LM26 SOT-23, ±3°C Accurate, Factory-Preset Thermostat datasheet (Rev. S)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SNIS115,S]
- PDF pages: 24
Technical content
V+ = 2.7V to 5.5V VTEMP GND HYST OS HYST REF TEMP SENSOR HYST=GND for 10° C Hysteresis HYST = V+ for 2° C Hysteresis TOS TOS - THYST Temp. of Leads OS Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community LM26 SNIS115S –MAY 2001–REVISED SEPTEMBER 2015 LM26SOT-23,±3°CAccurate,Factory-PresetThermostat
1 Features 3 Description
The LM26 is a precision, single digital-output, low- 1• Internal Comparator With Pin Programmable 2°C power thermostat comprised of an internal reference,or 10°C Hysteresis DAC, temperature sensor and comparator. Utilizing• No External Components Required factory programming, it can be manufactured with
- Open-Drain or Push-Pull Digital Output; Supports different trip points as well as different digital output functionality. The trip point (TOS) can be preset at theCMOS Logic Levels factory to any temperature in the range of −55°C to• Internal Temperature Sensor With VTEMP Output 110°C in 1°C increments. The LM26 has one digitalPin output (OS/OS/US/US), one digital input (HYST) and• VTEMP Output Allows After-Assembly System one analog output (VTEMP). The digital output stage Testing can be preset as either open-drain or push-pull. In addition, it can be factory programmed to be active• Internal Voltage Reference and DAC for Trip-Point HIGH or LOW. The digital output can be factorySetting programmed to indicate an over temperature• Currently Available in 5-pin SOT-23 Plastic shutdown event (OS or OS) or an under temperaturePackage shutdown event (US or US). When preset as an
- Excellent Power Supply Noise Rejection overtemperature shutdown (OS) it will go LOW to indicate that the die temperature is over the internally• UL Recognized Component preset TOS and go HIGH when the temperature goes• Key Specifications below (TOS–THYST). Similarly, when preprogrammed – Power Supply Voltage 2.7 V to 5.5 V as an undertemperature shutdown (US) it will go HIGH to indicate that the temperature is below TUS– Power Supply Current and go LOW when the temperature is above40 μA (Maximum) 16 μA (Typical) (TUS+THYST). The typical hysteresis, THYST, can be set– Hysteresis Temperature 2°C or 10°C (Typical) to 2°C or 10°C and is controlled by the state of the HYST pin. A VTEMP analog output provides a voltage2 Applications that is proportional to temperature and has a −10.82 mV/°C output slope.• Microprocessor Thermal Management
- Appliances Available parts are detailed in the Device Comparison Table. For other part options, contact a Texas• Portable Battery Powered Systems Instruments Distributor or Sales Representative for• Fan Control information on minimum order qualification. The
- Industrial Process Control LM26 is currently available in a 5-lead SOT-23 package.• HVAC Systems
- Remote Temperature Sensing Device Information(1)
- Electronic System Protection PART NUMBER PACKAGE BODY SIZE (NOM) LM26 SOT-23 (5) 2.90 mm × 1.60 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. LM26CIM5-TPA Simplified Block Diagram and Connection Diagram The LM26CIM5-TPA has a fixed trip point of 85°C. For other trip point and output function availability, please see the Device Comparison Table or contact Texas Instruments. An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
SNIS115S –MAY 2001–REVISED SEPTEMBER 2015 www.ti.com Table of Contents
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision R (February 2013) to Revision S Page
- Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information Changes from Revision Q (September 2011) to Revision R Page
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5 Device Comparison Table
Order Number Top Mark Trip Point Output Function SettingBulk Rail (1000 Units) Tape & Reel (3000 Units) LM26CIM5-BPB LM26CIM5X-BPB TBPB -45°C Active-Low, Open-Drain, US output LM26CIM5-DPB LM26CIM5X-DPB TDPB -25°C Active-Low, Open-Drain, US output LM26CIM5-HHD LM26CIM5X-HHD THHD 0°C Active-High, Push-Pull, US output LM26CIM5-NPA LM26CIM5X-NPA TNPA 45°C Active-Low, Open-Drain, OS output LM26CIM5-RPA LM26CIM5X-RPA TRPA 65°C Active-Low, Open-Drain, OS output LM26CIM5-SHA LM26CIM5X-SHA TSHA 75°C Active-Low, Open-Drain, OS output LM26CIM5-SPA LM26CIM5X-SPA TSPA 70°C Active-Low, Open-Drain, OS output LM26CIM5-TPA LM26CIM5X-TPA TTPA 85°C Active-Low, Open-Drain, OS output LM26CIM5-VHA LM26CIM5X-VHA TVHA 90°C Active-Low, Open-Drain, OS output LM26CIM5-VPA LM26CIM5X-VPA TVPA 95°C Active-Low, Open-Drain, OS output LM26CIM5-XHA LM26CIM5X-XHA TXHA 100°C Active-Low, Open-Drain, OS output LM26CIM5-XPA LM26CIM5X-XPA TXPA 105°C Active-Low, Open-Drain, OS output LM26CIM5-YHA LM26CIM5X-YHA TYHA 110°C Active-Low, Open-Drain, OS output LM26CIM5-YPA LM26CIM5X-YPA TYPA 115°C Active-Low, Open-Drain, OS output LM26CIM5-ZHA LM26CIM5X-ZHA TZHA 120°C Active-Low, Open-Drain, OS output Copyright © 2001–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM26
