Download PDFL293x Quadruple Half-H Drivers datasheet (Rev. D)
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L293x Quadruple Half-H Drivers
1 Features
- Wide Supply-Voltage Range: 4.5 V to 36 V
- Separate Input-Logic Supply
- Internal ESD Protection
- High-Noise-Immunity Inputs
- Output Current 1 A Per Channel (600 mA for L293D)
- Peak Output Current 2 A Per Channel (1.2 A for L293D)
- Output Clamp Diodes for Inductive Transient Suppression (L293D)
2 Applications
- Stepper Motor Drivers
- DC Motor Drivers
- Latching Relay Drivers
3 Description
The L293 and L293D devices are quadruple highcurrent half-H drivers. The L293 is designed to provide bidirectional drive currents of up to 1 A at voltages from 4.5 V to 36 V. The L293D is designed to provide bidirectional drive currents of up to 600-mA at voltages from 4.5 V to 36 V. Both devices are designed to drive inductive loads such as relays, solenoids, DC and bipolar stepping motors, as well as other high-current/high-voltage loads in positivesupply applications. Each output is a complete totem-pole drive circuit, with a Darlington transistor sink and a pseudo- Darlington source. Drivers are enabled in pairs, with drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4
enabled by 3,4EN. The L293 and L293D are characterized for operation from 0°C to 70°C.
Device Information(1)
| PART NUMBER | PACKAGE | BODY SIZE (NOM) |
|---|---|---|
| L293NE | PDIP (16) | 19.80 mm × 6.35 mm |
| L293DNE | PDIP (16) | 19.80 mm × 6.35 mm |
(1) For all available packages, see the orderable addendum at the end of the data sheet.
Logic Diagram
| 2 | 3 |
| 1 7 6 | |
| 10 11 | |
| 9 15 14 | |
1Y
1A
1,2EN
2A
2Y
3A
3Y
3,4EN
4A
4Y
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
Page 2
Table of Contents
1 Features.................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions......................... 3 6 Specifications......................................................... 4 6.1 Absolute Maximum Ratings ...................................... 4 6.2 ESD Ratings.............................................................. 4 6.3 Recommended Operating Conditions....................... 4 6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5 6.6 Switching Characteristics ......................................... 5 6.7 Typical Characteristics.............................................. 5 7 Parameter Measurement Information .................. 6 8 Detailed Description .............................................. 7 8.1 Overview ................................................................... 7 8.2 Functional Block Diagram ......................................... 7
4 Revision History
8.3 Feature Description................................................... 7 8.4 Device Functional Modes.......................................... 8 9 Application and Implementation .......................... 9 9.1 Application Information.............................................. 9 9.2 Typical Application ................................................... 9 9.3 System Examples ................................................... 10 10 Power Supply Recommendations ..................... 13 11 Layout................................................................... 14 11.1 Layout Guidelines ................................................. 14 11.2 Layout Example .................................................... 14
12 Device and Documentation Support ................. 15 12.1 Related Links ........................................................ 15 12.2 Community Resources.......................................... 15 12.3 Trademarks........................................................... 15 12.4 Electrostatic Discharge Caution............................ 15 12.5 Glossary................................................................ 15 13 Mechanical, Packaging, and Orderable Information ........................................................... 15
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (November 2004) to Revision D
Page
- Removed Ordering Information table .................................................................................................................................... 1
- Added ESD Ratings and Thermal Information tables, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. .................................... 1
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5 Pin Configuration and Functions
NE Package 16-Pin PDIP Top View
HEAT SINK AND
HEAT SINK AND
GROUND
GROUND
Pin Functions
| PIN | TYPE | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| 1,2EN | 1 | I | Enable driver channels 1 and 2 (active high input) |
| <1:4>A | 2, 7, 10, 15 | I | Driver inputs, noninverting |
| <1:4>Y | 3, 6, 11, 14 | O | Driver outputs |
| 3,4EN | 9 | I | Enable driver channels 3 and 4 (active high input) |
| GROUND | 4, 5, 12, 13 | — | Device ground and heat sink pin. Connect to printed-circuit-board ground plane with multiple solid vias |
| V CC1 | 16 | — | 5-V supply for internal logic translation |
| V CC2 | 8 | — | Power VCC for drivers 4.5 V to 36 V |
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
| MIN MAX | UNIT | |
|---|---|---|
| Supply voltage, V (2) CC1 | 36 | V |
| Output supply voltage, V CC2 | 36 | V |
| Input voltage, V I | 7 | V |
| Output voltage, V O | –3 V + 3 CC2 | V |
| Peak output current, I (nonrepetitive, t ≤5 ms): L293 O | –2 2 | A |
| Peak output current, I (nonrepetitive, t ≤100 µs): L293D O | –1.2 1.2 | A |
| Continuous output current, I : L293 O | –1 1 | A |
| Continuous output current, I : L293D O | –600 600 | mA |
| Maximum junction temperature, T J | 150 | °C |
| Storage temperature, T stg | –65 150 | °C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to the network ground terminal.
6.2 ESD Ratings
| VALUE | UNIT | ||
|---|---|---|---|
| Electrostatic V (ESD) discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1000 | ||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
| MIN NOM MAX | UNIT | ||
|---|---|---|---|
| Supply voltage | V CC1 | 4.5 7 | V |
| V CC2 | V 36 CC1 | ||
| V High-level input voltage IH | V ≤7 V CC1 | 2.3 V CC1 | V |
| V ≥7 V CC1 | 2.3 7 | V | |
| V Low-level output voltage IL | –0.3(1) 1.5 | V | |
| T Operating free-air temperature A | 0 70 | °C | |
(1) The algebraic convention, in which the least positive (most negative) designated minimum, is used in this data sheet for logic voltage levels.
6.4 Thermal Information
| THERMAL METRIC(1) | L293, L293D | UNIT |
|---|---|---|
| NE (PDIP) | ||
| 16 PINS | ||
| RθJA Junction-to-ambient thermal resistance (2) | 36.4 | °C/W |
| RθJC(top) Junction-to-case (top) thermal resistance | 22.5 | °C/W |
| RθJB Junction-to-board thermal resistance | 16.5 | °C/W |
| ψ Junction-to-top characterization parameter JT | 7.1 | °C/W |
| ψ Junction-to-board characterization parameter JB | 16.3 | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) The package thermal impedance is calculated in accordance with JESD 51-7.
Page 5
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
| PARAMETER | TEST CONDITIONS | MIN TYP MAX | UNIT | ||
|---|---|---|---|---|---|
| VOH High-level output voltage | L293: IOH = −1 A | VCC2 – 1.8 VCC2 – 1.4 | V | ||
| L293D: IOH = −0.6 A | |||||
| VOL Low-level output voltage | L293: IOL = 1 A | 1.2 1.8 | V | ||
| L293D: IOL = 0.6 A | |||||
| VOKH High-level output clamp voltage | L293D: IOK = –0.6 A | VCC2 + 1.3 | V | ||
| VOKL Low-level output clamp voltage | L293D: IOK = 0.6 A | 1.3 | V | ||
| IIH High-level input current | A | VI = 7 V | 0.2 100 | µA | |
| EN | 0.2 10 | ||||
| IIL Low-level input current | A | VI = 0 | –3 –10 | µA | |
| EN | –2 –100 | ||||
| ICC1 Logic supply current | IO = 0 | All outputs at high level | 13 22 | mA | |
| All outputs at low level | 35 60 | ||||
| All outputs at high impedance | 8 24 | ||||
| ICC2 Output supply current | IO = 0 | All outputs at high level | 14 24 | mA | |
| All outputs at low level | 2 6 | ||||
| All outputs at high impedance | 2 4 | ||||
6.6 Switching Characteristics
over operating free-air temperature range (unless otherwise noted) VCC1 = 5 V, VCC2 = 24 V, TA = 25°C
| PARAMETER | TEST CONDITIONS | MIN TYP MAX | UNIT | |
|---|---|---|---|---|
| Propagation delay time, low-to- tPLH high-level output from A input | L293NE, L293DNE | CL = 30 pF, See Figure 2 | 800 | ns |
| L293DWP, L293N L293DN | 750 | |||
| Propagation delay time, high-to- tPHL low-level output from A input | L293NE, L293DNE | 400 | ns | |
| L293DWP, L293N L293DN | 200 | |||
| Transition time, low-to-high-level tTLH output | L293NE, L293DNE | 300 | ns | |
| L293DWP, L293N L293DN | 100 | |||
| Transition time, high-to-low-level tTHL output | L293NE, L293DNE | 300 | ns | |
| L293DWP, L293N L293DN | 350 | |||
6.7 Typical Characteristics
150 100
−50
0 50
TA −Ambient Temperature − °C
Figure 1. Maximum Power Dissipation vs Ambient Temperature
Page 6
7 Parameter Measurement Information
VOLTAGE WAVEFORMS
TEST CIRCUIT
NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: tr ≤ 10 ns, tf ≤ 10 ns, tw = 10 µs, PRR = 5 kHz, ZO = 50 Ω.
