LHGB-T686

LHGB-T686 OSRAM

Document overview

• Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 19

Technical content

Features

 package: white P-LCC-4 package, higher contrast by a black surface (RGB-Displays)  feature of the device: additive mixture of color stimuli by independent driving of each chip  wavelength: 645 nm (hyper-red), 570 nm (green), 465 nm (blue)  viewing angle: Lambertian Emitter (120°)  technology: AlGaAs (hyper-red), GaP (green), GaN (blue)  optical efficiency: 3 lm/W (hyper-red), 2.5 lm/W (green), 1 lm/W (blue)  grouping parameter: luminous intensity  assembly methods: suitable for all SMT assembly methods  soldering methods: IR reflow soldering and TTW soldering  preconditioning: acc. to JEDEC Level 2  taping: 8 mm tape with 8000/reel, ø330 mm

Applications

 indoor displays (e.g. light writing displays)  LED chips can be controlled separately  full color displays, RGB-Displays  backlighting (LCD, switches, keys, displays, illuminated advertising, general lighting)  coupling into light guides  not suitable for automotive applications

■ Abgekündigt nach OS-PD-2005-002 - wird durch LATB T686 ersetzt werden Obsolete acc. to OS-PD-2005-002 - will be replaced by LATB T686 Letzte Bestellung / Last Order: 2005-08-31 Letzte Lieferung / Last Delivery: 2006-02-28 Anm.: - 1 Gesamter Farbbereich (siehe Seite 4) Note: - 1 Total color tolerance range (see page 4) Bestellinformation

Ordering Information

Lichtstärke1) Seite 19 Luminous Intensity1) page 19 IF = 10 mA IV (mcd) hyper-red green blue ■ LHGB T686 hyper-red green blue Bestellinformation LHGB T686-KL-1+KL-1+JK-1 Q62703Q5771

Operating temperature range Top – 40 … + 100 °C Lagertemperatur Storage temperature range Tstg – 40 … + 100 °C Sperrschichttemperatur Junction temperature Tj + 100 °C Durchlassstrom Forward current (TA=25°C) IF 30 30 20 mA Stoßstrom Surge current tp = 10 µs, D = 0.005, TA=25°C IFM 500 500 200 mA Sperrspannung2) Seite 19 Reverse voltage2) page 19 (TA=25°C) VR 5 12 5 V Leistungsaufnahme Power consumption (TA=25°C) Ptot 90 95 90 mW Wärmewiderstand Thermal resistance Sperrschicht / Umgebung3) Seite 19 1 chip on Junction / ambient3) page 19 3 chips on Sperrschicht / Lötpad 1 chip on Junction / solder point 3 chips on Rth JA Rth JA Rth JS Rth JS 480 680 260 370 480 770 260 420 580 820 360 510 K/W K/W K/W K/W

(TA = 25 °C) Bezeichnung Parameter Symbol Symbol Werte Values Einheit Unit hyper red green blue Wellenlänge des emittierten Lichtes (typ.) Wavelength at peak emission IF = 10 mA λpeak 660 572 428 nm Dominantwellenlänge4) Seite 19 Dominant wavelength4) page 19 IF = 10 mA λdom 645 ± 9 570 ± 6 465 ± 3 nm Spektrale Bandbreite bei 50 % Irel max (typ.) Spectral bandwidth at 50 % Irel max IF = 10 mA ∆λ 22 25 60 nm Abstrahlwinkel bei 50 % IV (Vollwinkel) (typ.) Viewing angle at 50 % IV 2ϕ 120 120 120 Grad deg. Durchlassspannung5) Seite 19 (typ.) Forward voltage5) page 19 (max.) IF = 10 mA VF VF 1.75 2.5 2.0 2.5 3.5 4.1 V V Sperrstrom (typ.) Reverse current (max.) VR = 12 V (green), VR = 5 V (hyper-red, blue) IR IR 0.01 0.01 0.01 µA µA Temperaturkoeffizient von λpeak (typ.) Temperature coefficient of λpeak IF = 10 mA; –10°C ≤ T ≤ 100°C TCλpeak 0.28 0.11 0.004 nm/K Temperaturkoeffizient von λdom (typ.) Temperature coefficient of λdom IF = 10 mA; –10°C ≤ T ≤ 100°C TCλdom 0.05 0.07 0.03 nm/K Temperaturkoeffizient von VF (typ.) Temperature coefficient of VF IF = 10 mA; –10°C ≤ T ≤ 100°C Optischer Wirkungsgrad (typ.) Optical efficiency IF = 10 mA ηopt 3 2.5 1 lm/W

Helligkeits-Gruppierungsschema Brightness Groups Helligkeitsgruppe Brightness Group Lichtstärke1) Seite 19 Luminous Intensity1) page 19 IV (mcd) Lichtstrom6) Seite 19 Luminous Flux6) page 19 ΦV (mlm) J K L 17 (typ.) 27 (typ.) 45 (typ.) Anm.: Die Standardlieferform von Serientypen beinhaltet eine Familiengruppe. Einzelne Helligkeitsgruppen sind nicht bestellbar. Note: The standard shipping format for serial types includes a family group. Individual brightness groups cannot be ordered. Gruppenbezeichnung auf Etikett Group Name on Label Beispiel: K-1+L-1+J-1 Example: K-1+L-1+J-1 Helligkeits- gruppe Brightness Group (hyper-red) Wellenlänge (keine Gruppierung) Wavelength (no grouping) (hyper-red) Helligkeits- gruppe Brightness Group (green) Wellenlänge (keine Gruppierung) Wavelength (no grouping) (green) Helligkeits- gruppe Brightness Group (blue) Wellenlänge (keine Gruppierung) Wavelength (no grouping) (blue) K 1 L 1 J 1 Anm.: In einer Verpackungseinheit / Gurt ist immer nur eine Helligkeitsgruppe pro Farbe enthalten. Note: No packing unit / tape ever contains more than one brightness group per color.

Relative spektrale Emission6) Seite 19 Relative Spectral Emission6) page 19 V(λ) = spektrale Augenempfindlichkeit / Standard eye response curve Irel = f (λ); TA = 25 °C; IF = 10 mA Abstrahlcharakteristik6) Seite 19 Radiation Characteristic6) page 19 Irel = f (ϕ); TA = 25 °C OHL01366 350 100 nm Irel λ 400 450 500 550 600 650 700 blue green hyper-redλV 0.2 0.4 1.0 0.8 0.6 ϕ 1.0 0.8 0.6 0.4 50˚ 60˚ 70˚ 80˚ 90˚ 100˚

Durchlassstrom6) 7) Seite 19 Forward Current6) 7) page 19 IF = f (VF); TA = 25 °C Durchlassstrom6) 7) Seite 19 Forward Current6) 7) page 19 IF = f (VF); TA = 25 °C; blue Relative Lichtstärke6) 7) Seite 19 Relative Luminous Intensity6) 7) page 19 IV/IV(10 mA) = f (IF); TA = 25 °C Relative Lichtstärke6) Seite 19 Relative Luminous Intensity6) page 19 IV/IV(25 °C) = f (Tj); IF = 10 mA 10 1.4 010 VF V 110 Ι F mA 210 green hyper-red OHL01360 V OHL00432 F FI V 1.5 2 2.5 3 3.5 4 4.5 5 610-1 010 110 102 mA OHL01368 010 mA 210 FI IV (10 mA) IV 101 101 -110 010 hyper-red green blue green OHL01369 jT 02 0 4 0 6 0 8 0 1 0 0 V V (25 ˚C)I I 0.4 0.8 1.2 1.6 hyper-red blue

Maximal zulässiger Durchlassstrom Max. Permissible Forward Current IF = f (T); 1 chip on Maximal zulässiger Durchlassstrom Max. Permissible Forward Current IF = f (T); 1 chip on Maximal zulässiger Durchlassstrom Max. Permissible Forward Current IF = f (T); 3 chips on Maximal zulässiger Durchlassstrom Max. Permissible Forward Current IF = f (T); 3 chips on OHL00100 IF T mA A 20 40 60 80 ˚C 10 0 green / hyper-red blue OHL00101 IF T mA S 20 40 60 80 ˚C 10 0 green / hyper-red blue OHL00106 IF T mA A 20 40 60 80 ˚C 10 0 hyper-redgreen blue OHL00107 IF T mA S 20 40 60 80 ˚C 10 0 hyper-redgreen blue

Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 25 °C blue (1 Chip on) Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 25 °C blue (3 Chips on) Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 85 °C blue (1Chip on) Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 85 °C blue (3 Chips on) OHL01433 FI 10 10-5 -4 -3 10 10 -2 10-1 100 s101 102 pt 0.05 0.5 0.2 0.1 D 0.02 0.01 0.005 D T t = P t T P IF 0.05 0.10 0.15 0.20 0.25 A 0.05 02 1-2-3-4-5 -1 101010 10 10 10 10 10 s 0.2 0.1 0.005 0.02 0.01 A OHL00117 0.5 FI pt P D T Pt t T FI D = 0.05 0.10 0.15 0.20 0.25 OHL01434 FI 10 10-5 -4 -3 10 10 -2 10-1 100 s101 102 pt 0.05 0.5 0.2 0.1 D 0.02 0.01 0.005 D T t = P t T P IF 0.05 0.10 0.15 0.20 0.25 A 0.05 0 21-2-3-4-5 -1 101010 10 10 10 10 10 s 0.2 0.1 0.005 0.02 0.01 A OHL00118 0.5 FI pt P D T Pt t T FI D = 0.005 0.010 0.015 0.020 0.025 0.040

Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 25 °C green/hyper-red (1 Chip on) Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 85 °C green/hyper-red (1 Chip on) OHL01686 s10-5 10-4 10-3 10-2 10-1 100 101 t D I T T P F tP= D = 0.005 0.01 0.02 0.05 0.2 0.5 DC 10 1 IF t 210 0.1 p 10 3 mA -510 0.2 0.1 0.005 0.02 mA OHL00104 0.5 100 pt IF D = -410 -310 -210 -110 010 110s 110 210 310 P D T Pt t T FI

Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 25 °C green (3 Chips on) Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 25 °C hyper-red (3 Chips on) Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 85 °C green (3 Chips on) Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 85 °C hyper-red (3 Chips on) -510 0.2 0.1 0.005 0.02 mA OHL00108 0.5 100 pt IF D = -410 -310 -210 -110 010 110s 110 210 310 P D T Pt t T FI -510 0.2 0.1 0.005 0.02 mA OHL00102 0.5 100 pt IF D = -410 -310 -210 -110 010 110s 110 210 310 P D T Pt t T FI -510 0.2 0.1 0.005 0.02 mA OHL00109 0.5 100 pt IF D = -410 -310 -210 -110 010 110s 110 210 310 P D T Pt t T FI -510 0.2 0.1 0.005 0.02 mA OHL00103 0.5 100 pt IF D = -410 -310 -210 -110 010 110s 110 210 310 P D T Pt t T FI

Die Farbkoordinaten des Mischlichtes können innerhalb des mit a) gekennzeichneten Bereichs des Farbdreiecks erwartet werden. Der Unbuntpunkt (x = 0,33, y = 0,33) ist mit „+“ gekennzeichnet. The color coordinates of the mixed light can be expected within the area of the color triangle marked a). The achromatic point (x = 0.33, y = 0.33) is marked “+”. OHA01435 520 530 540 550 560 570 580 590 600 610 620 630 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9

Maßzeichnung8) Seite 19 Package Outlines8) page 19 Gewicht / Approx. weight: 35 mg Gurtung / Polarität und Lage8) Seite 19 Verpackungseinheit 8000/Rolle, ø330 mm Method of Taping / Polarity and Orientation8) page 19 Packing unit 8000/reel, ø330 mm Package marking GPLY6900 2.6 (0.102) 2.1 (0.083) 2.3 (0.091) 3.0 (0.118) 0.8 (0.031) 0.6 (0.024) 3.0 (0.118) 3.4 (0.134) (2.4 (0.094)) 3.3 (0.130) 3.7 (0.146) 0.5 (0.020) 1.1 (0.043) 0.1 (0.004) typ 4˚±1 0.6 (0.024) 1.7 (0.067) 2.1 (0.083) 0.9 (0.035) 0.7 (0.028) C A C C Circuit Diagram

1 Cathode Hyper-red(H)

2 Anode H, G, B

3 Cathode Blue (B)

4 Cathode Green (G)

3.6 (0.142) 3.5 (0.138) 2 (0.079) 1.75 (0.069) 8 (0.315) CA CC

Empfohlenes Lötpaddesign8) Seite 19 IR Reflow Löten Recommended Solder Pad8) page 19 IR Reflow Soldering Empfohlenes Lötpaddesign8) Seite 19 Wellenlöten (TTW) Recommended Solder Pad8) page 19 TTW Soldering OHLPY439 Padgeometrie für verbesserte Wärmeableitung improved heat dissipation Paddesign for Lötstoplack Solder resist 1.1 (0.043) 4.5 (0.177) 1.5 (0.059) 2.6 (0.102) 3.3 (0.130) 0.5 (0.020) 7.5 (0.295) 0.4 (0.016) Cathode marking Kathoden Markierung / Cu Fläche / 12 mm per pad2 Cu-area 3.3 (0.130) OHAY0583 6.1 (0.240) 2.8 (0.110) 2 (0.079) 3 (0.118) 6 (0.236) 3.5 (0.138) 1.5 (0.059) 2 (0.079) 8 (0.315) 7.5 (0.295) Solder resist Lötstoplack PCB-direction Bewegungsrichtung der Platine 2 (0.079) Padgeometrie für improved heat dissipation verbesserte Wärmeableitung Paddesign for 2Cu Fläche / > 12 mm per pad Cu-area

Lötbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Conditions Preconditioning acc. to JEDEC Level 2 IR-Reflow Lötprofil (nach IPC 9501) IR Reflow Soldering Profile (acc. to IPC 9501) Wellenlöten (TTW) (nach CECC 00802) TTW Soldering (acc. to CECC 00802) OHLY0597 50 100 150 200 250 100 150 200 250 300 T t C s 240-245 C 10-40 s 183 C 120 to 180 s defined for Preconditioning: up to 6 K/s ramp-down rate up to 6 K/s ramp-up rate up to 6 K/s defined for Preconditioning: 2-3 K/s OHLY0598 50 100 150 200 250 100 150 200 250 300 T t C s 235 C 10 s C... 260 1. Welle 1. wave 2. Welle 2. wave

5 K/s 2 K/sca 200 K/s

CC... 130100

2 K/s

Zwangskühlung forced cooling Normalkurve standard curve Grenzkurven limit curves

Barcode-Produkt-Etikett (BPL) Barcode-Product-Label (BPL) Gurtverpackung Tape and Reel Tape dimensions in mm (inch) W P0 P1 P2 D0 E F 4 ± 0.1 (0.157 ± 0.004) 4 ± 0.1 (0.157 ± 0.004) 2 ± 0.05 (0.079 ± 0.002) 1.5 + 0.1 (0.059 + 0.004) 1.75 ± 0.1 (0.069 ± 0.004) 3.5 ± 0.05 (0.138 ± 0.002) Reel dimensions in mm (inch) A W Nmin W1 W2 max Sam ple OHA02043 X - X - X(G) GROUP: Lot Number(1T) LOT NO: (9D) D/C: Date Code (X) PROD NO: Product Code (6P) BATCH NO: Batch Number Lx xxxx Product Name Bin1: Bin Information Color 1 Bin2: Bin3: ML Temp ST

245 C R

260 C T2

PACKVAR: Packing Type Product Quantity per Reel(Q)QTY: Semiconductors OSRAM Opto Wavelength Rank Forward Voltage Rank Brightness Rank Bar Code Bar Code Bar Code W FE Direction of unreeling N A OHAY0324 Label Gurtvorlauf: Leader: Trailer: Gurtende: 13.0 Direction of unreeling ±0.25 160 mm 160 mm 400 mm 400 mm 8 + 0.3 – 0.1

Trockenverpackung und Materialien Dry Packing Process and Materials Anm.: Feuchteempfindliche Produkte sind verpackt in einem Trockenbeutel zusammen mit einem Trockenmittel und einer Feuchteindikatorkarte Bezüglich Trockenverpackung finden Sie weitere Hinweise im Internet und in unserem Short Form Catalog im Kapitel “Gurtung und Verpackung” unter dem Punkt “Trockenverpackung”. Hier sind Normenbezüge, unter anderem ein Auszug der JEDEC-Norm, enthalten. Note: Moisture-senisitve product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet and in the Short Form Catalog in chapter “Tape and Reel” under the topic “Dry Pack”. Here you will also find the normative references like JEDEC. Kartonverpackung und Materialien Transportation Packing and Materials OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparator check dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, M oistu re Lev el 3 Flo or tim e

168 Hours Moi

s a) Humidi ty Ind ica tor Car d is > 1 0% when rea d at ˚C ± 5 ˚C , or ref low, vap or hase reflow, or eq uiva lent p roces sing (peak pa ckage 2. Aft er this bag is op ene devices th at will be subject ed to inf rared She lf l ife in seal ed b ag: mon th s at ˚C a nd < 90 relati ve h um idi ty (R H). Mois tur e L ev el 5a at fa ctor y conditions of (if b lank , seal date i s identical with date code). a) M ounted within Sto red atbo dy temp. Dev ices re quire ba king , bef ore mo unt ing, if: Bag sea l d ate M oist ure Lev el 1 M oist ur e Level 2 Mo isture L evel 2a4. If baki ng is re quire b) 2 a or is not m et. Dat e and tim e op ened: refere nc e IPC /JEDEC J -STD-033 for b ake procedu re. Floo r tim e s ee be low If bl an k, se e ba r cod e labe l Flo or tim e > 1 Ye ar Floor time

1 Yea

r Floor time 4 W eeks10% R Moi sture L ev el 4 M oistur e Level 5 OPT O SEM ICONDUCTORS MOISTURE SENSI TIVE Thi s bag contai ns CAUTION Flo or t im e H ours Fl oor time Hou rs Flo or tim e 2 4 H our s 30 ˚C /60% RH LEVEL If blank , see ba r code label OHA02044 PACKVAR: R077Additional TEXT P-1+Q-1Multi TOPLED Muster OSRAM OptoSemiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 11(1T) LOT NO: 210021998 123GH1234 0 245 (Q)QTY: 2000 0144 (G) GROUP:

260 C RT240 C R

220 C RML

Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY PACKVAR: R077Additional TEXT P-1+Q-1Multi TOPLED Muster OSRAM OptoSemiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 11(1T) LOT NO: 210021998 123GH1234 0 245 (Q)QTY: 2000 0144 (G) GROUP: Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY OSRAM Barcode label Packing Sealing label Barcode label Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH). Moisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) Mounted within b) Stored at body temp. 3. Devices require baking, before mounting, if: Bag seal date Moisture Level 1 Moisture Level 2 Moisture Level 2a 4. If baking is required, b) 2a or 2b is not met. Date and time opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor time see below If blank, see bar code label Floor time > 1 Year Floor time 1 Year Floor time 4 Weeks 10% RH._< Moisture Level 4 Moisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag containsCAUTION Floor time 72 Hours Floor time 48 Hours Floor time 24 Hours 30 ˚C/60% RH. LEVEL If blank, seebar code label

Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components9) page 19 may only be used in life-support devices or systems 10) page 19 with the express written approval of OSRAM OS. Revision History: 2005-03-03 Previous Version: 2004-08-13 Page Subjects (major changes since last revision) Date of change 4 Durchlassspannung / Forward voltage (typ.)

2 Luminous intensity grouping (B)

3, 4 value (reverse voltage) 2002-09-18 3, 4 hyper-red & blue: value (reverse voltage from 12 V to 5 V) 2003-02-11 3 ambient temperature 2003-09-09 all new template 2004-03-09 all Product Discontinuation 2005-03-03

Fußnoten: 1) Helligkeitswerte werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ± 11% ermittelt. 2) Die LED kann kurzzeitig in Sperrichtung betrieben werden. 3) RthJA ergibt sich bei Montage auf PC-Board FR 4 (Padgröße ≥ 16 mm2 je Pad) 4) Wellenlängen werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ±1 nm ermittelt. 5) Spannungswerte werden mit einer Stromeinprägedauer von 1 ms und einer Genauigkeit von ±0,1 V ermittelt. 6) Wegen der besonderen Prozessbedingungen bei der Herstellung von LED können typische oder abgeleitete technische Parameter nur aufgrund statistischer Werte wiedergegeben werden. Diese stimmen nicht notwendigerweise mit den Werten jedes einzelnen Produktes überein, dessen Werte sich von typischen und abgeleiteten Werten oder typischen Kennlinien unterscheiden können. Falls erforderlich, z.B. aufgrund technischer Verbesserungen, werden diese typischen Werte ohne weitere Ankündigung geändert. 7) Im gestrichelten Bereich der Kennlinien muss mit erhöhten Helligkeitsunterschieden zwischen Leuchtdioden innerhalb einer Verpackungseinheit gerechnet werden. 8) Maße werden wie folgt angegeben: mm (inch) 9) Ein kritisches Bauteil ist ein Bauteil, das in lebenserhaltenden Apparaten oder Systemen eingesetzt wird und dessen Defekt voraussichtlich zu einer Fehlfunktion dieses lebenserhaltenden Apparates oder Systems führen wird oder die Sicherheit oder Effektivität dieses Apparates oder Systems beeinträchtigt. 10) Lebenserhaltende Apparate oder Systeme sind für (a) die Implantierung in den menschlichen Körper oder (b) für die Lebenserhaltung bestimmt. Falls sie versagen, kann davon ausgegangen werden, dass die Gesundheit und das Leben des Patienten in Gefahr ist. Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. Remarks: 1) Brightness groups are tested at a current pulse duration of 25 ms and a tolerance of ± 11%. 2) Driving the LED in reverse direction is suitable for short term application. 3) RthJA results from mounting on PC board FR 4 (pad size ≥ 16 mm2 per pad) 4) Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of ±1 nm. 5) Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of ±0.1 V. 6) Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 7) In the range where the line of the graph is broken, you must expect higher brightness differences between single LEDs within one packing unit. 8) Dimensions are specified as follows: mm (inch) 9) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. 10) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered.