LDT4032 LEIDITECH

Document overview

  • Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
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Technical content

FEATURES

 Improved component design in a compact case  High surge current capability of up to 3.5 kA  Superior performance at high temperature  White package design without shadow in LED lighting application  SMD mountable disk varistors, suitable for lead-free reflow / wave soldering

APPLICATIONS

 Power supplies for telecommunication systems  Protection for LED circuits  Protection for consumer, industrial equipment  P rotection for automotive electronics APPLICABLE STANDARDS  UL1449  IEC61051-1, -2, -2-2, IEC60950-1 Annex Q  GB/T10193, GB/T10194, GB4943.1, GB8898  IEC61000-4-5 TYPE CODE DESIGNATION LDT 4032 - 471 H Varistor voltage V1mA: 47×10 =470 V Tolerance of varistor voltage at 1 mA: ±10%(V 1mA GENERALTECHNICALDATA Parameter Value Unit Operating temperature -55 to +125 ℃ Storage temperature -55 to +150 ℃ Electric strength 2.5 kV RMS Insulation resistance 100 MΩ Leiditech: logo High absorption SMD Disc Varisttors LDT4032 Series Rev 2.0 : www.leiditech.com 12.01.2019 1/7

a=125℃) SM D Types IA Case 40×32 in inch) Cont inuous Voltage Peak Current (8/ 20 μs) Ener gy ms) Rat ed Power Max Ma x Max VRMS VDC (1 ti me) (2 times) (1 time) [V] [V] [A] [A] [J] [mW] LDT 4032 - 271H 175 225 2500 1500 400 LDT 4032 - 391H 250 320 2500 1500 50 400 LDT 4032 - 431H 275 350 2500 1500 55 400 LDT 4032 - 471H 300 385 2500 1500 60 400 LDT 4032 - 511H 320 420 2500 1500 67 400 LDT 4032 - 561H 350 460 2500 1500 67 400 LDT 4032 - 621H 385 505 2500 1500 67 400 LDT 4032 - 681H 420 560 2500 1500 67 400 LDT 4032 a=25℃) SM D Types IA Case 40×32 in inch) Varistor Voltage at 1 mA Clamping Voltage at Class Current (8/20 μs) Class Current (8/20 μs) Capacitance Max (±1 0%) (at 1 kHz) [V] [V] [A] [pF] LDT 4032 - 271H 270 455 25 350 LDT 4032 - 391H 390 650 25 300 LDT 4032 - 431H 430 710 25 270 LDT 4032 - 471H 470 775 25 230 LDT 4032 - 511H 510 845 25 210 LDT 4032 - 561H 560 930 25 200 - 681 H 680 1120 25 170 LDT4032 Series Rev 2.0 : www.leiditech.com 12.01.2019 2/7

e usage of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of the PCB. The components are suitable for reflow soldering per JEDEC J-STD-020C. - Wav e soldering Temper ature 250 300 Ti me 2K/s 0 50 100 150 200 s 250 100 150 200 100℃~130℃ 235℃~260℃ appr ox. 200K/s 1st wave 2nd w ave 5K/s 2K/s Forced cooling Normal c urve Limit curve s Te mperature characteristics at component terminal with dual-wave soldering LDT4032 Series Rev 2.0 : www.leiditech.com 12.01.2019 3/7

  • Re flow soldering Tem perature TS(m in) TS( max) TL TP tp tL time t o peak temperatue Time 25 ℃ to pea k) Ramp-up Ramp-down Preheat Critical Zone TL to TP ts Pr ofile feature Sn-Pb assembly Pb-Free assembly Av erage ramp-up rate (TSma x to Tp) 3℃/se c. Max 3℃/sec. Max Pr eheat -Temperature min. (Ts(m in)) +100℃ +150 -Te mperature max.(Ts( max)) +150℃ +200 -Ti me (tSm in to tSma x) 60-120 secs. 60-180 secs. Ts(m ax) to TL - Ram p-up Rate 3℃/sec. Max 3℃/sec. Max Ti me maintained above -Temperature min. (TL) +183℃ +217 -Time (tL) 60-15 0 secs. 60-150 secs. Pe ak classification temperature (Tp) +220 Tim e within 5℃of actual peak temperature (tp) 10 secs. to 30 secs. 20 secs. to 40 secs. Ram p-down rate 6℃/sec. max. 6℃/sec. max. Ti me 25℃ to peak temperature 6 min. max. 8 min. max. Not es: All temperature refer to topside of the package, measured on the package body surface Maximum number of reflow cycles: 3 ST ORAGE CONDITION - As far as possible, the components should be employed within 24 months after delivery from Kangtai Semiconductor. - Th ey should be left in their original packing to avoid soldering problems due to oxidized contacts. - Storage temperature: − 25 up to + 45°C. - Rel ative humidity: < 75 % annual average, < 95 % on max. 30 days in a year. LDT4032 Series Rev 2.0 : www.leiditech.com 12.01.2019 4/7

e h d Dimens ions Millimeters InchesRef. Min. l 10.1 Max. 10.7 Min. Max.Typ. Typ. 0.398 0.42110.4 0.409 d h e 0.3 0.012 B RE COMMENDED SOLDER PAD LAYOUT Di mensions Millimeters InchesRef. Min. A B Max. Min. Max. C 6.5 Typ. Typ. 2.8 3.5 B A C 265 0.110 0.138 D D 12 .1 0.476 TEMPER ATUREDERATINGCURVE 100 110 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 Per missible percentage of Max. ratings [%] Am bient temperature [℃] Max. current, energy, operating voltage and average power dissipation depending on ambient temperature LDT4032 Series Rev 2.0 : www.leiditech.com 12.01.2019 5/7

G AND PACKAGING SPECIFICATION ACCORDING TO IEC 60286-3 G F E W PD P 0 2 T T Di rection of unreeling 40 min. empt y cavities 25 min. empty cavities 300 mm c over tape Leader Tape end (trailer) LDT4032 Series Rev 2.0 : www.leiditech.com 12.01.2019 6/7

el diameter A 328 330 - 12.91 12.99 - Ree l width (inside) W1 - 16.4 17.9 - 0.646 0.705 Ree l width (outside) W2 - - 22.4 - - 0.882 1) Q uantity of taping packing(pcs): 1000 - D imensions of packing Def inition Symbol Dimension Mil limeters inches Min Co Co Spr ocket hole diameter D0 - 1.5 - - 0.059 - Spr Di stance center hole to center compartment Pi tch of the component compartments Tape Di Di stance center hole to center Di stance compartment to edge G 0.75 - - 0.295 - - Ov erall thickness T2 - - 5.5 - - 0.217 Thi ckness tape T - - 0.3 - - 0.012 LDT4032 Series Shangh ai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev 2.0 : www.leiditech.com 12.01.2019 7/7