LM1117 800-mA, Low-Dropout Linear Regulator datasheet (Rev. Q)

Document overview

  • Manufacturer or author: Texas Instruments, Incorporated [SNOS412,Q]
  • PDF pages: 46

Technical content

LM1117 800-mA, Low-Dropout Linear Regulator

1 Features

  • For a newer drop-in alternative, see the TLV1117
  • For drop-in replacements in fixed output SOT-223 package configuration and improved functionality, see the TLV761
  • Available in 1.8 V, 2.5 V, 3.3 V, 5 V, and adjustable versions
  • Space-saving SOT-223 and WSON packages
  • Current limiting and thermal protection
  • Output current: 800 mA
  • Line regulation: 0.2% (maximum)
  • Load regulation: 0.4% (maximum)
  • Temperature range: – LM1117: 0°C to +125°C – LM1117I: –40°C to +125°C

2 Applications

  • AC drive power stage modules
  • Merchant network and server PSU
  • Industrial AC/DC
  • Ultrasound scanners
  • Servo drive control modules

3 Description

The LM1117 is a low dropout voltage regulator with a dropout of 1.2 V at 800 mA of load current. The LM1117 is available in an adjustable version, which can set the output voltage from 1.25 V to 13.8 V with only two external resistors. In addition, the device is available in five fixed voltages, 1.8 V, 2.5 V, 3.3 V, and 5 V. The LM1117 offers current limiting and thermal shutdown. The circuit includes a Zener trimmed band- gap reference to assure output voltage accuracy to within ±1%. A minimum of 10-µF tantalum capacitor is required at the output to improve the transient response and stability.

Package Information

PART NUMBER PACKAGE(1) BODY SIZE (NOM) LM1117, LM1117I DCY (SOT-223, 4) 6.50 mm × 3.50 mm NDE (TO-220, 3) 14.986 mm × 10.16 mm NDP (TO-252, 3) 6.58 mm × 6.10 mm NGN (WSON, 8) 4.00 mm × 4.00 mm KTT (TO-263, 3) 10.18 mm × 8.41 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Adjustable Output Regulator LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

10.2 Receiving Notification of Documentation Updates..22

11 Mechanical, Packaging, and Orderable

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision P (July 2022) to Revision Q (January 2023) Page Changes from Revision O (June 2020) to Revision P (July 2022) Page LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 www.ti.com

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5 Device Comparison Table

IOUT PARAMETER LM1117 TLV1117 UNIT 800 mA Input voltage range (max) 15 15 V Load regulation accuracy 1.6 1.6 % PSRR (120 Hz) 75 75 dB Recommended operating temperature 0 – 125 -40 – 125 °C SOT-223 TJA 61.6 104.3 °C/W TO-220 TJA 23.8 30.1 °C/W TO-252 TJA 45.1 50.9 °C/W TO-263 TJA 41.3 27.5 °C/W WSON-8 TJA 39.3 38.3 °C/W

6 Pin Configuration and Functions

Figure 6-1. DCY Package, 4-Pin SOT (Top View) Figure 6-2. NDE Package, 3-Pin TO-220 (Top View) Figure 6-3. KTT Package, 3-Pin TO-263 (Top View) Figure 6-4. NDP Package, 3-Pin TO-252 (Top View) NOT CONNECTED VOUT VOUT VOUT ADJ/GND VIN VIN VIN VOUT When using the WSON package pins 2, 3, and 4 must be connected together and pins 5, 6, and 7 must be connected together. Figure 6-5. NGN Package, 8-Pin WSON (Top View) Table 6-1. Pin Functions PIN I/O DESCRIPTION NAME TO-252 WSON SOT-223 TO-263 TO-220 ADJ/GND 1 1 1 1 1 — Adjust pin for adjustable output option. Ground pin for fixed output option. VIN 3 2, 3, 4 3 3 3 I Input voltage pin for the regulator VOUT 2 , TAB 5, 6, 7, TAB 2, 4 2, TAB 2, TAB O Output voltage pin for the regulator www.ti.com LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: LM1117

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Maximum input voltage (VIN to GND) 20 V Power dissipation(2) Internally Limited Junction temperature (TJ)(2) 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PCB.

7.2 ESD Ratings

V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±2000 V may actually have higher performance.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Input voltage (VIN to GND) 15 V Junction temperature (TJ)(1) LM1117 0 125 °C LM1117I −40 125 (1) The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PCB.

7.4 Thermal Information

THERMAL METRIC(1) LM1117, LM1117I UNITDCY (SOT-223) NDE (TO-220) NDP (TO-252) NGN (WSON) KTT (TO-263)

4 PINS 3 PINS 3 PINS 8 PINS 3 PINS

RθJC(bot) Junction-to-case (bottom) thermal resistance — 1.5 1.3 5.6 1.3 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report. LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 www.ti.com

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7.5 LM1117 Electrical Characteristics

unless otherwise specified, TJ = 25°C PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT VREF Reference voltage LM1117-ADJ IOUT = 10 mA, VIN – VOUT = 2 V, TJ = 25°C 1.238 1.25 1.262 VLM1117-ADJ 10 mA ≤ IOUT ≤ 800 mA, 1.4 V ≤ VIN – VOUT ≤ 10 V TJ = 25°C 1.25 over the junction temperature range 0°C to 125°C 1.225 1.27 VOUT Output voltage LM1117-1.8 IOUT = 10 mA, VIN = 3.8 V, TJ = 25°C 1.782 1.8 1.818 VLM1117-1.8 0 ≤ IOUT ≤ 800 mA, 3.2 V ≤ VIN ≤ 10 V TJ = 25°C 1.8 over the junction temperature range 0°C to 125°C 1.746 1.854 LM1117-2.5 IOUT = 10 mA, VIN = 4.5 V, TJ = 25°C 2.475 2.5 2.525 VLM1117-2.5 0 ≤ IOUT ≤ 800 mA, 3.9 V ≤ VIN ≤ 10 V TJ = 25°C 2.5 over the junction temperature range 0°C to 125°C 2.45 2.55 LM1117-3.3 IOUT = 10 mA, VIN = 5 V TJ = 25°C 3.267 3.3 3.333 VLM1117-3.3 0 ≤ IOUT ≤ 800 mA, 4.75 V ≤ VIN ≤ 10 V TJ = 25°C 3.3 over the junction temperature range 0°C to 125°C 3.235 3.365 LM1117-5.0 IOUT = 10 mA, VIN = 7 V, TJ = 25°C 4.95 5 5.05 VLM1117-5.0 0 ≤ IOUT ≤ 800 mA, 6.5 V ≤ VIN ≤ 12 V TJ = 25°C 5 over the junction temperature range 0°C to 125°C 4.9 5.1 ΔVOUT Line regulation(3) LM1117-ADJ IOUT = 10mA, 1.5V ≤ VIN-VOUT ≤ 13.75V TJ = 25°C 0.035% over the junction temperature range 0°C to 125°C 0.2% LM1117-1.8 IOUT = 0 mA, 3.2 V ≤ VIN ≤ 10 V TJ = 25°C 1 mVover the junction temperature range 0°C to 125°C 6 LM1117-2.5 IOUT = 0 mA, 3.9 V ≤ VIN ≤ 10 V TJ = 25°C 1 mVover the junction temperature range 0°C to 125°C 6 LM1117-3.3 IOUT = 0 mA, 4.75 V ≤ VIN ≤ 15 V TJ = 25°C 1 mVover the junction temperature range 0°C to 125°C 6 LM1117-5.0 IOUT = 0 mA, 6.5 V ≤ VIN ≤ 15 V TJ = 25°C 1 mVover the junction temperature range 0°C to 125°C 10 ΔVOUT Load regulation(3) LM1117-ADJ VIN – VOUT = 3 V, 10 ≤ IOUT ≤ 800 mA TJ = 25°C 0.2% over the junction temperature range 0°C to 125°C 0.4% LM1117-1.8 VIN = 3.2 V, 0 ≤ IOUT ≤ 800 mA TJ = 25°C 1 mVover the junction temperature range 0°C to 125°C 10 LM1117-2.5 VIN = 3.9 V, 0 ≤ IOUT ≤ 800 mA TJ = 25°C 1 mVover the junction temperature range 0°C to 125°C 10 LM1117-3.3 VIN = 4.75 V, 0 ≤ IOUT ≤ 800 mA TJ = 25°C 1 mVover the junction temperature range 0°C to 125°C 10 LM1117-5.0 VIN = 6.5 V, 0 ≤ IOUT ≤ 800 mA TJ = 25°C 1 mVover the junction temperature range 0°C to 125°C 15 www.ti.com LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: LM1117

7.5 LM1117 Electrical Characteristics (continued)

unless otherwise specified, TJ = 25°C PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT VIN – V OUT Dropout voltage(4) IOUT = 100 mA TJ = 25°C 1.1 Vover the junction temperature range 0°C to 125°C 1.2 IOUT = 500 mA TJ = 25°C 1.15 Vover the junction temperature range 0°C to 125°C 1.25 IOUT = 800 mA TJ = 25°C 1.2 Vover the junction temperature range 0°C to 125°C 1.3 ILIMIT Current limit VIN – VOUT = 5 V, TJ = 25°C 800 1200 1500 mA Minimum load current(5) LM1117-ADJ VIN = 15 V TJ = 25°C 1.7 mAover the junction temperature range 0°C to 125°C 5 Quiescent current LM1117-1.8 VIN ≤ 15 V TJ = 25°C 5 mAover the junction temperature range 0°C to 125°C 10 LM1117-2.5 VIN ≤ 15 V TJ = 25°C 5 mAover the junction temperature range 0°C to 125°C 10 LM1117-3.3 VIN ≤ 15 V TJ = 25°C 5 mAover the junction temperature range 0°C to 125°C 10 LM1117-5.0 VIN ≤ 15 V TJ = 25°C 5 mAover the junction temperature range 0°C to 125°C 10 Thermal regulation TA = 25°C, 30-ms pulse 0.01 0.1 %/W Ripple regulation fRIPPLE = 1 20 Hz, VIN – VOUT = 3 V VRIPPLE = 1 VPP TJ = 25°C 75 dBover the junction temperature range 0°C to 125°C 60 Adjust pin current TJ = 25°C 60 μA over the junction temperature range 0°C to 125°C 120 Adjust pin current change 10 ≤ IOUT ≤ 80 0mA,

1.4 V ≤ VIN – VOUT ≤ 10 V

TJ = 25°C 0.2 µAover the junction temperature range 0°C to 125°C 5 Temperature stability 0.5% Long term stability TA = 125°C, 1000 hours 0.3% RMS output noise (% of VOUT), 10 Hz ≤ f ≤ 10 kHz 0.003% (1) All limits are ensured by testing or statistical analysis. (2) Typical Values represent the most likely parametric normal. (3) Load and line regulation are measured at constant junction room temperature. (4) The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. This voltage is measured when the output voltage has dropped 100 mV from the nominal value obtained at VIN = VOUT + 1.5 V. (5) The minimum output current required to maintain regulation. LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 www.ti.com

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7.6 LM1117I Electrical Characteristics

unless otherwise specified, TJ = 25°C PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT VREF Reference voltage LM1117I-ADJ IOUT = 10 mA, VIN – VOUT = 2 V, TJ = 25°C 1.238 1.25 1.262 VLM1117I-ADJ 10 mA ≤ IOUT ≤ 800 mA, 1.4 V ≤ VIN – VOUT ≤ 10 V TJ = 25°C 1.25 over the junction temperature range – 40°C to 125°C 1.2 1.29 VOUT Output voltage LM1117I-3.3 IOUT = 10 mA, VIN = 5 V, TJ = 25°C 3.267 3.3 3.333 VLM1117I-3.3 0 ≤ IOUT ≤ 800 mA, 4.75 V ≤ VIN ≤ 10 V TJ = 25°C 3.3 over the junction temperature range – 40°C to 125°C 3.168 3.432 LM1117I-5.0 IOUT = 10 mA, VIN = 7 V, TJ = 25°C 4.95 5 5.05 VLM1117I-5.0 0 ≤ IOUT ≤ 800 mA, 6.5 V ≤ VIN ≤ 12 V TJ = 25°C 5 over the junction temperature range – 40°C to 125°C 4.8 5.2 ΔVOUT Line regulation(3) LM1117I-ADJ IOUT = 10 mA, 1.5 V ≤ VIN – VOUT ≤ 13.75 V TJ = 25°C 0.035% over the junction temperature range – 40°C to 125°C 0.3% LM1117I-3.3 IOUT = 0 mA, 4.75 V ≤ VIN ≤ 15 V TJ = 25°C 1 mVover the junction temperature range – 40°C to 125°C LM1117I-5.0 IOUT = 0 mA, 6.5 V ≤ VIN ≤ 15 V TJ = 25°C 1 mVover the junction temperature range – 40°C to 125°C ΔVOUT Load regulation(3) LM1117I-ADJ VIN – VOUT = 3 V, 10 ≤ IOUT ≤ 800 mA TJ = 25°C 0.2% over the junction temperature range – 40°C to 125°C 0.5% LM1117I-3.3 VIN = 4.75 V, 0 ≤ IOUT ≤ 800 mA TJ = 25°C 1 mVover the junction temperature range – 40°C to 125°C LM1117I-5.0 VIN = 6.5 V, 0 ≤ IOUT ≤ 800 mA TJ = 25°C 1 mVover the junction temperature range – 40°C to 125°C www.ti.com LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: LM1117

