KBCSLNM1.14

KBCSLNM1.14 OSRAM

Document overview

• Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 24

Technical content

KB CSLNM1.14 DATASHEETDATASHEET 1 | Version 1.10 | 2022-04-14 www.osram-os.com KB CSLNM1.14 Datasheet Published by ams-OSRAM AG Tobelbader Strasse 30, 8141 Premstaetten, Austria Phone +43 3136 500-0 ams-osram.com © All rights reserved

KB CSLNM1.14 DATASHEETDATASHEET 2 | Version 1.10 | 2022-04-14 OSRAM OSTAR® Projection Compact KB CSLNM1.14 Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Applications

• Projection Home LED & Laser - Projection Professional LED & Laser - Stage Lighting (LED & Laser)

Features

• Package: white molded SMD ceramic package - Chip technology: UX:3 - Typ. Radiation: 120° (Lambertian emitter) - Color: λdom = 455 nm (● blue) - Corrosion Robustness Class: 3A - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)

KB CSLNM1.14 DATASHEETDATASHEET 3 | Version 1.10 | 2022-04-14

Ordering Information

Type Total radiant flux 1) Ordering Code IF = 1000 mA ΦE KB CSLNM1.14-4V7A-46 1000 ... 1590 mW Q65112A3602 KB CSLNM1.14-5A8A-23 1120 ... 1800 mW Q65113A1588

KB CSLNM1.14 DATASHEETDATASHEET 4 | Version 1.10 | 2022-04-14 Maximum Ratings Parameter Symbol Values Operating Temperature Top min. max. -40 °C 125 °C Storage Temperature Tstg min. max. -40 °C 125 °C Junction Temperature Tj max. 150 °C Forward current TS = 25 °C IF min. max. 40 mA 3000 mA Forward current pulsed D = 0.5; f = 240Hz; TS = 25°C IF pulse max. 4000 mA Surge current tp ≤ 50 µs; D = 0.1; TS = 25 °C IFS max. 4500 mA ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) VESD 8 kV Reverse current 2) IR max. 200 mA

KB CSLNM1.14 DATASHEETDATASHEET 5 | Version 1.10 | 2022-04-14 Characteristics IF = 1000 mA; TS = 25 °C Parameter Symbol Values Peak Wavelength λpeak typ. 450 nm Dominant Wavelength 3) IF = 1000 mA λdom min. typ. max. 445 nm 455 nm 465 nm Viewing angle at 50% IV 2φ typ. 120 ° Radiating surface Acolor typ. 1 x 1 mm² Partial Flux acc. CIE 127:2007 ΦE/V, 120° typ. 0.76 Forward Voltage 4) IF = 1000 mA VF min. typ. max. 2.75 V 3.00 V 3.50 V Reverse voltage (ESD device) VR ESD min. 45 V Reverse voltage 2) IR = 20 mA VR max. 1.2 V Real thermal resistance junction/solderpoint 5) RthJS real typ. max.

4.1 K / W

4.9 K / W

Electrical thermal resistance junction/solderpoint 5) with efficiency ηe = 33 % RthJS elec. typ. max.

2.7 K / W

3.3 K / W

KB CSLNM1.14 DATASHEETDATASHEET 6 | Version 1.10 | 2022-04-14 Brightness Groups Group Total radiant flux 1) Total radiant flux 1) IF = 1000 mA IF = 1000 mA min. max. ΦE ΦE 4V 1000 mW 1120 mW 5A 1120 mW 1250 mW 6A 1250 mW 1400 mW 7A 1400 mW 1590 mW 8A 1590 mW 1800 mW Wavelength Groups Group Dominant Wavelength 3) Dominant Wavelength 3) IF = 1000 mA IF = 1000 mA min. max. λdom λdom 2 445 nm 449 nm 3 449 nm 453 nm 4 453 nm 457 nm 5 457 nm 461 nm 6 461 nm 465 nm Group Name on Label Example: 4V-2 Brightness Wavelength 4V 2

KB CSLNM1.14 DATASHEETDATASHEET 7 | Version 1.10 | 2022-04-14 Relative Spectral Emission 6) Erel = f (λ); IF = 1000 mA; TJ = 25 °C KB CSLNM1.14S AA M 350 400 450 500 550 600 650 700 750 800 λ /n m 0.0 0.2 0.4 0.6 0.8 1.0Erel :V λ :b lue Radiation Characteristics 6) Irel = f (ϕ); TJ = 25 °C KB CSLNM1.14 -100° -90° -80° -70° -60° -50° -40° -30° -20° ϕ [°] 0,0 0,2 0,4 0,6 0,8 1,0 Irel

KB CSLNM1.14 DATASHEETDATASHEET 8 | Version 1.10 | 2022-04-14 Relative Partial Flux 6) ΦE(2φ)/ΦE(180°) = f(φ); TJ = 25 °C KB CSLNM1.14 02 04 06 08 0 100 120 140 160 180 2*ϕ /° 0.0 0.2 0.4 0.6 0.8 1.0Φe (2ϕ) Φe (180°) :b lue

KB CSLNM1.14 DATASHEETDATASHEET 9 | Version 1.10 | 2022-04-14 Forward current 6), 7) IF = f(VF); TJ = 25 °C KB CSLNM1.14 VF [V] 500 1000 1500 2000 2500 3000 3500 4000 IF [mA] Relative Radiant Power 6), 7) ΦE/ΦE(1000 mA) = f(IF); TJ = 25 °C KB CSLNM1.14 40 500 100 1500 2000 2500 3000 3500 400 IF [mA] 0,0 0,5 1,0 1,5 2,0 2,5 3,0 ΦE ΦE(1000mA) Dominant Wavelength 6) Δλdom = f(IF); TJ = 25 °C KB CSLNM1.14 40 500 1000 1500 2000 2500 3000 3500 4000 IF [mA] 8∆λ dom [nm]

KB CSLNM1.14 DATASHEETDATASHEET 10 | Version 1.10 | 2022-04-14 Forward Voltage 6) ΔVF = VF - VF(25 °C) = f(Tj); IF = 1000 mA KB CSLNM1.14 -40- 20 02 04 06 08 0 100 120 140 Tj [°C] -0,3 -0,2 -0,1 0,0 0,1 0,2 0,3∆VF [V] Relative Radiant Power 6) ΦE/ΦE(25 °C) = f(Tj); IF = 1000 mA KB CSLNM1.14 -40- 20 02 04 06 08 0 100 120 140 Tj [°C] 0,0 0,2 0,4 0,6 0,8 1,0 1,2ΦE ΦE (25°C) Dominant Wavelength 6) Δλdom = λdom - λdom(25 °C) = f(Tj); IF = 1000 mA KB CSLNM1.14 -40- 20 02 04 06 08 0 100 120 140 Tj [°C] ∆λ dom [nm]

KB CSLNM1.14 DATASHEETDATASHEET 11 | Version 1.10 | 2022-04-14 Max. Permissible Forward Current IF = f(T) KB CSLNM1.14 02 04 06 08 0 100 120 T [°C] 500 1000 1500 2000 2500 3000 IF [mA] :T s

KB CSLNM1.14 DATASHEETDATASHEET 12 | Version 1.10 | 2022-04-14 Dimensional Drawing 8) Further Information: Approximate Weight: 36.0 mg Package marking: Cathode Corrosion test: Class: 3A Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC 60068-2-43) ESD advice: The device is protected by ESD device which is connected in parallel to the Chip.

KB CSLNM1.14 DATASHEETDATASHEET 13 | Version 1.10 | 2022-04-14 Electrical Internal Circuit

KB CSLNM1.14 DATASHEETDATASHEET 14 | Version 1.10 | 2022-04-14 Recommended Solder Pad 8) Recommended Solder Pad 8) For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for any kind of wet cleaning or ultrasonic cleaning.

KB CSLNM1.14 DATASHEETDATASHEET 15 | Version 1.10 | 2022-04-14 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS 60 100 120 s Ramp-up rate to peak*) TSmax to TP 2 3 K/s Liquidus temperature TL 217 °C Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 10 20 30 s Ramp-down rate* TP to 100 °C 3 6 K/s Time 25 °C to TP 480 s All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

KB CSLNM1.14 DATASHEETDATASHEET 16 | Version 1.10 | 2022-04-14 Taping 8)

KB CSLNM1.14 DATASHEETDATASHEET 17 | Version 1.10 | 2022-04-14 Tape and Reel 9) Reel Dimensions A W Nmin W1 W2 max Pieces per PU 180 mm 12 + 0.3 / - 0.1 mm 60 mm 12.4 + 2 mm 18.4 mm 1000

KB CSLNM1.14 DATASHEETDATASHEET 18 | Version 1.10 | 2022-04-14 Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparator check dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, M oisture Level 3 Floor tim e 168 Hours M oisture Level 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 m onths at < 40 ˚C and < 90% relative hum idity (RH). M oisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) M ounted within b) Stored at body tem 3. Devices require baking, before m ounting, if: Bag seal date M oisture Level 1 M oisture Level 2 M oisture Level 2a4. If baking is required, b) 2a or 2b is not m et. Date and tim e opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor tim e see below If blank, see bar code label Floor tim e > 1 Year Floor tim e 1 Year Floor tim e 4 W eeks10% RH. M oisture Level 4 M oisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag contains CAUTION Floor tim e 72 Hours Floor tim e 48 Hours Floor tim e 24 Hours 30 ˚C/60% RH. LEVEL If blank, see bar code label Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

KB CSLNM1.14 DATASHEETDATASHEET 19 | Version 1.10 | 2022-04-14 CChhiipp TTeecchhnnoollooggyy:: PP:: Standard power class NN:: Standard power class EEnnccaappssuullaanntt TTyyppee // LLeennss PPrrooppeerrttiieess LL:: No lens (Lambertian) WWaavveelleennggtthh EEmmiissssiioonn ((λλddoomm ttyypp..)) WW:: white YY:: yellow BB:: 470 nm blue RR:: 625 nm red PP:: 560 nm pure green TT: 519 nm true green PPrroodduucctt vveerrssiioonn KK:: Automotive and Industry Product TTeecchhnnoollooggyy CCoonncceepptt MM:: Silicone encapsulation molding) LL:: Silicone casting Platform: Ceramic PPaacckkaaggee TTyyppee CC:: Toplooker Ceramic package w/o reflector LLeeaadd // PPaacckkaaggee PPrrooppeerrttiieess TTOOPPllooookkeerr:: SS:: 3131 CCeerraammiicc ppaacckkaaggeess:: SS:: 3030 TTyyppee DDeessiiggnnaattiioonn SSyysstteemm KK BB CC SS LL NN MM 11 .. 11 44 BBiinnnniinngg IInnffoorrmmaattiioonn:: 11:: 33:: mlm 44:: mW GG:: ECE binning:IEC 62707 (ebxD46 System) Y: Cx;Cy acc. to CIE 1931 SSppeecciiaall CChhaarraacctteerriissttiicc 11:: InGaN saturated colors 22:: INGaAlP or AlGaAs saturated colors FF:: Full conversion (color depending on color description) TT:: greenish cold white

KB CSLNM1.14 DATASHEETDATASHEET 20 | Version 1.10 | 2022-04-14 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet fall into the class moderate risk (exposure time 0.25 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye ex- ists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoy- ance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers avoid device exposure to aggressive substances during storage, production, and use. For further application related information please visit www.osram-os.com/appnotes

KB CSLNM1.14 DATASHEETDATASHEET 21 | Version 1.10 | 2022-04-14 Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on our website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications Our components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. Our products are not qualified at module and system level for such application. In case buyer – or customer supplied by buyer – considers using our components in product safety devices/ applications or medical devices/applications, buyer and/or customer has to inform our local sales partner immediately and we and buyer and /or customer will analyze and coordinate the customer-specific request between us and buyer and/or customer.

KB CSLNM1.14 DATASHEETDATASHEET 22 | Version 1.10 | 2022-04-14 Glossary 1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3). 2) Reverse Operation: This product is intended to be operated applying a forward current within the specified range. Applying any continuous reverse bias or forward bias below the voltage range of light emission shall be avoided because it may cause migration which can change the electro-optical char- acteristics or damage the LED. 3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro- ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3). 4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3). 5) Thermal Resistance: Rth max is based on statistic values (6σ). 6) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic- es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif- fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 7) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ- ences between single devices within one packing unit. 8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 9) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

KB CSLNM1.14 DATASHEETDATASHEET 23 | Version 1.10 | 2022-04-14

Revision History

1.7 2019-01-07 Additional Information 1.8 2020-07-17 Ordering Information 1.9 2021-09-13 Applications 1.9 2021-09-21 Derating (Diagrams) 1.10 2022-04-14 Ordering Information Maximum Ratings New Layout

KB CSLNM1.14 DATASHEETDATASHEET 24 | Version 1.10 | 2022-04-14 Published by ams-OSRAM AG Tobelbader Strasse 30, 8141 Premstaetten, Austria Phone +43 3136 500-0 ams-osram.com © All rights reserved