Comparator

LM193

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DUAL DIFFERENTIAL COMPARATORS

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Online Datasheet

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LM393B, LM2903B, LM193, LM293, LM393 and LM2903 Dual Comparators datasheet (Rev. AH)

Document overview

Manufacturer or author: Texas Instruments, Incorporated [SLCS005,A]
PDF pages: 56

Technical content

LM393B, LM2903B, LM193, LM293, LM393 and LM2903 Dual Comparators

1 Features

NEW LM393B and LM2903B
Improved specifications of B-version – Maximum rating: up to 38V – ESD rating (HBM): 2kV – Low input offset: 0.37mV – Low input bias current: 3.5nA – Low supply-current: 200µA per comparator – Faster response time of 1µsec – Extended temperature range for LM393B – Available in tiny 2 x 2mm WSON package
B-version is drop-in replacement for LM293, LM393 and LM2903, A and V versions
Common-mode input voltage range includes ground
Differential input voltage range equal to maximum- rated supply voltage: ±38 V
Low output saturation voltage
Output compatible with TTL, MOS, and CMOS

2 Applications

Vacuum robot
Single phase UPS
Server PSU
Cordless power tool
Wireless infrastructure
Applicances
Building automation
Factory automation & control
Motor drives
Infotainment & cluster

3 Description

The LM393B and LM2903B devices are the next generation versions of the industry-standard LM393 and LM2903 comparator family. These next generation B-version comparators feature lower offset voltage, higher supply voltage capability, lower supply current, lower input bias current, lower propagation delay, and improved 2 kV ESD performance and input ruggedness through dedicated ESD clamps. The LM393B and LM2903B can drop-in replace the LM293, LM393 and LM2903, for both "A" and "V" grades. All devices consist of two independent voltage comparators that are designed to operate from a single power supply over a wide range of voltages. Quiescent current is independent of the supply voltage. Device Information PART NUMBER PACKAGE(1) BODY SIZE (NOM) LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V, LM2903AV SOIC (8) 4.90mm x 3.91mm LM393B, LM2903B, LM293, LM293A, LM393, LM393A, LM2903 VSSOP (8) 3.00mm x 3.00mm LM293, LM393, LM393A, LM2903 PDIP (8) 9.81mm × 6.35mm LM393, LM393A, LM2903 SO (8) 6.20mm x 5.30mm LM393B, LM2903B, LM393, LM393A, LM2903, LM2903V, LM2903AV TSSOP (8) 3.00mm x 4.40mm LM393B, LM2903B SOT-23 (8) 2.90mm x 1.60mm LM393B, LM2903B WSON (8) 2.00mm × 2.00mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Family Comparison Table Specification LM393B LM2903B LM393 LM393A LM2903 LM2903V LM2903AV LM193 LM293 LM293A Units Supply Voltage 2 to 36 2 to 36 2 to 30 2 to 30 2 to 32 2 to 30 2 to 30 V Total Supply Current Temperature Range −40 to 85 −40 to 125 0 to 70 −40 to 125 −40 to 125 −55 to 125 −25 to 85 °C ESD (HBM) 2000 2000 2000 2000 2000 2000 2000 V Offset Voltage (Max over temp) ± 4 ± 4 ± 9 ± 4 ± 15 ± 15 ± 4 ± 9 ± 9 ± 4 mV Input Bias Current (typ / max) 3.5 / 25 3.5 / 25 25 / 250 25 / 250 25 / 250 25 / 100 25 / 250 nA LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

5.8 Electrical Characteristics for LM193, LM293, and

5.10 Electrical Characteristics for LM2903,

5.11 Switching Characteristics: LM193, LM239,

10 Mechanical, Packaging, and Orderable

LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 www.ti.com

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Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V

4 Pin Configuration and Functions

1IN− 1IN+ GND VCC 2OUT 2IN− 2IN+ Figure 4-1. D, DGK, JG, P, PS, DDF or PW Package 8-Pin SOIC, VSSOP, PDIP, SO, or TSSOP Top View 11OUT 8 V+ 21IN± 7 2OUT 31IN+ 6 2IN ± 4GND 5 2IN+ Exposed Thermal Die Pad on Underside Connect thermal pad directly to GND pin. Figure 4-2. DSG Package 8-Pin WSON With Exposed Pad Top View Table 4-1. Pin Functions PIN I/O DESCRIPTION NAME SOIC, VSSOP, PDIP, SO, DDF and TSSOP DSG 1OUT 1 1 Output Output pin of comparator 1 1IN– 2 2 Input Negative input pin of comparator 1 1IN+ 3 3 Input Positive input pin of comparator 1 GND 4 4 — Ground 2IN+ 5 5 Input Positive input pin of comparator 2 2IN- 6 6 Input Negative input pin of comparator 2 2OUT 7 7 Output Output pin of comparator 2 VCC 8 8 — Positive Supply Thermal Pad — PAD — Connect directly to GND pin www.ti.com LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V

5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage(2) Non-B Versions –0.3 V B Versions Only 38 VID Differential input voltage(3) Non-B Versions -36 36 V B Versions Only -38 38 VI Input voltage (either input) Non-B Versions –0.3 V B Versions Only 38 IIK Input current(5) -50 mA VO Output voltage Non-B Versions –0.3 V B Versions Only 38 IO Output current Non-B Versions 20 mA B Versions Only 25 ISC Duration of output short circuit to ground(4) Unlimited TJ Operating virtual-junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods can affect device reliability. Production Processing Does Not Necessarily Include Testing of All Parameters. (2) All voltage values, except differential voltages, are with respect to network ground. (3) Differential voltages are at IN+ with respect to IN–. (4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction. (5) Input current flows thorough parasitic diode to ground and turns on parasitic transistors that increases ICC and can cause the output to be incorrect. Normal operation resumes when input current is removed.

5.2 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage, VS = (V+) – (V–) non-V devices 2 30 VV devices 2 32 "B" version devices 2 36 Input voltage range, VIVR non-B devices 0 (V+) – 2.0 V "B" version devices –0.1 Ambient temperature, TA LM193 –55 125 LM2903, LM2903V, LM2903AV, LM2903B –40 125 LM393B –40 85 LM293, LM293A –25 85 LM393, LM393A 0 70 LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 www.ti.com

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Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V

5.3 Thermal Information: LMx93x and LM2903x

THERMAL METRIC(1) LMx93x, LM2903x UNIT D (SOIC) P (PDIP) PW (TSSOP) DGK (VSSOP) DDF (SOT-23) DSG (WSON) PINS PINS PINS PINS PINS PINS RθJC(bot) Junction-to-case (bottom) thermal resistance - - - - - 37.8 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.

