L293x Quadruple Half-H Drivers datasheet (Rev. D)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SLRS008,D]
- PDF pages: 19
Technical content
1,2EN 3,4EN Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community L293,L293D SLRS008D –SEPTEMBER 1986–REVISED JANUARY 2016 L293xQuadrupleHalf-HDrivers
1 Features 3 Description
The L293 and L293D devices are quadruple high- 1• Wide Supply-Voltage Range: 4.5 V to 36 V current half-H drivers. The L293 is designed to• Separate Input-Logic Supply provide bidirectional drive currents of up to 1 A at
- Internal ESD Protection voltages from 4.5 V to 36 V. The L293D is designed to provide bidirectional drive currents of up to 600-mA• High-Noise-Immunity Inputs at voltages from 4.5 V to 36 V. Both devices are• Output Current 1 A Per Channel (600 mA for designed to drive inductive loads such as relays,L293D) solenoids, DC and bipolar stepping motors, as well as
- Peak Output Current 2 A Per Channel (1.2 A for other high-current/high-voltage loads in positive- L293D) supply applications.
- Output Clamp Diodes for Inductive Transient Each output is a complete totem-pole drive circuit, Suppression (L293D) with a Darlington transistor sink and a pseudo- Darlington source. Drivers are enabled in pairs, with
2 Applications drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4
enabled by 3,4EN.• Stepper Motor Drivers The L293 and L293D are characterized for operation• DC Motor Drivers from 0°C to 70°C.• Latching Relay Drivers Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) L293NE PDIP (16) 19.80 mm × 6.35 mm L293DNE PDIP (16) 19.80 mm × 6.35 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Logic Diagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
L293,L293D SLRS008D –SEPTEMBER 1986–REVISED JANUARY 2016 www.ti.com Table of Contents
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (November 2004) to Revision D Page
- Added ESD Ratings and Thermal Information tables, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
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Product Folder Links: L293 L293D
1,2EN VCC2 VCC1 3,4EN L293,L293D www.ti.com SLRS008D –SEPTEMBER 1986–REVISED JANUARY 2016
5 Pin Configuration and Functions
NAME NO. 1,2EN 1 I Enable driver channels 1 and 2 (active high input) <1:4>A 2, 7, 10, 15 I Driver inputs, noninverting <1:4>Y 3, 6, 11, 14 O Driver outputs 3,4EN 9 I Enable driver channels 3 and 4 (active high input) Device ground and heat sink pin. Connect to printed-circuit-board ground plane with multipleGROUND 4, 5, 12, 13 — solid vias VCC1 16 — 5-V supply for internal logic translation VCC2 8 — Power VCC for drivers 4.5 V to 36 V Copyright © 1986–2016, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: L293 L293D
L293,L293D SLRS008D –SEPTEMBER 1986–REVISED JANUARY 2016 www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Supply voltage, VCC1(2) 36 V Output supply voltage, VCC2 36 V Input voltage, VI 7 V Output voltage, VO –3 VCC2 + 3 V Peak output current, IO (nonrepetitive, t ≤ 5 ms): L293 –2 2 A Peak output current, IO (nonrepetitive, t ≤ 100 µs): L293D –1.2 1.2 A Continuous output current, IO: L293 –1 1 A Continuous output current, IO: L293D –600 600 mA Maximum junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to the network ground terminal.
6.2 ESD Ratings
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000ElectrostaticV(ESD) Vdischarge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCC1 4.5 7 Supply voltage V VCC2 VCC1 36 VCC1 ≤ 7 V 2.3 VCC1 V VIH High-level input voltage VCC1 ≥ 7 V 2.3 7 V VIL Low-level output voltage –0.3(1) 1.5 V TA Operating free-air temperature 0 70 °C (1) The algebraic convention, in which the least positive (most negative) designated minimum, is used in this data sheet for logic voltage levels.
6.4 Thermal Information
L293, L293D THERMAL METRIC(1) NE (PDIP) UNIT
16 PINS
RθJA Junction-to-ambient thermal resistance (2) 36.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 22.5 °C/W RθJB Junction-to-board thermal resistance 16.5 °C/W ψJT Junction-to-top characterization parameter 7.1 °C/W ψJB Junction-to-board characterization parameter 16.3 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) The package thermal impedance is calculated in accordance with JESD 51-7.
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Product Folder Links: L293 L293D
6.5 Electrical Characteristics
6.6 Switching Characteristics
6.7 Typical Characteristics
Figure 1. Maximum Power Dissipation vs Ambient Temperature
NOTES: A. C L includes probe and jig capacitance. B. The pulse generator has the following characteristics: t r ≤ 10 ns, tf ≤ 10 ns, tw = 10 µs, PRR = 5 kHz, ZO = 50 Ω.
5 V 24 V
7 Parameter Measurement Information
Figure 2. Test Circuit and Voltage Waveforms
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M M M VCC2 VCC1 L293,L293D www.ti.com SLRS008D –SEPTEMBER 1986–REVISED JANUARY 2016
8 Detailed Description
8.1 Overview
The L293 and L293D are quadruple high-current half-H drivers. These devices are designed to drive a wide array of inductive loads such as relays, solenoids, DC and bipolar stepping motors, as well as other high-current and high-voltage loads. All inputs are TTL compatible and tolerant up to 7 V. Each output is a complete totem-pole drive circuit, with a Darlington transistor sink and a pseudo-Darlington source. Drivers are enabled in pairs, with drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4 enabled by 3,4EN. When an enable input is high, the associated drivers are enabled, and their outputs are active and in phase with their inputs. When the enable input is low, those drivers are disabled, and their outputs are off and in the high-impedance state. With the proper data inputs, each pair of drivers forms a full-H (or bridge) reversible drive suitable for solenoid or motor applications. On the L293, external high-speed output clamp diodes should be used for inductive transient suppression. On the L293D, these diodes are integrated to reduce system complexity and overall system size. A VCC1 terminal, separate from VCC2, is provided for the logic inputs to minimize device power dissipation. The L293 and L293D are characterized for operation from 0°C to 70°C.
8.2 Functional Block Diagram
Output diodes are internal in L293D.
8.3 Feature Description
The L293x has TTL-compatible inputs and high voltage outputs for inductive load driving. Current outputs can get up to 2 A using the L293. Copyright © 1986–2016, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: L293 L293D
8.4 Device Functional Modes
Table 1 lists the fuctional modes of the L293x. Table 1. Function Table (Each Driver)(1) state, regardless of the input levels. Figure 3. Schematic of Inputs for the L293x Figure 4. Schematic of Outputs for the L293 Figure 5. Schematic of Outputs for the L293D
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24 V5 V
9 Application and Implementation
validate and test their design implementation to confirm system functionality.
9.1 Application Information
how to properly connect a two-phase motor to the L293 device.
9.2 Typical Application
Figure 6. Two-Phase Motor Driver (L293)
9.2.1 Design Requirements
- VCC1 should fall within the limits described in the Recommended Operating Conditions.
- VCC2 should fall within the limits described in the Recommended Operating Conditions.
- The current per channel should not exceed 1 A for the L293 (600mA for the L293D).
9.2.2 Detailed Design Procedure
current per channel. Refer to the Power Supply Recommendations as well as the Layout Example.
9.2.3 Application Curve
dissipation. Figure 7 describes thermal dissipation based on Figure 14. Figure 7. Maximum Power and Junction vs Thermal Resistance
9.3 System Examples
9.3.1 L293D as a Two-Phase Motor Driver
enable each channel of the device. Figure 8. Two-Phase Motor Driver (L293D)
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9.3.2 DC Motor Controls
input high and input low voltage levels to enable each channel of the device. Figure 9. DC Motor Controls Table 2. Unidirectional DC Motor Control Figure 10. Bidirectional DC Motor Control Table 3. Bidrectional DC Motor Control
Table 3. Bidrectional DC Motor Control (continued)
9.3.3 Bipolar Stepping-Motor Control
enable each channel of the device. Figure 11. Bipolar Stepping-Motor Control
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10 Power Supply Recommendations
power down supply sequence order requirements. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 12. External Heat Sink Mounting Example (θJA = 25°C/W)
1 Ampere
11 Layout
11.1 Layout Guidelines
ground pins to ground plane of the printed-circuit-board.
11.2 Layout Example
Figure 13. Layout Diagram Figure 14. Example of Printed-Circuit-Board Copper Area (Used as Heat Sink)
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12 Device and Documentation Support
12.1 Related Links
resources, tools and software, and quick access to sample or buy. Table 4. Related Links
12.2 Community Resources
solve problems with fellow engineers. contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
www.ti.com 10-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) L293DNE Active Production PDIP (NE) | 16 25 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 L293DNE L293DNE.A Active Production PDIP (NE) | 16 25 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 L293DNE L293DNEE4 Active Production PDIP (NE) | 16 25 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 L293DNE L293NE Active Production PDIP (NE) | 16 25 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 L293NE L293NE.A Active Production PDIP (NE) | 16 25 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 L293NE L293NEE4 Active Production PDIP (NE) | 16 25 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 L293NE (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
www.ti.com 10-Nov-2025 Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) L293DNE NE PDIP 16 25 506 13.97 11230 4.32 L293DNE.A NE PDIP 16 25 506 13.97 11230 4.32 L293DNEE4 NE PDIP 16 25 506 13.97 11230 4.32 L293NE NE PDIP 16 25 506 13.97 11230 4.32 L293NE.A NE PDIP 16 25 506 13.97 11230 4.32 L293NEE4 NE PDIP 16 25 506 13.97 11230 4.32 Pack Materials-Page 1
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