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6 Pin Configuration and Functions
(Top View) Pin Functions PIN TYPE DESCRIPTION NO. NAME
1 HYST Input Hysteresis control, digital input; connect to GND for 10°C or V+ for 2°C
Power Ground, connected to the back side of the die through lead frame; connect to2 GND system ground Output Analog output voltage proportional to temperature; leave floating or connect to a3 VTEMP high impedance node. 4 V+ Power Supply input; connect to 2.7 V to 5.5 V with a 0.1-μF bypass capacitor. Output Overtemperature Shutdown open-drain active low thermostat digital output; OS connect to controller interrupt, system/power supply shutdown; pullup resistor ≥ 10 kΩ OS Output Overtemperature Shutdown push-pull active high thermostat digital output; connect to controller interrupt, system/power supply shutdown 5(1) US Output Undertemperature Shutdown open-drain active low thermostat digital output; connect to controller interrupt, system/power supply shutdown; pullup resistor ≥ 10 kΩ US Output Undertemperature Shutdown push-pull active high thermostat digital output; connect to controller interrupt, system/power supply shutdown (1) Pin 5 functionality and trip point setting are programmed during LM26 manufacture.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Input Voltage 6 V Input Current at any pin (2) 5 mA Package Input Current (2) 20 mA Package Dissipation at TA = 25°C(3) 500 mW Vapor Phase (60 seconds) 215Soldering SOT-23 Package °CInformation(4) Infrared (15 seconds) 220 Storage Temperature, Tstg −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V+), the current at that pin should be limited to 5 mA. The 20-mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5 mA each. (3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX (maximum junction temperature), θJA (junction to ambient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PD = (TJMAX–TA) / θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJMAX = 150°C. For this device the typical thermal resistance (θJA) of the different package types when board mounted follow: (4) See the URL http://www.ti.com/packaging for other recommendations and methods of soldering surface mount devices.
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7.2 ESD Ratings
Human body model (HBM) ±2500 V(ESD) Electrostatic discharge(1) V Machine Model ±250 (1) The human body model is a 100-pF capacitor discharge through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF capacitor discharged directly into each pin.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Specified Temperature Range (TMIN ≤ TA ≤ TMAX) −55 125 °C Positive Supply Voltage (V+) 2.7 5.5 V Maximum VOUT 5.5 V (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
7.4 Thermal Information
THERMAL METRIC(1) DBV (SOT-23) UNIT
5 PINS
RθJA Junction-to-ambient thermal resistance 250 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
7.5 Electrical Characteristics
The following specifications apply for V+ = 2.7 VDC to 5.5 VDC, and VTEMP load current = 0 µA unless otherwise specified. All limits apply for TA = TJ = TMIN to TMAX unless otherwise specified. PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT TEMPERATURE SENSOR Trip Point Accuracy (Includes VREF, DAC, –55°C ≤ TA ≤ +110°C ±3 °C Comparator Offset, and Temperature TA = +120°C ±4 °CSensitivity errors) HYST = GND 11 °C Trip Point Hysteresis HYST = V+ 2 °C VTEMP Output Temperature Sensitivity −10.82 mV/°C VTEMP Temperature Sensitivity Error to −30°C ≤ TA ≤ 120°C ±3 °C Source ≤ 1 μA 0.070 mV VTEMP Load Regulation Sink ≤ 40 μA 0.7 mV +2.7 V ≤ V+ ≤ +5.5 V,VTEMP Line Regulation −0.2 mV/V−30°C ≤ TA ≤ +120°C TA = 25°C 16 20 µA IS Supply Current (1) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level). (2) Typicals are at TJ = TA = 25°C and represent most likely parametric norm. Copyright © 2001–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM26
limits apply for TA = TJ = TMIN to TMAX unless otherwise specified. current for every 15°C increase in temperature. For example, the 1-nA typical current at 25°C would increase to 16 nA at 85°C.
