LHR974

LHR974 OSRAM

Document overview

• Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 12

Technical content

Features

 package: 0805, colorless diffused resin  feature of the device: extremely small package 2.0 mm x 1.25 mm x 0.8 mm  wavelength: 645 nm (hyper-red)  viewing angle: extremely wide (160°)  technology: GaAlAs  optical efficiency: 3 lm/W  assembly methods: suitable for all SMT assembly methods  soldering methods: IR reflow soldering  preconditioning: acc. to JEDEC Level 2  taping: 8 mm tape with 4000/reel, ø180 mm  ESD-withstand voltage: up to 2 kV acc. to JESD22-A114-B

Applications

 optical indicators  status indication  flat backlighting (LCD, cellular phones, switches, displays)  marker lights (e.g. steps, exit ways, etc.) t o y s

Anm.: Die Standardlieferform von Serientypen beinhaltet alle Gruppen. Einzelne Helligkeitsgruppen sind nicht bestellbar. In einer Verpackungseinheit / Gurt ist immer nur eine Helligkeitsgruppe enthalten. Note: The standard shipping format for serial types includes all groups. Individual brightness groups cannot be ordered. No packing unit / tape ever contains more than one brightness group. Bestellinformation

Ordering Information

Lichtstärke1) 2) Seite 12 Luminous Intensity1) 2) page 12 IF = 20 mA IV (mcd) Bestellnummer Ordering Code min. typ. LH R974 hyper-red 11.2 15 Q62702P5182

Operating temperature range Top – 30 … + 85 °C Lagertemperatur Storage temperature range Tstg – 40 … + 85 °C Sperrschichttemperatur Junction temperature Tj + 95 °C Durchlassstrom Forward current (TA=25°C) IF 30 mA Stoßstrom Surge current tp = 10 µs, D = 0.1, TA=25°C IFM 0.1 A Sperrspannung3) Seite 12 Reverse voltage3) page 12 (TA=25°C) VR 5 V Leistungsaufnahme Power consumption (TA=25°C) Ptot 80 mW Wärmewiderstand Thermal resistance Sperrschicht/Umgebung4) Seite 12 Junction/ambient4) page 12 Sperrschicht/Lötpad Junction/solder point Rth JA Rth JS 800 450 K/W K/W

(TA = 25 °C) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlänge des emittierten Lichtes (typ.) Wavelength at peak emission IF = 20 mA λpeak 660 nm Dominantwellenlänge5) Seite 12 (typ.) Dominant wavelength5) page 12 IF = 20 mA λdom 645 nm Spektrale Bandbreite (typ.) Spectral bandwidth IF = 20 mA ∆λ 20 nm Abstrahlwinkel bei 50 % IV (Vollwinkel) (typ.) Viewing angle at 50 % IV 2ϕ 160 Grad deg. Durchlassspannung6) Seite 12 (typ.) Forward voltage6) page 12 (max.) IF = 20 mA VF VF 1.8 2.6 V V Sperrstrom (typ.) Reverse current (max.) VR = 5 V IR IR 0.02 100 µA µA Temperaturkoeffizient von λpeak (typ.) Temperature coefficient of λpeak IF = 20 mA; –10°C ≤ T ≤ 100°C TCλpeak 0.18 nm/K Temperaturkoeffizient von λdom (typ.) Temperature coefficient of λdom IF = 20 mA; –10°C ≤ T ≤ 100°C TCλdom 0.06 nm/K Temperaturkoeffizient von VF (typ.) Temperature coefficient of VF IF = 20 mA; –10°C ≤ T ≤ 100°C TCV – 1.7 mV/K Optischer Wirkungsgrad (typ.) Optical efficiency IF = 20 mA ηopt 3 lm/W

Relative spektrale Emission2) Seite 12 Relative Spectral Emission2) page 12 V(λ) = spektrale Augenempfindlichkeit / Standard eye response curve Irel = f (λ); TA = 25 °C; IF = 20 mA Abstrahlcharakteristik2) Seite 12 Radiation Characteristic2) page 12 Irel = f (ϕ); TA = 25 °C OHL01727 100 0400 450 500 550 600 650 700 nm hyper-red I rel λ Vλ 0.2 0.4 1.0 0.8 0.6 ϕ 1.0 0.8 0.6 0.4 50˚ 60˚ 70˚ 80˚ 90˚ 100˚