Figure 2. Test Circuit and Voltage Waveforms
Page 7
8 Detailed Description
8.1 Overview The L293 and L293D are quadruple high-current half-H drivers. These devices are designed to drive a wide array of inductive loads such as relays, solenoids, DC and bipolar stepping motors, as well as other high-current and high-voltage loads. All inputs are TTL compatible and tolerant up to 7 V. Each output is a complete totem-pole drive circuit, with a Darlington transistor sink and a pseudo-Darlington source. Drivers are enabled in pairs, with drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4 enabled by 3,4EN. When an enable input is high, the associated drivers are enabled, and their outputs are active and in phase with their inputs. When the enable input is low, those drivers are disabled, and their outputs are off and in
the high-impedance state. With the proper data inputs, each pair of drivers forms a full-H (or bridge) reversible drive suitable for solenoid or motor applications. On the L293, external high-speed output clamp diodes should be used for inductive transient suppression. On the L293D, these diodes are integrated to reduce system complexity and overall system size. A VCC1 terminal, separate from VCC2, is provided for the logic inputs to minimize device power dissipation. The L293 and L293D are characterized for operation from 0°C to 70°C.
8.2 Functional Block Diagram
VCC1
VCC2 Output diodes are internal in L293D.
8.3 Feature Description The L293x has TTL-compatible inputs and high voltage outputs for inductive load driving. Current outputs can get up to 2 A using the L293.
Page 8
8.4 Device Functional Modes
Table 1 lists the fuctional modes of the L293x.
Table 1. Function Table (Each Driver)(1)
| INPUTS (2) | OUTPUT (Y) | |
| A | EN | |
| H | H | H |
| L | H | L |
| X | L | Z |
(1) H = high level, L = low level, X = irrelevant, Z = high impedance (off) (2) In the thermal shutdown mode, the output is in the high-impedance state, regardless of the input levels.
Input
Figure 3. Schematic of Inputs for the L293x
Figure 4. Schematic of Outputs for the L293
Figure 5. Schematic of Outputs for the L293D
Page 9
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.
9.1 Application Information A typical application for the L293 device is driving a two-phase motor. Below is an example schematic displaying how to properly connect a two-phase motor to the L293 device. Provide a 5-V supply to VCC1 and valid logic input levels to data and enable inputs. VCC2 must be connected to a power supply capable of supplying the needed current and voltage demand for the loads connected to the outputs.
9.2 Typical Application
Figure 6. Two-Phase Motor Driver (L293)
9.2.1 Design Requirements The design techniques in the application above as well as the applications below should fall within the following design requirements. 1. VCC1 should fall within the limits described in the Recommended Operating Conditions. 2. VCC2 should fall within the limits described in the Recommended Operating Conditions. 3. The current per channel should not exceed 1 A for the L293 (600mA for the L293D).
9.2.2 Detailed Design Procedure When designing with the L293 or L293D, careful consideration should be made to ensure the device does not exceed the operating temperature of the device. Proper heatsinking will allow for operation over a larger range of current per channel. Refer to the Power Supply Recommendations as well as the Layout Example.
Page 10
Typical Application (continued) 9.2.3 Application Curve Refer to Power Supply Recommendations for additional information with regards to appropriate power dissipation. Figure 7 describes thermal dissipation based on Figure 14.
0 10 20 30
50 40
Side −mm
Figure 7. Maximum Power and Junction vs Thermal Resistance
9.3 System Examples
9.3.1 L293D as a Two-Phase Motor Driver Figure 8 below depicts a typical setup for using the L293D as a two-phase motor driver. Refer to the Recommended Operating Conditions when considering the appropriate input high and input low voltage levels to enable each channel of the device.
Figure 8. Two-Phase Motor Driver (L293D)
Page 11
System Examples (continued)
9.3.2 DC Motor Controls
Figure 9 and Figure 10 below depict a typical setup for using the L293 device as a controller for DC motors. Note
that the L293 device can be used as a simple driver for a motor to turn on and off in one direction, and can also
be used to drive a motor in both directions. Refer to the function tables below to understand unidirectional vs
bidirectional motor control. Refer to the Recommended Operating Conditions when considering the appropriate
input high and input low voltage levels to enable each channel of the device.
