LM130F LEIDITECH
Document overview
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Technical content
Features
Surface mount devices Withstanding high interrupt voltage Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Product Dimensions (mm) Part number A B C D E Marking system * Terminal materials: Tin-plated brass. * Lead-free devices are available, the right logo is lead-free mark of wayon.
Electrical Characteristics
IH IT Max. Time-to-trip Vmax Imax Pd typ Rmin Rmax R1max (A) (A) Current(A) Time(s) (V) (A) (W) (Ω) (Ω) (Ω) IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Max. Time-to-trip =Maximum time to trip(s) at assigned current. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. Rmax=Maximum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance at 25℃ one hour post trip. Thermal Derating Chart-IH(A) LM130F Maximum ambient operating temperatures(℃) -40 -20 0 25 40 50 60 70 85
Package Information
Bulk: 1000pcs per bag. Tape & Reel: 1500pcs per reel. LM Product family Current rating LM130F LM130F Rev : www.leiditech.com 1/2 01.06.2015
Specifications are subject to change without notice Solder Reflow Recommendations C A B B A Solder Pad Layouts Part number A B C (mm) (mm) (mm) LM130F 4.6 1.8 6.1 * Recommended reflow methods: IR, Vapor phase oven, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Moisture Sensitivity Level：1 Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requiremen Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : www.leiditech.com 2/2 01.06.2015