LBY1SG

LBY1SG OSRAM

Document overview

• Manufacturer or author: Provided By www.digicamel.com(free datasheet download site)
• PDF pages: 23

Technical content

1 | Version 1.2 | 2024-03-08 www.osram-os.com LB Y1SG Datasheet Published by ams-OSRAM AG Tobelbader Strasse 30, 8141 Premstaetten, Austria Phone +43 3136 500-0 ams-osram.com © All rights reserved

2 | Version 1.2 | 2024-03-08 Micro SIDELED® 2808 LB Y1SG Micro SIDELED is a SMT LED with side emission. Due to its low package height it is ideal for applications in limited space environments.

Applications

• Access Control & Security - Factory Automation - Home & Building Automation - Material Processing - Projection & Display - Robotics

Features

• Package: white SMT package, colorless clear resin - Chip technology: InGaN on Sapphire - Typ. Radiation: 120° (Lambertian emitter) - Color: λdom = 470 nm (● blue) - Optical efficacy: 25 lm/W - Corrosion Robustness Class: 1B - ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

3 | Version 1.2 | 2024-03-08

Ordering Information

Type Luminous Intensity 1) Ordering Code IF = 20 mA Iv LB Y1SG-T1U2-35-1 280 ... 710 mcd Q65113A3369

4 | Version 1.2 | 2024-03-08 Maximum Ratings Parameter Symbol Values Operating Temperature Top min. max. -40 °C 85 °C Storage Temperature Tstg min. max. -40 °C 100 °C Junction Temperature Tj max. 95 °C Forward current TA = 25 °C IF min. max. 5 mA 30 mA Surge Current t ≤ 10 µs; D = 0.005 ; TA = 25 °C IFS max. 300 mA ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD 2 kV Reverse voltage 2) VR Not designed for reverse operation

5 | Version 1.2 | 2024-03-08 Characteristics IF = 20 mA; TA = 25 °C Parameter Symbol Values Dominant Wavelength 3) λdom min. typ. max. 464 nm 470 nm 476 nm Viewing angle at 50% IV 2φ typ. 120 ° Forward Voltage 4) IF = 20 mA VF min. typ. max. 2.40 V 2.85 V 3.20 V Reverse current 2) IR Not designed for reverse operation Real thermal resistance junction/solderpoint 5) RthJS real typ. max.

113 K / W

148 K / W

Electrical thermal resistance junction/solderpoint 5) with efficiency ηe = 44 % RthJS elec. typ. max.

63 K / W

83 K / W

6 | Version 1.2 | 2024-03-08 Brightness Groups Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 6) IF = 20 mA IF = 20 mA IF = 20 mA min. max. typ. Iv Iv ΦV T1 280 mcd 355 mcd 950 mlm T2 355 mcd 450 mcd 1210 mlm U1 450 mcd 560 mcd 1520 mlm U2 560 mcd 710 mcd 1910 mlm Forward Voltage Groups Group Forward Voltage 4) Forward Voltage 4) IF = 20 mA IF = 20 mA min. max. VF VF J 2.40 V 2.60 V K 2.60 V 2.80 V L 2.80 V 3.00 V M 3.00 V 3.20 V Wavelength Groups Group Dominant Wavelength 3) Dominant Wavelength 3) min. max. λdom λdom 3 464 nm 468 nm 4 468 nm 472 nm 5 472 nm 476 nm

7 | Version 1.2 | 2024-03-08 Group Name on Label Example: T1-3-J Brightness Wavelength Forward Voltage T1 3 J

8 | Version 1.2 | 2024-03-08 Relative Spectral Emission 6) Irel = f (λ); IF = 20 mA; TA = 25 °C LB Y1SG 350 400 450 500 550 600 650 700 750 800 850 λ /n m 0,0 0,2 0,4 0,6 0,8 1,0Irel :V λ :b lue Radiation Characteristics 6) Irel = f (ϕ); TA = 25 °C LB Y1SG -100° -90° -80° -70° -60° -50° -40° -30° ϕ /° 0,0 0,2 0,4 0,6 0,8 1,0 Irel

9 | Version 1.2 | 2024-03-08 Forward current 6) IF = f(VF); TA = 25 °C LB Y1SG VF /V 30IF /m A Relative Luminous Intensity 6), 7) Iv/Iv(20 mA) = f(IF); TA = 25 °C LB Y1SG 5 10 15 20 25 30 IF /m A 0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4IV IV(20mA) Dominant Wavelength 6) Δλdom = f(IF); TA = 25 °C LB Y1SG 5 10 15 20 25 30 IF /m A ∆λ dom /n m

10 | Version 1.2 | 2024-03-08 Forward Voltage 6) ΔVF = VF - VF(25 °C) = f(Tj); IF = 20 mA LB Y1SG -40- 20 02 04 06 08 0 Tj /° C -0,3 -0,2 -0,1 0,0 0,1 0,2 0,3∆VF /V Relative Luminous Intensity 6) Iv/Iv(25 °C) = f(Tj); IF = 20 mA LB Y1SG -40- 20 02 04 06 08 0 Tj /° C 0,0 0,2 0,4 0,6 0,8 1,0 1,2Iv Iv(25°C) Dominant Wavelength 6) Δλdom = λdom - λdom(25 °C) = f(Tj); IF = 20 mA LB Y1SG -40- 20 02 04 06 08 0 Tj /° C 3∆λ dom /n m

11 | Version 1.2 | 2024-03-08 Max. Permissible Forward Current 5) IF = f(T) 02 04 06 08 0 Ts /° C IF /m A LB Y1SG Do not use below 5m A Permissible Pulse Handling Capability IF = f(tp); D: Duty cycle; TA = 25 °C 10-6 10-5 10-4 10-3 0,01 0,11 10 Pulset ime /s 0,04 0,06 0,08 0,10 0,12IF /A TS =0 °C ... 85°C LB Y1SG :D =1 .0 :D =0 .5 :D =0 .2 :D =0 .1 :D =0 .05 :D =0 .02 :D =0 .01 :D =0 .005 Permissible Pulse Handling Capability IF = f(tp); D: Duty cycle; TA = 85 °C 10-6 10-5 10-4 10-3 0,01 0,11 10 Pulset ime /s 0,04 0,06 0,08 0,10 0,12IF /A TS = 85°C LB Y1SG :D =1 .0 :D =0 .5 :D =0 .2 :D =0 .1 :D =0 .05 :D =0 .02 :D =0 .01 :D =0 .005

12 | Version 1.2 | 2024-03-08 Dimensional Drawing 8) Further Information: Approximate Weight: 5.0 mg Corrosion test: Class: 1B Test condition: 25°C / 75 % RH / 200ppb SO2, 200ppb NO2, 10ppb H2S, 10ppb Cl2 / 21 days (EN 60068-2-60 (Method 4))

13 | Version 1.2 | 2024-03-08 Electrical Internal Circuit

14 | Version 1.2 | 2024-03-08 Recommended Solder Pad 8) For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning.

15 | Version 1.2 | 2024-03-08 Reflow Soldering Profile Product complies to MSL Level 4 acc. to JEDEC J-STD-020E 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS 60 100 120 s Ramp-up rate to peak*) TSmax to TP 2 3 K/s Liquidus temperature TL 217 °C Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 10 20 30 s Ramp-down rate* TP to 100 °C 3 6 K/s Time 25 °C to TP 480 s All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

16 | Version 1.2 | 2024-03-08 Taping 8)

17 | Version 1.2 | 2024-03-08 Tape and Reel 9) Reel Dimensions A W Nmin W1 W2 max Pieces per PU 180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 2000

18 | Version 1.2 | 2024-03-08 Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparator check dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, M oisture Level 3 Floor tim e 168 Hours M oisture Level 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 m onths at < 40 ˚C and < 90% relative hum idity (RH). M oisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) M ounted within b) Stored at body tem 3. Devices require baking, before m ounting, if: Bag seal date M oisture Level 1 M oisture Level 2 M oisture Level 2a4. If baking is required, b) 2a or 2b is not m et. Date and tim e opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor tim e see below If blank, see bar code label Floor tim e > 1 Year Floor tim e 1 Year Floor tim e 4 W eeks10% RH. M oisture Level 4 M oisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag contains CAUTION Floor tim e 72 Hours Floor tim e 48 Hours Floor tim e 24 Hours 30 ˚C/60% RH. LEVEL If blank, see bar code label Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

19 | Version 1.2 | 2024-03-08 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo- sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita- tion, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There- fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related information please visit https://ams-osram.com/support/application-notes

20 | Version 1.2 | 2024-03-08 Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on our website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications Our components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. Our products are not qualified at module and system level for such application. In case buyer – or customer supplied by buyer – considers using our components in product safety devices/ applications or medical devices/applications, buyer and/or customer has to inform our local sales partner immediately and we and buyer and /or customer will analyze and coordinate the customer-specific request between us and buyer and/or customer.

21 | Version 1.2 | 2024-03-08 Glossary 1) Brightness: Brightness groups are tested at a current pulse duration of 25 ms and a tolerance of ±11 %. 2) Reverse Operation: Not designed for reverse operation. Continuous reverse operation can cause mi- gration and damage of the device. 3) Wavelength: Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of ±1 nm. 4) Forward Voltage: Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of ±0.1 V. 5) Thermal Resistance: Rth max is based on statistic values (6σ) used for Derating. 6) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic- es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif- fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 7) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ- ences between single devices within one packing unit. 8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 9) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

22 | Version 1.2 | 2024-03-08

Revision History

1.0 2021-09-20 Initial Version 1.1 2022-03-17 New Layout Derating (Diagrams) 1.2 2024-03-08 Applications Notes

23 | Version 1.2 | 2024-03-08 Published by ams-OSRAM AG Tobelbader Strasse 30, 8141 Premstaetten, Austria Phone +43 3136 500-0 ams-osram.com © All rights reserved