LM27 SOT-23 Accurate, 120C-150C Factory Preset Thermostat datasheet (Rev. D)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SNIS124,D]
- PDF pages: 18
Technical content
V+=2.7V to 5.5V VTEMP GND HYST OS HYST REF TEMP SENSOR HYST=GND for 10oC Hysteresis HYST=V+ for 2oC Hysteresis TOS TOS - THYST Temp. of Leads OS LM27 www.ti.com SNIS124D –AUGUST 2002–REVISED JULY 2013 LM27SOT-23,±3°CAccurate,120°C-150°CFactoryPresetThermostat Check for Samples: LM27 1FEATURES DESCRIPTION The LM27 is a precision, single digital-output, low- 2• Internal Comparator with Pin Selectable 2°C or power thermostat comprised of an internal reference,10°C Hysteresis DAC, temperature sensor and comparator. Utilizing• No External Components Required factory programming, it can be manufactured with
- Open-drain or Push-pull Digital Output; different trip points as well as different digital output functionality. The trip point (TOS) can be preset at theSupports CMOS Logic Levels factory to any temperature in the range of +120°C to• Internal Temperature Sensor with VTEMP Output +150°C in 1°C increments. The LM27 has one digitalPin output (OS/OS/US/US), one digital input (HYST) and
- VTEMP Output Allows After-assembly System one analog output (VTEMP). The digital output stage Testing can be preset as either open-drain or push-pull. In addition, it can be factory programmed to be active• Internal Voltage Reference and DAC for Trip- HIGH or LOW. The digital output can be factorypoint Setting programmed to indicate an over temperature• Currently Available in 5-pin SOT-23 Plastic shutdown event (OS or OS) or an under temperaturePackage shutdown event (US or US). When preset as an
- Excellent Power Supply Noise Rejection overtemperature shutdown (OS) it will go LOW to indicate that the die temperature is over the internally preset TOS and go HIGH when the temperature goesAPPLICATIONS below (TOS–THYST). Similarly, when preprogrammed• Microprocessor Thermal Management as an undertemperature shutdown (US) it will go
- Appliances HIGH to indicate that the temperature is below TUS and go LOW when the temperature is above• Portable Battery Powered Systems (TUS+THYST). The typical hysteresis, THYST, can be set• Fan Control to 2°C or 10°C and is controlled by the state of the
- Industrial Process Control HYST pin. A VTEMP analog output provides a voltage that is proportional to temperature and has a• HVAC Systems −10.7mV/°C output slope.• Electronic System Protection Currently, there are several standard parts available, see Table 1. For other part options, contact a TexasKEY SPECIFICATIONS Instruments Distributor or Sales Representative for• Power Supply Voltage 2.7V to 5.5V information on minimum order qualification. The
- Power Supply Current 40μA (Max), 15μA (Typ) LM27 is currently available in a 5-lead SOT-23 package.• Hysteresis Temperature 2°C or 10°C (Typ)
- Temperature Trip Point Accuracy ±3°C (Max) Simplified Block Diagram and Connection Diagram LM27CIM5-2HJ (140°C Trip-Point) Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Copyright © 2002–2013, Texas Instruments IncorporatedProducts conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Table 1. Summary Table of Trip Point and Output Function Capabilities of Released Parts(1) (1) Other device options have not been released to market, contact Texas Instruments for volume and other requirements for release.
1 HYST Hysteresis control, digital input GND for 10°C or V+ for 2°C
2 GND Ground, connected to the back side of System GND
3 VTEMP Analog output voltage proportional to Leave floating or connect to a high impedance node. information see NOISE CONSIDERATIONS. (1) Pin 5 functionality and trip point setting are programmed during LM27 manufacture. during storage or handling to prevent electrostatic damage to the MOS gates.