5.4 ESD Ratings

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process. www.ti.com LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V

5.5 Electrical Characteristics LM393B

VS = 5V, VCM = (V–) ; TA = 25°C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIO Input offset voltage VS = 5 to 36V –2.5 ±0.37 2.5 mV VS = 5 to 36V, TA = –40°C to +85°C -4 4 Input offset voltage, DGK package only VS = 5 to 36V –3.5 ±0.37 3.5 VS = 5 to 36V, TA = –40°C to +85°C –5 5 IB Input bias current –3.5 –25 nA TA = –40°C to +85°C –50 nA IOS Input offset current –10 ±0.5 10 nA TA = –40°C to +85°C –25 25 nA VCM Common mode range (1) VS = 3 to 36V (V–) (V+) – 1.5 V VS = 3 to 36V, TA = –40°C to +85°C (V–) (V+) – 2.0 V AVD Large signal differential voltage amplification VS = 15V, VO = 1.4V to 11.4V; RL ≥ 15k to (V+) 50 200 V/mV VOL Low level output Voltage {swing from (V–)} ISINK ≤ 4mA, VID = -1V 110 400 mV ISINK ≤ 4mA, VID = -1V TA = –40°C to +85°C 550 mV IOH-LKG High-level output leakage current (V+) = VO = 5V; VID = 1V 0.1 20 nA (V+) = VO = 36V; VID = 1V 0.3 50 nA IOL Low level output current VOL = 1.5V; VID = -1V; VS = 5V 6 21 mA IQ Quiescent current (all comparators) VS = 5V, no load 400 600 µA VS = 36V, no load, TA = –40°C to +85°C 550 800 µA (1) The voltage at either input can not be allowed to go negative by more than 0.3V otherwise output can be incorrect and excessive input current can flow. The upper end of the common-mode voltage range is limited by VCC – 2V. However only one input needs to be in the valid common mode range, the other input can go up the maximum VCC level and the comparator provides a proper output state. Either or both inputs can go to maximum VCC level without damage. LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 www.ti.com

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Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V

5.6 Electrical Characteristics LM2903B

VS = 5V, VCM = (V–) ; TA = 25°C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIO Input offset voltage VS = 5 to 36V –2.5 ±0.37 2.5 mV VS = 5 to 36V, TA = –40°C to +125°C –4 4 Input offset voltage, DGK package only VS = 5 to 36V -3.5 ±0.37 3.5 VS = 5 to 36V, TA = –40°C to +125°C -5 5 IB Input bias current –3.5 –25 nA TA = –40°C to +125°C –50 nA IOS Input offset current –10 ±0.5 10 nA TA = –40°C to +125°C –25 25 nA VCM Common mode range (1) VS = 3 to 36V (V–) (V+) – 1.5 V VS = 3 to 36V, TA = –40°C to +125°C (V–) (V+) – 2.0 V AVD Large signal differential voltage amplification VS = 15V, VO = 1.4V to 11.4V; RL ≥ 15k to (V+) 50 200 V/mV VOL Low level output Voltage {swing from (V–)} ISINK ≤ 4mA, VID = -1V 110 400 mV ISINK ≤ 4mA, VID = -1V TA = –40°C to +125°C 550 mV IOH-LKG High-level output leakage current (V+) = VO = 5V; VID = 1V 0.1 20 nA (V+) = VO = 36V; VID = 1V 0.3 50 nA IOL Low level output current VOL = 1.5V; VID = -1V; VS = 5V 6 21 mA IQ Quiescent current (all comparators) VS = 5V, no load 400 600 µA VS = 36V, no load, TA = –40°C to +125°C 550 800 µA (1) The voltage at either input can not be allowed to go negative by more than 0.3V otherwise output can be incorrect and excessive input current can flow. The upper end of the common-mode voltage range is limited by VCC – 2V. However only one input needs to be in the valid common mode range, the other input can go up the maximum VCC level and the comparator provides a proper output state. Either or both inputs can go to maximum VCC level without damage.

5.7 Switching Characteristics LM393B and LM2903B

VS = 5V, VO_PULLUP = 5V, VCM = VS/2, CL = 15pF, RL = 5.1k Ohm, TA = 25°C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tresponse Propagation delay time, high-to-low; TTL input signal (1) TTL input with Vref = 1.4V 300 ns tresponse Propagation delay time, high-to-low; Small scale input signal (1) Input overdrive = 5mV, Input step = 100mV 1000 ns (1) High-to-low and low-to-high refers to the transition at the input. www.ti.com LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V

5.8 Electrical Characteristics for LM193, LM293, and LM393 (without A suffix)

at specified free-air temperature, VCC = 5V (unless otherwise noted) PARAMETER TEST CONDITIONS TA (1) LM193 LM293 LM393 UNIT MIN TYP MAX MIN TYP MAX VIO Input offset voltage VCC = 5V to 30V, VIC = VICR min, VO = 1.4V 25°C 2 5 2 5 mV Full range 9 9 IIO Input offset current VO = 1.4V 25°C 3 25 5 50 nA Full range 100 250 IIB Input bias current VO = 1.4V 25°C –25 –100 –25 –250 nA Full range –300 –400 VICR Common-mode input-voltage range(2) 25°C 0 to VCC – 1.5 0 to VCC – 1.5 V Full range 0 to VCC – 2 0 to VCC – 2 AVD Large-signal differential-voltage amplification VCC = 15V, VO = 1.4V to 11.4V, RL ≥ 15kΩ to VCC 25°C 50 200 50 200 V/mV IOH High-level output current VOH = 5V VID = 1V 25°C 0.1 0.1 50 nA VOH = 30V VID = 1V Full range 1 1 µA VOL Low-level output voltage IOL = 4mA, VID = –1V 25°C 150 400 130 400 mV Full range 700 700 IOL Low-level output current VOL = 1.5V, VID = –1V 25°C 6 6 mA ICC Supply current RL = ∞ VCC = 5V 25°C 0.8 1 0.45 1 mA VCC = 30V Full range 2.5 0.55 2.5 (1) Full range (minimum or maximum) for LM193 is –55°C to 125°C, for LM293 is –25°C to 85°C, and for LM393 is 0°C to 70°C. All characteristics are measured with zero common-mode input voltage, unless otherwise specified. (2) The voltage at either input can not be allowed to go negative by more than 0.3V otherwise output can be incorrect and excessive input current can flow. The upper end of the common-mode voltage range is limited by VCC – 2V. However only one input needs to be in the valid common mode range, and the other input can go up the maximum VCC level and the comparator provides a proper output state. Either or both inputs can go to maximum VCC level without damage. LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 www.ti.com

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Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V

5.9 Electrical Characteristics for LM293A and LM393A

at specified free-air temperature, VCC = 5V (unless otherwise noted) PARAMETER TEST CONDITIONS TA (1) LM293A LM393A UNIT MIN TYP MAX VIO Input offset voltage VCC = 5V to 30V, VO = 1.4V VIC = VICR(min) 25°C 1 2 mV Full range 4 IIO Input offset current VO = 1.4V 25°C 5 50 nA Full range 150 IIB Input bias current VO = 1.4V 25°C –25 –250 nA Full range –400 VICR Common-mode input-voltage range(2) 25°C 0 to VCC – 1.5 V Full range 0 to VCC – 2 AVD Large-signal differential-voltage amplification VCC = 15V, VO = 1.4V to 11.4V, RL ≥ 15kΩ to VCC 25°C 50 200 V/mV IOH High-level output current VOH = 5V, VID = 1V 25°C 0.1 50 nA VOH = 30V, VID = 1V Full range 1 µA VOL Low-level output voltage IOL = 4mA, VID = –1V 25°C 110 400 mV Full range 700 IOL Low-level output current VOL = 1.5V, VID = –1V, 25°C 6 mA ICC Supply current RL = ∞ VCC = 5V 25°C 0.60 1 mA VCC = 30V Full range 0.72 2.5 (1) Full range (minimum or maximum) for LM293A is –25°C to 85°C, and for LM393A is 0°C to 70°C. All characteristics are measured with zero common-mode input voltage, unless otherwise specified. (2) The voltage at either input can not be allowed to go negative by more than 0.3V otherwise output can be incorrect and excessive input current can flow. The upper end of the common-mode voltage range is limited by VCC – 2V. However only one input needs to be in the valid common mode range, and the other input can go up the maximum VCC level and the comparator provides a proper output state. Either or both inputs can go to maximum VCC level without damage. www.ti.com LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V

5.10 Electrical Characteristics for LM2903, LM2903V, and LM2903AV

at specified free-air temperature, VCC = 5V (unless otherwise noted) PARAMETER TEST CONDITIONS TA (1) LM2903, LM2903V LM2903AV UNIT MIN TYP MAX MIN TYP MAX VIO Input offset voltage VCC = 5V to MAX(2) , VO = 1.4V, VIC = VICR(min), 25°C 2 7 1 2 mV Full range 15 4 IIO Input offset current VO = 1.4V 25°C 5 50 5 50 nA Full range 200 200 IIB Input bias current VO = 1.4V 25°C –25 –250 –25 –250 nA Full range –500 –500 VICR Common-mode input- voltage range(3) 25°C 0 to VCC – 1.5 0 to VCC – 1.5 V Full range 0 to VCC – 2 0 to VCC – 2 AVD Large-signal differential- voltage amplification VCC = 15V, VO = 1.4V to 11.4V, RL ≥ 15kΩ to VCC 25°C 25 100 25 100 V/mV IOH High-level output current VOH = 5V, VID = 1V 25°C 0.1 50 0.1 50 nA VOH = VCC MAX(2), VID = 1V Full range 1 1 µA VOL Low-level output voltage IOL = 4mA, VID = –1V, 25°C 150 400 150 400 mV Full range 700 700 IOL Low-level output current VOL = 1.5V, VID = –1V 25°C 6 6 mA ICC Supply current RL = ∞ VCC = 5V 25°C 0.8 1 0.8 1 mA VCC = MAX Full range 2.5 2.5 (1) Full range (minimum or maximum) for LM2903 is –40°C to 125°C. All characteristics are measured with zero common-mode input voltage, unless otherwise specified. (2) VCC MAX = 30V for non-V devices and 32V for V-suffix devices. (3) The voltage at either input can not be allowed to go negative by more than 0.3V otherwise output can be incorrect and excessive input current can flow. The upper end of the common-mode voltage range is limited by VCC – 2V. However only one input needs to be in the valid common mode range, the other input can go up the maximum VCC level and the comparator provides a proper output state. Either or both inputs can go to maximum VCC level without damage.

5.11 Switching Characteristics: LM193, LM239, LM393, LM2903, all 'A' and 'V' versions

VCC = 5V, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT Response time RL connected to 5V through 5.1kΩ, CL = 15pF(1) (2) 100mV input step with 5mV overdrive 1.3 µs TTL-level input step 0.3 (1) CL includes probe and jig capacitance. (2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4V. LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 www.ti.com

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Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V

5.12 Typical Characteristics, LMx93x and LM2903x

TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. Figure 5-1. Total Supply Current vs. Supply Voltage Input Voltage (V) Total Supply Current (PA) 100 140 180 220 260 300 340 380 420 460 500 VS=3V -40°C 0°C 25°C 85°C 125°C Figure 5-2. Total Supply Current vs. Input Voltage at 3V Input Voltage (V) Total Supply Current (PA) 100 140 180 220 260 300 340 380 420 460 500 VS=3.3V -40°C 0°C 25°C 85°C 125°C Figure 5-3. Total Supply Current vs. Input Voltage at 3.3V Input Voltage (V) Total Supply Current (PA) 100 140 180 220 260 300 340 380 420 460 500 VS=5V -40°C 0°C 25°C 85°C 125°C Figure 5-4. Total Supply Current vs. Input Voltage at 5V Input Voltage (V) Total Supply Current (PA) -1 0 1 2 3 4 5 6 7 8 9 10 11 100 140 180 220 260 300 340 380 420 460 500 VS=12V -40°C 0°C 25°C 85°C 125°C Figure 5-5. Total Supply Current vs. Input Voltage at 12V Input Voltage (V) Total Supply Current (PA) 0 3 6 9 12 15 18 21 24 27 30 33 36 150 190 230 270 310 350 390 430 470 510 550 VS=36V -40°C 0°C 25°C 85°C 125°C Figure 5-6. Total Supply Current vs. Input Voltage at 36V www.ti.com LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V

5.12 Typical Characteristics, LMx93x and LM2903x (continued)

TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. Temperature (°C) Input Offset Voltage (mV) -40 -25 -10 5 20 35 50 65 80 95 110 125 -1.5 -0.5 0.5 1.5 VS = 3V

63 Channels

Figure 5-7. Input Offset Voltage vs. Temperature at 3V Temperature (°C) Input Offset Voltage (mV) -40 -25 -10 5 20 35 50 65 80 95 110 125 -1.5 -0.5 0.5 1.5 VS = 5V 62 Channels Figure 5-8. Input Offset Voltage vs. Temperature at 5V Temperature (°C) Input Offset Voltage (mV) -40 -25 -10 5 20 35 50 65 80 95 110 125 -1.5 -0.5 0.5 1.5 VS = 12V

62 Channels

Figure 5-9. Input Offset Voltage vs. Temperature at 12V Temperature (°C) Input Offset Voltage (mV) -40 -25 -10 5 20 35 50 65 80 95 110 125 -1.5 -0.5 0.5 1.5 VS = 36V 62 Channels Figure 5-10. Input Offset Voltage vs. Temperature at 36 Supply Voltage (V) Input Offset Voltage (mV) 3 6 9 12 15 18 21 24 27 30 33 36 -1.5 -0.5 0.5 1.5 TA = -40°C Figure 5-11. Input Offset Voltage vs. Supply Voltage at -40°C Supply Voltage (V) Input Offset Voltage (mV) 3 6 9 12 15 18 21 24 27 30 33 36 -1.5 -0.5 0.5 1.5 TA = 25°C 62 Channels Figure 5-12. Input Offset Voltage vs. Supply Voltage at 25°C LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 www.ti.com

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Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V

TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. Supply Voltage (V) Input Offset Voltage (mV) 3 6 9 12 15 18 21 24 27 30 33 36 -1.5 -0.5 0.5 1.5 TA = 85°C Figure 5-13. Input Offset Voltage vs. Supply Voltage at 85°C Supply Voltage (V) Input Offset Voltage (mV) 3 6 9 12 15 18 21 24 27 30 33 36 -1.5 -0.5 0.5 1.5 TA = 125qC 62 Channels Figure 5-14. Input Offset Voltage vs. Supply Voltage at 125°C Supply Voltage (V) Input Bias Current (nA) 3 6 9 12 15 18 21 24 27 30 33 36 -4.5 -3.5 -2.5 -1.5 -0.5 VCM=0V 125°C 85°C 25°C 0°C -40°C Figure 5-15. Input Bias Current vs. Supply Voltage Input Voltage (V) Input Bias Current (nA) -4.5 -3.5 -2.5 -1.5 -0.5 VS=5V 125°C 85°C 25°C 0°C -40°C Figure 5-16. Input Bias Current vs. Input Voltage at 5V Input Voltage (V) Input Bias Current (nA) -4.5 -3.5 -2.5 -1.5 -0.5 VS=12V 125°C 85°C 25°C 0°C -40°C Figure 5-17. Input Bias Current vs. Input Voltage at 12V Input Voltage (V) Input Bias Current (nA) 0 4 8 12 16 20 24 28 32 36 -4.5 -3.5 -2.5 -1.5 -0.5 0.5 VS=36V 125°C 85°C 25°C 0°C -40°C Figure 5-18. Input Bias Current vs. Input Voltage at 36V www.ti.com LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V

TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. Output Sinking Current (A) Output Voltage to GND (V) 10P 100P 1m 10m 100m 10m 100m VS = 3V 125°C 85°C 25°C 0°C -40°C Figure 5-19. Output Low Voltage vs. Output Sinking Current at Output Sinking Current (A) Output Voltage to GND (V) 10P 100P 1m 10m 100m 10m 100m VS = 5V 125°C 85°C 25°C 0°C -40°C Figure 5-20. Output Low Voltage vs. Output Sinking Current at Output Sinking Current (A) Output Voltage to GND (V) 10P 100P 1m 10m 100m 10m 100m VS = 12V 125°C 85°C 25°C 0°C -40°C Figure 5-21. Output Low Voltage vs. Output Sinking Current at 12V Output Sinking Current (A) Output Voltage to GND (V) 10P 100P 1m 10m 100m 10m 100m VS = 36V 125°C 85°C 25°C 0°C -40°C Figure 5-22. Output Low Voltage vs.Output Sinking Current at 36V Temperature (°C) Output High Leakage to GND (nA) -40 -25 -10 5 20 35 50 65 80 95 110 125 0.01 0.02 0.05 0.1 0.2 0.5 100 Output set high VOUT = VS Figure 5-23. Output High Leakage Current vs.Temperature at 5V Temperature (°C) Output High Leakage to GND (nA) -40 -25 -10 5 20 35 50 65 80 95 110 125 0.01 0.02 0.05 0.1 0.2 0.5 100 Output set high VOUT = VS Figure 5-24. Output High Leakage Current vs. Temperature at 36V LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 www.ti.com

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TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. Input Overdrive (mV) Propagation Delay, High to Low (ns) 5 10 100 1000 100 200 300 400 500 600 700 800 900 1000 VS = 5V VCM = 0V CL = 15pF RP = 5.1k 125°C 85°C 25°C -40°C Figure 5-25. High to Low Propagation Delay vs. Input Overdrive Voltage, 5V Input Overdrive (mV) Propagation Delay, Low to High (ns) 5 10 100 1000 100 200 300 400 500 600 700 800 900 1000 VS = 5V VCM = 0V CL = 15pF RP = 5.1k 125°C 85°C 25°C -40°C Figure 5-26. Low to High Propagation Delay vs. Input Overdrive Voltage, 5V Input Overdrive (mV) Propagation Delay, High to Low (ns) 5 10 100 1000 100 200 300 400 500 600 700 800 900 1000 VS = 12V VCM = 0V CL = 15pF RP = 5.1k 125°C 85°C 25°C -40°C Figure 5-27. High to Low Propagation Delay vs. Input Overdrive Voltage, 12V Input Overdrive (mV) Propagation Delay, Low to High (ns) 5 10 100 1000 100 200 300 400 500 600 700 800 900 1000 VS = 12V VCM = 0V CL = 15pF RP = 5.1k 125°C 85°C 25°C -40°C Figure 5-28. Low to High Propagation Delay vs. Input Overdrive Voltage, 12V Input Overdrive (mV) Propagation Delay, High to Low (ns) 5 10 100 1000 100 200 300 400 500 600 700 800 900 1000 VS = 36V VCM = 0V CL = 15pF RP = 5.1k 125°C 85°C 25°C -40°C Figure 5-29. High to Low Propagation Delay vs. Input Overdrive Voltage, 36V Input Overdrive (mV) Propagation Delay, Low to High (ns) 5 10 100 1000 100 200 300 400 500 600 700 800 900 1000 VS = 36V VCM = 0V CL = 15pF RP = 5.1k 125°C 85°C 25°C -40°C Figure 5-30. Low to High Propagation Delay vs. Input Overdrive Voltage, 36V www.ti.com LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V

TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. Time (Ps) Output Voltage (V) VREF = VCC/2 20mV Overdrive 5mV Overdrive 100mV Overdrive Figure 5-31. Response Time for Various Overdrives, High-to- Low Transition Time (Ps) Output Voltage (V) 20mV Overdrive 5mV Overdrive 100mV Overdrive VREF = VCC/2 Figure 5-32. Response Time for Various Overdrives, Low-to- High Transition LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 www.ti.com

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6 Detailed Description

6.1 Overview

These dual comparators have the ability to operate up to absolute maximum of 36V (38V for the "B" version) on the supply pin. This device has proven ubiquity and versatility across a wide range of applications. This is due to very wide supply voltages range, low Iq and fast response of the devices. The open-collector outputs allow the user to level shift to the desired logic level indpendent of VCC, while also enabling AND functionality when multiple outputs are connected together.

6.2 Functional Block Diagram

Input Q9 Q10 Q11 Q5 Q6 D2 D3 Q12 + Input Output VCC Internal Bias Itail I1 I2 Q13 Q14 ESD ESD VCM Clamp Q15 Figure 6-1. Schematic (Each Comparator)

6.3 Feature Description

The comparator consists of a PNP Darlington pair input, allowing the device to operate with very high gain and fast response with minimal input bias current. The input Darlington pair creates a limit on the input common mode voltage capability, allowing the comparator to accurately function from ground to V CC– 2V over temperature. A clamp is added around Q3 to mimic the both inputs above input voltage range behavior of the original classic silicon. The output consists of an open drain NPN (pull-down or low side) transistor. The output NPN sinks current when the negative input voltage is higher than the positive input voltage and the offset voltage. The V OL is resistive and scales with the output current. Please see the "Output Low Voltage vs. Output Sinking Current" graphs for VOL values with respect to the output current.

