LM111-N

LM111/LM211/LM311 Voltage Comparator datasheet (Rev. E)

Document overview

• Manufacturer or author: Texas Instruments, Incorporated [SNOSBJ1,E]
• PDF pages: 34

Technical content

LM111-N,LM211-N,LM311-N www.ti.com SNOSBJ1E –MAY 1999–REVISED MARCH 2013 LM111-N/LM211-N/LM311-NVoltageComparator Check forSamples: LM111-N ,LM211-N ,LM311-N Both the inputsand the outputsof the LM111-N,1FEATURES LM211-N or the LM311-N can be isolatedfrom 2• Operates From Single5V Supply system ground, and the output can drive loads

• InputCurrent:150 nA Max. Over Temperature referredtoground,thepositivesupplyorthenegative supply.Offsetbalancingand strobecapabilityare• OffsetCurrent:20 nA Max. Over Temperature providedand outputscan be wireOR 'ed. Although• DifferentialInputVoltageRange: ±30V slowerthantheLM106 and LM710 (200ns response
• Power Consumption: 135 mW at±15V timevs 40 ns)thedevicesare alsomuch lessprone tospuriousoscillations.The LM111-N has thesame DESCRIPTION pinconfigurationas theLM106 and LM710. The LM111-N, LM211-N and LM311-N are voltage The LM211-N isidenticaltotheLM111-N, exceptthatcomparators that have input currentsnearly a itsperformanceisspecifiedover a −25°C to +85°CthousandtimeslowerthandevicesliketheLM106 or temperaturerange insteadof−55°C to +125°C. TheLM710. They are also designed to operateover a LM311-N has a temperaturerangeof0°C to+70°C.widerrange of supplyvoltages:from standard±15V op amp suppliesdown tothesingle5V supplyused forIC logic.TheiroutputiscompatiblewithRTL, DTL and TTL as wellas MOS circuits.Further,theycan drivelamps orrelays,switchingvoltagesup to50V at currentsas highas 50 mA. TypicalApplications NOTE Pin connectionsshown inSchematicDiagram and TypicalApplicationsare forthe LMC TO-99 package. Do Not Ground StrobePin.Outputisturnedoffwhen currentis pulledfromStrobePin. Figure1.OffsetBalancing Figure2.Strobing Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1999–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

LM111-N,LM211-N,LM311-N SNOSBJ1E –MAY 1999–REVISED MARCH 2013 www.ti.com Increasestypicalcommon mode slewfrom7.0V/μs to18V/μs. Figure3.IncreasingInputStage Current Figure4.DetectorforMagnetic Transducer *Absorbsinductivekickbackofrelayand protectsIC fromsevere voltagetransientson V++ line. Do Not Ground StrobePin. Figure5.DigitalTransmissionIsolator Figure6.Relay DriverwithStrobe *SolidtantalumDo Not Ground StrobePin. Typicalinputcurrentis50 pA withinputsstrobedoff. Pinconnectionsshown inSchematicDiagram and Typical ApplicationsarefortheLMC TO-99 package. Figure7.StrobingoffBoth Inputand Output Figure8.PositivePeak Detector Stages

2 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N www.ti.com SNOSBJ1E –MAY 1999–REVISED MARCH 2013 Figure9.Zero Crossing DetectorDrivingMOS Logic These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N SNOSBJ1E –MAY 1999–REVISED MARCH 2013 www.ti.com TotalSupplyVoltage(V84) 36V OutputtoNegativeSupplyVoltage(V74) 50V Ground toNegativeSupplyVoltage(V14) 30V DifferentialInputVoltage ±30V InputVoltage(3) ±15V OutputShortCircuitDuration 10 sec OperatingTemperatureRange LM111-N −55°C to125°C LM211-N −25°C to85°C Lead Temperature(Soldering,10 sec) 260°C VoltageatStrobePin V+−5V SolderingInformation Dual-In-LinePackage Soldering(10seconds) 260°C SmallOutlinePackage Vapor Phase (60seconds) 215°C Infrared(15seconds) 220°C ESD Rating(4) 300V (1) RefertoRETS111X fortheLM111H, LM111J and LM111J-8 militaryspecifications. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) Thisratingappliesfor±15 supplies.The positiveinputvoltagelimitis30V above thenegativesupply.The negativeinputvoltagelimitis equaltothenegativesupplyvoltageor30V belowthepositivesupply,whicheverisless. (4) Human body model,1.5kΩ inserieswith100 pF. Parameter Conditions Min Typ Max Units InputOffsetVoltage(2) TA=25°C, R S≤50k 0.7 3.0 mV InputOffsetCurrent TA=25°C 4.0 10 nA InputBiasCurrent TA=25°C 60 100 nA VoltageGain TA=25°C 40 200 V/mV Response Time(3) TA=25°C 200 ns SaturationVoltage VIN≤−5 mV, IOUT =50 mA 0.75 1.5 VTA=25°C StrobeON Current(4) TA=25°C 2.0 5.0 mA OutputLeakage Current VIN≥5 mV, VOUT =35V, TA=25°C, 0.2 10 nAISTROBE =3 mA InputOffsetVoltage(2) R S≤50 k 4.0 mV InputOffsetCurrent(2) 20 nA InputBiasCurrent 150 nA InputVoltageRange V+=15V, V−=−15V,Pin7 Pull-Up −14.5 13.8-14.7 13.0 VMay Go To 5V SaturationVoltage V+≥4.5V,V−=0,VIN≤−6 mV, 0.23 0.4 VIOUT ≤8 mA OutputLeakage Current VIN≥5 mV, VOUT =35V 0.1 0.5 μA PositiveSupplyCurrent TA=25°C 5.1 6.0 mA NegativeSupplyCurrent TA=25°C 4.1 5.0 mA (1) These specificationsapplyforVS=±15V and Ground pinatground,and −55°C ≤TA≤+125°C, unlessotherwisestated.WiththeLM211-N, however,alltemperaturespecificationsarelimitedto−25°C ≤TA≤+85°C. The offsetvoltage,offsetcurrentand biascurrentspecifications applyforany supplyvoltagefroma single5V supplyup to±15V supplies. (2) The offsetvoltagesand offsetcurrentsgivenarethemaximum valuesrequiredtodrivetheoutputwithina voltofeithersupplywitha 1 mA load.Thus,theseparametersdefinean errorband and takeintoaccounttheworst-caseeffectsofvoltagegainand R S. (3) The responsetimespecified(seedefinitions)isfora 100 mV inputstepwith5 mV overdrive. (4) Thisspecificationgivestherangeofcurrentwhichmust be drawn fromthestrobepintoensuretheoutputisproperlydisabled.Do not shortthestrobepintoground;itshouldbe currentdrivenat3 to5 mA.

4 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N www.ti.com SNOSBJ1E –MAY 1999–REVISED MARCH 2013 AbsoluteMaximum RatingsfortheLM311-N (1)(2) TotalSupplyVoltage(V84) 36V OutputtoNegativeSupplyVoltage(V74) 40V Ground toNegativeSupplyVoltage(V14) 30V DifferentialInputVoltage ±30V InputVoltage(3) ±15V Power Dissipation(4) 500 mW ESD Rating(5) 300V OutputShortCircuitDuration 10 sec OperatingTemperatureRange 0° to70°C StorageTemperatureRange −65°C to150°C Lead Temperature(soldering,10 sec) 260°C VoltageatStrobePin V+−5V SolderingInformation Dual-In-LinePackage Soldering(10seconds) 260°C SmallOutlinePackage Vapor Phase (60seconds) 215°C Infrared(15seconds) 220°C (1) “AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdo notensurespecificperformancelimits.” (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) Thisratingappliesfor±15V supplies.The positiveinputvoltagelimitis30V above thenegativesupply.The negativeinputvoltagelimit isequaltothenegativesupplyvoltageor30V belowthepositivesupply,whicheverisless. (4) The maximum junctiontemperatureoftheLM311-N is110°C. Foroperatingatelevatedtemperature,devicesintheLMC package must be deratedbased on a thermalresistanceof165°C/W, junctiontoambient,or20°C/W, junctiontocase.The thermalresistanceofthe dual-in-linepackage is100°C/W, junctiontoambient. (5) Human body model,1.5kΩ inserieswith100 pF. ElectricalCharacteristics(1)fortheLM311-N Parameter Conditions Min Typ Max Units InputOffsetVoltage(2) TA=25°C, R S≤50k 2.0 7.5 mV InputOffsetCurrent(2) TA=25°C 6.0 50 nA InputBiasCurrent TA=25°C 100 250 nA VoltageGain TA=25°C 40 200 V/mV Response Time(3) TA=25°C 200 ns SaturationVoltage VIN≤−10 mV, IOUT =50 mA , 0.75 1.5 VTA=25°C StrobeON Current(4) TA=25°C 2.0 5.0 mA OutputLeakage Current VIN≥10 mV, VOUT =35V TA=25°C, 0.2 50 nA ISTROBE =3 mA V− = Pin1 = −5V InputOffsetVoltage(2) R S≤50K 10 mV InputOffsetCurrent(2) 70 nA InputBiasCurrent 300 nA InputVoltageRange −14.5 13.8,−14.7 13.0 V SaturationVoltage V+≥4.5V,V−=0,VIN≤−10 mV, 0.23 0.4 VIOUT ≤8 mA PositiveSupplyCurrent TA=25°C 5.1 7.5 mA NegativeSupplyCurrent TA=25°C 4.1 5.0 mA (1) These specificationsapplyforVS=±15V and Pin1 atground,and 0°C < TA < +70°C, unlessotherwisespecified.The offsetvoltage, offsetcurrentand biascurrentspecificationsapplyforany supplyvoltagefroma single5V supplyup to±15V supplies. (2) The offsetvoltagesand offsetcurrentsgivenarethemaximum valuesrequiredtodrivetheoutputwithina voltofeithersupplywith 1 mA load.Thus,theseparametersdefinean errorband and takeintoaccounttheworst-caseeffectsofvoltagegainand R S. (3) The responsetimespecified(seedefinitions)isfora 100 mV inputstepwith5 mV overdrive. (4) Thisspecificationgivestherangeofcurrentwhichmust be drawn fromthestrobepintoensuretheoutputisproperlydisabled.Do not shortthestrobepintoground;itshouldbe currentdrivenat3 to5 mA. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N SNOSBJ1E –MAY 1999–REVISED MARCH 2013 www.ti.com TypicalPerformance CharacteristicsLM111-N/LM211-N InputBias Current InputBias Current Figure10. Figure11. InputBias Current InputBias Current Figure12. Figure13. InputBias Current InputBias Current Figure14. Figure15.

6 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N www.ti.com SNOSBJ1E –MAY 1999–REVISED MARCH 2013 TypicalPerformance CharacteristicsLM111-N/LM211-N (continued) InputBias Current InputBias Current InputOverdrives InputOverdrives Figure16. Figure17. Response Time forVarious InputBias Current InputOverdrives Figure18. Figure19. Response Time forVarious InputOverdrives Output LimitingCharacteristics Figure20. Figure21. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N SNOSBJ1E –MAY 1999–REVISED MARCH 2013 www.ti.com TypicalPerformance CharacteristicsLM111-N/LM211-N (continued) Supply Current Supply Current Figure22. Figure23. Leakage Currents Figure24.

8 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N www.ti.com SNOSBJ1E –MAY 1999–REVISED MARCH 2013 TypicalPerformance CharacteristicsLM311-N InputBias Current InputOffsetCurrent Figure25. Figure26. OffsetError InputCharacteristics Figure27. Figure28. Common Mode Limits TransferFunction Figure29. Figure30. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N SNOSBJ1E –MAY 1999–REVISED MARCH 2013 www.ti.com TypicalPerformance CharacteristicsLM311-N (continued) Response Time forVarious Response Time forVarious InputOverdrives InputOverdrives Figure31. Figure32. Response Time forVarious Output SaturationVoltage InputOverdrives Figure33. Figure34. Response Time forVarious InputOverdrives Output LimitingCharacteristics Figure35. Figure36.

10 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N www.ti.com SNOSBJ1E –MAY 1999–REVISED MARCH 2013 TypicalPerformance CharacteristicsLM311-N (continued) Supply Current Supply Current Figure37. Figure38. Leakage Currents Figure39. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N SNOSBJ1E –MAY 1999–REVISED MARCH 2013 www.ti.com APPLICATION HINTS CIRCUIT TECHNIQUES FOR AVOIDING OSCILLATIONS IN COMPARATOR APPLICATIONS When a high-speedcomparatorsuch as theLM111-N isused withfastinputsignalsand lowsourceimpedances, theoutputresponsewillnormallybe fastand stable,assumingthatthepower supplieshave been bypassed(with 0.1μF disccapacitors),and thattheoutputsignalisroutedwellaway from theinputs(pins2 and 3) and also away frompins5 and 6. However,when theinputsignalisa voltageramp ora slowsinewave, orifthesignalsourceimpedance ishigh (1kΩ to100 kΩ),thecomparatormay burstintooscillationnearthecrossing-point.Thisisdue tothehighgain and wide bandwidthofcomparatorsliketheLM111-N. To avoidoscillationorinstabilityinsuch a usage,several precautionsarerecommended, as shown inFigure40 below. 1. The trimpins(pins5 and 6) actas unwanted auxiliaryinputs.Ifthesepinsare notconnectedtoa trim-pot, theyshouldbe shortedtogether.Iftheyareconnectedtoa trim-pot,a 0.01μF capacitorC1 between pins5 and 6 willminimizethesusceptibilitytoAC coupling.A smallercapacitorisused ifpin5 isused forpositive feedbackas inFigure40. 2. Certainsourceswillproducea cleanercomparatoroutputwaveform ifa 100 pF to1000 pF capacitorC2 is connecteddirectlyacrosstheinputpins. 3. When thesignalsourceisappliedthrougha resistivenetwork,R S,itisusuallyadvantageoustochoose an R S′ ofsubstantiallythesame value,bothforDC and fordynamic (AC) considerations.Carbon,tin-oxide,and metal-filmresistorshave allbeen used successfullyin comparatorinputcircuitry.Inductivewirewound resistorsarenotsuitable. 4. When comparatorcircuitsuse inputresistors(eg.summing resistors),theirvalue and placement are particularlyimportant.Inallcases thebody oftheresistorshouldbe closetothedeviceor socket.Inother words thereshouldbe verylittleleadlengthor printed-circuitfoilrun between comparatorand resistorto radiateorpickup signals.The same appliestocapacitors,pots,etc.For example,ifR S=10 kΩ,as littleas 5 inchesofleadbetween theresistorsand theinputpinscan resultinoscillationsthatareveryhardtodamp. Twistingthese inputleads tightlyis the only (second best)alternativeto placingresistorscloseto the comparator. 5. Sincefeedbacktoalmostany pinofa comparatorcan resultinoscillation,theprinted-circuitlayoutshouldbe engineeredthoughtfully.Preferablythereshouldbe a groundplaneundertheLM111-N circuitry,forexample, one sideofa double-layercircuitcard.Ground foil(or,positivesupplyornegativesupplyfoil)shouldextend between theoutputand theinputs,toactas a guard.The foilconnectionsfortheinputsshouldbe as small and compact as possible,and shouldbe essentiallysurroundedby groundfoilon allsides,toguardagainst capacitivecouplingfromany high-levelsignals(suchas theoutput).Ifpins5 and 6 arenotused,theyshould be shortedtogether.Iftheyareconnectedtoa trim-pot,thetrim-potshouldbe located,atmost,a few inches away from theLM111-N, and the0.01μF capacitorshouldbe installed.Ifthiscapacitorcannotbe used,a shieldingprinted-circuitfoilmay be advisablebetween pins6 and 7. The power supplybypass capacitors shouldbe locatedwithina coupleinchesoftheLM111-N. (Some othercomparatorsrequirethepower-supply bypasstobe locatedimmediatelyadjacenttothecomparator.) 6. Itisa standardproceduretouse hysteresis(positivefeedback)arounda comparator,topreventoscillation, and toavoidexcessivenoiseon theoutputbecause thecomparatorisa good amplifierforitsown noise.In the circuitof Figure41, the feedback from the outputto the positiveinputwillcause about 3 mV of hysteresis.However,ifR S islargerthan100Ω,such as 50 kΩ,itwould notbe reasonabletosimplyincrease thevalueofthepositivefeedbackresistorabove 510 kΩ.The circuitofFigure42 couldbe used,butitis ratherawkward.See thenotesinparagraph7 below. 7. When bothinputsoftheLM111-N areconnectedtoactivesignals,orifa high-impedancesignalisdrivingthe positiveinputoftheLM111-N so thatpositivefeedbackwould be disruptive,thecircuitofFigure40 isideal. The positivefeedbackisto pin5 (one of the offsetadjustmentpins).Itissufficientto cause 1 to 2 mV hysteresisand sharptransitionswithinputtrianglewaves from a few Hz tohundredsofkHz. The positive- feedbacksignalacrossthe82Ω resistorswings240 mV below thepositivesupply.Thissignaliscentered aroundthenominalvoltageatpin5,so thisfeedbackdoes notadd totheVOS ofthecomparator.As much as 8 mV ofVOS can be trimmedout,usingthe5 kΩ potand 3 kΩ resistoras shown. 8. These applicationnotes apply specificallyto the LM111-N, LM211-N, LM311-N, and LF111 familiesof comparators,and are applicableto allhigh-speedcomparatorsingeneral,(withthe exceptionthatnot all comparatorshave trimpins).