VCC2
GND
Connections to ground and to supply voltage
Figure 9. DC Motor Controls
Table 2. Unidirectional DC Motor Control
| EN | 3A | M1(1) | 4A | M2 |
| H | H | Fast motor stop | H | Run |
| H | L | run | L | Fast motor stop |
| L | X | Free-running motor stop | X | Free-running motor stop |
(1) L = low, H = high, X = don’t care
VCC2
GND
Figure 10. Bidirectional DC Motor Control
Table 3. Bidrectional DC Motor Control
| EN | 1A | 2A | FUNCTION(1) |
| H | L | H | Turn right |
| H | H | L | Turn left |
(1) L = low, H = high, X = don’t care
Page 12
Table 3. Bidrectional DC Motor Control (continued)
| EN | 1A | 2A | FUNCTION(1) |
| H | L | L | Fast motor stop |
| H | H | H | Fast motor stop |
| L | X | X | Free-running motor stop |
9.3.3 Bipolar Stepping-Motor Control
Figure 11 below depicts a typical setup for using the L293D as a two-phase motor driver. Refer to the
Recommended Operating Conditions when considering the appropriate input high and input low voltage levels to
enable each channel of the device.
IL1/IL2 = 300 mA
VCC2
D1−D8 = SES5001
Figure 11. Bipolar Stepping-Motor Control
Page 13
10 Power Supply Recommendations
VCC1 is 5 V ± 0.5 V and VCC2 can be same supply as VCC1 or a higher voltage supply with peak voltage up to 36 V. Bypass capacitors of 0.1 uF or greater should be used at VCC1 and VCC2 pins. There are no power up or power down supply sequence order requirements. Properly heatsinking the L293 when driving high-current is critical to design. The Rthj-amp of the L293 can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board or to an external heat sink. Figure 14 shows the maximum package power PTOT and the θJA as a function of the side of two equal square copper areas having a thickness of 35 μm (see Figure 14). In addition, an external heat sink can be used (see
Figure 12). During soldering, the pin temperature must not exceed 260°C, and the soldering time must not exceed 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground.
Figure 12. External Heat Sink Mounting Example (θJA = 25°C/W)
Page 14
11 Layout
11.1 Layout Guidelines
Place the device near the load to keep output traces short to reduce EMI. Use solid vias to transfer heat from
ground pins to ground plane of the printed-circuit-board.
11.2 Layout Example
Figure 13. Layout Diagram
Figure 14. Example of Printed-Circuit-Board Copper Area (Used as Heat Sink)
Page 15
12 Device and Documentation Support
12.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.
Table 4. Related Links
| PARTS | PRODUCT FOLDER | SAMPLE & BUY | TECHNICAL DOCUMENTS | TOOLS & SOFTWARE | SUPPORT & COMMUNITY |
|---|---|---|---|---|---|
| L293 | Click here | Click here | Click here | Click here | Click here |
| L293D | Click here | Click here | Click here | Click here | Click here |
12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Page 16
PACKAGE OPTION ADDENDUM
10-Nov-2025
PACKAGING INFORMATION
(1) Status: For more details on status, see our product life cycle.
(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.
(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.
(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width.
(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.
(6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.
Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers
and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Page 17
Page 18
PACKAGE MATERIALS INFORMATION
10-Aug-2026
TUBE
T - Tube
height
L - Tube length
\*All dimensions are nominal
| Device | Package Name | Package Type | Pins | SPQ | L (mm) | W (mm) | T (µm) | B (mm) |
|---|---|---|---|---|---|---|---|---|
| L293DNE | NE | PDIP | 16 | 25 | 506 | 13.97 | 11230 | 4.32 |
| L293DNE.A | NE | PDIP | 16 | 25 | 506 | 13.97 | 11230 | 4.32 |
| L293DNEE4 | NE | PDIP | 16 | 25 | 506 | 13.97 | 11230 | 4.32 |
| L293NE | NE | PDIP | 16 | 25 | 506 | 13.97 | 11230 | 4.32 |
| L293NE.A | NE | PDIP | 16 | 25 | 506 | 13.97 | 11230 | 4.32 |
| L293NEE4 | NE | PDIP | 16 | 25 | 506 | 13.97 | 11230 | 4.32 |
Pack Materials-Page 1
Page 19
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Last updated 10/2025