7.6 LM1117I Electrical Characteristics (continued)

unless otherwise specified, TJ = 25°C PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT VIN-V OUT Dropout voltage(4) IOUT = 100 mA TJ = 25°C 1.1 Vover the junction temperature range – 40°C to 125°C 1.3 IOUT = 500 mA TJ = 25°C 1.15 Vover the junction temperature range – 40°C to 125°C 1.35 IOUT = 800 mA TJ = 25°C 1.2 Vover the junction temperature range – 40°C to 125°C 1.4 ILIMIT Current limit VIN – VOUT = 5 V, TJ = 25°C 800 1200 1500 mA Minimum load current(5) LM1117I-ADJ VIN = 15 V TJ = 25°C 1.7 mAover the junction temperature range – 40°C to 125°C Quiescent current LM1117I-3.3 VIN ≤ 15 V TJ = 25°C 5 mAover the junction temperature range – 40°C to 125°C LM1117I-5.0 VIN ≤ 15 V TJ = 25°C 5 mAover the junction temperature range – 40°C to 125°C Thermal regulation TA = 25°C, 30-ms pulse 0.01 0.1 %/W Ripple regulation fRIPPLE = 120 Hz, VIN – VOUT = 3 V VRIPPLE = 1 VPP TJ = 25°C 75 dBover the junction temperature range – 40°C to 125°C Adjust pin current TJ = 25°C 60 μA over the junction temperature range –40°C to 125°C 120 Adjust pin current change 10 ≤ IOUT ≤ 800 mA, TJ = 25°C 0.2 µAover the junction temperature range – 40°C to 125°C Temperature stability 0.5% Long term stability TA = 125°C, 1000 hours 0.3% RMS output noise (% of VOUT), 10 Hz ≤ f ≤ 10 kHz 0.003% (1) All limits are ensured by testing or statistical analysis. (2) Typical Values represent the most likely parametric normal. (3) Load and line regulation are measured at constant junction room temperature. (4) The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. This voltage is measured when the output voltage has dropped 100 mV from the nominal value obtained at VIN = VOUT + 1.5 V. (5) The minimum output current required to maintain regulation. LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 www.ti.com

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7.7 Typical Characteristics

Figure 7-1. Dropout Voltage (VIN – VOUT) Figure 7-2. Short-Circuit Current Figure 7-3. Load Regulation Figure 7-4. LM1117-ADJ Ripple Rejection Figure 7-5. LM1117-ADJ Ripple Rejection vs Current Figure 7-6. Temperature Stability www.ti.com LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: LM1117

7.7 Typical Characteristics (continued)

Figure 7-7. Adjust Pin Current Figure 7-8. LM1117-5.0 Load Transient Response Figure 7-9. LM1117-5.0 Line Transient Response LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 www.ti.com

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8 Detailed Description

8.1 Overview

The LM1117 adjustable version develops a 1.25-V reference voltage, V REF, between the output and the adjust pin. As shown in Figure 8-1, this voltage is applied across resistor R1 to generate a constant current I1. The current IADJ from the adjust pin can introduce error to the output, but because this current is very small (60 μA) compared to the I1 and very constant with line and load changes, the error can be ignored. The constant current I1 then flows through the output set resistor R2 and sets the output voltage to the desired level. For fixed voltage devices, R1 and R2 are integrated inside the devices. Figure 8-1. Basic Adjustable Regulator

8.2 Functional Block Diagram

8.3 Feature Description

8.3.1 Load Regulation

The LM1117 regulates the voltage that appears between the output and ground pins, or between the output and adjust pins. In some cases, line resistances can introduce errors to the voltage across the load. To obtain the best load regulation, a few precautions are needed. Figure 8-2 illustrates a typical application using a fixed output regulator. The Rt1 and Rt2 are the line resistances. Obviously the V LOAD is less than the V OUT by the sum of the voltage drops along the line resistances. In this case, the load regulation at the R LOAD is degraded from the data sheet specification. To improve this degradation, the load must be tied directly to the output terminal on the positive side and directly tied to the ground terminal on the negative side. www.ti.com LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: LM1117

Figure 8-2. Typical Application Using Fixed Output Regulator When the adjustable regulator is used ( Figure 8-3), the best performance is obtained with the positive side of the resistor R1 tied directly to the output terminal of the regulator rather than near the load. This eliminates line drops from appearing effectively in series with the reference and degrading regulation. For example, a 5-V regulator with 0.05- Ω resistance between the regulator and load has a load regulation resulting from the line resistance of 0.05 Ω × IL. If R1 (= 125 Ω) is connected near the load, the effective line resistance is 0.05 Ω (1 + R2 / R1) or in this case, four times worse. In addition, the ground side of the resistor R2 can be returned near the ground of the load to provide remote ground sensing and improve load regulation. Figure 8-3. Best Load Regulation Using Adjustable Output Regulator LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 www.ti.com

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8.4 Device Functional Modes

8.4.1 Protection Diodes

Under normal operation, the LM1117 regulators do not need any protection diode. With the adjustable device, the internal resistance between the adjust and output terminals limits the current. No diode is needed to divert the current around the regulator even with capacitor on the adjust terminal. The adjust pin can take a transient signal of ±25V with respect to the output voltage without damaging the device. When a output capacitor is connected to a regulator and the input is shorted to ground, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage of the regulator, and rate of decrease of VIN. In the LM1117 regulators, the internal diode between the output and input pins can withstand microsecond surge currents of 10A to 20A. With an extremely large output capacitor (≥1000 µF), and with input instantaneously shorted to ground, the regulator could be damaged. In this case, an external diode is recommended between the output and input pins to protect the regulator, as shown in Figure 8-4. Figure 8-4. Regulator With Protection Diode www.ti.com LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: LM1117

9 Application and Implementation

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

9.1 Application Information

The LM1117 is a versatile and high performance linear regulator with a wide temperature range and tight line/ load regulation operation. An output capacitor is required to further improve transient response and stability. For the adjustable option, the ADJ pin can also be bypassed to achieve very high ripple-rejection ratios. The LM1117 is versatile in its applications, including being used as a post regulator for DC/DC converters, battery chargers, and microprocessor supplies.

9.2 Typical Application

Figure 9-1. 1.25-V to 10-V Adjustable Regulator With Improved Ripple Rejection

9.2.1 Design Requirements

The device component count is very minimal, employing two resistors as part of a voltage divider circuit and an output capacitor for load regulation. A 10- μF tantalum on the input is a suitable input capacitor for almost all applications. An optional bypass capacitor across R2 can also be used to improve PSRR. See the Recommended Operating Conditions table for more information.

9.2.2 Detailed Design Procedure

The output voltage is set based on the selection of the two resistors, R1 and R2, as shown in Figure 9-1. For details on capacitor selection, see the External Capacitors section.

9.2.2.1 External Capacitors

9.2.2.1.1 Input Bypass Capacitor

An input capacitor is recommended. A 10-µF tantalum on the input is a suitable input capacitor for almost all applications.

9.2.2.1.2 Adjust Terminal Bypass Capacitor

The adjust terminal can be bypassed to ground with a bypass capacitor (C ADJ) to improve ripple rejection. This bypass capacitor prevents ripple from being amplified as the output voltage is increased. At any ripple frequency, the impedance of the CADJ must be less than R1 to prevent the ripple from being amplified: LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 www.ti.com

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1 / (2π × fRIPPLE × CADJ) < R1 (1) The R1 is the resistor between the output and the adjust pin. The value is normally in the range of 100 Ω to 200 Ω. For example, with R1 = 124 Ω and fRIPPLE = 120 Hz, the CADJ must be > 11µF.

9.2.2.1.3 Output Capacitor

The output capacitor is critical in maintaining regulator stability, and must meet the required conditions for both minimum amount of capacitance and equivalent series resistance (ESR). The minimum output capacitance required by the LM1117 is 10 µF, if a tantalum capacitor is used. Any increase of the output capacitance will merely improve the loop stability and transient response. The ESR of the output capacitor should range between 0.3 Ω to 22 Ω. In the case of the adjustable regulator, when the CADJ is used, a larger output capacitance (22-µF tantalum) is required.

9.2.3 Application Curve

As shown in Figure 9-2, the dropout voltage will vary with output current and temperature. Care should be taken during design to ensure the dropout voltage requirement is met across the entire operating temperature and output current range. Figure 9-2. Dropout Voltage (VIN – VOUT) www.ti.com LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: LM1117

9.3 System Examples

Several circuits can be realized with the LM1117. The circuit diagrams in this section demonstrate multiple system examples that can be utilized in many applications. Figure 9-3. Fixed Output Regulator Figure 9-4. Adjusting Output of Fixed Regulators Figure 9-5. Regulator With Reference Figure 9-6. 5-V Logic Regulator With Electronic Shutdown* Figure 9-7. Battery Backed-Up Regulated Supply Figure 9-8. Low Dropout Negative Supply LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 www.ti.com

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9.4 Power Supply Recommendations

The input supply to the LM1117 must be kept at a voltage level such that the maximum rating is not exceeded. The minimum dropout voltage must also be met with extra headroom when possible to keep the LM1117 in regulation. An input capacitor is recommended. For more information regarding capacitor selection, see the External Capacitors section.

9.5 Layout

9.5.1 Layout Guidelines

Some layout guidelines must be followed to ensure proper regulation of the output voltage with minimum noise. Traces carrying the load current must be wide to reduce the amount of parasitic trace inductance and the feedback loop from V OUT to ADJ must be kept as short as possible. To improve PSRR, a bypass capacitor can be placed at the ADJ pin and must be located as close as possible to the IC. In cases when V IN shorts to ground, an external diode must be placed from V OUT to VIN to divert the surge current from the output capacitor and protect the IC. The diode must be placed close to the corresponding IC pins to increase their effectiveness.

9.5.1.1 Heat Sink Requirements

When an integrated circuit operates with an appreciable current, the junction temperature is elevated. The thermal limits must be quantified in order to achieve acceptable performance and reliability. This limit is determined by summing the individual parts consisting of a series of temperature rises from the semiconductor junction to the operating environment. A one-dimensional steady-state model of conduction heat transfer is demonstrated in Figure 9-9. The heat generated at the device junction flows through the die to the die attach pad, through the lead frame to the surrounding case material, to the printed circuit board, and eventually to the ambient environment. Below is a list of variables that may affect the thermal resistance and in turn the need for a heat sink. Table 9-1. Component and Application Variables RθJC (COMPONENT VARIABLES) RθJA (Application Variables) Lead frame size and material Mounting pad size, material, and location No. of conduction pins Placement of mounting pad Die size PCB size and material Die attach material Traces length and width Molding compound size and material Adjacent heat sources Volume of air Ambient temperature Shape of mounting pad The case temperature is measured at the point where the leads contact with the mounting pad surface Figure 9-9. Cross-Sectional View of Integrated Circuit Mounted on a Printed Circuit Board www.ti.com LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: LM1117

The LM1117 regulators have internal thermal shutdown to protect the device from over-heating. Under all possible operating conditions, the junction temperature of the LM1117 must be within the range of 0°C to +125°C. A heat sink can be required depending on the maximum power dissipation and maximum ambient temperature of the application. To determine if a heat sink is needed, the power dissipated by the regulator, P D , must be calculated: IIN = IL + IG (2) PD = (VIN-VOUT)I L + VINIG (3) Figure 9-10 shows the voltages and currents which are present in the circuit. Figure 9-10. Power Dissipation Diagram The next parameter which must be calculated is the maximum allowable temperature rise, TR(max): TR(max) = TJ(max)-TA(max) (4) where

  • TJ(max) is the maximum allowable junction temperature (125°C) which is encountered in the application
  • TA(max) is the maximum ambient temperature which is encountered in the application Using the calculated values for T R(max) and P D, the maximum allowable value for the junction-to-ambient thermal resistance (RθJA) can be calculated: RθJA = TR(max) / PD (5) For the maximum allowable value for θJA, see the Thermal Information table. As a design aid, Table 9-2 shows the value of the θJA of SOT-223 and TO-252 for different heat sink area. Figure 9-11 and Figure 9-12 reflects the same test results as what are in the Table 9-2 Figure 9-13 and Figure 9-14 shows the maximum allowable power dissipation vs. ambient temperature for the SOT-223 and TO-252 device. Figure 9-15 and Figure 9-16 shows the maximum allowable power dissipation vs. copper area (in2) for the SOT-223 and TO-252 devices. Please see AN1028 for power enhancement techniques to be used with SOT-223 and TO-252 packages. The AN-1187 Leadless Leadframe Package (LLP) application note discusses improved thermal performance and power dissipation for the WSON. Table 9-2. RθJA Different Heat Sink Area LAYOUT COPPER AREA THERMAL RESISTANCE Top Side (in2)(1) Bottom Side (in2) (θJA,°C/W) SOT-223 (θJA,°C/W) TO-252 1 0.0123 0 136 103 2 0.066 0 123 87 3 0.3 0 84 60 4 0.53 0 75 54 5 0.76 0 69 52 6 1 0 66 47 7 0 0.2 115 84 LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 www.ti.com

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Product Folder Links: LM1117

Figure 9-15. Maximum Allowable Power Dissipation vs 1-oz Copper Area for SOT-223 Figure 9-16. Maximum Allowable Power Dissipation vs 2-oz Copper Area for TO-252 Figure 9-17. Top View of the Thermal Test Pattern in Actual Scale LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 www.ti.com

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Figure 9-18. Bottom View of the Thermal Test Pattern in Actual Scale

9.5.2 Layout Example

Figure 9-19. Layout Example (SOT-223) www.ti.com LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: LM1117

10 Device and Documentation Support

10.1 Documentation Support

10.1.1 Related Documentation

For related documentation see the following: Texas Instruments, AN-1187 Leadless Leadframe Package (LLP) application note

10.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

10.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

10.4 Trademarks

TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

10.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

10.6 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. LM1117 SNOS412Q – FEBRUARY 2000 – REVISED JANUARY 2023 www.ti.com

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www.ti.com 8-Jun-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM1117DT-1.8/NOPB Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-1.8 LM1117DT-1.8/NOPB.B Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-1.8 LM1117DT-2.5/NOPB Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-2.5 LM1117DT-2.5/NOPB.B Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-2.5 LM1117DT-3.3/NOPB Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-3.3 LM1117DT-3.3/NOPB.B Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-3.3 LM1117DT-5.0/NOPB Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-5.0 LM1117DT-5.0/NOPB.B Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-5.0 LM1117DT-ADJ/NOPB Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-ADJ LM1117DT-ADJ/NOPB.B Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-ADJ LM1117DTX-1.8/NOPB Active Production TO-252 (NDP) | 3 2500 | LARGE T&R Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-1.8 LM1117DTX-1.8/NOPB.B Active Production TO-252 (NDP) | 3 2500 | LARGE T&R Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-1.8 LM1117DTX-2.5/NOPB Active Production TO-252 (NDP) | 3 2500 | LARGE T&R Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-2.5 LM1117DTX-2.5/NOPB.B Active Production TO-252 (NDP) | 3 2500 | LARGE T&R Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-2.5 LM1117DTX-3.3/NOPB Active Production TO-252 (NDP) | 3 2500 | LARGE T&R Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-3.3 LM1117DTX-3.3/NOPB.B Active Production TO-252 (NDP) | 3 2500 | LARGE T&R Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-3.3 Addendum-Page 1

www.ti.com 8-Jun-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM1117DTX-5.0/NOPB Active Production TO-252 (NDP) | 3 2500 | LARGE T&R Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-5.0 LM1117DTX-5.0/NOPB.B Active Production TO-252 (NDP) | 3 2500 | LARGE T&R Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-5.0 LM1117DTX-ADJ/NOPB Active Production TO-252 (NDP) | 3 2500 | LARGE T&R Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-ADJ LM1117DTX-ADJ/NOPB.B Active Production TO-252 (NDP) | 3 2500 | LARGE T&R Yes SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-ADJ LM1117IDT-3.3/NOPB Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-3.3 LM1117IDT-3.3/NOPB.B Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-3.3 LM1117IDT-5.0/NOPB Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-5.0 LM1117IDT-5.0/NOPB.B Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-5.0 LM1117IDT-ADJ/NOPB Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-ADJ LM1117IDT-ADJ/NOPB.B Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-ADJ LM1117IDTX-3.3/NOPB Active Production TO-252 (NDP) | 3 2500 | LARGE T&R Yes SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-3.3 LM1117IDTX-5.0/NOPB Active Production TO-252 (NDP) | 3 2500 | LARGE T&R Yes SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-5.0 LM1117IDTX-ADJ/NOPB Active Production TO-252 (NDP) | 3 2500 | LARGE T&R Yes SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-ADJ LM1117ILD-ADJ/NOPB Active Production WSON (NGN) | 8 1000 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 125 1117IAD LM1117ILD-ADJ/NOPB.B Active Production WSON (NGN) | 8 1000 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 125 1117IAD LM1117IMP-3.3/NOPB Active Production SOT-223 (DCY) | 4 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 N05B LM1117IMP-3.3/NOPB.B Active Production SOT-223 (DCY) | 4 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 N05B LM1117IMP-5.0/NOPB Active Production SOT-223 (DCY) | 4 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 N06B LM1117IMP-5.0/NOPB.B Active Production SOT-223 (DCY) | 4 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 N06B LM1117IMP-ADJ/NOPB Active Production SOT-223 (DCY) | 4 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 N03B LM1117IMP-ADJ/NOPB.B Active Production SOT-223 (DCY) | 4 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 N03B Addendum-Page 2