12 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N www.ti.com SNOSBJ1E –MAY 1999–REVISED MARCH 2013 Pinconnectionsshown areforLM111H intheLMC hermeticpackage. Figure40. Improved PositiveFeedback Pinconnectionsshown areforLM111H intheLMC hermeticpackage. Figure41. ConventionalPositiveFeedback Figure42. PositiveFeedback withHigh Source Resistance Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N SNOSBJ1E –MAY 1999–REVISED MARCH 2013 www.ti.com TypicalApplications (Pinnumbers refertoLMC package) Figure43. Zero Crossing DetectorDrivingMOS Switch *TTL orDTL fanoutoftwo Figure44. 100 kHz Free Running Multivibrator *Adjustforsymmetricalsquarewave timewhen VIN = 5 mV †Minimum capacitance20 pF Maximum frequency50 kHz Figure45. 10 Hz to10 kHz VoltageControlledOscillator

14 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N www.ti.com SNOSBJ1E –MAY 1999–REVISED MARCH 2013 *Inputpolarityisreversedwhen usingpin1 as output. Figure46. DrivingGround-ReferredLoad Figure47. Using Clamp Diodes toImprove Response *Valuesshown arefora 0 to30V logicswingand a 15V threshold. †May be added tocontrolspeed and reducesusceptibilitytonoisespikes. Figure48. TTL InterfacewithHigh LevelLogic Figure49. CrystalOscillator Figure50. Comparator and SolenoidDriver Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N SNOSBJ1E –MAY 1999–REVISED MARCH 2013 www.ti.com *Solidtantalum †Adjusttosetclamp level Figure51. PrecisionSquarer *Solidtantalum Figure52. Low-VoltageAdjustableReferenceSupply *Solidtantalum Figure53. PositivePeak Detector

16 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N www.ti.com SNOSBJ1E –MAY 1999–REVISED MARCH 2013 Figure54. Zero Crossing DetectorDrivingMOS Logic *Solidtantalum Figure55. NegativePeak Detector *R2 setsthecomparisonlevel.Atcomparison,thephotodiodehas lessthan5 mV acrossit,decreasingleakagesby an orderofmagnitude. Figure56. PrecisionPhotodiode Comparator Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N SNOSBJ1E –MAY 1999–REVISED MARCH 2013 www.ti.com Figure57. SwitchingPower Amplifier Figure58. SwitchingPower Amplifier

18 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N www.ti.com SNOSBJ1E –MAY 1999–REVISED MARCH 2013 Schematic Diagram NOTE Pinconnectionsshown intheschematicdiagramarefortheLMC package. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 19 ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N SNOSBJ1E –MAY 1999–REVISED MARCH 2013 www.ti.com Pin Diagrams Top View Figure59. 8-PinTO-99 See LMC Package Top View Top View Figure60. 8-PinCDIP (See NAB Package) Figure61. 14-PinCDIP (See J Package) 8-PinSOIC (See D Package) 14-PinPDIP (See NFF Package) 8-PinPDIP (See P Package) Top View Figure62. LM111W/883, LM111WG/883 10-PinCLGA (See NAD Package) 10-PinCLGA (See NAC Package)

20 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM111-N LM211-N LM311-N

LM111-N,LM211-N,LM311-N www.ti.com SNOSBJ1E –MAY 1999–REVISED MARCH 2013

REVISION HISTORY

Changes from RevisionD (March 2013)toRevisionE Page Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 21 ProductFolderLinks:LM111-N LM211-N LM311-N

www.ti.com 15-Jul-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM111 MW8 Active Production WAFERSALE (YS) | 0 1 | NOT REQUIRED - Call TI Level-1-NA-UNLIM -55 to 125 LM111H Active Production TO-99 (LMC) | 8 500 | OTHER No Call TI Call TI -55 to 125 ( LM111H, LM111H) LM111H/NOPB Active Production TO-99 (LMC) | 8 500 | OTHER Yes Call TI Level-1-NA-UNLIM -55 to 125 ( LM111H, LM111H) LM111J-8 Active Production CDIP (NAB) | 8 40 | TUBE No Call TI Call TI -55 to 125 LM111J-8 LM311-MWC Active Production WAFERSALE (YS) | 0 1 | NOT REQUIRED - Call TI Level-1-NA-UNLIM -40 to 85 LM311H Active Production TO-99 (LMC) | 8 500 | TRAY NON-STD No Call TI Call TI 0 to 70 ( LM311H, LM311H) LM311H/NOPB Active Production TO-99 (LMC) | 8 500 | OTHER Yes Call TI Level-1-NA-UNLIM 0 to 70 ( LM311H, LM311H) LM311M Obsolete Production SOIC (D) | 8 - - Call TI Call TI 0 to 70 LM 311M LM311M/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM 311M LM311M/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM 311M LM311MX Obsolete Production SOIC (D) | 8 - - Call TI Call TI 0 to 70 LM 311M LM311MX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM 311M LM311MX/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM 311M LM311N/NOPB Active Production PDIP (P) | 8 40 | TUBE Yes NIPDAU Level-1-NA-UNLIM 0 to 70 LM 311N LM311N/NOPB.B Active Production PDIP (P) | 8 40 | TUBE Yes NIPDAU Level-1-NA-UNLIM 0 to 70 LM 311N (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. Addendum-Page 1

www.ti.com 15-Jul-2026 (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM311MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) LM111J-8 NAB CDIP 8 40 502 14 11938 4.32 LM311M/NOPB D SOIC 8 95 495 8 4064 3.05 LM311M/NOPB.B D SOIC 8 95 495 8 4064 3.05 LM311N/NOPB P PDIP 8 40 502 14 11938 4.32 LM311N/NOPB.B P PDIP 8 40 502 14 11938 4.32 Pack Materials-Page 3

www.ti.com J08A (Rev M)

www.ti.com PACKAGE OUTLINE C .305-.335 [7.75-8.51] .165-.185 [4.19-4.70] .010-.040 [0.25-1.02] SEATING PLANE .040 MAX [1.02] .335-.370 [8.51-9.40] .110-.160 [2.79-4.06] .028-.034 [0.71-0.86] .500 MIN [12.7] .225 [5.72] 8X .016-.021 [0.41-0.53] .200 [5.08] .100 [2.54] UNCONTROLLED LEAD DIA .055[1.397] MAX .029-.045 [0.74-1.14]

45 TYP

TO-CAN - 5.72 mm max heightLMC0008A TRANSISTOR OUTLINE 4220610/B 09/2024 NOTES: 1. All linear dimensions are in inches [millimeters]. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Pin numbers shown for reference only. Numbers may not be marked on package. 4. Reference JEDEC registration MO-002/TO-99. MAX .010 [0.25] C A A

www.ti.com EXAMPLE BOARD LAYOUT (45 ) TYP .003 MAX [0.07] ALL AROUND 7X .003 MAX [0.07] ALL AROUND ( .200 ) [5.08] ( .055) [1.4] 7X ( .055) [1.4] METAL 8X ( .031) VIA [0.8] (R.002 ) TYP [0.05] TO-CAN - 5.72 mm max heightLMC0008A TRANSISTOR OUTLINE 4220610/B 09/2024 LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE: 12X 7X SOLDER MASK OPENING SOLDER MASK OPENING METAL

www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800

www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM

www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5

IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you fully indemnify TI and its representatives against any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale, TI’s General Quality Guidelines, or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Unless TI explicitly designates a product as custom or customer-specified, TI products are standard, catalog, general purpose devices. TI objects to and rejects any additional or different terms you may propose. IMPORTANT NOTICE Copyright © 2026, Texas Instruments Incorporated Last updated 10/2025