LM2704 Micropower Step-up DC/DC Converter with 550mA Peak Current Limit datasheet (Rev. D)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SNVS175,D]
- PDF pages: 19
Technical content
www.ti.com SNVS175D –FEBRUARY 2002–REVISED MAY 2013 LM2704MicropowerStep-upDC/DCConverterwith550mAPeakCurrentLimit Check forSamples: LM2704 1FEATURES DESCRIPTION The LM2704 is a micropower step-upDC/DC in a 2• 550mA, 0.7Ω,InternalSwitch small5-leadSOT-23 package.A currentlimited,fixed• Uses Small SurfaceMount Components off-timecontrolscheme conservesoperatingcurrent
- AdjustableOutput Voltageup to20V resultinginhighefficiencyovera wide range ofload conditions.The 21V switchallowsforoutputvoltages• 2.2Vto7V InputRange as highas 20V. The low 400ns off-timepermitsthe• InputUndervoltageLockout use of tiny,low profileinductorsand capacitorsto
- 0.01µA Shutdown Current minimize footprintand cost in space-conscious portableapplications.The LM2704 isidealforLCD• Small 5-Lead SOT-23 Package panels requiringlow currentand high efficiencyas wellas white LED applicationsforcellularphoneAPPLICATIONS back-lighting.The LM2704 can driveup to 8 white
- LCD Bias Supplies LEDs froma singleLi-Ionbattery.
- White LED Back-Lighting
- Handheld Devices
- DigitalCameras
- PortableApplications TypicalApplicationCircuit Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2002–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNVS175D –FEBRUARY 2002–REVISED MAY 2013 www.ti.com Connection Diagram The maximum allowablepower dissipationisa functionofthemaximum junctiontemperature,TJ(MAX),thejunction- to-ambientthermalresistance,θJA,and theambienttemperature,TA.See theElectricalCharacteristicstableforthe thermalresistance.The maximum allowablepower dissipationatany ambienttemperatureiscalculatedusing:PD (MAX) = (TJ(MAX) − TA)/θJA.Exceedingthemaximum allowablepower dissipationwillcause excessivedie temperature. Figure1. SOT23-5 -Top View TJmax = 125°C, θJA = 220°C/W PIN DESCRIPTIONS Pin Name Function 1 SW Power Switchinput. 2 GND Ground. 3 FB Outputvoltagefeedbackinput. 4 SHDN Shutdown controlinput,activelow. 5 VIN Analogand Power input. SW(Pin 1):SwitchPin.Thisisthe drainof the internalNMOS power switch.Minimizethe metaltracearea connectedtothispintominimizeEMI. GND(Pin 2):Ground Pin.Tiedirectlytogroundplane. FB(Pin 3):Feedback Pin.Settheoutputvoltageby selectingvaluesforR1 and R2 using: (1) Connectthegroundofthefeedbacknetworktoan AGND planewhichshouldbe tieddirectlytotheGND pin. SHDN(Pin 4):Shutdown Pin.The shutdown pinisan activelow control.Tiethispinabove 1.1V toenablethe device.Tiethispinbelow0.3Vtoturnoffthedevice. VIN(Pin5):InputSupplyPin.Bypass thispinwitha capacitoras closetothedeviceas possible. These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates.