www.ti.com 8-Jun-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM1117IMPX-3.3/NOPB Active Production SOT-223 (DCY) | 4 2000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 N05B LM1117IMPX-5.0/NOPB Active Production SOT-223 (DCY) | 4 2000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 N06B LM1117IMPX-ADJ/NOPB Active Production SOT-223 (DCY) | 4 2000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 N03B LM1117LD-1.8/NOPB Active Production WSON (NGN) | 8 1000 | SMALL T&R Yes SN Level-3-260C-168 HR 0 to 125 1117-18 LM1117LD-1.8/NOPB.B Active Production WSON (NGN) | 8 1000 | SMALL T&R Yes SN Level-3-260C-168 HR 0 to 125 1117-18 LM1117LD-2.5/NOPB Active Production WSON (NGN) | 8 1000 | SMALL T&R Yes SN Level-3-260C-168 HR 0 to 125 1117-25 LM1117LD-2.5/NOPB.B Active Production WSON (NGN) | 8 1000 | SMALL T&R Yes SN Level-3-260C-168 HR 0 to 125 1117-25 LM1117LD-3.3/NOPB Active Production WSON (NGN) | 8 1000 | SMALL T&R Yes SN Level-3-260C-168 HR 0 to 125 1117-33 LM1117LD-3.3/NOPB.B Active Production WSON (NGN) | 8 1000 | SMALL T&R Yes SN Level-3-260C-168 HR 0 to 125 1117-33 LM1117LD-ADJ/NOPB Active Production WSON (NGN) | 8 1000 | SMALL T&R Yes SN Level-3-260C-168 HR 0 to 125 1117ADJ LM1117LD-ADJ/NOPB.B Active Production WSON (NGN) | 8 1000 | SMALL T&R Yes SN Level-3-260C-168 HR 0 to 125 1117ADJ LM1117LDX-1.8/NOPB Active Production WSON (NGN) | 8 4500 | LARGE T&R Yes SN Level-3-260C-168 HR 0 to 125 1117-18 LM1117LDX-1.8/NOPB.B Active Production WSON (NGN) | 8 4500 | LARGE T&R Yes SN Level-3-260C-168 HR 0 to 125 1117-18 LM1117LDX-ADJ/NOPB Active Production WSON (NGN) | 8 4500 | LARGE T&R Yes SN Level-3-260C-168 HR 0 to 125 1117ADJ LM1117LDX-ADJ/NOPB.B Active Production WSON (NGN) | 8 4500 | LARGE T&R Yes SN Level-3-260C-168 HR 0 to 125 1117ADJ LM1117MP-1.8/NOPB Active Production SOT-223 (DCY) | 4 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM 0 to 125 N12A LM1117MP-1.8/NOPB.B Active Production SOT-223 (DCY) | 4 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM 0 to 125 N12A LM1117MP-2.5/NOPB Active Production SOT-223 (DCY) | 4 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM 0 to 125 N13A LM1117MP-2.5/NOPB.B Active Production SOT-223 (DCY) | 4 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM 0 to 125 N13A LM1117MP-3.3/NOPB Active Production SOT-223 (DCY) | 4 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM 0 to 125 N05A LM1117MP-3.3/NOPB.B Active Production SOT-223 (DCY) | 4 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM 0 to 125 N05A LM1117MP-5.0/NOPB Active Production SOT-223 (DCY) | 4 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM 0 to 125 N06A LM1117MP-5.0/NOPB.B Active Production SOT-223 (DCY) | 4 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM 0 to 125 N06A LM1117MP-ADJ/NOPB Active Production SOT-223 (DCY) | 4 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM 0 to 125 N03A LM1117MP-ADJ/NOPB.B Active Production SOT-223 (DCY) | 4 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM 0 to 125 N03A LM1117MPX-1.8/NOPB Active Production SOT-223 (DCY) | 4 2000 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 125 N12A LM1117MPX-1.8/NOPB.B Active Production SOT-223 (DCY) | 4 2000 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 125 N12A LM1117MPX-2.5/NOPB Active Production SOT-223 (DCY) | 4 2000 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 125 N13A LM1117MPX-2.5/NOPB.B Active Production SOT-223 (DCY) | 4 2000 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 125 N13A LM1117MPX-3.3/NOPB Active Production SOT-223 (DCY) | 4 2000 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 125 N05A LM1117MPX-3.3/NOPB.B Active Production SOT-223 (DCY) | 4 2000 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 125 N05A Addendum-Page 3

www.ti.com 8-Jun-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM1117MPX-5.0/NOPB Active Production SOT-223 (DCY) | 4 2000 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 125 N06A LM1117MPX-5.0/NOPB.B Active Production SOT-223 (DCY) | 4 2000 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 125 N06A LM1117MPX-ADJ/NOPB Active Production SOT-223 (DCY) | 4 2000 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 125 N03A LM1117MPX-ADJ/NOPB.B Active Production SOT-223 (DCY) | 4 2000 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 125 N03A LM1117S-ADJ/NOPB Active Production DDPAK/ TO-263 (KTT) | 3 45 | TUBE ROHS Exempt SN Level-3-245C-168 HR 0 to 125 LM1117S ADJ LM1117S-ADJ/NOPB.B Active Production DDPAK/ TO-263 (KTT) | 3 45 | TUBE ROHS Exempt SN Level-3-245C-168 HR 0 to 125 LM1117S ADJ LM1117SX-3.3/NOPB Active Production DDPAK/ TO-263 (KTT) | 3 500 | LARGE T&R ROHS Exempt SN Level-3-245C-168 HR 0 to 125 LM1117S 3.3 LM1117SX-3.3/NOPB.B Active Production DDPAK/ TO-263 (KTT) | 3 500 | LARGE T&R ROHS Exempt SN Level-3-245C-168 HR 0 to 125 LM1117S 3.3 LM1117SX-5.0/NOPB Active Production DDPAK/ TO-263 (KTT) | 3 500 | LARGE T&R ROHS Exempt SN Level-3-245C-168 HR 0 to 125 LM1117S 5.0 LM1117SX-5.0/NOPB.B Active Production DDPAK/ TO-263 (KTT) | 3 500 | LARGE T&R ROHS Exempt SN Level-3-245C-168 HR 0 to 125 LM1117S 5.0 LM1117SX-ADJ/NOPB Active Production DDPAK/ TO-263 (KTT) | 3 500 | LARGE T&R ROHS Exempt SN Level-3-245C-168 HR 0 to 125 LM1117S ADJ LM1117SX-ADJ/NOPB.B Active Production DDPAK/ TO-263 (KTT) | 3 500 | LARGE T&R ROHS Exempt SN Level-3-245C-168 HR 0 to 125 LM1117S ADJ LM1117T-2.5/NOPB Active Production TO-220 (NDE) | 3 45 | TUBE Yes SN Level-1-NA-UNLIM 0 to 125 LM1117T 2.5 LM1117T-2.5/NOPB.B Active Production TO-220 (NDE) | 3 45 | TUBE Yes SN Level-1-NA-UNLIM 0 to 125 LM1117T 2.5 LM1117T-3.3/NOPB Active Production TO-220 (NDE) | 3 45 | TUBE Yes SN Level-1-NA-UNLIM 0 to 125 LM1117T 3.3 LM1117T-3.3/NOPB.B Active Production TO-220 (NDE) | 3 45 | TUBE Yes SN Level-1-NA-UNLIM 0 to 125 LM1117T 3.3 LM1117T-5.0/NOPB Active Production TO-220 (NDE) | 3 45 | TUBE Yes SN Level-1-NA-UNLIM 0 to 125 LM1117T 5.0 LM1117T-5.0/NOPB.B Active Production TO-220 (NDE) | 3 45 | TUBE Yes SN Level-1-NA-UNLIM 0 to 125 LM1117T 5.0 LM1117T-ADJ/NOPB Active Production TO-220 (NDE) | 3 45 | TUBE Yes SN Level-1-NA-UNLIM 0 to 125 LM1117T ADJ Addendum-Page 4