7.6 Typical Characteristics
Figure 1. Power Supply Current Temperature Dependence
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8 Detailed Description
8.1 Overview
- OS: active low, open drain that indicates an over temperature shutdown event (most common)
- US: active low, open-drain that indicates an under temperature shutdown event
- OS: active high, push-pull that indicates an over temperature shutdown event
- US: active high, push-pull that indicates an under temperature shutdown event The internal temperature sensor is brought out on the VTEMP pin and can be used to determine the temperature that the LM26 is reading by monitoring with an ADC. It has a negative temperature coefficient (NTC) of approximately -10mV/°C. This pin also allows after assembly PCB testing (see section After Assembly PCB Testing for more details). The comparator hysteresis is selectable by the state of the HYST. Two values are available 10°C or 2°C. Comparator hysteresis is essential, as it prevents comparator output chattering when the temperature is at the comparator threshold set point (REF as shown in the functional block diagrams). Once the comparator trips the hysteresis function changes the comparator threshold (REF) level such that the output remains locked in the active state. The threshold is changed by either 10°C or 2°C as programmed by the state of the HYST pin.
8.2 Functional Block Diagrams
Figure 2. LM26-_ _A Output Pin Block Diagram Figure 3. LM26-_ _B Output Pin Block Diagram Figure 4. LM26-_ _C Output Pin Block Diagram
6 TEMP
Figure 5. LM26-_ _D Output Pin Block Diagram
8.3 Feature Description
8.3.1 Hysteresis
the pin is less than 10 µA. The value of the resistor will depend on the value of V+ as well as the leakage current.
8.3.2 VTEMP Output
The VTEMP output provides an output voltage that can be used to determine the temperature reading of the LM26. be at least a factor of 10 smaller than CLOAD. Table 1. Resistive Compensation for Capacitive Loading of VTEMP
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Figure 6. Resistor Placement for Capacitive- Figure 7. Resistor Placement for Capacitive-
8.4 Device Functional Modes
and the temperature transition rate.
8.4.1 After Assembly PCB Testing
procedure that can be used to test the LM26CIM5-TPA which has an 85°C trip point.
- Turn on V+ and measure VTEMP. Then calculate the temperature reading of the LM26 using the equation:
- Verify that the temperature measured in step one is within (±3°C + error of reference temperature sensor) of
measured using an extremely accurate calibrated temperature sensor. (a) Observe that OS is high. (c) Observe that OS is now low. (e) Observe that OS is now high. (a) Observe that OS is high. (b) Drive VTEMP voltage down gradually. (c) When OS goes low, note the VTEMP voltage. (e) Calculate Trig using Equation 2. (a) Gradually raise VTEMP until OS goes HIGH. Note VTEMP. (b) Calculate THYST using Equation 2.
9 Application and Implementation
validate and test their design implementation to confirm system functionality.
9.1 Application Information
adjust or plain temperature monitoring.
9.2 Typical Application
Figure 8. Two-Speed Fan Speed Control
9.2.1 Design Requirements
Table 2. Design Parameters
9.2.2 Detailed Design Procedure
resistance at higher temperatures thus setting fan to max speed.
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1900 RPM
3800 RPM
9.2.3 Application Curve
Figure 9. Temperature Effect on Fan Speed
9.3 System Examples
Figure 10. Fan High-Side Drive Figure 11. Fan Low-Side Drive Figure 12. Audio Power Amplifier Thermal Figure 13. Simple Thermostat
10 Power Supply Recommendations
- square wave 400 kHz, 1 Vp-p
- square wave 2 kHz, 200 mVp-p
- sine wave 100 Hz to 1 MHz, 200 mVp-p Testing was done while maintaining the temperature of the LM26 one degree centigrade way from the trip point with the output not activated.
11 Layout
11.1 Layout Guidelines
temperature to which the LM26's leads are attached to. be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity, the backside of the LM26 die is directly attached to the GND pin (pin 2). paints or dips are often used to ensure that moisture cannot corrode the LM26 or its connections.
11.2 Layout Example
Figure 14. LM26 Typical Layout
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11.3 Thermal Considerations
- TA is the ambient temperature, V+ is the power supply voltage
- IQ is the quiescent current, IL_TEMP is the load current on the VTEMP output
- VDO is the voltage on the digital output
- and IDO is the load current on the digital output (5) Since the LM26's junction temperature is the actual temperature being measured, care should be taken to minimize the load current that the LM26 is required to drive. Table 3 summarizes the thermal resistance for different conditions and the rise in die temperature of the LM26 without any loading on VTEMP and a 10-kΩ pullup resistor on an open-drain digital output with a 5.5-V power supply.
Table 3. Thermal resistance (RθJA) and Temperature Rise Due to Self Heating (TJ−TA)
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11.4 Part Number Template
The series of digits labeled xyz in the part number LM26CIM-xyz, describe the set point value and the function of the output as follows: The place holders xy describe the set point temperature as shown in the following table. x (10x) y (1x) Temperature (°C) A - −5 B - −4 C - −3 D - −2 E - −1 F - −0 H H 0 J J 1 K K 2 L L 3 N N 4 P P 5 R R 6 S S 7 T T 8 V V 9 X - 10 Y - 11 Z - 12 The value of z describes the assignment/function of the output as shown in the following table: Open-Drain/ Push-Active-Low/High OS/US Value of z Digital Output FunctionPull 0 0 0 A Active-Low, Open-Drain, OS output 0 0 1 B Active-Low, Open-Drain, US output 1 1 0 C Active-High, Push-Pull, OS output 1 1 1 D Active-High, Push-Pull, US output For example:
- the part number LM26CIM5-TPA has TOS = 85°C, and programmed as an active-low open-drain overtemperature shutdown output.
- the part number LM26CIM5-FPD has TUS = −5°C, and programmed as an active-high, push-pull undertemperature shutdown output. Active-high open-drain and active-low push-pull options are available, please contact Texas Instruments for more information.
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12 Device and Documentation Support
12.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
12.2 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2001–2015, Texas Instruments Incorporated Submit Documentation Feedback 15 Product Folder Links: LM26
www.ti.com 15-Jul-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM26CIM5-BPB/NOPB Active Production SOT-23 (DBV) | 5 1000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TBPB LM26CIM5-BPB/NOPB.A Active Production SOT-23 (DBV) | 5 1000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TBPB LM26CIM5-DPB/NOPB Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -55 to 125 TDPB LM26CIM5-HHD/NOPB Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -55 to 125 THHD LM26CIM5-NPA/NOPB Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -55 to 125 TNPA LM26CIM5-PHA/NOPB Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -55 to 125 TPHA LM26CIM5-RPA/NOPB Active Production SOT-23 (DBV) | 5 1000 | LARGE T&R Yes Call TI | Sn Level-1-260C-UNLIM -55 to 125 TRPA LM26CIM5-RPA/NOPB.A Active Production SOT-23 (DBV) | 5 1000 | LARGE T&R Yes Call TI Level-1-260C-UNLIM -55 to 125 TRPA LM26CIM5-SHA/NOPB Active Production SOT-23 (DBV) | 5 1000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TSHA LM26CIM5-SHA/NOPB.A Active Production SOT-23 (DBV) | 5 1000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TSHA LM26CIM5-SPA/NOPB Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -55 to 125 TSPA LM26CIM5-TPA/NOPB Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -55 to 125 TTPA LM26CIM5-VHA/NOPB Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -55 to 125 TVHA LM26CIM5-VPA/NOPB Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -55 to 125 TVPA LM26CIM5-XHA/NOPB Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -55 to 125 TXHA LM26CIM5-XPA/NOPB Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -55 to 125 TXPA LM26CIM5-YHA/NOPB Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -55 to 125 TYHA LM26CIM5-YPA/NOPB Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -55 to 125 TYPA LM26CIM5-YPA/NOPB.B Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -55 to 125 LM26CIM5-ZHA NRND Production SOT-23 (DBV) | 5 1000 | LARGE T&R No Call TI Call TI -55 to 125 TZHA LM26CIM5-ZHA.A NRND Production SOT-23 (DBV) | 5 1000 | LARGE T&R No Call TI Call TI -55 to 125 TZHA LM26CIM5-ZHA/NOPB Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -55 to 125 TZHA LM26CIM5X-DPB/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TDPB LM26CIM5X-DPB/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TDPB LM26CIM5X-DPB/NOPB.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R - Call TI Call TI -55 to 125 LM26CIM5X-HHD/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 THHD LM26CIM5X-HHD/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 THHD LM26CIM5X-HHD/NOPB.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R - Call TI Call TI -55 to 125 LM26CIM5X-NPA/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TNPA Addendum-Page 1
