LM2717 Dual Step-Down DC/DC Converter datasheet (Rev. D)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SNVS253,D]
- PDF pages: 21
Technical content
www.ti.com SNVS253D –MAY 2005–REVISED MARCH 2013 LM2717DualStep-DownDC/DCConverter Check forSamples: LM2717 1FEATURES DESCRIPTION The LM2717 iscomposed oftwo PWM DC/DC buck 2• Fixed3.3VOutput Buck Converterwitha 2.2A, InternalSwitch voltage.Both convertersfeaturelow R DSON (0.16Ω) internalswitchesformaximum efficiency.Operating• OperatingInputVoltageRange of4V to20V frequency can be adjusted anywhere between• InputUndervoltageProtection 300kHz and 600kHz allowingthe use of small• 300kHz to600kHz Pin AdjustableOperating externalcomponents.Externalsoft-startpinsforeach Frequency enables the user to tailorthe soft-starttimes to a specificapplication.Each convertermay alsobe shut• Over Temperature Protection down independentlywithitsown shutdown pin.The• Small 24-Lead TSSOP Package LM2717 isavailableina low profile24-leadTSSOP package ensuringa lowprofileoverallsolution.APPLICATIONS
- TFT-LCD Displays
- Handheld Devices
- PortableApplications
- Laptop Computers TypicalApplicationCircuit Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2005–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNVS253D –MAY 2005–REVISED MARCH 2013 www.ti.com Connection Diagram Top View Figure1. 24-Lead TSSOP See Package Number PW0024A PIN DESCRIPTIONS Pin Name Function 1 PGND Power ground.PGND and AGND pinsmust be connectedtogetherdirectlyatthepart. 2 PGND Power ground.PGND and AGND pinsmust be connectedtogetherdirectlyatthepart. 3 AGND Analogground.PGND and AGND pinsmust be connectedtogetherdirectlyatthepart. 4 FB1 Fixedbuck outputvoltagefeedbackinput. 5 VC1 Fixedbuck compensationnetworkconnection.Connectedtotheoutputofthevoltageerroramplifier. 6 VBG Bandgap connection. 7 VC2 Adjustablebuck compensationnetworkconnection.Connectedtotheoutputofthevoltageerror amplifier. 8 FB2 Adjustablebuck outputvoltagefeedbackinput. 9 AGND Analogground.PGND and AGND pinsmust be connectedtogetherdirectlyatthepart. 10 AGND Analogground.PGND and AGND pinsmust be connectedtogetherdirectlyatthepart. 11 PGND Power ground.PGND and AGND pinsmust be connectedtogetherdirectlyatthepart. 12 PGND Power ground.PGND and AGND pinsmust be connectedtogetherdirectlyatthepart. 13 SW2 Adjustablebuck power switchinput.Switchconnectedbetween VIN pinsand SW2 pin. 14 VIN Analogpower input.VIN pinsshouldbe connectedtogetherdirectlyatthepart. 15 VIN Analogpower input.VIN pinsshouldbe connectedtogetherdirectlyatthepart. 16 CB2 Adjustablebuck converterbootstrapcapacitorconnection. 17 SHDN2 Shutdown pinforadjustablebuck converter.Activelow. 18 SS2 Adjustablebuck softstartpin. 19 FSLCT Switchingfrequencyselectinput.Use a resistortosetthefrequencyanywhere between 300kHz and 600kHz. 20 SS1 Fixedbuck softstartpin. 21 SHDN1 Shutdown pinforfixedbuck converter.Activelow. 22 CB1 Fixedbuck converterbootstrapcapacitorconnection. 23 VIN Analogpower input.VIN pinsshouldbe connectedtogetherdirectlyatthepart. 24 SW1 Fixedbuck power switchinput.Switchconnectedbetween VIN pinsand SW1 pin.
