LM160808T LEIDITECH
Document overview
- Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 9
Technical content
1 Scope:
2 Part Numbering: Product Identification
3 Rating:
－５５℃～１２５℃(after PCB) －５℃～４０℃ ,Humidity ４０％～７０％ (before PCB)
4 Marking:
5 Standard Testing Condition
Unless otherwise specified In case of doubt Temperature Ordinary Temperature(15 to 35 Humidity Ordinary Humidity(25 to 85% RH) This specification applies to MULTILAYER FERRITE CHIP BEADS 20±2 60 to 70 % RH Operating Temperature: Storage Temperature: (Including self - temperature rise) LM160808T Series LM Rev : www.leiditech.com 01.06.2018 1/9
6 Configuration and Dimensions:
7 ELECTRICAL CHARACTERISTICS：
Impedance Test Freq. RDC Rated Current (Ω) ( Ω)Max. (mA)Max. LM160808T-100 □-N 10 100 MHz,200 mV 0.01 5000 LM160808T-300 □-N 30 100 MHz,200 mV 0.015 4500 LM160808T-600 □-N 60 100 MHz,200 mV 0.02 4000 LM160808T-700 □-N 70 100 MHz,200 mV 0.02 4000 LM160808T-101 □-N 100 100 MHz,200 mV 0.03 3000 LM160808T-121 □-N 120 100 MHz,200 mV 0.03 3000 LM160808T-181 □-N 180 100 MHz,200 mV 0.05 2000 LM160808T-221 □-N 220 100 MHz,200 mV 0.04 2500 NOTE: □-tolerance Y=±25% / T=±30% 1.Operating temperature range － ５ ５ ℃ ～ １ ２ ５ ℃ (Including self - temperature rise) 2.Rate Current : Applied the current to coils, the temperature rise shall not be more than 30 3.As for PB/UPB type. Rated Current is derated as left figure depending on the operating temprature. "-N" FOR COMPLETELY LEAD FREE TYPE(INCLUDING FERRITE BODY & SOLDER) Part No. LM160808T Series Rev : www.leiditech.com 01.06.2018 2/9
8 LM160808T Series
8.1 Construction:
8.2 Material List:
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9 Reliability Of Ferrite Multilayer Chip Bead
1-1.Mechanical Performance No Item Specification 1-1-1 Flexure Strength The forces applied on the right Test device shall be soldered on the substrate conditions must not damage Substrate Dimension: 100x 40x1.6mm the terminal electrode and the Deflection: 2.0mm ferrite Keeping Time: 30sec *For 100505, substrate dimension is 100x40x0.8mm 1-1-2 Vibration Test device shall be soldered on the substrate Oscillation Frequency: 10 to 55 to 10Hz for 1min Amplitude: 1.5mm Time: 2hrs for each axis (X, Y & Z), total 6hrs 1-1-3 Resistance to Soldering Heat Appearance: No damag e Pre-heating: 150 , 1min More than 75% of the terminal. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free) electrode should be covered Solder Temperature: 260±5 with solder. Immersion Time: 10±1sec Impedance : within ±30% of initial value 1-1-4 Solder ability The electrodes shall be at Pre-heating: 150 , 1min least 95% covered with new Solder Composition: Sn/Ag3. 0/Cu0.5(Pb-Free) solder coating Solder Temperature: 245±5 (Pb-Free) Immersion Time: 4±1sec 1-1-5 Terminal Strength Test No split termination Test device shall be soldered on the substrate, then apply a force in the direction of the arrow. Force : 5N Keeping Time: 10±1sec 1-2.Environmental Performance No Item Specification 1-2-1 Temperature Cycle Appearance: No damage One cycle : Impedance: within±30% of Step Temperature ( ) Time (min) initial value 1 -55±3 30 2 25±2 3 3 125±3 30 4 25±2 3 Total: 100cycles Measured after exposure in the room condition for 24hrs 1-2-2 Humidity Resistance Temperature: 40±2 Relative Humidity: 90 ~ 95% / Time: 1000hrs Measured after exposure in the room condition for 24hrs 1-2-3 High Temperature: 125±3 / Relative Humidity: 0% Temperature Resistance Applied Current: Rated Current /Time: 1000hrs Measured after exposure in the room condition for 24hrs 1-2-4 Low Temperature: -55±3 Temperature Resistance Relative Humidity: 0% / Time: 1000hrs Measured after exposure in the room condition for 24hrs Test Method Test Method Mounting Pad F Chip LM160808T Series Rev : www.leiditech.com 01.06.2018 4/9
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10 TEST DATA FOR PREPRODUCTION SAMPLES
DESCRIPTION: LM160808T-221Y-N Z RDC A B C D (Ω) ( Ω) m/m m/m m/m m/m Spec Customer 220±25% TEST INSTRUMENT: HP4291A RF IMPEDANCE / MATERIAL ANALYZER FOR Z CHEN HWA 502BC / HP4338B FOR RDC APPEARANCE AND DIMENSIONS : SPEC : MEET ITEM 6. TEST METHOD : VISUAL INSPECTION AND MEASURED WITH SILDE CALIPERS. TESTING CONDITIONS : MEAS. Item Test Freq. ln case of doubt X R Unless otherwise specified CUSTOMER 200mV 100MHz 20 ± 2 ℃ 60 to 70 %RH Ordinary Temperature (15 to 35℃) Ordinary Humidity (25 to 85 %RH) Temperature SAMPLE Humidity LM160808T Series Rev : www.leiditech.com 01.06.2018 6/9
11 PACKAGING
11.1 Packaging -Cover tape
The force for tearing off cover tape is 10 to 100 g rams in the arrow direction.
11.2 Packaging Quantity
11.3 Reel Dimensions
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11.4 Tape Dimensions in mm
12 Recommended Pattern
13 Note:
- Please make sure that your product is has been evaluated and confirmed against your specifications when our product is mounted to your product. 2. Do not knock nor drop. 3. All the items and parameters in this product specification have been prescribed on the premise that our product is used for the purpose,under the condition and in the environment agreed upon between you and us. You are requested not to use our product deviating from such agreement. 4. Please keep the distance between transformer/coil and other components (refer to the standard IEC 950 ) LM160808T Series Rev : www.leiditech.com 01.06.2018 8/9
14 Curve:
Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : www.leiditech.com 01.06.2018 9/9