LBAS16LT1G LEIDITECH
Document overview
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Technical content
Continuous Reverse Voltage V R
75 Vdc
F 200 mAdc Peak Forward Surge Current I FM(surge) 500 mAdc THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation FR– 5 Board, (1) P D 225 mW T A = 25°C Derate above 25°C 1.8 mW/°C Thermal Resistance, Junction to Ambient R θJA 556 °C/W Total Device Dissipation P D 300 mW Alumina Substrate, (2) T A = 25°C Derate above 25°C 2.4 mW/°C Thermal Resistance, Junction to Ambient R θJA 417 °C/W Junction and Storage Temperature T J stg –55 to +150 °C
ELECTRICAL CHARACTERISTICS
(T A = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit OFF CHARACTERISTICS Reverse Voltage Leakage Current I R µAdc R = 75Vdc) — 1.0 R = 75 Vdc, T J = 150°C) — 50 R = 25 Vdc, T J = 150°C) — 30 Reverse Breakdown Voltage V (BR) 75 — Vdc(I BR = 100µAdc) Forward Voltage V F mV F = 1.0 mAdc) — 715 F = 10 mAdc) — 855 F = 50 mAdc) — 1000 F = 150 mAdc) — 1250 Diode Capacitance C D — 2.0 pF(V R = 0, f = 1.0 MHz) Forward Recovery Voltage V FR –- 1.75 Vdc(I F = 10 mAdc, t r = 20ns ) Reverse Recovery Time t rr — 6.0 ns(I F = I R = 10 mAdc, R L = 50Ω) Stored Charge Q S —4 5p C F = 10 mAdc to V R = 5.0Vdc, R L = 500Ω) LBAS16LT1G CATHODE ANODE ƽ DEVICE MARKING AND ORDERING INFORMATION Device Marking Shipping LBAS16LT1G A6 3000/Tape&Reel LBAS16LT3G A6 10000/Tape&Reel We declare that the material of product compliance with RoHS requirements. S- Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable. ƽ S-LBAS16LT1G S-LBAS16LT1G S-LBAS16LT3G Dimensions SOT-23 Pin Configuration Rev : www.leiditech.com 01.06.2015 1/3
Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Millimeters Inches Symbol Min. Nom. Max. Min. Nom. Max. 0.01 0.06 0.10 0.001 0.002 0.004 c 0.09 0.13 0.18 0.003 0.005 0.007 E 1.20 1.30 1.40 0.047 0.051 0.055 L 0.35 0.54 0.69 0.014 0.021 0.029 Symbol Millimeters Inches X 0.80 0.031 0.95 0.037 Y 0.90 0.035 Z 2.00 0.079 Soldering Footprint LBAS16LT1G S-LBAS16LT1G Rev : www.leiditech.com 01.06.2015 3/3