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95% Duty Cycle LimitOSC FSLCT DC LIMIT SET PWM Comp RESET OVP Comp Buck Driver BUCK DRIVE Error Amp BG FB1 Bandgap Soft Start Thermal Shutdown VBG VC1 OVP TSH SHDN1 SD Buck Load Current Measurement Fixed Buck Converter CB1 SS1 SW1 VIN PGND 95% Duty Cycle LimitOSC FSLCT DC LIMIT SET PWM Comp RESET OVP Comp Buck Driver BUCK DRIVE Error Amp BG FB2 Bandgap Soft Start Thermal Shutdown VBG VC2 OVP TSH SHDN2 SD Buck Load Current Measurement Adjustable Buck Converter CB2 SS2 SW2 VIN PGND 36.5k 20.38k LM2717 www.ti.com SNVS253D –MAY 2005–REVISED MARCH 2013 Block Diagram These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. Copyright© 2005–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM2717
SNVS253D –MAY 2005–REVISED MARCH 2013 www.ti.com AbsoluteMaximum Ratings(1)(2) VIN −0.3Vto22V SW1 Voltage −0.3Vto22V SW2 Voltage −0.3Vto22V FB1, FB2 Voltages −0.3Vto7V CB1, CB2 Voltages −0.3VtoVIN+7V (VIN=VSW ) VC1 Voltage 1.75V≤ VC1 ≤ 2.25V VC2 Voltage 0.965V≤ VC2 ≤ 1.565V SHDN1 Voltage −0.3Vto7.5V SHDN2 Voltage −0.3Vto7.5V SS1 Voltage −0.3Vto2.1V SS2 Voltage −0.3Vto2.1V FSLCT Voltage AGND to5V Maximum JunctionTemperature 150°C Power Dissipation(3) InternallyLimited Lead Temperature 300°C Vapor Phase (60sec.) 215°C Infrared(15sec.) 220°C ESD Susceptibility(4) Human Body Model 2kV (1) Absolutemaximum ratingsarelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsareconditionsforwhichthe deviceisintendedtobe functional,butdeviceparameterspecificationsmay notbe ensured.Forensuredspecificationsand test conditions,see theElectricalCharacteristics. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) The maximum allowablepower dissipationisa functionofthemaximum junctiontemperature,TJ(MAX),thejunction-to-ambientthermal resistance,θJA,and theambienttemperature,TA.See theElectricalCharacteristicstableforthethermalresistance.The maximum allowablepower dissipationatany ambienttemperatureiscalculatedusing:PD (MAX) = (TJ(MAX) − TA)/θJA.Exceedingthemaximum allowablepower dissipationwillcause excessivedietemperature,and theregulatorwillgo intothermalshutdown. (4) The human body model isa 100 pF capacitordischargedthrougha 1.5kΩ resistorintoeach pin. OperatingConditions OperatingJunctionTemperatureRange (1) −40°C to+125°C StorageTemperature −65°C to+150°C SupplyVoltage 4V to20V SW1 Voltage 20V SW2 Voltage 20V (1) Alllimitsspecifiedatroom temperature(standardtypeface)and attemperatureextremes(boldtypeface).Allroom temperaturelimitsare 100% testedorensuredthroughstatisticalanalysis.Alllimitsattemperatureextremesarespecifiedviacorrelationusingstandard StatisticalQualityControl(SQC) methods.Alllimitsareused tocalculateAverageOutgoingQualityLevel(AOQL). ElectricalCharacteristics SpecificationsinstandardtypefaceareforTJ = 25°C and thosewithboldfacetypeapplyoverthefullOperating Temperature Range (TJ = −40°C to+125°C).VIN = 5V,IL = 0A,and FSW = 300kHz unlessotherwisespecified. Symbol Parameter Conditions Min (1) Typ (2) Max (1) Units IQ TotalQuiescentCurrent(both Not Switching 2.7 6 mA switchers) Switching,switchopen 6 12 mA VSHDN = 0V 9 27 µA VFB1 FixedBuck Feedback Voltage 3.3 V VFB2 AdjustableBuck Feedback 1.267 VVoltage (1) Alllimitsspecifiedatroom temperature(standardtypeface)and attemperatureextremes(boldtypeface).Allroom temperaturelimitsare 100% testedorensuredthroughstatisticalanalysis.Alllimitsattemperatureextremesarespecifiedviacorrelationusingstandard StatisticalQualityControl(SQC) methods.Alllimitsareused tocalculateAverageOutgoingQualityLevel(AOQL). (2) Typicalnumbers areat25°C and representthemost likelynorm.
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www.ti.com SNVS253D –MAY 2005–REVISED MARCH 2013 ElectricalCharacteristics(continued) SpecificationsinstandardtypefaceareforTJ = 25°C and thosewithboldfacetypeapplyoverthefullOperating Temperature Range (TJ = −40°C to+125°C).VIN = 5V,IL = 0A,and FSW = 300kHz unlessotherwisespecified. Symbol Parameter Conditions Min (1) Typ (2) Max (1) Units ICL1 (3) FixedBuck SwitchCurrent VIN = 8V (4)
2.2 ALimit
ICL2 (3) AdjustableBuck Switch VIN = 8V (4)
3.2 ACurrentLimit
IB1 FixedBuck FB PinBias VIN = 20V 65 µACurrent(5) IB2 AdjustableBuck FB PinBias VIN = 20V 65 nACurrent(5) VIN InputVoltageRange 4 20 V gm1 FixedBuck ErrorAmp ΔI= 20µA 1340 µmhoTransconductance gm2 AdjustableBuck ErrorAmp ΔI= 20µA 1360 µmhoTransconductance AV1 FixedBuck ErrorAmp Voltage 134 V/VGain AV2 AdjustableBuck ErrorAmp 136 V/VVoltageGain D MAX Maximum DutyCycle 89 93 % FSW SwitchingFrequency R F = 46.4k 200 300 400 kHz R F = 22.6k 475 600 775 kHz ISHDN1 FixedBuck Shutdown Pin 0V < VSHDN1 < 7.5V −5 5 µACurrent ISHDN2 AdjustableBuck Shutdown Pin 0V < VSHDN2 < 7.5V −5 5 µACurrent IL1 FixedBuck SwitchLeakage VIN = 20V 0.01 5 µACurrent IL2 AdjustableBuck Switch VIN = 20V 0.01 5 µALeakage Current R DSON1 FixedBuck SwitchR DSON (6) 160 m Ω R DSON2 AdjustableBuck Switch 160 m ΩR DSON (6) ThSHDN1 FixedBuck SHDN Threshold OutputHigh 1.8 1.36 V OutputLow 1.33 0.7 ThSHDN2 AdjustableBuck SHDN OutputHigh 1.8 1.36 VThreshold OutputLow 1.33 0.7 ISS1 FixedBuck SoftStartPin 4 9 15 µACurrent ISS2 AdjustableBuck SoftStartPin 4 9 15 µACurrent UVP On Threshold 4 3.8 V OffThreshold 3.6 3.3 θJA ThermalResistance(7) TSSOP, package only 115 °C/W (3) Dutycycleaffectscurrentlimitdue toramp generator. (4) Currentlimitat0% dutycycle.See TYPICAL PERFORMANCE sectionforSwitchCurrentLimitvs.VIN (5) BiascurrentflowsintoFB pin. (6) Includesthebond wires,R DSON fromVIN pin(s)toSW pin. (7) RefertoTexas Instrumentspackagingwebsiteformore detailedthermalinformationand mountingtechniquesfortheTSSOP package. Copyright© 2005–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM2717
INPUT VOLTAGE (V) 100 110 120 130 140 150 160 170 180 190 200 SWITCH RDS(ON) (m: LOAD CURRENT (A) 100 V IN = 5V V IN = 12V V IN = 18V EFFICIENCY (%) 4 6 8 10 12 14 16 18 20 INPUT VOLTAGE (V) 100 110 120 130 140 150 160 170 180 190 200 SWITCH RDS(ON) (m: 4 6 8 10 12 14 16 18 20 INPUT VOLTAGE (V) 290 295 300 305 310 315 320 R F = 46.4k SWITCHING FREQUENCY (kHz) 4 6 8 10 12 14 16 18 20 INPUT VOLTAGE (V) QUIESCENT CURRENT (mA) 4 6 8 10 12 14 16 18 20 INPUT VOLTAGE (V) QUIESCENT CURRENT (PA) LM2717 SNVS253D –MAY 2005–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics SwitchingIQ Shutdown IQ vs. vs. InputVoltage InputVoltage (FSW = 300kHz) Figure2. Figure3. SwitchingFrequency vs. FixedBuck R DS(ON) InputVoltage vs. (FSW = 300kHz) InputVoltage Figure4. Figure5. AdjustableBuck R DS(ON) FixedBuck Efficiency vs. vs. InputVoltage Load Current Figure6. Figure7.
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INPUT VOLTAGE (V) 1.2 1.4 1.6 1.8 2.2 2.4 SWITCH CURRENT LIMIT (A) 8 10 12 14 16 18 20 INPUT VOLTAGE (V) SWITCH CURRENT LIMIT (A) 2.2 2.4 2.6 2.8 3.2 3.4 0 0.5 1 1.5 2 2.5 LOAD CURRENT (A) 100EFFICIENCY (%) V IN = 18V 0 0.5 1 1.5 2 2.5 LOAD CURRENT (A) 100EFFICIENCY (%) V IN = 18V LM2717 www.ti.com SNVS253D –MAY 2005–REVISED MARCH 2013 TypicalPerformance Characteristics(continued) AdjustableBuck Efficiency AdjustableBuck Efficiency vs. vs. Load Current Load Current (VOUT = 15V) (VOUT = 5V) Figure8. Figure9. AdjustableBuck Switch CurrentLimt FixedBuck Switch CurrentLimt vs. vs. InputVoltage InputVoltage (VOUT = 5V) Figure10. Figure11. Copyright© 2005–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM2717
:R FB1 = RFB2 x VOUT - 1.267 1.267 VOUT VIN , D' = (1-D) D = LM2717 SNVS253D –MAY 2005–REVISED MARCH 2013 www.ti.com BUCK OPERATION PROTECTION (BOTH REGULATORS) The LM2717 has dedicatedprotectioncircuitryrunningduringnormaloperationtoprotecttheIC.The Thermal Shutdown circuitryturnsoffthe power deviceswhen the dietemperaturereachesexcessivelevels.The UVP comparatorprotectsthe power devicesduringsupplypower startupand shutdown to preventoperationat voltageslessthantheminimum inputvoltage.The OVP comparatorisused topreventtheoutputvoltagefrom risingatno loadsallowingfullPWM operationoverallloadconditions.The LM2717 alsofeaturesa shutdown mode foreach converterdecreasingthesupplycurrenttoapproximately10µA (bothinshutdownmode). CONTINUOUS CONDUCTION MODE The LM2717 containscurrent-mode,PWM buck regulators.A buck regulatorstepstheinputvoltagedown toa loweroutputvoltage.Incontinuousconductionmode (when theinductorcurrentneverreacheszeroatsteady state),the buck regulatoroperatesintwo cycles.The power switchisconnectedbetween VIN and SW1 and SW2. Inthefirstcycleofoperationthetransistorisclosedand thediodeisreversebiased.Energy iscollectedinthe inductorand theloadcurrentissuppliedby C OUT and therisingcurrentthroughtheinductor. Duringthesecond cyclethetransistorisopen and thediodeisforwardbiaseddue tothefactthattheinductor currentcannotinstantaneouslychange direction.The energystoredintheinductoristransferredtotheloadand outputcapacitor. The ratioofthesetwo cyclesdeterminestheoutputvoltage.The outputvoltageisdefinedapproximatelyas: (1) where D isthedutycycleoftheswitch,D and D ′ willbe requiredfordesigncalculations. DESIGN PROCEDURE Thissectionpresentsguidelinesforselectingexternalcomponents. SETTING THE OUTPUT VOLTAGE (ADJUSTABLE REGULATOR) The outputvoltageissetusingthe feedbackpinand a resistordividerconnectedto the outputas shown in Figure12. The feedbackpinvoltageis1.26V,so the ratioof the feedbackresistorssetsthe outputvoltage accordingtothefollowingequation: (2) INPUT CAPACITOR A low ESR aluminum,tantalum,or ceramiccapacitorisneeded betwen the inputpinand power ground.This capacitorpreventslargevoltagetransientsfrom appearingattheinput.The capacitorisselectedbased on the RMS currentand voltagerequirements.The RMS currentisgivenby: (3) The RMS currentreachesitsmaximum (IOUT /2)when VIN equals2VOUT .Thisvalueshouldbe calculatedforboth regulatorsand added togivea totalRMS currentrating.Foran aluminum orceramiccapacitor,thevoltagerating shouldbe atleast25% higherthanthemaximum