LM136-5.0 LM236-5.0 LM336-5.0 5.0V Reference Diode datasheet (Rev. D)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SNVS750,D]
- PDF pages: 24
Technical content
www.ti.com SNVS750D –JUNE 1999–REVISED MARCH 2013 LM136-5.0,LM236-5.0,LM336-5.05.0VReferenceDiode Check forSamples: LM136-5.0,LM236-5.0,LM336-5.0 1FEATURES DESCRIPTION The LM136-5.0/LM236-5.0/LM336-5.0 integrated 2• Adjustable4V to6V circuitsare precision5.0V shunt regulatordiodes.• Low Temperature Coefficient These monolithicIC voltagereferencesoperateas a
- Wide OperatingCurrentof600 μA to10 mA low temperaturecoefficient5.0V zener with 0.6Ω dynamic impedance.A thirdterminalon the LM136-• 0.6Ω Dynamic Impedance 5.0 allowsthe referencevoltageand temperature• ± 1% InitialToleranceAvailable coefficienttobe trimmedeasily.
- SpecifiedTemperature Stability The LM136-5.0 seriesisusefulas a precision5.0V• EasilyTrimmed forMinimum Temperature Drift low voltagereferencefordigitalvoltmeters,power
- FastTurn-on suppliesor op amp circuitry.The 5.0V makes it convenientto obtaina stablereferencefrom low• Three Lead TransistorPackage voltage supplies.Further,since the LM136-5.0 operatesas a shunt regulator,itcan be used as eithera positiveornegativevoltagereference. The LM136-5.0 isratedforoperationover −55°C to +125°C whiletheLM236-5.0isratedovera −25°C to +85°C temperaturerange.The LM336-5.0isratedfor operationover a 0°C to +70°C temperaturerange. See theConnectionDiagramsforavailablepackages. Forapplicationsrequiring2.5Vsee LM136-2.5. Connection Diagrams Figure1. TO-92 PlasticPackage Figure2. TO MetalCan Package (Bottom View) (Bottom View) Figure3.SOIC Package Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1999–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNVS750D –JUNE 1999–REVISED MARCH 2013 www.ti.com TypicalApplications Figure4. 5.0VReference † Adjustto5.00V *Any siliconsignaldiode Figure5. 5.0VReferencewithMinimum Temperature Coefficient *Does notaffecttemperaturecoefficient Figure6. Trimmed 4V to6V Reference withTemperature Coefficient IndependentofBreakdown Voltage
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www.ti.com SNVS750D –JUNE 1999–REVISED MARCH 2013 These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. ABSOLUTE MAXIMUM RATINGS (1) ReverseCurrent 15 mA ForwardCurrent 10 mA StorageTemperature −60 to+150 °C OperatingTemperatureRange (2) LM136-5.0 −55 to+150 °C LM236-5.0 −25 to+85 °C LM336-5.0 0 to+70 °C SolderingInformation Vapor Phase (60sec.) 215 °C Infrared(15sec.) 220 °C (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.Electricalspecificationsdo notapplywhen operatingthedevicebeyond itsspecifiedoperatingconditions. (2) Forelevatedtemperatureoperation,Tjmax see THERMAL CHARACTERISTICS THERMAL CHARACTERISTICS overoperatingfree-airtemperaturerange(unlessotherwisenoted) LM136 150°C LM236 125°C LM336 100°C Thermal Resistance TO-92 TO SOIC-8 θja(JunctiontoAmbient) 180°C/W (0.4″ Leads) 440°C/W 165°C/W 170°C/W (0.125″ Leads) θja(JunctiontoCase) N/A 80°C/W N/A
ELECTRICAL CHARACTERISTICS
LM136A-5.0/LM236A-5.0 LM336B-5.0 Parameter Conditions LM136-5.0/LM236-5.0 LM336-5.0 Units Min Typ Max Min Typ Max ReverseBreakdown TA=25°C, IR =1 mA Voltage ReverseBreakdown TA=25°C, 6 12 6 20 mV Change WithCurrent 600 μA≤IR ≤10 mA ReverseDynamic TA=25°C, IR =1 mA, f= 100 Hz 0.6 1.2 0.6 2 Ω Impedance TemperatureStabilityVR Adjusted5.00V (2) IR =1 mA, (Figure15) 0°C ≤TA≤70°C (LM336-5.0) 4 12 mV (1) Unlessotherwisespecified,theLM136-5.0isspecifiedfrom−55°C ≤TA≤+125°C, theLM236-5.0from−25°C ≤TA≤+85°C and theLM336- 5.0from0°C ≤TA≤+70°C. (2) TemperaturestabilityfortheLM336 and LM236 familyisspecifiedby design.Designlimitsarespecified(butnot100% percent productiontested)overtheindicatedtemperatureand supplyvoltageranges.These limitsarenotused tocalculateoutgoingquality levels.Stabilityisdefinedas themaximum chargeinVREF from25°C toTA(min)orTA(max). Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM136-5.0 LM236-5.0 LM336-5.0
SNVS750D –JUNE 1999–REVISED MARCH 2013 www.ti.com ELECTRICAL CHARACTERISTICS (continued) (1) LM136A-5.0/LM236A-5.0 LM336B-5.0 Parameter Conditions LM136-5.0/LM236-5.0 LM336-5.0 Units Min Typ Max Min Typ Max ReverseBreakdown 600 μA≤IR ≤10 mA 6 17 6 24 mVChange WithCurrent AdjustmentRange CircuitofFigure14 ±1 ±1 V ReverseDynamic IR = 1 mA 0.8 1.6 0.8 2.5 Ω Impedance Long Term Stability TA=25°C ±0.1°C, IR =1 mA, t= 1000 hrs 20 20 ppm
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www.ti.com SNVS750D –JUNE 1999–REVISED MARCH 2013 TYPICAL PERFORMANCE CHARACTERISTICS Reverse VoltageChange Zener Noise Voltage Figure7. Figure8. Dynamic Impedance Response Time Figure9. Figure10. Reverse Characteristics Temperature Drift Figure11. Figure12. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM136-5.0 LM236-5.0 LM336-5.0
SNVS750D –JUNE 1999–REVISED MARCH 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) Forward Characteristics Figure13.
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www.ti.com SNVS750D –JUNE 1999–REVISED MARCH 2013 APPLICATION HINTS The LM136-5.0 seriesvoltagereferencesare much easierto use than ordinaryzener diodes.Theirlow impedance and wide operatingcurrentrangesimplifybiasinginalmostany circuit.Further,eitherthebreakdown voltageorthetemperaturecoefficientcan be adjustedtooptimizecircuitperformance. Figure14 shows an LM136-5.0 witha 10k potentiometerforadjustingthereversebreakdown voltage.With the additionofR1 thebreakdown voltagecan be adjustedwithoutaffectingthetemperaturecoefficientofthedevice. The adjustmentrangeisusuallysufficienttoadjustforboththeinitialdevicetoleranceand inaccuraciesinbuffer circuitry. Ifminimum temperaturecoefficientis desired,four diodes can be added in serieswith the adjustment potentiometeras shown in Figure15. When the deviceis adjustedto 5.00V the temperaturecoefficientis minimized.Almostany siliconsignaldiodecan be used forthispurposesuch as a 1N914, 1N4148 ora 1N457. For propertemperaturecompensationthediodesshouldbe inthesame thermalenvironmentas theLM136-5.0. Itis usuallysufficientto mount the diodes near the LM136-5.0 on the printedcircuitboard.The absolute resistanceofthenetworkisnotcriticaland any valuefrom2k to20k willwork.Because ofthewide adjustment range,fixedresistorsshouldbe connectedinserieswiththepottomake potsettinglesscritical. Figure14.LM136-5.0withPot forAdjustment of Figure15.Temperature CoefficientAdjustment Breakdown Voltage(TrimRange = ±1.0VTypical) (TrimRange = ±0.5VTypical) TypicalApplications *Adjustfor6.25VacrossR1 Figure16. PrecisionPower RegulatorwithLow Temperature Coefficient Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM136-5.0 LM236-5.0 LM336-5.0
SNVS750D –JUNE 1999–REVISED MARCH 2013 www.ti.com Figure17.5V Crowbar Figure18.AdjustableShunt Regulator Figure19.LinearOhmmeter Figure20.Op Amp withOutput Clamped Figure21.BipolarOutput Reference Figure22.5.0VSquare Wave Calibrator
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www.ti.com SNVS750D –JUNE 1999–REVISED MARCH 2013 Figure23.10V BufferedReference Figure24.Low Noise BufferedReference Figure25.Wide InputRange Reference Schematic Diagram Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM136-5.0 LM236-5.0 LM336-5.0
SNVS750D –JUNE 1999–REVISED MARCH 2013 www.ti.com
REVISION HISTORY
Changes from RevisionC (March 2013)toRevisionD Page
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www.ti.com 15-Jul-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM136-5.0-MW8 Active Production WAFERSALE (YS) | 0 1 | NOT REQUIRED - Call TI Level-1-NA-UNLIM -55 to 125 LM136AH-5.0 Active Production TO (NDV) | 3 1000 | BULK No Call TI Call TI -40 to 125 ( LM136AH5.0, LM13 6AH5.0) LM136AH-5.0/NOPB Active Production TO (NDV) | 3 1000 | BULK Yes Call TI Level-1-NA-UNLIM -40 to 125 ( LM136AH5.0, LM13 6AH5.0) LM136H-5.0 Active Production TO (NDV) | 3 1000 | BULK No Call TI Call TI -55 to 125 ( LM136H5.0, LM136 H5.0) LM136H-5.0/NOPB Active Production TO (NDV) | 3 1000 | BULK Yes Call TI Level-1-NA-UNLIM -55 to 125 ( LM136H5.0, LM136 H5.0) LM236AH-5.0/NOPB Active Production TO (NDV) | 3 1000 | BULK Yes Call TI Level-1-NA-UNLIM -55 to 125 ( LM236AH5.0, LM23 6AH5.0) LM236H-5.0 Active Production TO (NDV) | 3 1000 | BULK No Call TI Call TI -25 to 85 ( LM236H5.0, LM236 H5.0) LM236H-5.0/NOPB Active Production TO (NDV) | 3 1000 | BULK Yes Call TI Level-1-NA-UNLIM -25 to 85 ( LM236H5.0, LM236 H5.0) LM336-5 MWC Active Production WAFERSALE (YS) | 0 1 | NOT REQUIRED - Call TI Level-1-NA-UNLIM -40 to 85 LM336BM-5.0/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM336 BM5.0 LM336BM-5.0/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM336 BM5.0 LM336BMX-5.0/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM336 BM5.0 LM336BMX-5.0/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM336 BM5.0 LM336BZ-5.0/NOPB Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type 0 to 70 LM336 BZ5.0 LM336BZ-5.0/NOPB.B Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type 0 to 70 LM336 BZ5.0 LM336M-5.0/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM336 M5.0 LM336M-5.0/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM336 M5.0 Addendum-Page 1
www.ti.com 15-Jul-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM336MX-5.0/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM336 M5.0 LM336MX-5.0/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM336 M5.0 LM336Z-5.0/NOPB Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type 0 to 70 LM336 Z-5.0 LM336Z-5.0/NOPB.B Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type 0 to 70 LM336 Z-5.0 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM336BMX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM336MX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) LM336BM-5.0/NOPB D SOIC 8 95 495 8 4064 3.05 LM336BM-5.0/NOPB.B D SOIC 8 95 495 8 4064 3.05 LM336M-5.0/NOPB D SOIC 8 95 495 8 4064 3.05 LM336M-5.0/NOPB.B D SOIC 8 95 495 8 4064 3.05 Pack Materials-Page 3
www.ti.com PACKAGE OUTLINE 1.22 0.72 ( 2.54) 1.16 0.92 4.95 4.55 0.76 MAX 2.67 MAX UNCONTROLLED LEAD DIA
0.64 MAX
(MIL/AERO)
1.397 MAX
(COMMERCIAL)
12.7 MIN
3X 0.483 0.407 5.32-5.56 TO-CAN - 2.67 mm max heightNDV0003H TRANSISTOR OUTLINE 4219876/B 09/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-46. SCALE 1.250
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
( 1.2) METAL 2X ( 1.2) METAL 3X ( 0.7) VIA (R0.05) TYP (2.54) (1.27) TO-CAN - 2.67 mm max heightNDV0003H TRANSISTOR OUTLINE 4219876/B 09/2024 LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE:12X SOLDER MASK OPENING SOLDER MASK OPENING
www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800
www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM
www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5
www.ti.com PACKAGE OUTLINE 3X 2.67 2.03 5.21 4.44 5.34 4.32 2X 1.27 0.13 3X 0.55 0.38 4.19 3.17
3.43 MIN
3X 0.43 0.35 (2.54) NOTE 3 2X 2.9 2.4
4 MAX
0.076 MAX
(0.51) TYP (1.5) TYP TO-92 - 5.34 mm max heightLP0003A TO-92 4215214/C 04/2025 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Lead dimensions are not controlled within this area. 4. Reference JEDEC TO-226, variation AA. 5. Shipping method: a. Straight lead option available in bulk pack only. b. Formed lead option available in tape and reel or ammo pack. c. Specific products can be offered in limited combinations of shipping medium and lead options. d. Consult product folder for more information on available options. EJECTOR PIN OPTIONAL PLANE SEATING STRAIGHT LEAD OPTION 3 2 1 SCALE 1.200 FORMED LEAD OPTION OTHER DIMENSIONS IDENTICAL TO STRAIGHT LEAD OPTION SCALE 1.200
www.ti.com EXAMPLE BOARD LAYOUT
0.05 MAX
(1.07) (1.5) 2X (1.5) 2X (1.07) (1.27) (2.54) FULL R TYP ( 1.4)0.05 MAX ALL AROUND TYP (2.6) (5.2) (R0.05) TYP 3X ( 0.9) HOLE 2X ( 1.4) METAL 3X ( 0.85) HOLE (R0.05) TYP 4215214/C 04/2025 TO-92 - 5.34 mm max heightLP0003A TO-92 LAND PATTERN EXAMPLE FORMED LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING 1 2 3 LAND PATTERN EXAMPLE STRAIGHT LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X METAL TYP SOLDER MASK OPENING SOLDER MASK OPENING METAL 1 2 3
www.ti.com TAPE SPECIFICATIONS 19.0 17.5 13.7 11.7 11.0 8.5
0.5 MIN
3.7-4.3 TYP 9.75 8.50 2.9
2.4 TYP
6.75 5.95 13.0 12.4 (2.5) TYP 16.5 15.5 4215214/C 04/2025 TO-92 - 5.34 mm max heightLP0003A TO-92 FOR FORMED LEAD OPTION PACKAGE
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