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www.ti.com SNIS124D –AUGUST 2002–REVISED JULY 2013 Absolute Maximum Ratings(1) Input Voltage 6.0V Input Current at any pin(2) 5mA Package Input Current(2) 20mA Package Dissipation at TA = 25°C(3) 500mW Vapor Phase (60 seconds) 215°C Soldering Information(4) SOT23 Package Infrared (15 seconds) 220°C Storage Temperature −65°C to + 150°C Human Body Model 2500V ESD Susceptibility(5) Machine Model 250V (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. (2) When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V+), the current at that pin should be limited to 5mA. The 20mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5mA each. (3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (junction to ambient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PD = (TJmax–TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJmax = 150°C. For this device the typical thermal resistance (θJA) of the different package types when board mounted refer to Table 2 (4) See http://www.ti.com/packaging for other recommendations and methods of soldering surface mount devices. (5) The human body model is a 100pF capacitor discharge through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor discharged directly into each pin. Table 2. Package Type θJA SOT23-5, DBV 250°C/W Operating Ratings(1) Specified Temperature Range TMIN ≤ TA ≤ TMAX LM27CIM −40°C ≤ TA ≤ +150°C Positive Supply Voltage (V+) +2.7V to +5.5V Maximum VOUT +5.5V (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM27
SNIS124D –AUGUST 2002–REVISED JULY 2013 www.ti.com The following specifications apply for V+ = 2.7VDC to 5.5VDC, and VTEMP load current = 0µA unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C unless otherwise specified. Parameter LM27CIM UnitsSymbol Conditions Typical(1) Limits(2) (Limits) Temperature Sensor Trip Point Accuracy (Includes VREF, DAC, +120°C<TA<+150°C ±3 °C (max) Comparator Offset, and Temperature Sensitivity errors) Trip Point Hysteresis HYST = GND 10 °C HYST = V+ 2 °C VTEMP Output Temperature Sensitivity −10.82 mV/°C VTEMP Temperature Sensitivity Error to −30°C ≤ TA ≤ 150°C, 2.7V ≤ ±3 °C (max) Equation: V+ ≤ 5.5V TA = 25°C ±2.5 °C (max) VTEMP Load Regulation Source ≤ 1 μA 0.070 mV Sink ≤ 40 μA 0.7 mV (max) VTEMP Line Regulation +2.7V ≤ V+ ≤ +5.5V, −0.2 mV/V IS Supply Current 15 22 µA (max) 40 µA (max) Digital Output and Input IOUT(“1”) Logical “1”Output Leakage Current(3) V+ = +5.0V 0.001 1 µA (max) VOUT(“0”) Logical “0”Output Voltage IOUT = +1.2mA and 0.4 V (max) V+≥2.7V; IOUT = +3.2mA and V+≥4.5V(4) VOUT(“1”) Logical “1”Push-Pull Output Voltage ISOURCE = 500µA, V+ ≥ 2.7V 0.8 × V+ V (min) ISOURCE = 800µA, V+≥4.5V V+ − 1.5 V (min) VIH HYST Input Logical ”1“Threshold Voltage 0.8 × V+ V (min) VIL HYST Input Logical ”0“Threshold Voltage 0.2 × V+ V (max) (1) Typicals are at TJ = TA = 25°C and represent most likely parametric norm. (2) Limits are ensured to AOQL (Average Outgoing Quality Level). (3) The 1µA limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the current for every 15°C increase in temperature. For example, the 1nA typical current at 25°C would increase to 16nA at 85°C. (4) Care should be taken to include the effects of self heating when setting the maximum output load current. The power dissipation of the LM27 would increase by 1.28mW when IOUT=3.2mA and VOUT=0.4V. With a thermal resistance of 250°C/W, this power dissipation would cause an increase in the die temperature of about 0.32°C due to self heating. Self heating is not included in the trip point accuracy specification.
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Product Folder Links: LM27
www.ti.com SNIS124D –AUGUST 2002–REVISED JULY 2013 Part Number Template The series of digits labeled xyz in the part number LM27CIM-xyz, describe the set point value and the function of the output as follows: The place holders xy describe the set point temperature as shown in the following table. x (10x) y (1x) Temperature (°C) - H 0 - J 1 - K 2 - L 3 - N 4 - P 5 - R 6 - S 7 - T 8 - V 9 Z - 12 1 - 13 2 - 14 3 - 15 The value of z describes the assignment/function of the output as shown in the following table: Open-Drain/ Push-Active-Low/High OS/US Value of z Digital Output FunctionPull 0 0 0 J Active-Low, Open-Drain, OS output 0 0 1 K Active-Low, Open-Drain, US output 1 1 0 L Active-High, Push-Pull, OS output 1 1 1 N Active-High, Push-Pull, US output For example:
- the part number LM27CIM5-2SJ has TOS = 147°C, and programmed as an active-low open-drain overtemperature shutdown output.
- the part number LM27CIM5-ZLN has TUS = 123°C, and programmed as an active-high, push-pull undertemperature shutdown output. Active-high open-drain and active-low push-pull options are available, please contact Texas Instruments for more information. Note: Currently, there are several standard parts available, see Table 1. For other part options, contact a Texas Instruments Distributor or Sales Representative for information on minimum order qualification Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM27
Figure 1. LM27-_ _J Figure 2. LM27-_ _K Figure 3. LM27-_ _L Figure 4. LM27-_ _N The LM27 can be factory programmed to have a trip point anywhere in-between 120°C to 150°C. procedure that can be used to test the LM27CIM5X-2HJ which has a 140°C trip point.
- Turn on V+ and measure VTEMP. Then calculate the temperature reading of the LM27 using the equation:
- Verify that the temperature measured in step one is within (±3°C + error of reference temperature sensor) of
(a) Observe that OS is high. (c) Observe that OS is now low. (e) Observe that OS is now high. (a) Observe that OS is high. (b) Drive VTEMP voltage down gradually. (c) When OS goes low, note the VTEMP voltage. (e) Calculate Ttrig using Equation 3.
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temperature to which the LM27's leads are attached to. be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity, the backside of the LM27 die is directly attached to the GND pin (pin 2). paints or dips are often used to ensure that moisture cannot corrode the LM27 or its connections. to minimize the load current that the LM27 is required to drive. Table 4. Thermal resistance (θJA) and temperature rise due to self heating (TJ−TA) goes low, the fan will speed up. Figure 7. Two Speed Fan Speed Control
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SNIS124D –AUGUST 2002–REVISED JULY 2013 www.ti.com
REVISION HISTORY
Changes from Revision B (March 2013) to Revision C Page
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www.ti.com 5-Mar-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM27CIM5-1HJ/NOPB Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI 120 to 150 T1HJ LM27CIM5-2HJ/NOPB Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI 120 to 150 T2HJ LM27CIM5-ZHJ/NOPB Active Production SOT-23 (DBV) | 5 1000 | LARGE T&R Yes SN Level-1-260C-UNLIM 120 to 150 TZHJ LM27CIM5-ZHJ/NOPB.A Active Production SOT-23 (DBV) | 5 1000 | LARGE T&R Yes SN Level-1-260C-UNLIM 120 to 150 TZHJ LM27CIM5-ZHJ/NOPB.B Active Production SOT-23 (DBV) | 5 1000 | LARGE T&R - Call TI Call TI 120 to 150 LM27CIM5X-1HJ/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM - T1HJ LM27CIM5X-1HJ/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM 120 to 150 T1HJ LM27CIM5X-2HJ/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM - T2HJ LM27CIM5X-2HJ/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM 120 to 150 T2HJ (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative Addendum-Page 1
www.ti.com 5-Mar-2026 and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 5-Sep-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 5-Sep-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM27CIM5-ZHJ/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM27CIM5X-1HJ/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM27CIM5X-2HJ/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C 0.22
0.08 TYP
0.25 3.0 2.6 2X 0.95 1.9 1.45 0.90 0.15
0.00 TYP
5X 0.5 0.3 0.6
0.3 TYP
0 TYP
1.9 (0.1) (0.15) 4X 0 -15 4X 4 -15 A 3.05 2.75 B1.75 1.45 (1.1) SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25 mm per side. 5. Support pin may differ or may not be present.
0.2 C A B
0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
5X (1.1) 5X (0.6) (2.6) (1.9) 2X (0.95) (R0.05) TYP 4214839/K 08/2024 SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (2.6) (1.9) 2X(0.95) 5X (1.1) 5X (0.6) (R0.05) TYP SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X SYMM PKG 3 4
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