Durchlassstrom2) Seite 12 Forward Current2) page 12 IF = f (VF); TA = 25 °C Maximal zulässiger Durchlassstrom Max. Permissible Forward Current IF = f (T) Relative Lichtstärke2) 7) Seite 12 Relative Luminous Intensity2) 7) page 12 IV/IV(20 mA) = f (IF); TA = 25 °C Relative Lichtstärke2) Seite 12 Relative Luminous Intensity2) page 12 IV/IV(25 °C) = f (TA); IF = 20 mA OHL00594 10 1.1 10 -2 10 -1 10 0 I 10F 1 mA 10 2 FV F OHL01213 T I mA ˚C20 40 60 80 100 temp. ambientAT temp. solder pointTS AT TS V V (20 mA) 10 -1 0 10 10 12 10mA 10 -2 OHL00624 FI 110 I I 10 -1 10 0 V V(25 ˚C) OHL01141 I I Tj 0-20 0.4 0.8 1.2 1.6 0 20 40 60 100˚C

Maßzeichnung8) Seite 12 Package Outlines8) page 12 Gewicht / Approx. weight: 3.2 mg Gurtung / Polarität und Lage8) Seite 12 Verpackungseinheit: 4 Rollen mit 4000/Rolle, 8 mm Gurt, ø180 mm Method of Taping / Polarity and Orientation8) page 12 Packing unit: 4 reels with 4000/reel, 8 mm tape, ø180 mm Empfohlenes Lötpaddesign8) Seite 12 IR Reflow Löten Recommended Solder Pad8) page 12 IR Reflow Soldering mark Anode ø0.6 (ø0.024) 1.35 (0.053) 2.1 (0.083) 0.9 (0.035) 0.4 (0.016) 0.5 (0.020) 1.4 (0.055) 1.1 (0.043) Soldering terminal Polarity GEOY6026 1.9 (0.075) 1.15 (0.045) 0.7 (0.028) 1.2 (0.047) 0.3 (0.012) 0.9 (0.035) may flow in x, y direction 1.25 (0.049) 1.05 (0.041) Anode mark OHAY0663 2.4 (0.094) 1.75 (0.069)Anode mark 1.6 (0.063) 4 (0.157) 2 (0.079) 3.5 (0.138) 8 (0.315) Processive direction A C OHAPY607 1.2 (0.047) 1.2 (0.047)

Lötbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Conditions Preconditioning acc. to JEDEC Level 2 IR-Reflow Lötprofil (nach CECC 00802) IR Reflow Soldering Profile (acc. to CECC 00802) IR-Reflow Lötprofil für bleifreies Löten (nach J-STD-020B) IR Reflow Soldering Profile for lead free soldering (acc. to J-STD-020B) OHLA0685 0:00 T t min 100 150 200 250 0:30 1:00 1:30 2:00 2:30 3:00 3:30 4:00 4:30 5:00 5:30 2-3 K/s 2-3 K/s T = 183 ˚C = 70 s t maxT = 245 ˚C OHLA0687 T t s 120 s max 100 150 200 250 300 Ramp Up 100 s max 50 100 150 200 250 300 Ramp Down

6 K/s (max)

3 K/s (max)

25 ˚C 30 s max 260 ˚C+0 ˚C -5 ˚C 245 ˚C ±5 ˚C 240 ˚C 255 ˚C 217 ˚C Maximum Solder Profile Recommended Solder Profile 235 ˚C-0 ˚C +5 ˚C Minimum Solder Profile 10 s min

Barcode-Produkt-Etikett (BPL) Barcode-Product-Label (BPL) Gurtverpackung Tape and Reel Tape dimensions in mm (inch) W P0 P1 P2 D0 E F 4 ± 0.1 (0.157 ± 0.004) 4 ± 0.1 (0.157 ± 0.004) 2 ± 0.05 (0.079 ± 0.002) 1.5 + 0.1 (0.059 + 0.004) 1.75 ± 0.1 (0.069 ± 0.004) 3.5 ± 0.05 (0.138 ± 0.002) Reel dimensions in mm (inch) A W Nmin W1 W2 max SampleOHA12043 X - X - X(G) GROUP: Lot Number(1T) LOT NO: (9D) D/C: Date Code (X) PROD NO: Product Code (6P) BATCH NO: Batch Number Lx xxxx Product Name RoHS Compliant Bin1: Bin Information Color 1 Bin2: Bin3: ML Temp ST

260 C RT

PACKVAR: Packing Type Product Quantity per Reel(Q)QTY: Semiconductors OSRAM Opto Wavelength Group Forward Voltage Group Brightness Group Bar Code Bar Code Bar Code WFE Direction of unreeling N A OHAY0324 Label Gurtvorlauf: Leader: Trailer: Gurtende: 13.0 Direction of unreeling ±0.25 160 mm 160 mm 400 mm 400 mm 8+ 0.3 – 0.1

Trockenverpackung und Materialien Dry Packing Process and Materials Anm.: Feuchteempfindliche Produkte sind verpackt in einem Trockenbeutel zusammen mit einem Trockenmittel und einer Feuchteindikatorkarte Bezüglich Trockenverpackung finden Sie weitere Hinweise im Internet und in unserem Short Form Catalog im Kapitel “Gurtung und Verpackung” unter dem Punkt “Trockenverpackung”. Hier sind Normenbezüge, unter anderem ein Auszug der JEDEC-Norm, enthalten. Note: Moisture-senisitve product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet and in the Short Form Catalog in chapter “Tape and Reel” under the topic “Dry Pack”. Here you will also find the normative references like JEDEC. Kartonverpackung und Materialien Transportation Packing and Materials OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparator check dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, M oisture Level 3 Floor tim e 168 Hours M oisture Level 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 m onths at < 40 ˚C and < 90% relative hum idity (RH). M oisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) M ounted within b) Stored at body tem 3. Devices require baking, before m ounting, if: Bag seal date M oisture Level 1 M oisture Level 2 M oisture Level 2a4. If baking is required, b) 2a or 2b is not m et. Date and tim e opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor tim e see below If blank, see bar code label Floor tim e > 1 Year Floor tim e 1 Year Floor tim e 4 W eeks10% RH. M oisture Level 4 M oisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag contains CAUTIO N Floor tim e 72 Hours Floor tim e 48 Hours Floor tim e 24 Hours 30 ˚C/60% RH. LEVEL If blank, see bar code label OHA02624 PACKVAR:R077 Additional TEXT P-1+Q-1 Multi TOPLED Muster OSRAM Opto Semiconductors (6P) BATCH NO: (X) PROD NO: 10 (9D) D /C: (1T) LOT NO: 210021998123GH1234 0 245 (Q)QTY: 2000 0144 (G) GROUP:

260 C RT240 C R3 220 C R

Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 22a Temp ST R18 DEMY

Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components9) page 12 may only be used in life-support devices or systems 10) page 12 with the express written approval of OSRAM OS. Revision History: 2005-06-28 Previous Version: 2005-05-18 Page Subjects (major changes since last revision) Date of change 4 forward current 3 pad size from 16 mm2 to 5 mm2 10 annotations 2002-07-23 3 ambient temperature 2003-09-08 all new template 2004-03-22 all RoHS compliant 2004-08-12

1 ESD-withstand voltage 2004-08-30

9 Product Label acc. to OS-IN-2005-015 2005-05-18

Fußnoten: 1) Helligkeitswerte werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ± 11% ermittelt. 2) Wegen der besonderen Prozessbedingungen bei der Herstellung von LED können typische oder abgeleitete technische Parameter nur aufgrund statistischer Werte wiedergegeben werden. Diese stimmen nicht notwendigerweise mit den Werten jedes einzelnen Produktes überein, dessen Werte sich von typischen und abgeleiteten Werten oder typischen Kennlinien unterscheiden können. Falls erforderlich, z.B. aufgrund technischer Verbesserungen, werden diese typischen Werte ohne weitere Ankündigung geändert. 3) Die LED kann kurzzeitig in Sperrichtung betrieben werden. 4) Montage auf PC-Board FR 4 (Padgröße ≥ 5 mm2) 5) Wellenlängen werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ±1 nm ermittelt. 6) Spannungswerte werden mit einer Stromeinprägedauer von 1 ms und einer Genauigkeit von ±0,1 V ermittelt. 7) Im gestrichelten Bereich der Kennlinien muss mit erhöhten Helligkeitsunterschieden zwischen Leuchtdioden innerhalb einer Verpackungseinheit gerechnet werden. 8) Maße werden wie folgt angegeben: mm (inch) 9) Ein kritisches Bauteil ist ein Bauteil, das in lebenserhaltenden Apparaten oder Systemen eingesetzt wird und dessen Defekt voraussichtlich zu einer Fehlfunktion dieses lebenserhaltenden Apparates oder Systems führen wird oder die Sicherheit oder Effektivität dieses Apparates oder Systems beeinträchtigt. 10) Lebenserhaltende Apparate oder Systeme sind für (a) die Implantierung in den menschlichen Körper oder (b) für die Lebenserhaltung bestimmt. Falls sie versagen, kann davon ausgegangen werden, dass die Gesundheit und das Leben des Patienten in Gefahr ist. Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. Remarks: 1) Brightness groups are tested at a current pulse duration of 25 ms and a tolerance of ± 11%. 2) Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 3) Driving the LED in reverse direction is suitable for short term application. 4) Mounted on PC board FR 4 (pad size ≥ 5 mm2) 5) Wavelengths are tested at a current pulse duration of ms and a tolerance of ±1 nm. 6) Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of ±0.1 V. 7) In the range where the line of the graph is broken, you must expect higher brightness differences between single LEDs within one packing unit. 8) Dimensions are specified as follows: mm (inch). 9) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. 10) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered.