LDT3220 LEIDITECH

Document overview

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Technical content

FEATURES

 Improved component design in a compact case  High surge current capability  Superior performance at high temperature  SMD mountable disk varistors, suitable for lead-free reflow / wave soldering

APPLICATIONS

 Power supplies for telecommunication systems  Protection for LED circuits  Protection for consumer, industrial equipment  P rotection for automotive electronics APPLICABLE STANDARDS  UL1449  VDE (IEC61051-1, -2, -2-2, IEC60950-1Annex Q)  CQC (GB/T10193, GB/T10194, GB4943.1, GB8898) TYPE CODE DESIGNATION 3220 - 471 H Varistor voltage V1mA: 47×10 =470 V Tolerance of varistor voltage at 1 mA: ±10%(V 1mA GENERALTECHNICALDATA Parameter Value Unit Operating temperature -55 to +125 ℃ Storage temperature -55 to +150 ℃ Electric strength 2.5 kV RMS Insulation resistance 100 MΩ LDT High absorption SMD Disc Varisttors LDT3220 Series Rev 2.0 : www.leiditech.com 12.01.2019 1/7 Leiditech: logo

a=125℃) SM D Types IA Case 32×20 in inch) Cont inious Voltage Peak Current Energy Rated Power Max Ma x Max VRMS VDC (8 /20 μs, 1 time) (2 ms, 1 time) [V] [V] [A] [J] [mW] LDT322 0 - 271H 175 225 1250 8.0 200 LDT 3220 - 391H 250 320 1250 12.0 200 LDT 3220 - 431H 275 350 1250 13.5 200 LDT 3220 - 471H 300 385 1250 15.0 200 LDT 3220 - 511H 320 420 1250 16.0 200 350 460 1250 16.5 200 LDT 3220 - 681H 420 560 1250 18.0 200 a=25℃) SM D Types IA Case 32×20 in inch) Varistor Voltage at 1 mA Clamping Voltage at Class Current (8/20 μs) Class Current (8/20 μs) Capacitance Max (±1 0%) (at 1 kHz) [V] [V] [A] [pF] LDT 3220 - 271H 270 455 10 170 LDT 3220 - 391H 390 650 10 120 LDT 3220 - 431H 430 710 10 120 LDT 3220 - 471H 470 775 10 110 LDT 3220 - 511H 510 845 10 105 LDT 3220 - 561H 560 930 10 100 LDT 3220 - 621H 620 1025 10 95 LDT 3220 - 681H 680 1120 10 90 LDT3220 Series Rev 2.0 : www.leiditech.com 12.01.2019 2/7

e usage of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of the PCB. The components are suitable for reflow soldering per JEDEC J-STD-020C. - Wav e soldering Temper ature 250 300 Ti me 2K/s 0 50 100 150 200 s 250 100 150 200 100℃~130℃ 235℃~260℃ appr ox. 200K/s 1st wave 2nd w ave 5K/s 2K/s Forced cooling Normal cu rve Limit curve s Te mperature characteristics at component terminal with dual-wave soldering LDT3220 Series Rev 2.0 : www.leiditech.com 12.01.2019 3/7

  • Re flow soldering Tem perature TS(m in) TS( max) TL TP tp tL time t o peak temperatue Time (t 2 5℃ to pea k) Ramp-up Ramp-down Preheat Critical Zone TL to TP ts Pr ofile feature Sn-Pb assembly Pb-Free assembly Av erage ramp-up rate (TSma x to Tp) 3℃/sec. Max 3℃/sec. Max Pr eheat -Temperature min. (Ts(m in)) +100℃ +150 -Te mperature max.(Ts(m ax)) +150℃ +200 -Ti me (tSm in to tSma x) 60-120 se cs. 60-180 secs. Ts(m ax) to TL - Ram p-up Rate 3℃/sec. Max 3℃/sec. Max Ti me maintained above -Temperature min. (TL) +183℃ +217 -Time (tL) 60-15 0 secs. 60-150 secs. Pe ak classification temperature (Tp) +220 Tim e within 5℃of actual peak temperature (tp) 10 secs. to 30 secs. 20 secs. to 40 secs. Ram p-down rate 6℃/sec. max. 6℃/sec. max. Ti me 25℃ to peak temperature 6 min. max. 8 min. max. Not es: All temperature refer to topside of the package, measured on the package body surface Maximum number of reflow cycles: 3 ST ORAGE CONDITION - As far as possible, the components should be employed within 24 months after delivery from Kangtai Semiconductor. - Th ey should be left in their original packing to avoid soldering problems due to oxidized contacts. - Storage temperature: − 25 up to + 45°C. - Rel ative humidity: < 75 % annual average, < 95 % on max. 30 days in a year. LDT3220 Series Rev 2.0 : www.leiditech.com 12.01.2019 4/7

Millimeters InchesRef. Min. l w h d e f 7.7 6.0 3.1 1.2 Max. 8.3 6.6 4.0 1.8 0.3 Min. Max.Typ. Typ. 2.7 3.3 0.303 0.236 0.122 0.047 0.327 0.260 0.150 0.071 0.012 0.106 0.130 l e w h h f d RE COMMENDED SOLDER PAD LAYOUT B A C Dim ensions Millimeters InchesRef. Min. A B Max. Min. Max. C 4.5 Typ. Typ. 2.8 3.5 0.177 0.110 0.138 TEMPER ATUREDERATINGCURVE 100 110 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 Per missible percentage of Max. ratings [%] Am bient temperature [℃] Max. current, energy, operating voltage and average power dissipation depending on ambient temperature LDT3220 Series Rev 2.0 : www.leiditech.com 12.01.2019 5/7

G AND PACKAGING SPECIFICATION ACCORDING TO IEC 60286-3 G F E W PD P 0 2 T T Di rection of unreeling 40 m in. empt y cavities 25 m in. empty cavities 300 mm c over tape Leader Tape end (trailer) LDT3220 Series Rev 2.0 : www.leiditech.com 12.01.2019 6/7

el diameter A 328 - 330 12.91 12.99 Ree l width (inside) W1 16.4 - 17.9 0.646 - 0.705 Ree l width (outside) W2 - - 22.4 - - 0.882 1) Q uantity of taping packing(pcs): 1000 - Di mensions of packing Def inition Symbol Dimension Mi llimeters inches Min Co Co Spr ocket hole diameter D0 1.5 - 1.6 0.059 - 0.063 Spr Di stance center hole to center compartment Pi tch of the component compartments Tape w Di Di stance center hole to center Di stance compartment to edge G 0.75 - - 0.030 - - Ov erall thickness T2 - - 5.5 - - 0.217 Thi ckness tape T - - 0.3 - - 0.012 LDT3220 Series Shangh ai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev 2.0 : www.leiditech.com 12.01.2019 7/7