inputvoltage.Ifa tantalumcapacitorisused,thevoltagerating requiredisabouttwicethemaximum inputvoltage.The tantalumcapacitorshouldbe surgecurrenttestedby the manufacturertopreventbeingshortedby theinrushcurrent.The minimum capacitorvalueshouldbe 47µF for loweroutputloadcurrentapplicationsand lessdynamic (quicklychanging)loadconditions.For higheroutput currentapplicationsor dynamic loadconditionsa 68µF to100µF low ESR capacitorisrecommended. Itisalso recommended toputa smallceramiccapacitor(0.1µF to4.7µF) between theinputpinsand ground toreduce highfrequencyspikes.
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www.ti.com SNVS253D –MAY 2005–REVISED MARCH 2013 INDUCTOR SELECTION The most criticalparametersforthe inductorare the inductance,peak currentand the DC resistance.The inductanceisrelatedtothepeak-to-peakinductorripplecurrent,theinputand theoutputvoltages(for300kHz operation): (4) A highervalueofripplecurrentreducesinductance,butincreasestheconductanceloss,coreloss,and current stressfortheinductorand switchdevices.Italsorequiresa biggeroutputcapacitorforthesame outputvoltage ripplerequirement.A reasonablevalueissettingtheripplecurrenttobe 30% oftheDC outputcurrent.Sincethe ripplecurrentincreaseswiththe inputvoltage,the maximum inputvoltageisalways used to determinethe inductance.The DC resistanceof the inductorisa key parameterforthe efficiency.Lower DC resistanceis availablewitha biggerwindingarea.A good tradeoffbetween the efficiencyand the core sizeislettingthe inductorcopperlossequal2% oftheoutputpower. OUTPUT CAPACITOR The selectionofC OUT isdrivenby themaximum allowableoutputvoltageripple.The outputrippleintheconstant frequency,PWM mode isapproximatedby: (5) The ESR term usuallyplaysthedominantroleindeterminingthevoltageripple.Low ESR ceramic,aluminum electrolytic,or tantalumcapacitors(suchas TaiyoYuden MLCC, NichiconPL series,Sanyo OS-CON, Sprague 593D, 594D, AVX TPS, and CDE polymer aluminum) is recommended. An electrolyticcapacitoris not recommended fortemperaturesbelow −25°C sinceitsESR risesdramaticallyatcoldtemperature.Ceramic or tantalumcapacitorshave much betterESR specificationsat cold temperatureand is preferredfor low temperatureapplications. BOOTSTRAP CAPACITOR A 4.7nFceramiccapacitororlargerisrecommended forthebootstrapcapacitor.Forapplicationswhere theinput voltageislessthan twicethe outputvoltagea largercapacitorisrecommended, generally0.1µF to 1µF to ensureplentyofgatedrivefortheinternalswitchesand a consistentlylowR DS(ON) . SOFT-START CAPACITOR (BOTH REGULATORS) The LM2717 does notcontaininternalsoft-startwhich allowsforfaststartuptimebutalsocauses highinrush current.Thereforeforapplicationsthatneed reducedinrushcurrenttheLM2717 has circuitrythatisused tolimit theinrushcurrenton start-upoftheDC/DC switchingregulators.Thisinrushcurrentlimitingcircuitryservesas a soft-start.The externalSS pinsareused totailorthesoft-startfora specificapplication.A current(ISS )charges theexternalsoft-startcapacitor,C SS .The soft-starttimecan be estimatedas: TSS = C SS *0.6V/ISS (6) When programmingthesoftstarttimesimplyuse theequationgivenintheSoft-StartCapacitorsectionabove. SHUTDOWN OPERATION (BOTH REGULATORS) The shutdownpinsoftheLM2717 aredesignedso thattheymay be controlledusing1.8Vorhigherlogicsignals. Iftheshutdown functionisnottobe used thepinmay be leftopen.The maximum voltagetotheshutdown pin shouldnotexceed 7.5V.Iftheuse ofa highervoltageisdesireddue tosystem or otherconstraintsitmay be used,however a 100k or largerresistorisrecommended between theappliedvoltageand theshutdown pinto protectthedevice. SCHOTTKY DIODE The breakdown voltageratingofD 1 and D 2 ispreferredtobe 25% higherthanthemaximum inputvoltage.The currentratingforthe diode should be equal to the maximum outputcurrentforbest reliabilityin most applications.Incases where theinputvoltageismuch greaterthantheoutputvoltagetheaveragediodecurrent islower.Inthiscase itispossibletouse a diodewitha loweraveragecurrentrating,approximately(1-D)*IOUT however thepeak currentratingshouldbe higherthanthemaximum loadcurrent. Copyright© 2005–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM2717
SNVS253D –MAY 2005–REVISED MARCH 2013 www.ti.com LAYOUT CONSIDERATIONS The LM2717 uses two separateground connections,PGND forthedriversand boostNMOS power deviceand AGND forthesensitiveanalogcontrolcircuitry.The AGND and PGND pinsshouldbe tieddirectlytogetheratthe package.The feedbackand compensationnetworksshouldbe connecteddirectlytoa dedicatedanalogground planeand thisground planemust connectto the AGND pin.Ifno analogground planeisavailablethen the ground connectionsofthefeedbackand compensationnetworksmust tiedirectlytotheAGND pin.Connecting thesenetworkstothePGND can injectnoiseintothesystemand effectperformance. The inputbypass capacitorC IN,as shown inFigure12,must be placedclosetotheIC.Thiswillreducecopper traceresistancewhicheffectsinputvoltagerippleoftheIC.Foradditionalinputvoltagefiltering,a 0.1µF to4.7µF bypass capacitorscan be placedinparallelwithC IN,closetotheVIN pinstoshuntany highfrequencynoiseto ground.The outputcapacitors,C OUT1 and C OUT2 , shouldalsobe placedcloseto the IC.Any copper trace connectionsforthe C OUTX capacitorscan increasethe seriesresistance,which directlyeffectsoutputvoltage ripple.The feedbacknetwork,resistorsR FB1 and R FB2 ,shouldbe keptclosetotheFB pin,and away from the inductortominimizecoppertraceconnectionsthatcan injectnoiseintothesystem.Traceconnectionsmade to the inductorsand schottkydiodes should be minimizedto reduce power dissipationand increaseoverall efficiency.For more detailon switchingpower supplylayoutconsiderationssee ApplicationNote AN-1149: LayoutGuidelinesforSwitchingPower Supplies(SNVA021 ). ApplicationInformation Table1.Some Recommended Inductors(OthersMay Be Used) Manufacturer Inductor ContactInformation Coilcraft DO3316 and DO5022 series www.coilcraft.com Coiltronics DRQ73 and CD1 series www.cooperet.com Pulse P0751 and P0762 series www.pulseeng.com Sumida CDRH8D28 and CDRH8D43 series www.sumida.com Table2.Some Recommended InputAnd Output Capacitors(OthersMay Be Used) Manufacturer Capacitor ContactInformation VishaySprague 293D, 592D, and 595D seriestantalum www.vishay.com TaiyoYuden HighcapacitanceMLCC ceramic www.t-yuden.com ESRD seriecPolymerAluminum ElectrolyticCornellDubilier www.cde.comSPV and AFK seriesV-chipseries HighcapacitanceMLCC ceramicPanasonic www.panasonic.comEEJ-L seriestantalum
