E –MAY 2008–REVISED APRIL 2013 www.ti.com TypicalApplicationCircuit Connection Diagrams Figure1.10-PinWSON Figure2.10-pinMSOP-PowerPAD See Package DSC See Package DGQ PIN DESCRIPTIONS Pin(s) Name Description 1 VINC Inputsupplyforinternalbiasand controlcircuitry.Need tolocallybypassthispintoGND. Enablecontrolinput.Logichighenablesoperation.Do notallowthispintofloatorsubjectto2 EN voltagesgreaterthanVIN + 0.3V. Signal(analog)ground.Placethebottomresistorofthefeedbacknetworkas closeas possibleto3 SGND thispinforgood loadregulation. 4 NC No userfunction,connectthispintoGND. 5 FB Feedback pin.Connectthispintotheexternalresistordividertosetoutputvoltage. 6 PGND Power groundpin.Providesgroundreturnpathfortheinternaldriver. 7,8 SW Switchpins.Connectthesepinstotheinductorand catchdiode. 9,10 VIND Inputsupplyvoltage.Connecta bypasscapacitorlocallyfromthesepinstoPGND. Connecttosystemgroundforlowthermalimpedance,butitcannotbe used as a primaryGNDDAP DieAttachPad connection.

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www.ti.com SNVS505E –MAY 2008–REVISED APRIL 2013 These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) VINC, VIND -0.5Vto7V FB Voltage -0.5Vto3V EN Voltage -0.5Vto7V SW Voltage -0.5Vto7V ESD Susceptibility(3) 2kV JunctionTemperature(4) 150°C StorageTemperature −65°C to+150°C SolderingInformation Infrared/ConvectionReflow(15sec) 220°C (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur,includinginoperabilityand degradationof devicereliabilityand/orperformance.Functionaloperationofthedeviceand/ornon-degradationattheAbsoluteMaximum Ratingsor otherconditionsbeyond thoseindicatedintherecommended OperatingRatingsisnotimplied.The recommended OperatingRatings indicateconditionsatwhichthedeviceisfunctionaland shouldnotbe operatedbeyond such conditions. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontactTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) Human body model,1.5kΩ inserieswith100pF. (4) Thermalshutdownwilloccurifthejunctiontemperatureexceedsthemaximum junctiontemperatureofthedevice. OperatingRatings VINC, VIND 3V to5.5V JunctionTemperature −40°C to+125°C Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM2833

SNVS505E –MAY 2008–REVISED APRIL 2013 www.ti.com ElectricalCharacteristics UnlessotherwisespecifiedundertheConditionscolumn,VIN = 5V.LimitsinstandardtypeareforTJ = 25°C only;limitsin boldfacetypeapplyoverthejunctiontemperature(TJ)rangeof-40°C to+125°C. Minimum and Maximum limitsarespecified throughtest,design,orstatisticalcorrelation.Typicalvaluesrepresentthemost likelyparametricnorm,and areprovidedfor referencepurposesonly. Symbol Parameter Conditions Min Typ Max Units VFB Feedback Voltage VMSOP-PowerPAD-10 0.584 0.600 0.616 Package ΔVFB /(ΔVINxVFB ) Feedback VoltageLineRegulation VIN = 3V to5.5V 0.08 %/V IB Feedback InputBiasCurrent 0.1 100 nA VIN Rising 2.70 2.90 UndervoltageLockout V UVLO VIN Falling 1.85 2.35 UVLO Hysteresis 0.35 V LM2833X 1.1 1.5 1.95 fSW SwitchingFrequency MHz LM2833Z 2.25 3.0 3.75 LM2833X 86 95 D MAX Maximum DutyCycle % LM2833Z 80 90 LM2833X 5 D MIN Minimum DutyCycle % LM2833Z 7 R DS(ON) SwitchOn Resistance m ΩMSOP-PowerPAD 10 56 Package ICL SwitchCurrentLimit 3.4 4.4 A EnableThresholdVoltage 1.8 VEN_TH V Shutdown ThresholdVoltage 0.4 ISW SwitchLeakage 100 nA IEN EnablePinCurrent Sink/Source 100 nA LM2833X, VFB = 0.55 3.2 5 QuiescentCurrent(switching) mA IQ LM2833Z, VFB = 0.55 4.3 6.5 QuiescentCurrent(shutdown) AllOptionsVEN = 0V 300 nA VFB_F FB FrequencyFoldbackThreshold AllOptions 0.32 V LM2833X, VFB = 0V 400 fFB FoldbackFrequency kHz LM2833Z, VFB = 0V 800 JunctiontoAmbientθJA °C/WMSOP-PowerPAD-100 LFPM AirFlow(1) 50Package θJC JunctiontoCase (1) °C/WMSOP-PowerPAD-10 11Package JunctionTemperatureTSD ThermalShutdown Threshold 165 °CRising JunctionTemperatureTSD_HYS ThermalShutdown Hysteresis 15 °CFalling (1) Appliesforpackagessoldereddirectlyontoa 4”x 3”4-layerstandardJEDEC boardinstillair.

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www.ti.com SNVS505E –MAY 2008–REVISED APRIL 2013 TypicalPerformance Characteristics Unlessotherwisespecified,VIN = 5V and TA = 25°C. Efficiencyvs Load Current-"LM2833X " and "LM2833Z " Efficiencyvs Load Current-"LM2833X " Figure3. Figure4. Efficiencyvs Load Current-"LM2833Z " OscillatorFrequency vs Temperature -"LM2833X " Figure5. Figure6. OscillatorFrequency vs Temperature -"LM2833Z " CurrentLimitvs Temperature Figure7. Figure8. Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM2833

SNVS505E –MAY 2008–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) Unlessotherwisespecified,VIN = 5V and TA = 25°C. R DS(ON) vs Temperature (WSON-10 Package) R DS(ON) vs Temperature (MSOP-PowerPAD-10 Package) Figure9. Figure10. LM2833X IQ (QuiescentCurrent) LM2833Z IQ (QuiescentCurrent) Figure11. Figure12. VFB vs Temperature Frequency Foldback Figure13. Figure14.

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www.ti.com SNVS505E –MAY 2008–REVISED APRIL 2013 TypicalPerformance Characteristics(continued) Unlessotherwisespecified,VIN = 5V and TA = 25°C. Loop Gain and Phase -"LM2833X " Loop Gain and Phase -"LM2833Z " Figure15. Figure16. Load Step Response -"LM2833X " LineTransientResponse -"LM2833X " Figure17. Figure18. Startupby EN -"LM2833X " Shutdown by EN -"LM2833X " Figure19. Figure20. Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM2833

SNVS505E –MAY 2008–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) Unlessotherwisespecified,VIN = 5V and TA = 25°C. StartupwithEN tiedtoVIN -"LM2833X " Short-circuitTriggering-"LM2833X " Figure21. Figure22. Short-circuitRelease -"LM2833X " Recovery from Thermal Shutdown -"LM2833X " Figure23. Figure24.

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www.ti.com SNVS505E –MAY 2008–REVISED APRIL 2013 Block Diagram Figure25. SimplifiedBlock Diagram Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM2833

-VD TON t t Inductor Current D = TON /TSW VSW TOFF TSW IL SW Voltage 'iL IOUT ILPK LM2833 SNVS505E –MAY 2008–REVISED APRIL 2013 www.ti.com

APPLICATION INFORMATION

The LM2833 isa constantfrequencyPWM buck regulatorIC thatdeliversa 3.0A loadcurrent.The regulatoris availablein presetswitchingfrequenciesof 1.5MHz or 3.0MHz. This high frequencyallowsthe LM2833 to operatewithsmallsurfacemount capacitorsand inductors,resultingin a DC/DC converterthatrequiresa minimum amount of board space.The LM2833 isinternallycompensated,thereforeitissimpleto use and requiresfew externalcomponents.The LM2833 uses peak current-modecontroltoregulatetheoutputvoltage. The followingdescriptionofoperationoftheLM2833 willrefertotheTypicalApplicationCircuit,tothewaveforms inFigure26 and simplifiedblockdiagram inFigure25. The LM2833 suppliesa regulatedoutputvoltageby switchingthe internalPMOS power switchat a constantfrequencyand variabledutycycle.A switchingcycle beginsatthefallingedge oftheresetpulsegeneratedby theinternaloscillator.When thispulsegoes low,the outputcontrollogicturnson the internalPMOS power switch.Duringthison-time,the SW pinvoltage(VSW ) swingsup toapproximatelyVIN,and theinductorcurrent(IL)increaseswitha linearslope.IL ismeasured by the currentsense amplifier,which generatesan outputproportionalto the switchcurrent.The sense signalis summed withtheregulator’s correctiveramp and compared totheerroramplifier’s output,which isproportional to the differencebetween the feedbackvoltageand VREF . When the PWM comparatoroutputgoes high,the internalpower switchturnsoffuntilthe next switchingcyclebegins.Duringthe switchoff-time,the inductor currentdischargesthroughthecatchdiodeD1, which forcestheSW pintoswing below ground by theforward voltage(VD ) of the catchdiode.The regulatorloopadjuststhe dutycycle(D) to maintaina constantoutput voltage. Figure26. SW Pin Voltageand InductorCurrentWaveforms SOFT-START/SHUTDOWN The LM2833 has both enableand shutdown modes thatare controlledby the EN pin.Connectinga voltage sourcegreaterthan1.8V totheEN pinenablestheoperationoftheLM2833, whilereducingthisvoltagebelow 0.4V placesthepartina low quiescentcurrent(300nA typical)shutdown mode. There isno internalpull-upon EN pin,thereforean externalsignalisrequiredtoinitiateswitching.Do notallowthispintofloatorriseto0.3V above VIN.Itshouldbe notedthatwhen theEN pinvoltagerisesabove 1.8V whiletheinputvoltageisgreater thanUVLO, thereis15µs delaybeforeswitchingstarts.DuringthisdelaytheLM2833 willgo througha power on resetstateafterwhichtheinternalsoft-startprocesscommences. Duringsoft-start,theerroramplifier’s reference voltageramps from 0V toitsnominalvalueof0.6V inapproximately600µs.Thisforcestheregulatoroutputto ramp up in a controlledfashion,which helpsreduce inrushcurrentseen at the inputand minimizesoutput voltageovershoot. The simplestway toenabletheoperationoftheLM2833 istoconnecttheEN pintoVIN whichallowsselfstart-up oftheLM2833 whenever theinputvoltageisapplied.However,when an inputvoltageofslowrisetimeisused to power theapplicationand ifboththeinputvoltageand theoutputvoltagearenotfullyestablishedbeforethesoft- starttimeelapses,thecontrolcircuitwillcommand maximum dutycycleoperationoftheinternalpower switchto bringup the outputvoltagerapidly.When the feedbackpinvoltageexceeds 0.6V,the dutycyclewillhave to

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www.ti.com SNVS505E –MAY 2008–REVISED APRIL 2013 reduce from the maximum valueaccordingly,to maintainregulation.Ittakesa finiteamount of time forthis reductionof dutycycleand thiscan resultina transientinoutputvoltagefora shortduration,as shown in Figure27. In applicationswhere thisoutputvoltageovershootisundesirable,one simplesolutionisto add a feed-forwardcapacitor(CFF)acrossthetopfeedbackresistorR1 tospeed Gm Amplifierrecovery.Inpractice,a 27nF to 100nF ceramiccapacitorisusuallya good choiceto remove the overshootcompletelyor limitthe overshootto an insignificantlevelduringstartup,as shown inFigure28. Anothermore effectivesolutionisto controlEN pinvoltageby a separatelogicsignal,and pullthesignalhighonlyafterVIN isfullyestablished.Inthis way, thechipcan executea normal,completesoftstartprocess,minimizingany outputvoltageovershoot.Under some circumstancesatcoldtemperature,thisapproachmay alsobe requiredtominimizeany unwanted output voltagetransientsthatmay occurwhen theinputvoltagerisesslowly.For a fastrisinginputvoltage(100µs for example),thereisno need tocontrolEN separatelyoradd a feed-forwardcapacitorsincethesoft-startcan bring up outputvoltagesmoothlyas shown inFigure29. Duringstartup,the LM2833 graduallyincreasesthe switchingfrequencyfrom 400kHz (LM2833X) or 800kHz (LM2833Z) tothenominalfixedvalue,as thefeedbackvoltageincreases(seeFREQUENCY FOLDBACK section formore information).Sincetheinternalcorrectiveramp signaladjustsitsslopedynamically,and isproportional totheswitchingfrequencyduringstartup,a largeroutputcapacitancemay be requiredtoinsurea smooth output voltagerise,atlowprogrammed outputvoltageand highoutputloadcurrent. Figure27. StartupResponse toVIN Figure28. StartupResponse toVIN withC FF Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM2833

SNVS505E –MAY 2008–REVISED APRIL 2013 www.ti.com Figure29. StartupResponse toVIN with100µs risetime FREQUENCY FOLDBACK The LM2833 uses frequencyfoldbackto helplimitswitchcurrentand power dissipationduringstart-up,short- circuitand over loadconditionsby sensingifthe feedbackvoltageisbelow 0.32V (typical).The LM2833 will reducetheswitchingfrequencyfromthenominalfixedvalue(1.5MHz or3.0MHz) down to400kHz (LM2833X) or 800kHz (LM2833Z) when the feedback voltagedrops to 0V. See Figure14 in the TypicalPerformance Characteristicssection. LOAD STEP RESPONSE The LM2833 has a fixedinternalloopcompensation,whichresultsina small-signalloopbandwidthhighlyrelated totheoutputvoltagelevel.Ingeneral,theloopbandwidthatlow voltageislargerthanathighvoltagedue tothe increasedoverallloopgain.The limitedbandwidthathighoutputvoltagemay pose a challengewhen loopstep responseisconcerned.Inthiscase,one effectiveapproachtoimprovingloopstepresponseistoadd a feed- forwardcapacitor(CFF)intherangeof27nF to100nF inparallelwiththeupperfeedbackresistor(assumingthe lowerfeedbackresistoris2kΩ),as shown inFigure30.The feed-forwardcapacitorintroducesa zero-polepair which helpscompensate theloop.The positionofthezero-polepairisa functionofthefeedbackresistorsand capacitor: (1) (2) Note thefactorinparenthesisistheratiooftheoutputvoltagetothefeedbackvoltage.As theoutputvoltage getscloseto0.6V,thepolemoves towardsthezero,tendingtocancelitout.Consequently,addingC FF willhave lesseffecton thestepresponseatloweroutputvoltages. As an example,Figure32 shows thatattheoutputvoltageof3.3V,a 47nF ofC FF can boosttheloopbandwidth to 117kHz, from the original23kHz as shown in Figure31. Correspondingly,the responsesto a load step between 0.3A and 3A withoutand withC FF areshown inFigure33 and Figure34 respectively.The higherloop bandwidthas a resultofC FF reducesthetotaloutputexcursionby more thanhalf. Aside from the above approach,increasingthe outputcapacitanceisgenerallyalsoeffectiveto reduce the excursionin outputvoltagecaused by a load step.This approach remains validforapplicationswhere the desiredoutputvoltagesareclosetothefeedbackvoltage.

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www.ti.com SNVS505E –MAY 2008–REVISED APRIL 2013 Figure30. Adding a C FF Capacitor Figure31.Loop Gain and Phase withoutC FF Figure32.Loop Gain and Phase withC FF Figure33.Load Step Response withoutC FF Figure34.Load Step Response withC FF Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LM2833

r = 'iL lOUT D = VOUT + VD VIN + VD - VSW D = VOUT VIN LM2833 SNVS505E –MAY 2008–REVISED APRIL 2013 www.ti.com OUTPUT OVER-VOLTAGE PROTECTION The LM2833 has a builtinoutputover-voltagecomparatorthatcompares the FB pinvoltageto a threshold voltagethatis15% higherthantheinternalreferenceVREF .Once theFB pinvoltageexceeds thisthresholdlevel (typically0.69V),the internalPMOS power switchisturnedoff,which allowsthe outputvoltageto decrease towardsregulation. UNDER-VOLTAGE LOCKOUT Under-voltagelockout(UVLO) preventsthe LM2833 from operatinguntilthe inputvoltageexceeds 2.70V (typical).The UVLO thresholdhas approximately350mV of hysteresis,so the partwilloperateuntilVIN drops below2.35V(typical).Hysteresispreventsthepartfromturningoffduringpower up ifVIN isnon-monotonic. CURRENT LIMIT The LM2833 uses cycle-by-cyclecurrentlimitingto protectthe internalpower switch.Duringeach switching cycle,a currentlimitcomparatordetectsifthe power switchcurrentexceeds 4.4A (typical),and turnsoffthe switchuntilthenextswitchingcyclebegins. THERMAL SHUTDOWN Thermal shutdown limitstotalpower dissipationby turningoffthe internalpower switchwhen the IC junction temperaturetypicallyexceeds 165°C. Afterthermalshutdown occurs,thepower switchdoes notturnon again untilthejunctiontemperaturedropsbelowapproximately150°C. Design Guide INDUCTOR SELECTION The DutyCycle(D)can be approximatedquicklyusingtheratioofoutputvoltage(VOUT )toinputvoltage(VIN): (3) The catchdiode(D1)forwardvoltagedropand thevoltagedrop acrosstheinternalPMOS must be includedto calculatea more accuratedutycycle.CalculateD by usingthefollowingformula: (4) VSW can be approximatedby: VSW = IOUT x R DS(ON) where

• IOUT isoutputloadcurrent. (5) The diodeforwarddrop (VD ) can range from 0.3V to0.7V dependingon thequalityofthediode.The lowerthe VD ,thehighertheoperatingefficiencyoftheconverter. The inductorvaluedeterminesthe outputripplecurrent(ΔiL, as definedinFigure26).Lower inductorvalues decreasethesizeoftheinductor,butincreasetheoutputripplecurrent.An increaseintheinductorvaluewill decreasetheoutputripplecurrent.Ingeneral,theratioofripplecurrenttotheoutputcurrentisoptimizedwhen it issetbetween 0.2and 0.4foroutputcurrentsabove 2A.Thisratiorisdefinedas: (6) One must ensurethattheminimum currentlimit(3.4A)isnotexceeded,so thepeak currentintheinductormust be calculated.The peak current(ILPK )intheinductoriscalculatedby: ILPK = IOUT + ΔiL/2 (7)

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IRMS-IN = IOUT x D x 1 - D IRMS-IN = IOUT x D x r2 121 - D + L = VOUT + VD IOUT x r x fSW x (1-D) LM2833 www.ti.com SNVS505E –MAY 2008–REVISED APRIL 2013 When thedesignedmaximum outputcurrentisreduced,theratiorcan be increased.At a currentof0.1A,rcan be made as highas 0.9.The rippleratiocan be increasedatlighterloadsbecause thenetrippleisactuallyquite low,and ifrremainsconstanttheinductorvaluecan be made quitelarge.An equationempiricallydevelopedfor themaximum rippleratioatany currentbelow2A is: r= 0.387x IOUT -0.3667 (8) Note thatthisisjusta guideline,and itneeds tobe combined withtwo importantfactorsforproperselectionof inductancevaluesatany operatingcondition.The firstconsiderationisatoutputvoltageabove 2.5V,one needs to ensure thatthe inductancegivenby the above guidelineshouldnot be lessthan 1µH forthe LM2833X or 0.5µH forthe LM2833Z. Since the LM2833 has a fixedinternalcorrectiveramp signal,a verylow inductance valueat highoutputvoltagewillgeneratea verysteepdown slopeof inductorcurrent,which willresultinan insufficientslopecompensation,and cause instabilityknown as sub-harmonicoscillation.Anotherconsideration isatlow loadcurrent,one needs toensurethattheinductancevaluegivenby theguidelineshouldnotexceed 10µH forthe LM2833X and 4.7µH forthe LM2833Z, sincetoo much inductanceeffectivelyflattensthe down slopeof the inductorcurrent,and may significantlylimitthe system bandwidthand phase margin resultingin instability. The LM2833 operatesat frequenciesallowingthe use of ceramic outputcapacitorswithoutcompromising transientresponse.Ceramic capacitorsallowhigherinductorripplewithoutsignificantlyincreasingoutputripple. See theOUTPUT CAPACITOR sectionformore detailson calculatingoutputvoltageripple. Now thattheripplecurrentisdetermined,theinductanceiscalculatedby: where

• fSW istheswitchingfrequency. (9) When selectingan inductor,make surethatitiscapableofsupportingthepeak outputcurrentwithoutsaturating. Inductorsaturationwillresultin a sudden reductionin inductanceand preventthe regulatorfrom operating properly.Because oftheoperatingfrequencyoftheLM2833, ferritebased inductorsare preferredtominimize core losses.Thispresentslittlerestrictionsincethe varietyand availabilityof ferrite-basedinductorsislarge. Lastly,inductorswithlowerseriesresistance(DCR) willprovidebetteroperatingefficiency.For recommended inductorselection,refertoDesignExamples. INPUT CAPACITOR An inputcapacitorisnecessaryto ensure thatVIN does not drop excessivelyduringswitchingtransients.The primaryspecificationsof the inputcapacitorare capacitance,voltagerating,RMS currentrating,and ESL (EquivalentSeriesInductance).The inputvoltageratingisspecificallystatedby the capacitormanufacturer. Make suretocheck any recommended deratingsand alsoverifyifthereisany significantchange incapacitance attheoperatinginputvoltageand theoperatingtemperature.The inputcapacitormaximum RMS inputcurrent rating(IRMS-IN )must be greaterthan: (10) Neglectinginductorripplesimplifiestheabove equationto: (11) Itcan be shown from theabove equationthatmaximum RMS capacitorcurrentoccurswhen D = 0.5.Always calculatetheRMS atthepointwhere thedutycycleD isclosestto0.5.The ESL ofan inputcapacitorisusually determinedby theeffectivecrosssectionalareaofthecurrentpath.As a ruleofthumb,a largeleadedcapacitor willhave highESL and a 1206 ceramicchipcapacitorwillhave verylow ESL. At theoperatingfrequenciesofthe LM2833, leadedcapacitorsmay have an ESL so largethattheresultingimpedance (2πfL)willbe higherthan thatrequiredtoprovidestableoperation.Itisstronglyrecommended touse ceramiccapacitorsdue totheirlow Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:LM2833

x R2R1 = VREF VOUT - 1 'VOUT = 'IL R ESR +8 x fSW x COUT LM2833 SNVS505E –MAY 2008–REVISED APRIL 2013 www.ti.com ESR and low ESL. A 22µF multilayerceramiccapacitor(MLCC) isa good choiceformost applications.Incases where largecapacitanceisrequired,use surfacemount capacitorssuch as Tantalum capacitorsand placeat leasta 4.7µF ceramic capacitorcloseto the VIN pin.For MLCCs itis recommended to use X7R or X5R dielectrics.Consultcapacitormanufacturerdatasheetto see how ratedcapacitancevariesover operating conditions. OUTPUT CAPACITOR The outputcapacitorisselectedbased upon thedesiredoutputrippleand transientresponse.The initialcurrent ofa loadtransientisprovidedmainlyby theoutputcapacitor.The outputrippleoftheconverteris: (12) When usingMLCCs, theESR istypicallyso low thatthecapacitiveripplemay dominate.When thisoccurs,the outputripplewillbe approximatelysinusoidaland 90° phase shiftedfrom the switchingaction.Given the availabilityand qualityofMLCCs and theexpectedoutputvoltageofdesignsusingtheLM2833, thereisreallyno need toreviewany othercapacitortechnologies.Anotherbenefitofceramiccapacitorsistheirabilitytobypass highfrequencynoise.A certainamount ofswitchingedge noisewillcouplethroughparasiticcapacitancesinthe inductorto the output.A ceramiccapacitorwillbypass thisnoisewhilea tantalumwillnot.Since the output capacitorisone of the two externalcomponents thatcontrolthe stabilityof the regulatorcontrolloop,most applicationswillrequirea minimum of22µF outputcapacitance.Inthecase oflow outputvoltage,a largeroutput capacitanceisrequiredtoensuresufficientphase margin.Capacitancecan often,butnotalways,be increased significantlywithlittledetrimentto the regulatorstability.Like the inputcapacitor,recommended multilayer ceramiccapacitorsareX7R orX5R types.Again,verifyactualcapacitanceatthedesiredoperatingvoltageand temperature.Check theRMS currentratingofthecapacitor.The maximum RMS currentratingofthecapacitor is: (13) One may selecta 1206 sizeMLCC foroutputcapacitor,sinceitscurrentratingistypicallyabove 1A, more than enough fortherequirement. CATCH DIODE The catchdiodeconductsduringtheswitchoff-time.A Schottkydiodeisrecommended foritsfastswitchingtime and lowforwardvoltagedrop.The catchdiodeshouldbe chosen such thatitscurrentratingisgreaterthan: ID = IOUT x (1-D) (14) The reversebreakdown ratingofthediodemust be atleastthemaximum inputvoltageplusappropriatemargin. To improveefficiency,choose a Schottkydiodewitha lowforwardvoltagedrop. OUTPUT VOLTAGE The outputvoltageissetusingthefollowingequationwhere R2 isconnectedbetween theFB pinand GND, and R1 isconnectedbetween VOUT and theFB pin.A good valueforR2 is2kΩ. (15) VREF = 0.60V (16)

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PCOND = (IOUT 2 x D) x 1 31 + x 'iL IOUT x RDS (ON) D = VOUT + VD + VDCR VIN + VD - VSW D = VOUT + VD VIN + VD - VSW K = POUT POUT + PLOSS K = POUT PIN LM2833 www.ti.com SNVS505E –MAY 2008–REVISED APRIL 2013 EFFICIENCY ESTIMATION The completeLM2833 DC/DC converterefficiencycan be calculatedinthefollowingmanner: (17) Or (18) Calculationsfordeterminingthemost significantpower lossesareshown below.Otherlossestotalinglessthan 2% arenotdiscussed. The main power loss(PLOSS )intheconverterincludestwo basictypesoflosses:switchinglossand conduction loss.In addition,thereislossassociatedwiththe power requiredforthe internalcircuitryof IC.Conduction lossesusuallydominateathigheroutputloads,whereas switchinglossesdominateatloweroutputloads.The firststepindeterminingthelossesistocalculatethedutycycle(D): (19) VSW isthevoltagedropacrosstheinternalpower switchwhen itison,and isequalto: VSW = IOUT x R DS(ON) (20) VD istheforwardvoltagedropacrossthecatchdiode.Itcan be obtainedfromthediodemanufacturesElectrical Characteristicssection.Ifthe DC voltagedrop across the inductor(VDCR ) is accounted for,the equation becomes: (21) The conductionlossesinthecatchdiodearecalculatedas follows: PDIODE = VD x IOUT x (1-D) (22) Oftenthisisthe singlemost significantpower lossinthe circuit.Care shouldbe takento choose a Schottky diodewitha lowforwardvoltagedrop. Another significantexternalpower lossis the conductionlossin the outputinductor.The equationcan be simplifiedto: PIND = IOUT 2 x R DCR (23) The LM2833 conductionlossismainlyassociatedwiththeinternalpower switch: (24) Iftheinductorripplecurrentisfairlysmall,theconductionlossescan be simplifiedto: PCOND = IOUT 2 x R DS(ON) x D (25) Switchinglossesare alsoassociatedwiththe internalpower switch.They occurduringthe switchon and off transitionperiods,where voltagesand currentsoverlapresultinginpower loss.The simplestmeans todetermine thislossistoempiricallymeasuringtheriseand falltimes(10% to90%) oftheswitchattheswitchnode. SwitchingPower Loss iscalculatedas follows: PSWR = 0.5x (VIN x IOUT x fSW x TRISE) (26) PSWF = 0.5x (VIN x IOUT x fSW x TFALL ) (27) PSW = PSWR + PSWF (28) The power lossrequiredforoperationoftheinternalcircuitryisgivenby: PQ = IQ x VIN (29) Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:LM2833

SNVS505E –MAY 2008–REVISED APRIL 2013 www.ti.com IQ is the quiescentoperatingcurrent,and is typicallyaround 3.2mA forthe LM2833X, and 4.3mA forthe LM2833Z. An example ofefficiencycalculationfora typicalapplicationisshown inTable1: Table1.Power Loss Tabulation Conditions Power loss VIN 5V VOUT 3.3V IOUT 3.0A POUT 9.9W VD 0.33V PDIODE 277mW R DS(ON) 56m Ω PCOND 363mW fSW 1.5MHz TRISE 10ns PSW 225mW TFALL 10ns INDDCR 28m Ω PIND 252mW IQ 3.2mA PQ 16mW η 89.7% D iscalculatedtobe 0.72 PLOSS = Σ (PCOND + PSW + PQ + PIND + PDIODE ) (30) PLOSS = 1.133W (31) PCB LAYOUT CONSIDERATIONS When planninglayouttherearea few thingstoconsidertoachievea clean,regulatedoutput.The most important considerationistheclosecouplingoftheGND connectionsoftheinputcapacitorC1 and thecatchdiodeD1. These ground ends shouldbe closeto one anotherand be connectedto the GND plane withat leasttwo through-holes.Placethesecomponents as closetotheIC as possible.The nextconsiderationisthelocationof theGND connectionoftheoutputcapacitorC2, whichshouldbe neartheGND connectionsofC1 and D1. There shouldbe a continuousgroundplaneon thebottomlayerofa two-layerboardexceptundertheswitchingnode island.The signalgroundSGND (pin3)and power groundPGND (pin6)shouldbe tiedtogetherand connected togroundplanethroughvias. The FB pinisa highimpedance node and careshouldbe takentomake theFB traceshorttoavoidnoisepickup thatcauses inaccurateregulation.The feedbackresistorsshouldbe placedas closeas possibletotheIC,with theGND ofR2 placedas closeas possibletotheSGND oftheIC.The VOUT tracetoR1 shouldbe routedaway fromtheinductorand any othertracesthatareswitching. High AC currentsflowthroughtheVIN,SW and VOUT traces,so theyshouldbe as shortand wide as possible. Radiatednoisecan be decreasedby choosinga shieldedinductor. The remainingcomponents shouldalsobe placedas closeas possibletotheIC.Pleasesee ApplicationNote AN-1229 SNVA054 forfurtherconsiderationsand theLM2833 demo boardas an example ofa four-layerlayout.

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7,89,10 C3 4NC LM2833 www.ti.com SNVS505E –MAY 2008–REVISED APRIL 2013 LM2833X Design Example 1 Table2.BillofMaterials PartID PartValue Manufacturer PartNumber U1 3.0ABuck Regulator TI LM2833X C1, InputCap 22µF,6.3V,X5R TDK C3216X5R0J226M C2, OutputCap 47µF,6.3V,X5R TDK C3216X5R0J476M C3, Bypass Cap 0.22µF,10V,X7R Murata GRM216R71A224KC01D D1, CatchDiode Schottky,0.33Vat3A,VR =30V Toshiba CMS01 L1 1.8µH, 3.6A TDK LTF5022T-1R8N3R6 R1 2.0kΩ,1% Vishay CRCW08052K00FKEA R2 2.0kΩ,1% Vishay CRCW08052K00FKEA R3 10Ω,1% Vishay CRCW080510R0FKEA Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 19 ProductFolderLinks:LM2833

SNVS505E –MAY 2008–REVISED APRIL 2013 www.ti.com LM2833X Design Example 2 Figure36. LM2833X (1.5MHz):VIN = 5V,Output = 3.3V/3.0A Table3.BillofMaterials PartID PartValue Manufacturer PartNumber U1 3.0ABuck Regulator TI LM2833X C1, InputCap 22µF,6.3V,X5R TDK C3216X5R0J226M C2, OutputCap 47µF,6.3V,X5R TDK C3216X5R0J476M C3, Bypass Cap 0.22µF,10V,X7R Murata GRM216R71A224KC01D C FF,Feed-forwardCap 47nF,10V,X7R AVX 0805ZC473JAZ2A D1, CatchDiode Schottky,0.43Vat3A,VR =30V Vishay SSA33L-E3/61T L1 1.2µH, 4.2A TDK LTF5022T-1R2N4R2 R1 10.2kΩ,1% Vishay CRCW080510K2FKEA R2 2.26kΩ,1% Vishay CRCW08052K26FKEA R3 10Ω,1% Vishay CRCW080510R0FKEA

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7,89,10 C3 4NC LM2833 www.ti.com SNVS505E –MAY 2008–REVISED APRIL 2013 LM2833Z Design Example 3 Figure37. LM2833Z (3MHz):VIN = 3.3V,Output = 1.2V/3.0A Table4.BillofMaterials PartID PartValue Manufacturer PartNumber U1 3.0ABuck Regulator TI LM2833Z C1, InputCap 22µF,6.3V,X5R TDK C3216X5R0J226M C2, OutputCap 47µF,6.3V,X5R TDK C3216X5R0J476M C3, Bypass Cap 0.22µF,10V,X7R Murata GRM216R71A224KC01D D1, CatchDiode Schottky,0.33Vat3A,VR =30V Toshiba CMS01 L1 1.0µH, 4.0A TaiyoYuden NP04SZB1R0N R1 2.0kΩ,1% Vishay CRCW08052K00FKEA R2 2.0kΩ,1% Vishay CRCW08052K00FKEA R3 10Ω,1% Vishay CRCW080510R0FKEA Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 21 ProductFolderLinks:LM2833

SNVS505E –MAY 2008–REVISED APRIL 2013 www.ti.com LM2833Z Design Example 4 Figure38. LM2833Z (3MHz):VIN = 5V,Output = 3.3V/3.0A Table5.BillofMaterials PartID PartValue Manufacturer PartNumber U1 3.0ABuck Regulator TI LM2833Z C1, InputCap 22µF,6.3V,X5R TDK C3216X5R0J226M C2, OutputCap 47µF,6.3V,X5R TDK C3216X5R0J476M C3, Bypass Cap 0.22µF,10V,X7R Murata GRM216R71A224KC01D C FF,Feed-forwardCap 47nF,10V,X7R AVX 0805ZC473JAZ2A D1, CatchDiode Schottky,0.43Vat3A,VR =30V Vishay SSA33L-E3/61T L1 1.0µH, 4.0A TaiyoYuden NP04SZB1R0N R1 10.2kΩ,1% Vishay CRCW080510K2FKEA R2 2.26kΩ,1% Vishay CRCW08052K26FKEA R3 10Ω,1% Vishay CRCW080510R0FKEA

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www.ti.com SNVS505E –MAY 2008–REVISED APRIL 2013

REVISION HISTORY

Changes from RevisionD (April2013)toRevisionE Page Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 23 ProductFolderLinks:LM2833

www.ti.com 31-Oct-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM2833XMY/NOPB Active Production HVSSOP (DGQ) | 10 1000 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 125 SPYB LM2833XMY/NOPB.A Active Production HVSSOP (DGQ) | 10 1000 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 125 SPYB LM2833XSD/NOPB Active Production WSON (DSC) | 10 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 2833X LM2833XSD/NOPB.A Active Production WSON (DSC) | 10 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 2833X LM2833ZMY/NOPB Active Production HVSSOP (DGQ) | 10 1000 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 125 SPZB LM2833ZMY/NOPB.A Active Production HVSSOP (DGQ) | 10 1000 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 125 SPZB LM2833ZMYX/NOPB Active Production HVSSOP (DGQ) | 10 3500 | LARGE T&R Yes SN Level-3-260C-168 HR -40 to 125 SPZB LM2833ZMYX/NOPB.A Active Production HVSSOP (DGQ) | 10 3500 | LARGE T&R Yes SN Level-3-260C-168 HR -40 to 125 SPZB LM2833ZSD/NOPB Active Production WSON (DSC) | 10 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 2833Z LM2833ZSD/NOPB.A Active Production WSON (DSC) | 10 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 2833Z (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative Addendum-Page 1

www.ti.com 31-Oct-2025 and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 31-Jul-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 31-Jul-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2833XMY/NOPB HVSSOP DGQ 10 1000 208.0 191.0 35.0 LM2833XSD/NOPB WSON DSC 10 1000 210.0 185.0 35.0 LM2833ZMY/NOPB HVSSOP DGQ 10 1000 208.0 191.0 35.0 LM2833ZMYX/NOPB HVSSOP DGQ 10 3500 356.0 356.0 36.0 LM2833ZSD/NOPB WSON DSC 10 1000 210.0 185.0 35.0 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C 5.05

4.75 TYP

1.1 MAX

8X 0.5 10X 0.27 0.17 0.23

0.13 TYP

0.15 0.05 1.88 1.58 2.05 1.75 0.25 GAGE PLANE 0.7 0.4 A 3.1 2.9 NOTE 3 B 3.1 2.9 4214864/A 05/2020 PowerPAD - 1.1 mm max heightDGQ0010A PLASTIC SMALL OUTLINE NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-187, variation BA-T. PowerPAD is a trademark of Texas Instruments. TM 1 10

0.08 C A B

0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 3.700 EXPOSED THERMAL PAD

www.ti.com EXAMPLE BOARD LAYOUT (4.4)

0.05 MAX

0.05 MIN

8X (0.5) (2.2) NOTE 9 (3.1) NOTE 9 (1.88) (2.05) SOLDER MASK OPENING ( 0.2) TYP VIA (1.3) TYP (1.3) TYP (R0.05) TYP 4214864/A 05/2020 PowerPAD - 1.1 mm max heightDGQ0010A PLASTIC SMALL OUTLINE SYMM SYMM SEE DETAILS LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X 5 6 SOLDER MASK OPENING METAL COVERED BY SOLDER MASK SOLDER MASK DEFINED PAD TM NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature 9. Size of metal pad may vary due to creepage requirement. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN 8X (0.5) (4.4) (1.88) (2.05) BASED ON

0.125 THICK

(R0.05) TYP 4214864/A 05/2020 PowerPAD - 1.1 mm max heightDGQ0010A PLASTIC SMALL OUTLINE 1.59 X 1.730.175 1.72 X 1.870.150 1.88 X 2.05 (SHOWN)0.125 2.10 X 2.290.1 SOLDER STENCIL OPENING STENCIL THICKNESS NOTES: (continued) 10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 11. Board assembly site may have different recommendations for stencil design. TM SOLDER PASTE EXAMPLE EXPOSED PAD 100% PRINTED SOLDER COVERAGE BY AREA SCALE:15X SYMM SYMM BASED ON

www.ti.com SDA10A (Rev A)

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