www.ti.com 8-Jun-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM1117T-ADJ/NOPB.B Active Production TO-220 (NDE) | 3 45 | TUBE Yes SN Level-1-NA-UNLIM 0 to 125 LM1117T ADJ (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM1117 :

  • Automotive : LM1117-Q1 NOTE: Qualified Version Definitions: Addendum-Page 5

www.ti.com 8-Jun-2026

  • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 6

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant LM1117SX-3.3/NOPB DDPAK/ TO-263 LM1117SX-5.0/NOPB DDPAK/ TO-263 LM1117SX-ADJ/NOPB DDPAK/ TO-263 Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM1117DTX-1.8/NOPB TO-252 NDP 3 2500 356.0 356.0 36.0 LM1117DTX-2.5/NOPB TO-252 NDP 3 2500 356.0 356.0 36.0 LM1117DTX-3.3/NOPB TO-252 NDP 3 2500 356.0 356.0 36.0 LM1117DTX-5.0/NOPB TO-252 NDP 3 2500 356.0 356.0 36.0 LM1117DTX-ADJ/NOPB TO-252 NDP 3 2500 356.0 356.0 36.0 LM1117IDTX-3.3/NOPB TO-252 NDP 3 2500 356.0 356.0 36.0 LM1117IDTX-5.0/NOPB TO-252 NDP 3 2500 356.0 356.0 36.0 LM1117IDTX-ADJ/NOPB TO-252 NDP 3 2500 356.0 356.0 36.0 LM1117ILD-ADJ/NOPB WSON NGN 8 1000 208.0 191.0 35.0 LM1117IMP-3.3/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117IMP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117IMP-ADJ/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117IMPX-3.3/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117IMPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117IMPX-ADJ/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117LD-1.8/NOPB WSON NGN 8 1000 208.0 191.0 35.0 LM1117LD-2.5/NOPB WSON NGN 8 1000 208.0 191.0 35.0 LM1117LD-3.3/NOPB WSON NGN 8 1000 208.0 191.0 35.0 Pack Materials-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM1117LD-ADJ/NOPB WSON NGN 8 1000 208.0 191.0 35.0 LM1117LDX-1.8/NOPB WSON NGN 8 4500 356.0 356.0 36.0 LM1117LDX-ADJ/NOPB WSON NGN 8 4500 356.0 356.0 36.0 LM1117MP-1.8/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117MP-2.5/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117MP-3.3/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117MP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117MP-ADJ/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117MPX-1.8/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117MPX-2.5/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117MPX-3.3/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117MPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117MPX-ADJ/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117SX-3.3/NOPB DDPAK/TO-263 KTT 3 500 356.0 356.0 45.0 LM1117SX-5.0/NOPB DDPAK/TO-263 KTT 3 500 356.0 356.0 45.0 LM1117SX-ADJ/NOPB DDPAK/TO-263 KTT 3 500 356.0 356.0 45.0 Pack Materials-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) LM1117DT-1.8/NOPB NDP TO-252 3 75 508 20 4165.6 3.1 LM1117DT-1.8/NOPB.B NDP TO-252 3 75 508 20 4165.6 3.1 LM1117DT-2.5/NOPB NDP TO-252 3 75 508 20 4165.6 3.1 LM1117DT-2.5/NOPB.B NDP TO-252 3 75 508 20 4165.6 3.1 LM1117DT-3.3/NOPB NDP TO-252 3 75 508 20 4165.6 3.1 LM1117DT-3.3/NOPB.B NDP TO-252 3 75 508 20 4165.6 3.1 LM1117DT-5.0/NOPB NDP TO-252 3 75 508 20 4165.6 3.1 LM1117DT-5.0/NOPB.B NDP TO-252 3 75 508 20 4165.6 3.1 LM1117DT-ADJ/NOPB NDP TO-252 3 75 508 20 4165.6 3.1 LM1117DT-ADJ/NOPB.B NDP TO-252 3 75 508 20 4165.6 3.1 LM1117IDT-3.3/NOPB NDP TO-252 3 75 508 20 4165.6 3.1 LM1117IDT-3.3/NOPB.B NDP TO-252 3 75 508 20 4165.6 3.1 LM1117IDT-5.0/NOPB NDP TO-252 3 75 508 20 4165.6 3.1 LM1117IDT-5.0/NOPB.B NDP TO-252 3 75 508 20 4165.6 3.1 LM1117IDT-ADJ/NOPB NDP TO-252 3 75 508 20 4165.6 3.1 LM1117IDT-ADJ/NOPB.B NDP TO-252 3 75 508 20 4165.6 3.1 LM1117S-ADJ/NOPB KTT TO-263 3 45 502 25 8204.2 9.19 LM1117S-ADJ/NOPB.B KTT TO-263 3 45 502 25 8204.2 9.19 LM1117T-2.5/NOPB NDE TO-220 3 45 502 33 6985 4.06 LM1117T-2.5/NOPB.B NDE TO-220 3 45 502 33 6985 4.06 LM1117T-3.3/NOPB NDE TO-220 3 45 502 33 6985 4.06 LM1117T-3.3/NOPB.B NDE TO-220 3 45 502 33 6985 4.06 LM1117T-5.0/NOPB NDE TO-220 3 45 502 33 6985 4.06 LM1117T-5.0/NOPB.B NDE TO-220 3 45 502 33 6985 4.06 LM1117T-ADJ/NOPB NDE TO-220 3 45 502 33 6985 4.06 LM1117T-ADJ/NOPB.B NDE TO-220 3 45 502 33 6985 4.06 Pack Materials-Page 5

