LDAN222T1G LEIDITECH

Document overview

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Technical content

  1. FEATURES
  • Fast Trr
  • Low CD
  • We declare that the material of product compliance with RoHS requirements and Halogen Free.
  • S- prefix for automotive and other applications requiring unique site and control change requirements; AEC-Q101 qualified and PPAP capable. 2. DEVICE MARKING AND RESISTOR VALUES 3. MAXIMUM RATINGS(Ta = 25º C) Reverse Voltage Peak Reverse Voltage Forward Current Peak Forward Current Peak Forward Surge Current(Note 1) 4. THERMAL CHARACTERISTICS Power Dissipation Junction Temperature Storage Temperature Range 1. t = 1 µ S Shipping 3000/Tape&Reel 10000/Tape&Reel Symbol LDAN222T1G S-LDAN222T1G Common Cathode Silicon Dual Switching Diode LDAN222T3G N9 Device Marking LDAN222T1G N9 Parameter Symbol Limits Unit VR 80 V IF 100 mA VRM 80 V IFM 300 mA Tj Tstg 150 150 mW IFSM 2 A Parameter Limits Unit PD -55~+150 ℃ SC89 CATHODE ANODE ANODE Rev : www.leiditech.com 01.06.2018 1/4
  1. ELECTRICAL CHARACTERISTICS (Ta= 25ºC) Characteristic Reverse Voltage Leakage Current (VR = 70 V) Forward Voltage (IF = 100 mA) Reverse Breakdown Voltage (IR = 100 µ A ) Diode Capacitance (VR = 6.0 V, f = 1.0 MHz) Reverse Recovery Time (IF = 5.0 mA, VR = 6.0 V, RL = 100 Ω, Irr = 0.1 IR) CD Trr ns V pF - - 3.5 - - 4.0 -80 - VR Unit IR - - 0.1 VF V - - 1.2 µA Typ. Max.Symbol Min. LDAN222T1G S-LDAN222T1G Rev : www.leiditech.com 01.06.2018 2/4

6.ELECTRICAL CHARACTERISTICS CURVES 0.3 0.32 0.34 0.36 0.38 0.4 0.42 0.44 0.46 0 10 20 30 40 50 CT,Capacitor(pF) VR,Reverse Voltage(V) f=1MHz Ta=25℃ 1.00E-10 1.00E-09 1.00E-08 1.00E-07 1.00E-06 1.00E-05 1.00E-04 0 20 40 60 80 100 VR,Reverse Voltage(V) 150℃ 85℃ 25℃ -55℃ 0.0001 0.001 0.01 0.1 IF,Forward Current(A) VF,Forward Voltage(V) 150 ℃ 85℃ 25℃ -55℃ IF vs. VF IR vs. VR CT vs. VR IR,Reverse Current(A) LDAN222T1G S-LDAN222T1G Rev : www.leiditech.com 01.06.2018 3/4

7.OUTLINE AND DIMENSIONS Notes: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 8.SOLDERING FOOTPRINT L 1.10REF 0.043REF 0.013 INCHES MIN NOM MAX MIN NOM MAX G H 0.50BSC 0.020BSC 0.53REF 0.021REF C 0.067 DIM MILLIMETERS LDAN222T1G S-LDAN222T1G Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : www.leiditech.com 01.06.2018 4/4