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www.ti.com SNVS175D –FEBRUARY 2002–REVISED MAY 2013 AbsoluteMaximum Ratings(1)(2) VIN 7.5V SW Voltage 21V FB Voltage 2V SHDN Voltage 7.5V Maximum JunctionTemp. TJ(3) 150°C Lead Temperature (Soldering10 sec.) 300°C Vapor Phase (60sec.) 215°C Infrared (15sec.) 220°C ESD Ratings(4) Human Body Model 2kV Machine Model (5) 200V (1) Absolutemaximum ratingsarelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsareconditionsforwhichthe deviceisintendedtobe functional,butdeviceparameterspecificationsmay notbe ensured.Forensuredspecificationsand test conditions,see theElectricalCharacteristics. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityand specifications. (3) The maximum allowablepower dissipationisa functionofthemaximum junctiontemperature,TJ(MAX),thejunction-to-ambientthermal resistance,θJA,and theambienttemperature,TA.See theElectricalCharacteristicstableforthethermalresistance.The maximum allowablepower dissipationatany ambienttemperatureiscalculatedusing:PD (MAX) = (TJ(MAX) − TA)/θJA.Exceedingthemaximum allowablepower dissipationwillcause excessivedietemperature. (4) The human body model isa 100 pF capacitordischargedthrougha 1.5kΩ resistorintoeach pin.The machine model isa 200 pF capacitordischargeddirectlyintoeach pin. (5) ESD susceptibilityusingthemachine model is150V forSW pin. OperatingConditions JunctionTemperature (1) −40°C to+125°C SupplyVoltage 2.2Vto7V SW VoltageMax. 20.5V (1) Alllimitsensuredatroom temperature(standardtypeface)and attemperatureextremes(boldtypeface).Allroom temperaturelimitsare 100% productiontestedorensuredthroughstatisticalanalysis.Alllimitsattemperatureextremesareensuredviacorrelationusing standardStatisticalQualityControl(SQC) methods.Alllimitsareused tocalculateAverageOutgoingQualityLevel(AOQL). ElectricalCharacteristics(1) SpecificationsinstandardtypefaceareforTJ = 25°C and thoseinboldfacetypeapplyoverthefullOperatingTemperature Range (TJ = −40°C to+125°C).Unlessotherwisespecified.VIN =2.2V. Min Typ MaxSymbol Parameter Conditions Units(1) (2) (1) IQ DeviceDisabled FB = 1.3V 40 70 DeviceEnabled FB = 1.2V 235 300 µA Shutdown SHDN = 0V 0.01 2.5 VFB Feedback TripPoint 1.189 1.237 1.269 V ICL SwitchCurrentLimit 490 550 610 mA420 620 IB FB PinBiasCurrent FB = 1.23V (3) 30 120 nA VIN InputVoltageRange 2.2 7.0 V R DSON SwitchR DSON 0.7 1.6 Ω TOFF SwitchOffTime 400 ns (1) Alllimitsensuredatroom temperature(standardtypeface)and attemperatureextremes(boldtypeface).Allroom temperaturelimitsare 100% productiontestedorensuredthroughstatisticalanalysis.Alllimitsattemperatureextremesareensuredviacorrelationusing standardStatisticalQualityControl(SQC) methods.Alllimitsareused tocalculateAverageOutgoingQualityLevel(AOQL). (2) Typicalnumbers areat25°C and representthemost likelynorm. (3) Feedback currentflowsintothepin. Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM2704
SNVS175D –FEBRUARY 2002–REVISED MAY 2013 www.ti.com ElectricalCharacteristics(1)(continued) SpecificationsinstandardtypefaceareforTJ = 25°C and thoseinboldfacetypeapplyoverthefullOperatingTemperature Range (TJ = −40°C to+125°C).Unlessotherwisespecified.VIN =2.2V. Min Typ MaxSymbol Parameter Conditions Units(1) (2) (1) ISD SHDN PinCurrent SHDN = VIN,TJ = 25°C 0 80 SHDN = VIN,TJ = 125°C 15 nA SHDN = GND 0 IL SwitchLeakage Current VSW = 20V 0.05 5 µA UVP InputUndervoltageLockout ON/OFF Threshold 1.8 V VFB Feedback Hysteresis 8 mVHysteresis SHDN SHDN low 0.7 0.3 VThreshold SHDN High 1.1 0.7 θJA ThermalResistance 220 °C/W
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www.ti.com SNVS175D –FEBRUARY 2002–REVISED MAY 2013 TypicalPerformance Characteristics Enable Current DisableCurrent vs vs VIN VIN (PartSwitching) (PartNot Switching) Efficiency Efficiency vs vs Load Current Load Current Efficiency SHDN Threshold vs vs Load Current VIN Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM2704
SNVS175D –FEBRUARY 2002–REVISED MAY 2013 www.ti.com TypicalPerformance Characteristics(continued) Switch CurrentLimit Switch R DSON vs vs VIN VIN FB TripPointand FB Pin Current Output Voltage vs vs Temperature Load Current
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www.ti.com SNVS175D –FEBRUARY 2002–REVISED MAY 2013 TypicalPerformance Characteristics(continued) Step Response Start-Up/Shutdown VOUT = 20V,VIN = 3.0V VOUT = 20V,VIN = 2.5V1)Load,1mA to17mA to1mA, DC 1)SHDN, 1V/div,DC2)VOUT ,200mV/div,AC 2)IL,250mA/div,DC3)IL,500mA/div,DC 3)VOUT ,20V/div,DCT = 40µs/div T = 400µs/div R L = 1.3kΩ Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM2704
SNVS175D –FEBRUARY 2002–REVISED MAY 2013 www.ti.com OPERATION Figure2. LM2704 Block Diagram VOUT = 20V,VIN = 2.5V 1)VSW ,20V/div,DC 2)InductorCurrent,500mA/div,DC 3)VOUT ,100mV/div,AC T = 10µs/div Figure3. TypicalSwitchingWaveform The LM2704 featuresa constantoff-timecontrolscheme. Operationcan be best understoodby referringto Figure2 and Figure3.TransistorsQ1 and Q2 and resistorsR3 and R4 ofFigure2 form a bandgap reference used to controlthe outputvoltage.When the voltageat the FB pinislessthan 1.237V,the Enable Comp in Figure2 enablesthedeviceand theNMOS switchisturnedon pullingtheSW pintoground.When theNMOS switchison,currentbeginstoflowthroughinductorL whiletheloadcurrentissuppliedby theoutputcapacitor C OUT .Once thecurrentintheinductorreachesthepeak currentlimit,theCL Comp tripsand the400ns One Shot
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www.ti.com SNVS175D –FEBRUARY 2002–REVISED MAY 2013 turnsofftheNMOS switch.The SW voltagewillthenrisetotheoutputvoltageplusa diodedropand theinductor currentwillbegin to decrease as shown in Figure3. Duringthistime the energy storedin the inductoris transferredtoC OUT and theload.Afterthe400ns off-timetheNMOS switchisturnedon and energyisstoredin theinductoragain.Thisenergytransferfrom theinductortotheoutputcauses a steppingeffectintheoutput rippleas shown inFigure3. This cycleiscontinueduntilthe voltageat FB reaches 1.237V.When FB reaches thisvoltage,the enable comparatorthendisablesthedeviceturningofftheNMOS switchand reducingtheIqofthedeviceto40uA. The loadcurrentisthensuppliedsolelyby C OUT indicatedby thegraduallydecreasingslopeattheoutputas shown inFigure3.When theFB pindropsslightlybelow 1.237V,theenablecomparatorenablesthedeviceand begins thecycledescribedpreviously.The SHDN pincan be used toturnofftheLM2704 and reducetheIq to0.01µA. Inshutdownmode theoutputvoltagewillbe a diodedroplowerthantheinputvoltage.
APPLICATION INFORMATION
The appropriateinductorfora givenapplicationiscalculatedusingthefollowingequation: (2) where VD is the schottkydiode voltage,ICL is the switchcurrentlimitfound in the TypicalPerformance Characteristicssection,and TOFF istheswitchofftime.When usingthisequationbe suretouse theminimum inputvoltageforthe application,such as forbatterypowered applications.For the LM2704 constant-offtime controlscheme, theNMOS power switchisturnedoffwhen thecurrentlimitisreached.There isapproximatelya 200ns delayfrom thetimethecurrentlimitisreachedintheNMOS power switchand when theinternallogic actuallyturnsoffthe switch.Duringthis200ns delay,the peak inductorcurrentwillincrease.Thisincreasein inductorcurrentdemands a largersaturationcurrentratingforthe inductor.This saturationcurrentcan be approximatedby thefollowingequation: (3) ChoosinginductorswithlowESR decreasepower lossesand increaseefficiency. Care shouldbe takenwhen choosingan inductor.For applicationsthatrequirean inputvoltagethatapproaches theoutputvoltage,such as when convertinga Li-Ionbatteryvoltageto5V,the400ns offtimemay notbe enough timetodischargetheenergyintheinductorand transfertheenergytotheoutputcapacitorand load.Thiscan cause a rampingeffectintheinductorcurrentwaveform and an increasedrippleon theoutputvoltage.Usinga smallerinductorwillcause the IPK to increaseand willincreasethe outputvoltageripplefurther.Thiscan be solvedby addinga 4.7pFcapacitoracrosstheR F1 feedbackresistor(Figure2)and slightlyincreasingtheoutput capacitor.A smallerinductorcan thenbe used toensureproperdischargeinthe400ns offtime. DIODE SELECTION To maintainhighefficiency,the average currentratingof the schottkydiodeshouldbe largerthan the peak inductorcurrent,IPK .Schottkydiodeswitha low forwarddropand fastswitchingspeeds areidealforincreasing efficiencyinportableapplications.Choose a reversebreakdown of the schottkydiodelargerthan the output voltage. CAPACITOR SELECTION Choose lowESR capacitorsfortheoutputtominimizeoutputvoltageripple.Multilayerceramiccapacitorsarethe bestchoice.For most applications,a 1µF ceramiccapacitorissufficient.For some applicationsa reductionin outputvoltageripplecan be achievedby increasingtheoutputcapacitor. Localbypassingfortheinputisneeded on theLM2704. Multilayerceramiccapacitorsarea good choiceforthis as well.A 4.7µF capacitorissufficientformost applications.For additionalbypassing,a 100nF ceramiccapacitor can be used toshunthighfrequencyrippleon theinput. Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM2704
SNVS175D –FEBRUARY 2002–REVISED MAY 2013 www.ti.com LAYOUT CONSIDERATIONS The inputbypass capacitorC IN,as shown inTypicalApplicationCircuit,must be placedclosetotheIC.Thiswill reducecoppertraceresistancewhicheffectsinputvoltagerippleoftheIC.For additionalinputvoltagefiltering,a 100nF bypass capacitorcan be placedinparallelwithC IN to shuntany highfrequencynoiseto ground.The outputcapacitor,C OUT , should also be placed closeto the IC. Any copper traceconnectionsforthe Cout capacitorcan increasetheseriesresistance,whichdirectlyeffectsoutputvoltageripple.The feedbacknetwork, resistorsR1 and R2, shouldbe keptcloseto the FB pinto minimizecopper traceconnectionsthatcan inject noiseintothe system.The ground connectionforthe feedbackresistornetworkshouldconnectdirectlyto an analogground plane.The analogground planeshouldtiedirectlytotheGND pin.Ifno analogground planeis available,thegroundconnectionforthefeedbacknetworkshouldtiedirectlytotheGND pin.Traceconnections made totheinductorand schottkydiodeshouldbe minimizedtoreducepower dissipationand increaseoverall efficiency. Figure4. White LED Application Figure5. Li-Ion5V Application Figure6. Li-Ion12V Application
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www.ti.com SNVS175D –FEBRUARY 2002–REVISED MAY 2013 Figure7. 5V to12V Application Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM2704
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REVISION HISTORY
Changes from RevisionC (May 2013)toRevisionD Page
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www.ti.com 11-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM2704MF-ADJ/NOPB Active Production SOT-23 (DBV) | 5 1000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 S28B LM2704MF-ADJ/NOPB.A Active Production SOT-23 (DBV) | 5 1000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 S28B LM2704MF-ADJ/NOPB.B Active Production SOT-23 (DBV) | 5 1000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 S28B (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 5-Sep-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 5-Sep-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2704MF-ADJ/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C 0.22
0.08 TYP
0.25 3.0 2.6 2X 0.95 1.9 1.45 0.90 0.15
0.00 TYP
5X 0.5 0.3 0.6
0.3 TYP
0 TYP
1.9 (0.1) (0.15) 4X 0 -15 4X 4 -15 A 3.05 2.75 B1.75 1.45 (1.1) SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25 mm per side. 5. Support pin may differ or may not be present.
0.2 C A B
0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
5X (1.1) 5X (0.6) (2.6) (1.9) 2X (0.95) (R0.05) TYP 4214839/K 08/2024 SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (2.6) (1.9) 2X(0.95) 5X (1.1) 5X (0.6) (R0.05) TYP SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X SYMM PKG 3 4
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