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3.3V OUT1 8V to 20V IN 5V OUT2 PGND R FB1 59k R FB2 20k R F *Connect CINA (pin 23) and CINB (pins 14,15) as close as possible to the VIN pins. 68 PF C OUT1A 1 PF ceramic 22 PH MBRS240 1 PF C BOOT1 *CINA C IN 68 PF C SS1 C C1 C BG C C2 C SS2 AGND R C2 R C1 20k 10k 4.7 nF 1 nF 47 nF 4.7 nF 47 nF VIN VIN CB2 AGND *CINB 4.7 PF ceramic 4.7 PF ceramic 1 PF C BOOT2 C OUT2A 1 PF ceramic 20.5k PGND FB1 VC1 VBG SS2 VC2 FB2 AGND AGND PGND PGND PGND SW1 VIN CB1 SHDN1 SS1 FSLCT SHDN2 SW2 LM2717 22 PH MBRS240 C OUT2 68 PF C OUT1 3.3V OUT1 17V to 20V IN 15V OUT2 PGND R FB1 221k R FB2 20k R F *Connect CINA (pin 23) and CINB (pins 14,15) as close as possible to the VIN pins. 68 PF C OUT1A 1 PF ceramic 22 PH MBRS240 4.7 nF C BOOT1 *CINA C IN 68 PF C SS1 C C1 C BG C C2 C SS2 AGND R C2 R C1 20k 4.7 nF 1 nF 47 nF 4.7 nF 47 nF VIN VIN CB2 AGND *CINB 4.7 PF ceramic 4.7 PF ceramic 1 PF C BOOT2 C OUT2A 1 PF ceramic 20.5k LM2717 www.ti.com SNVS253D –MAY 2005–REVISED MARCH 2013 Figure12. 15V,3.3VOutput Application Figure13. 5V,3.3VOutput Application Copyright© 2005–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM2717
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REVISION HISTORY
Changes from RevisionC (March 2013)toRevisionD Page
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www.ti.com 11-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM2717MT/NOPB Active Production TSSOP (PW) | 24 61 | TUBE Yes SN Level-1-260C-UNLIM -40 to 125 LM2717MT LM2717MT/NOPB.A Active Production TSSOP (PW) | 24 61 | TUBE Yes SN Level-1-260C-UNLIM -40 to 125 LM2717MT LM2717MT/NOPB.B Active Production TSSOP (PW) | 24 61 | TUBE Yes SN Level-1-260C-UNLIM -40 to 125 LM2717MT LM2717MTX/NOPB Active Production TSSOP (PW) | 24 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 LM2717MT LM2717MTX/NOPB.A Active Production TSSOP (PW) | 24 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 LM2717MT LM2717MTX/NOPB.B Active Production TSSOP (PW) | 24 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 LM2717MT (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
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PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2717MTX/NOPB TSSOP PW 24 2500 367.0 367.0 35.0 Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) LM2717MT/NOPB PW TSSOP 24 61 495 8 2514.6 4.06 LM2717MT/NOPB.A PW TSSOP 24 61 495 8 2514.6 4.06 LM2717MT/NOPB.B PW TSSOP 24 61 495 8 2514.6 4.06 Pack Materials-Page 3
www.ti.com PACKAGE OUTLINE C 22X 0.65 7.15 24X 0.30 0.19 TYP6.6 6.2
1.2 MAX
0.15 0.05 0.25 GAGE PLANE -80 B NOTE 4 4.5 4.3 A NOTE 3 7.9 7.7 0.75 0.50 (0.15) TYP TSSOP - 1.2 mm max heightPW0024A SMALL OUTLINE PACKAGE 4220208/A 02/2017
0.1 C A B
0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. SEATING PLANE A 20 DETAIL A TYPICAL SCALE 2.000
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0.05 MAX
0.05 MIN
24X (1.5) 24X (0.45) 22X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0024A SMALL OUTLINE PACKAGE 4220208/A 02/2017 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SYMM SYMM 12 13 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED
www.ti.com EXAMPLE STENCIL DESIGN 24X (1.5) 24X (0.45) 22X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0024A SMALL OUTLINE PACKAGE 4220208/A 02/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X SYMM SYMM 12 13
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