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www.ti.com PACKAGE OUTLINE C 0 -8 0.25 GAGE PLANE 2.24 1.24 0 -8 2.24 1.24 1.32 1.22

1.27 MAX

2X 2.54 4.64 4.45

5.08 MIN

3X0.97 0.71

14.35 MAX

0.76 0.38 0.25 0.00 B 8.64 A 10.41 9.91 0.25 GAGE PLANE 4215105/C 08/2024 TO-263 - 4.83 mm max heightKTT0003B TRANSISTOR OUTLINE NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Features may not exist and shape may vary per different assembly sites. 4. Reference JEDEC registration TO-263, except minimum lead thickness and minimum exposed pad length.

0.25 C A B

SCALE 1.000

www.ti.com EXAMPLE BOARD LAYOUT (6.99) (14.17) (1.91) (8.33)

0.07 MAX

0.07 MIN

(10.8) 3X (2.16) 3X (1.07) (2.54) (R0.05) TYP 4215105/C 08/2024 TO-263 - 4.83 mm max heightKTT0003B TRANSISTOR OUTLINE LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:5X SYMM NOTES: (continued) 5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers 6. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented. OPENING SOLDER MASK METAL NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL SOLDER MASK OPENING SOLDER MASK METAL UNDER SOLDER MASK DEFINED EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN 14.17 (4.515) (0.91)(1.29) TYP (1.29) (1.29) TYP (2.54) 3X (2.16)3X (1.07) (R0.05) TYP 32X ( 1.09) 4215105/C 08/2024 TO-263 - 4.83 mm max heightKTT0003B TRANSISTOR OUTLINE NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 60% PRINTED SOLDER COVERAGE BY AREA SCALE:6X SYMM EXPOSED METAL TYP

MPDS094A – APRIL 2001 – REVISED JUNE 2002 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 4202506/B 06/2002 6,30 (0.248) 6,70 (0.264) 2,90 (0.114) 3,10 (0.122) 6,70 (0.264) 3,30 (0.130) 0,02 (0.0008) 0,10 (0.0040) 1,50 (0.059) 1,70 (0.067) 0,23 (0.009) 0,35 (0.014) 1 2 3 0,66 (0.026) 0,84 (0.033) 1,80 (0.071) MAX Seating Plane 0°–10° Gauge Plane 0,75 (0.030) MIN 0,25 (0.010) 0,08 (0.003) 0,10 (0.004) M 2,30 (0.091) NOTES: A. All linear dimensions are in millimeters (inches). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. D. Falls within JEDEC TO-261 Variation AA.

www.ti.com PACKAGE OUTLINE C 8X 0.35 0.25 2.4

0.8 MAX

(0.25) (0.25) (0.2) (0.15) 0.05 0.00 8X 0.6 0.4 3 0.05 2.2 0.05 6X 0.8 A 4.1 3.9 B 4.1 3.9 (0.2) TYP WSON - 0.8 mm max heightNGN0008A PLASTIC SMALL OUTLINE - NO LEAD 4214794/A 11/2019 PIN 1 INDEX AREA SEATING PLANE 0.08 C 4 5 PIN 1 ID

0.1 C A B

0.05 C THERMAL PAD EXPOSED SYMM SYMM9 DETAIL A SEE NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 3.000 PIN 1 ID DETAIL A PIN 1 ID

www.ti.com EXAMPLE BOARD LAYOUT 8X (0.3) (3) (3.3) 6X (0.8) (2.2) ( 0.2) VIA TYP (0.85) (1.25) 8X (0.5) (R0.05) TYP WSON - 0.8 mm max heightNGN0008A PLASTIC SMALL OUTLINE - NO LEAD 4214794/A 11/2019 SYMM 4 5 LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SYMM 9 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING SOLDER MASK METAL UNDER SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN (R0.05) TYP 0.59 4X (1.31) 8X (0.3) 8X (0.5) 4X (0.98) (3.3) (0.755) 6X (0.8) WSON - 0.8 mm max heightNGN0008A PLASTIC SMALL OUTLINE - NO LEAD 4214794/A 11/2019 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 9: 78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:20X SYMM 4 5 METAL TYP SYMM

www.ti.com PACKAGE OUTLINE C 10.42 9.40 6.73 6.35 6.22 5.97 1.27 0.88 5.46 4.96 2.285 4.57 1.02 0.64 3X 0.88 0.64

2.55 MAX

0.88 0.46 1.14 0.89 0.60 0.46 0.17

0.51 MIN

4.32 MIN

(2.345) (2.5) TO-252 - 2.55 mm max heightNDP0003B TRANSISTOR OUTLINE 4219870/A 03/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-252. TOP & BOTTOM PKG OPTIONAL SEATING PLANE SCALE 1.500 A B

www.ti.com EXAMPLE BOARD LAYOUT (4.57) 2X (1.3) 2X (2.15) (5.7) (5.5) (2.285)(4.38) (R0.05) TYP TO-252 - 2.55 mm max heightNDP0003B TRANSISTOR OUTLINE 4219870/A 03/2018 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers 5. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 8X SYMM PKG SEE SOLDER MASK DETAIL EXPOSED METAL METAL EDGE SOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAIL EXPOSED METAL METAL UNDER SOLDER MASK SOLDER MASK OPENING SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN 2X (2.15) 2X (1.3) (4.57) (4.38) (1.32) TYP (1.35) TYP (0.26) (R0.05) TYP 16X (1.12) 16X (1.15) TO-252 - 2.55 mm max heightNDP0003B TRANSISTOR OUTLINE 4219870/A 03/2018 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. PKG SOLDER PASTE EXAMPLE BASED ON 0.125 MM THICK STENCIL SCALE: 8X

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