6.4 Device Functional Modes

6.4.1 Voltage Comparison

The device operates solely as a voltage comparator, comparing the differential voltage between the positive and negative pins and outputting a logic low or high impedance (logic high with pullup) based on the input differential polarity. www.ti.com LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V

7 Application and Implementation

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

7.1 Application Information

The device is typically used to compare a single signal to a reference or two signals against each other. Many users take advantage of the open drain output to drive the comparison logic output to a logic voltage level to an MCU or logic device. The wide supply range and high voltage capability makes this comaprator an excellent choice for level shifting to a higher or lower voltage.

7.2 Typical Application

½ LM2903 VLOGIC VSUP Vref Vin + ½ LM2903 Vin- Vin+ Rpullup Rpullup VLOGIC VSUP CL CL Figure 7-1. Single-Ended and Differential Comparator Configurations

7.2.1 Design Requirements

For this design example, use the parameters listed in Table 7-1 as the input parameters. Table 7-1. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Input Voltage Range 0V to Vsup-2V Supply Voltage 4.5V to VCC maximum Logic Supply Voltage 0V to VCC maximum Output Current (RPULLUP) 1µA to 4mA Input Overdrive Voltage 100mV Reference Voltage 2.5V Load Capacitance (CL) 15pF

7.2.2 Detailed Design Procedure

When using the device in a general comparator application, determine the following:

Input Voltage Range
Minimum Overdrive Voltage
Output and Drive Current
Response Time

7.2.2.1 Input Voltage Range

When choosing the input voltage range, the input common mode voltage range (V ICR) must be taken in to account. If temperature operation is below 25°C the V ICR can range from 0V to V CC– 2.0V. This limits the input LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 www.ti.com

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voltage range to as high as V CC– 2.0V and as low as 0V. Operation outside of this range can yield incorrect comparisons. The following is a list of input voltage situation and the outcomes: 1. When both IN- and IN+ are both within the common-mode range: a. If IN- is higher than IN+ and the offset voltage, the output is low and the output transistor is sinking current b. If IN- is lower than IN+ and the offset voltage, the output is high impedance and the output transistor is not conducting 2. When IN- is higher than common-mode and IN+ is within common-mode, the output is low and the output transistor is sinking current 3. When IN+ is higher than common-mode and IN- is within common-mode, the output is high impedance and the output transistor is not conducting 4. When IN- and IN+ are both higher than common-mode, see Section 2 of Application Design Guidelines for LM339, LM393, TL331 Family Comparators Including the New B-versions.

7.2.2.2 Minimum Overdrive Voltage

Overdrive Voltage is the differential voltage produced between the positive and negative inputs of the comparator over the offset voltage (V IO). To make an accurate comparison the Overdrive Voltage (V OD) must be higher than the input offset voltage (V IO). Overdrive voltage can also determine the response time of the comparator, with the response time decreasing with increasing overdrive. Figure 7-2 and Figure 7-3 show positive and negative response times with respect to overdrive voltage.

7.2.2.3 Output and Drive Current

Output current is determined by the load/pull-up resistance and logic/pullup voltage. The output current produces a output low voltage (V OL) from the comparator. In which V OL is proportional to the output current. See the Output Low vs. Sinking Current graphs in the Typical Characteristics, LMx93x and LM2903x section to determine VOL based on the output current.

7.2.2.4 Response Time

Response time is a function of input over drive. See Application Curves for typical response times. The rise and falls times can be determined by the load capacitance (C L), load/pullup resistance (RPULLUP) and equivalent collector-emitter resistance (RCE).

The rise time (τR) is approximately τR = RPULLUP × CL
The fall time (τF) is approximately τF = RCE × CL – RCE can be determine by taking the slope of Figure 5-20 in the linear region at the desired temperature, or by dividing the VOL by Iout www.ti.com LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V

7.2.3 Application Curves

The following curves are generated with 5V on VCC and VLogic, RPULLUP = 5.1kΩ, and 50pF scope probe. Output Voltage, Vo(V) Time (usec) 5mV OD 20mV OD 100mV OD C004 Figure 7-2. Response Time for Various Overdrives (Positive Transition) Output Voltage (Vo) Time (usec) 5mV OD 20mV OD 100mV OD C006 Figure 7-3. Response Time for Various Overdrives (Negative Transition)

7.2.4 Power Supply Recommendations

For fast response and comparison applications with noisy or AC inputs, TI recommends to use a bypass capacitor on the supply pin to reject any variation on the supply voltage. This variation can eat into the input common-mode range of the comparator and create an inaccurate comparison.

7.2.5 Layout

7.2.5.1 Layout Guidelines

For accurate comparator applications without hysteresis maintaining a stable power supply with minimized noise and glitches is critical. Best practice is to add a bypass capacitor between the supply voltage and ground. This can be implemented on the positive power supply and negative supply (if available). If a negative supply is not being used, do not put a capacitor between the IC's GND pin and system ground. Minimize coupling between outputs and inverting inputs to prevent output oscillations. Do not run output and inverting input traces in parallel unless there is a V CC or GND trace between output and inverting input traces to reduce coupling. When series resistance is added to inputs, place resistor close to the device.

7.2.5.2 Layout Example

Figure 7-4. LM2903 Layout Example LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 www.ti.com

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8 Device and Documentation Support

8.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

8.2 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

8.3 Trademarks

TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

8.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

8.5 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

9 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision AG (January 2025) to Revision AH (April 2025) Page Changes from Revision AF (August 2023) to Revision AG (January 2025) Page Changes from Revision AE (November 2020) to Revision AF (August 2023) Page Changes from Revision AD (October 2020) to Revision AE (November 2020) Page www.ti.com LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V

Changes from Revision AC (February 2020) to Revision AD (October 2020) Page Changes from Revision AB (December 2019) to Revision AC (February 2020) Page Changes from Revision AA (September 2019) to Revision AB (December 2019) Page Changes from Revision Z (October 2017) to Revision AA (September 2019) Page

Deleted from Device Information old LM193 CDIP and LCCC package references and drawings. These are

10 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser based versions of this data sheet, refer to the left hand navigation. LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025 www.ti.com

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www.ti.com 14-Aug-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM193DR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 LM193 LM193DR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 LM193 LM193DRG4 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 LM193 LM193DRG4.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 LM193 LM2903AVQDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV LM2903AVQDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV LM2903AVQDRG4 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV LM2903AVQDRG4.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV LM2903AVQPWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 (2903AV, L2903AV) LM2903AVQPWR.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 (2903AV, L2903AV) LM2903AVQPWR.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 (2903AV, L2903AV) LM2903AVQPWRG4 Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 (2903AV, L2903AV) LM2903AVQPWRG4.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 (2903AV, L2903AV) LM2903AVQPWRG4.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 (2903AV, L2903AV) LM2903BIDDFR Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2903B LM2903BIDDFR.B Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2903B LM2903BIDDFRG4 Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2903B LM2903BIDDFRG4.B Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2903B LM2903BIDGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 903B LM2903BIDGKR.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 903B LM2903BIDGKR.B Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 903B LM2903BIDGKRG4 Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 903B LM2903BIDGKRG4.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 903B LM2903BIDGKRG4.B Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 903B LM2903BIDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903B LM2903BIDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903B LM2903BIDR.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903B LM2903BIDRG4 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903B LM2903BIDRG4.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903B Addendum-Page 1

www.ti.com 14-Aug-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM2903BIDRG4.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903B LM2903BIDSGR Active Production WSON (DSG) | 8 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 903B LM2903BIDSGR.A Active Production WSON (DSG) | 8 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 903B LM2903BIDSGR.B Active Production WSON (DSG) | 8 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 903B LM2903BIDSGRG4 Active Production WSON (DSG) | 8 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 903B LM2903BIDSGRG4.A Active Production WSON (DSG) | 8 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 903B LM2903BIDSGRG4.B Active Production WSON (DSG) | 8 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 903B LM2903BIPWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903B LM2903BIPWR.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903B LM2903D Obsolete Production SOIC (D) | 8 - - Call TI Call TI -40 to 125 LM2903 LM2903DGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU | SN | NIPDAUAG Level-1-260C-UNLIM -40 to 125 (MAP, MAS, MAU) LM2903DGKR.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 (MAP, MAS, MAU) LM2903DR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 LM2903 LM2903DR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 LM2903 LM2903DRG3 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 LM2903 LM2903DRG3.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 LM2903 LM2903P Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 125 LM2903P LM2903P.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 125 LM2903P LM2903P.B Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 125 LM2903P LM2903PSR Active Production SO (PS) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903 LM2903PSR.A Active Production SO (PS) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903 LM2903PWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 L2903 LM2903PWR.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903 LM2903PWR.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903 LM2903PWRG3 Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 L2903 LM2903PWRG3.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 L2903 LM2903PWRG4 Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903 LM2903PWRG4.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903 LM2903PWRG4.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903 LM2903QD Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q Addendum-Page 2

www.ti.com 14-Aug-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM2903QD.A Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q LM2903QDG4 Obsolete Production SOIC (D) | 8 - - Call TI Call TI -40 to 125 2903Q LM2903QDRG4 Obsolete Production SOIC (D) | 8 - - Call TI Call TI -40 to 125 2903Q LM2903VQDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V LM2903VQDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V LM2903VQDRG4 Obsolete Production SOIC (D) | 8 - - Call TI Call TI -40 to 125 L2903V LM2903VQPWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V LM2903VQPWR.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V LM2903VQPWR.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V LM2903VQPWRG4 Obsolete Production TSSOP (PW) | 8 - - Call TI Call TI -40 to 125 L2903V LM293AD Obsolete Production SOIC (D) | 8 - - Call TI Call TI -25 to 85 LM293A LM293ADGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 (MDP, MDS, MDU) LM293ADGKR.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 (MDP, MDS, MDU) LM293ADGKRG4 Active Production VSSOP (DGK) | 8 2500 | LARGE T&R - Call TI Call TI -25 to 85 LM293ADR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A LM293ADR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A LM293ADRG4 Obsolete Production SOIC (D) | 8 - - Call TI Call TI -25 to 85 LM293A LM293D Obsolete Production SOIC (D) | 8 - - Call TI Call TI -25 to 85 LM293 LM293DGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -25 to 85 (MCP, MCS, MCU) LM293DGKR.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 (MCP, MCS, MCU) LM293DGKR.B Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 (MCP, MCS, MCU) LM293DGKRG4 Active Production VSSOP (DGK) | 8 2500 | LARGE T&R - Call TI Call TI -25 to 85 LM293DR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 LM293 LM293DR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 LM293 LM293DRG3 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -25 to 85 LM293 LM293DRG3.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -25 to 85 LM293 LM293P Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -25 to 85 LM293P LM293P.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -25 to 85 LM293P LM293P.B Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -25 to 85 LM293P LM293PE4 Active Production PDIP (P) | 8 50 | TUBE - Call TI Call TI -25 to 85 LM393AD Obsolete Production SOIC (D) | 8 - - Call TI Call TI 0 to 70 LM393A Addendum-Page 3

www.ti.com 14-Aug-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM393ADGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 (M8P, M8S, M8U) LM393ADGKR.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 (M8P, M8S, M8U) LM393ADGKRG4 Active Production VSSOP (DGK) | 8 2500 | LARGE T&R - Call TI Call TI 0 to 70 LM393ADR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A LM393ADR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A LM393ADRG4 Obsolete Production SOIC (D) | 8 - - Call TI Call TI 0 to 70 LM393A LM393AP Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU | SN N/A for Pkg Type 0 to 70 LM393AP LM393AP.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM393AP LM393AP.B Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM393AP LM393APE4 Active Production PDIP (P) | 8 50 | TUBE - Call TI Call TI 0 to 70 LM393APSR Active Production SO (PS) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L393A LM393APSR.A Active Production SO (PS) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L393A LM393APWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L393A LM393APWR.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L393A LM393APWR.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L393A LM393APWRG4 Obsolete Production TSSOP (PW) | 8 - - Call TI Call TI 0 to 70 L393A LM393BIDDFR Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 393B LM393BIDDFR.B Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 393B LM393BIDDFRG4 Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 393B LM393BIDDFRG4.B Active Production SOT-23-THIN (DDF) | 83000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 393B LM393BIDGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 393B LM393BIDGKR.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 393B LM393BIDGKR.B Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 393B LM393BIDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM393B LM393BIDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM393B LM393BIDR.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM393B LM393BIDRG4 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM393B LM393BIDRG4.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM393B LM393BIDRG4.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM393B LM393BIDSGR Active Production WSON (DSG) | 8 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 393B LM393BIDSGR.A Active Production WSON (DSG) | 8 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 393B Addendum-Page 4

www.ti.com 14-Aug-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM393BIDSGR.B Active Production WSON (DSG) | 8 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 393B LM393BIDSGRG4 Active Production WSON (DSG) | 8 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 393B LM393BIDSGRG4.A Active Production WSON (DSG) | 8 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 393B LM393BIDSGRG4.B Active Production WSON (DSG) | 8 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 393B LM393BIPWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM393B LM393BIPWR.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM393B LM393BIPWR.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM393B LM393D Obsolete Production SOIC (D) | 8 - - Call TI Call TI 0 to 70 LM393 LM393DGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM 0 to 70 (M9P, M9S, M9U) LM393DGKR.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 (M9P, M9S, M9U) LM393DGKRG4 Active Production VSSOP (DGK) | 8 2500 | LARGE T&R - Call TI Call TI 0 to 70 LM393DR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 LM393 LM393DR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 LM393 LM393DRG3 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM393 LM393DRG3.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM393 LM393DRG4 Obsolete Production SOIC (D) | 8 - - Call TI Call TI 0 to 70 LM393 LM393P Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU | SN N/A for Pkg Type 0 to 70 LM393P LM393P.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM393P LM393P.B Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM393P LM393PE3 Active Production PDIP (P) | 8 50 | TUBE Yes SN N/A for Pkg Type 0 to 70 LM393P LM393PE3.A Active Production PDIP (P) | 8 50 | TUBE Yes SN N/A for Pkg Type 0 to 70 LM393P LM393PE4 Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM393P LM393PE4.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM393P LM393PE4.B Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM393P LM393PS Active Production SO (PS) | 8 80 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L393 LM393PS.A Active Production SO (PS) | 8 80 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L393 LM393PSR Active Production SO (PS) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L393 LM393PSR.A Active Production SO (PS) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L393 LM393PSRG4 Active Production SO (PS) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L393 LM393PW Obsolete Production TSSOP (PW) | 8 - - Call TI Call TI 0 to 70 L393 LM393PWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L393 Addendum-Page 5

www.ti.com 14-Aug-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM393PWR.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L393 LM393PWR.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L393 LM393PWRG3 Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 L393 LM393PWRG3.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 L393 LM393PWRG4 Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L393 LM393PWRG4.A Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L393 LM393PWRG4.B Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L393 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 6

www.ti.com 14-Aug-2026 OTHER QUALIFIED VERSIONS OF LM2903, LM2903B, LM293 :

Automotive : LM2903-Q1 , LM2903B-Q1
Enhanced Product : LM293-EP NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 7

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant LM2903BIDDFR SOT-23- THIN LM2903BIDDFRG4 SOT-23- THIN Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant LM393BIDDFR SOT-23- THIN LM393BIDDFRG4 SOT-23- THIN Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM193DR SOIC D 8 2500 367.0 367.0 35.0 LM193DR SOIC D 8 2500 353.0 353.0 32.0 LM193DRG4 SOIC D 8 2500 353.0 353.0 32.0 LM2903AVQDR SOIC D 8 2500 340.5 338.1 20.6 LM2903AVQDR SOIC D 8 2500 353.0 353.0 32.0 LM2903AVQDRG4 SOIC D 8 2500 353.0 353.0 32.0 LM2903AVQPWR TSSOP PW 8 2000 353.0 353.0 32.0 LM2903AVQPWRG4 TSSOP PW 8 2000 353.0 353.0 32.0 LM2903BIDDFR SOT-23-THIN DDF 8 3000 210.0 185.0 35.0 LM2903BIDDFRG4 SOT-23-THIN DDF 8 3000 210.0 185.0 35.0 LM2903BIDGKR VSSOP DGK 8 2500 367.0 367.0 35.0 LM2903BIDGKR VSSOP DGK 8 2500 353.0 353.0 32.0 LM2903BIDGKR VSSOP DGK 8 2500 353.0 353.0 32.0 LM2903BIDGKRG4 VSSOP DGK 8 2500 353.0 353.0 32.0 LM2903BIDR SOIC D 8 2500 353.0 353.0 32.0 LM2903BIDR SOIC D 8 2500 356.0 356.0 35.0 LM2903BIDRG4 SOIC D 8 2500 353.0 353.0 32.0 LM2903BIDSGR WSON DSG 8 3000 210.0 185.0 35.0 Pack Materials-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2903BIDSGRG4 WSON DSG 8 3000 210.0 185.0 35.0 LM2903BIPWR TSSOP PW 8 2000 353.0 353.0 32.0 LM2903DGKR VSSOP DGK 8 2500 353.0 353.0 32.0 LM2903DR SOIC D 8 2500 353.0 353.0 32.0 LM2903DRG3 SOIC D 8 2500 364.0 364.0 27.0 LM2903PSR SO PS 8 2000 353.0 353.0 32.0 LM2903PWR TSSOP PW 8 2000 353.0 353.0 32.0 LM2903PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0 LM2903PWRG4 TSSOP PW 8 2000 353.0 353.0 32.0 LM2903VQDR SOIC D 8 2500 353.0 353.0 32.0 LM2903VQDR SOIC D 8 2500 353.0 353.0 32.0 LM2903VQDR SOIC D 8 2500 340.5 338.1 20.6 LM2903VQPWR TSSOP PW 8 2000 353.0 353.0 32.0 LM293ADGKR VSSOP DGK 8 2500 353.0 353.0 32.0 LM293ADR SOIC D 8 2500 353.0 353.0 32.0 LM293ADR SOIC D 8 2500 340.5 338.1 20.6 LM293ADR SOIC D 8 2500 353.0 353.0 32.0 LM293DGKR VSSOP DGK 8 2500 353.0 353.0 32.0 LM293DR SOIC D 8 2500 340.5 338.1 20.6 LM293DR SOIC D 8 2500 353.0 353.0 32.0 LM293DR SOIC D 8 2500 353.0 353.0 32.0 LM293DRG3 SOIC D 8 2500 364.0 364.0 27.0 LM393ADGKR VSSOP DGK 8 2500 353.0 353.0 32.0 LM393ADR SOIC D 8 2500 353.0 353.0 32.0 LM393ADR SOIC D 8 2500 340.5 338.1 20.6 LM393APSR SO PS 8 2000 353.0 353.0 32.0 LM393APWR TSSOP PW 8 2000 353.0 353.0 32.0 LM393BIDDFR SOT-23-THIN DDF 8 3000 210.0 185.0 35.0 LM393BIDDFRG4 SOT-23-THIN DDF 8 3000 210.0 185.0 35.0 LM393BIDGKR VSSOP DGK 8 2500 353.0 353.0 32.0 LM393BIDR SOIC D 8 2500 356.0 356.0 35.0 LM393BIDR SOIC D 8 2500 353.0 353.0 32.0 LM393BIDRG4 SOIC D 8 2500 353.0 353.0 32.0 LM393BIDSGR WSON DSG 8 3000 210.0 185.0 35.0 LM393BIDSGRG4 WSON DSG 8 3000 210.0 185.0 35.0 LM393BIPWR TSSOP PW 8 2000 353.0 353.0 32.0 LM393DGKR VSSOP DGK 8 2500 353.0 353.0 32.0 LM393DGKR VSSOP DGK 8 2500 353.0 353.0 32.0 LM393DR SOIC D 8 2500 353.0 353.0 32.0 LM393DRG3 SOIC D 8 2500 364.0 364.0 27.0 LM393PSR SO PS 8 2000 353.0 353.0 32.0 LM393PWR TSSOP PW 8 2000 353.0 353.0 32.0 LM393PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0 Pack Materials-Page 5

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM393PWRG4 TSSOP PW 8 2000 353.0 353.0 32.0 Pack Materials-Page 6

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) LM2903P P PDIP 8 50 506 13.97 11230 4.32 LM2903P.A P PDIP 8 50 506 13.97 11230 4.32 LM2903P.B P PDIP 8 50 506 13.97 11230 4.32 LM2903QD D SOIC 8 75 505.46 6.76 3810 4 LM2903QD.A D SOIC 8 75 505.46 6.76 3810 4 LM293P P PDIP 8 50 506 13.97 11230 4.32 LM293P.A P PDIP 8 50 506 13.97 11230 4.32 LM293P.B P PDIP 8 50 506 13.97 11230 4.32 LM393AP P PDIP 8 50 506 13.97 11230 4.32 LM393AP P PDIP 8 50 506.1 9 600 5.4 LM393AP.A P PDIP 8 50 506.1 9 600 5.4 LM393AP.A P PDIP 8 50 506 13.97 11230 4.32 LM393AP.B P PDIP 8 50 506.1 9 600 5.4 LM393AP.B P PDIP 8 50 506 13.97 11230 4.32 LM393P P PDIP 8 50 506 13.97 11230 4.32 LM393P P PDIP 8 50 506.1 9 600 5.4 LM393P.A P PDIP 8 50 506 13.97 11230 4.32 LM393P.A P PDIP 8 50 506.1 9 600 5.4 LM393P.B P PDIP 8 50 506 13.97 11230 4.32 LM393P.B P PDIP 8 50 506.1 9 600 5.4 LM393PE3 P PDIP 8 50 506.1 9 600 5.4 LM393PE3.A P PDIP 8 50 506.1 9 600 5.4 LM393PE4 P PDIP 8 50 506 13.97 11230 4.32 LM393PE4.A P PDIP 8 50 506 13.97 11230 4.32 LM393PE4.B P PDIP 8 50 506 13.97 11230 4.32 LM393PS PS SOP 8 80 530 10.5 4000 4.1 LM393PS.A PS SOP 8 80 530 10.5 4000 4.1 Pack Materials-Page 7

www.ti.com PACKAGE OUTLINE C 6X 0.65 1.95 8X 0.38 0.25 5.05

4.75 TYP

0.15 0.05 0.25 GAGE PLANE 0 -8

1.1 MAX

0.23 0.13 B 3.1 2.9 NOTE 4 A 3.1 2.9 NOTE 3 0.7 0.4 VSSOP - 1.1 mm max heightDGK0008A SMALL OUTLINE PACKAGE 4214862/A 04/2023

0.13 C A B

0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-187. PowerPAD is a trademark of Texas Instruments. A 20 DETAIL A TYPICAL SCALE 4.000

www.ti.com EXAMPLE BOARD LAYOUT

0.05 MAX

0.05 MIN

8X (1.4) 8X (0.45) 6X (0.65) (4.4) (R0.05) TYP VSSOP - 1.1 mm max heightDGK0008A SMALL OUTLINE PACKAGE 4214862/A 04/2023 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 8. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. 9. Size of metal pad may vary due to creepage requirement. TM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 15X SYMM SYMM SEE DETAILS 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN 8X (1.4) 8X (0.45) 6X (0.65) (4.4) (R0.05) TYP VSSOP - 1.1 mm max heightDGK0008A SMALL OUTLINE PACKAGE 4214862/A 04/2023 NOTES: (continued) 11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 12. Board assembly site may have different recommendations for stencil design. TM SOLDER PASTE EXAMPLE SCALE: 15X SYMM SYMM

www.ti.com PACKAGE OUTLINE C 2.95

2.65 TYP

1.1 MAX 6X 0.65 8X 0.38 0.22 1.95 0.20

0.08 TYP

0 - 8 0.1 0.0 0.25 GAGE PLANE 0.6 0.3 4X 0 -15 4X 4 -15 A 2.95 2.85 NOTE 3 B 1.65 1.55 4222047/E 07/2024 SOT-23-THIN - 1.1 mm max heightDDF0008A PLASTIC SMALL OUTLINE NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 1 8

0.1 C A B

0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 4.000

www.ti.com EXAMPLE BOARD LAYOUT (2.6) ALL AROUND 0.05 MIN ALL AROUND 8X (1.05) 8X (0.45) 6X (0.65) (R0.05) TYP 4222047/E 07/2024 SOT-23-THIN - 1.1 mm max heightDDF0008A PLASTIC SMALL OUTLINE SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X 4 5 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN (2.6) 6X (0.65) 8X (0.45) 8X (1.05) (R0.05) TYP 4222047/E 07/2024 SOT-23-THIN - 1.1 mm max heightDDF0008A PLASTIC SMALL OUTLINE NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. SYMM SYMM 4 5 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X

www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800

www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM

www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5

www.ti.com GENERIC PACKAGE VIEW This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. WSON - 0.8 mm max heightDSG 8 PLASTIC SMALL OUTLINE - NO LEAD2 x 2, 0.5 mm pitch 4224783/A

www.ti.com PACKAGE OUTLINE C 8X 0.32 0.18 1.6 0.1 1.5 0.9 0.1 6X 0.5 8X 0.4 0.2 0.05 0.00 0.8 0.7 A 2.1 1.9 B 2.1 1.9 0.32 0.18 0.4 0.2 (DIM A) TYP WSON - 0.8 mm max heightDSG0008A PLASTIC SMALL OUTLINE - NO LEAD 4218900/E 08/2022 SIDE WALL METAL THICKNESS DIM A OPTION 1 OPTION 2 0.1 0.2 PIN 1 INDEX AREA SEATING PLANE 0.08 C 4 5 X 0.25)(45 PIN 1 ID 0.05 C THERMAL PAD EXPOSED NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 5.500 ALTERNATIVE TERMINAL SHAPE TYPICAL

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MIN

0.07 MAX

8X (0.25) (1.6) (1.9) 6X (0.5) (0.9) ( 0.2) VIA TYP (0.55) 8X (0.5) (R0.05) TYP WSON - 0.8 mm max heightDSG0008A PLASTIC SMALL OUTLINE - NO LEAD 4218900/E 08/2022 SYMM 4 5 LAND PATTERN EXAMPLE SCALE:20X SYMM 9 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING SOLDER MASK METAL UNDER SOLDER MASK DEFINED METALSOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED)

www.ti.com EXAMPLE STENCIL DESIGN (R0.05) TYP 8X (0.25) 8X (0.5) (0.9) (0.7) (1.9) (0.45) 6X (0.5) WSON - 0.8 mm max heightDSG0008A PLASTIC SMALL OUTLINE - NO LEAD 4218900/E 08/2022 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 9: 87% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:25X SYMM METAL SYMM

www.ti.com PACKAGE OUTLINE C TYP6.6 6.2

1.2 MAX

6X 0.65 8X 0.30 0.19 1.95 0.15 0.05 (0.15) TYP 0 - 8 0.25 GAGE PLANE 0.75 0.50 A NOTE 3 3.1 2.9 B NOTE 4 4.5 4.3 4221848/A 02/2015 TSSOP - 1.2 mm max heightPW0008A SMALL OUTLINE PACKAGE NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153, variation AA. 1 8 0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800

www.ti.com EXAMPLE BOARD LAYOUT (5.8) 8X (1.5) 8X (0.45) 6X (0.65) (R ) TYP 0.05 4221848/A 02/2015 TSSOP - 1.2 mm max heightPW0008A SMALL OUTLINE PACKAGE SYMM SYMM LAND PATTERN EXAMPLE SCALE:10X 4 5 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN (5.8) 6X (0.65) 8X (0.45) 8X (1.5) (R ) TYP0.05 4221848/A 02/2015 TSSOP - 1.2 mm max heightPW0008A SMALL OUTLINE PACKAGE NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SYMM SYMM 4 5 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X

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