www.ti.com 15-Jul-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM26CIM5X-NPA/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TNPA LM26CIM5X-NPA/NOPB.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R - Call TI Call TI -55 to 125 LM26CIM5X-PHA/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TPHA LM26CIM5X-PHA/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TPHA LM26CIM5X-PHA/NOPB.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R - Call TI Call TI -55 to 125 LM26CIM5X-SPA/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TSPA LM26CIM5X-SPA/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TSPA LM26CIM5X-SPA/NOPB.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R - Call TI Call TI -55 to 125 LM26CIM5X-TPA/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TTPA LM26CIM5X-TPA/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TTPA LM26CIM5X-TPA/NOPB.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R - Call TI Call TI -55 to 125 LM26CIM5X-VHA/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TVHA LM26CIM5X-VHA/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TVHA LM26CIM5X-VHA/NOPB.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R - Call TI Call TI -55 to 125 LM26CIM5X-VPA/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TVPA LM26CIM5X-VPA/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TVPA LM26CIM5X-VPA/NOPB.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R - Call TI Call TI -55 to 125 LM26CIM5X-XHA/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TXHA LM26CIM5X-XHA/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TXHA LM26CIM5X-XPA/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TXPA LM26CIM5X-XPA/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TXPA LM26CIM5X-XPA/NOPB.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R - Call TI Call TI -55 to 125 LM26CIM5X-YHA/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TYHA LM26CIM5X-YHA/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TYHA LM26CIM5X-YHA/NOPB.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R - Call TI Call TI -55 to 125 LM26CIM5X-YPA/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TYPA LM26CIM5X-YPA/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TYPA LM26CIM5X-YPA/NOPB.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R - Call TI Call TI -55 to 125 LM26CIM5X-ZHA/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TZHA LM26CIM5X-ZHA/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 125 TZHA LM26CIM5X-ZHA/NOPB.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R - Call TI Call TI -55 to 125 Addendum-Page 2
www.ti.com 15-Jul-2026 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3
PACKAGE MATERIALS INFORMATION www.ti.com 5-Sep-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 5-Sep-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM26CIM5-BPB/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5-RPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5-SHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5X-DPB/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-HHD/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-NPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-PHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-SPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-TPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-VHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-VPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-XHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-XPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-YHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-YPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-ZHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C 0.22
0.08 TYP
0.25 3.0 2.6 2X 0.95 1.9 1.45 0.90 0.15
0.00 TYP
5X 0.5 0.3 0.6
0.3 TYP
0 TYP
1.9 (0.1) (0.15) 4X 0 -15 4X 4 -15 A 3.05 2.75 B1.75 1.45 (1.1) SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25 mm per side. 5. Support pin may differ or may not be present.
0.2 C A B
0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
5X (1.1) 5X (0.6) (2.6) (1.9) 2X (0.95) (R0.05) TYP 4214839/K 08/2024 SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (2.6) (1.9) 2X(0.95) 5X (1.1) 5X (0.6) (R0.05) TYP SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X SYMM PKG 3 4
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