2SK2828 HITACHI

Document overview

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Technical content

Features

  • Low on-resistance
  • High speed switching
  • Low drive current
  • No secondary breakdown
  • Suitable for switching regulator and DC–DC converter
  • Avalanche ratings Outline TO–3P 1. Gate 2. Drain (Flange) 3. Source 2 3 D S G

Absolute Maximum Ratings (Ta = 25°C) Item Symbol Ratings Unit Drain to source voltage V DSS 700 V Gate to source voltage V GSS –30 V Drain current I D 12 A Drain peak current I D(pulse)*1 48 A Body-drain diode reverse drain current IDR 12 A Channel dissipation Pch* 2 175 W Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C Note: 1. PW £ 10ms, duty cycle £ 1 % 2. Value at Tc = 25°C

Electrical Characteristics (Ta = 25°C) Item Symbol Min Typ Max Unit Test Conditions Drain to source breakdown voltage V(BR)DSS 700 — — V I D = 10mA, VGS = 0 Gate to source breakdown voltage V(BR)GSS –3 0 ——V I G = –100mA, VDS = 0 Gate to source leak current I GSS —— –10 mAV GS = –25V, VDS = 0 Zero gate voltege drain current IDSS — — 100 mAV DS = 560 V, VGS = 0 Gate to source cutoff voltage VGS(off) 2.0 — 3.0 V I D = 1mA, VDS = 10V*3 Static drain to source on state resistance R DS(on) — 0.9 1.2 W ID = 6A, VGS = 10V*3 Forward transfer admittance |y fs| 5.5 9.0 — S I D = 6A, VDS = 10V*3 Input capacitance Ciss — 1850 — pF V DS = 10V Output capacitance Coss — 400 — pF V GS = 0 Reverse transfer capacitance Crss — 45 — pF f = 1MHz Total gate charge Qg — 35 — nc V DD = 400V Gate to source charge Qgs — 8 — nc V GS = 10V Gate to drain charge Qgd — 10 — nc I D = 12A Turn-on delay time t d(on) — 25 — ns I D = 6A, RL = 5W Rise time t r — 65 — ns V GS = 10V Turn-off delay time t d(off) — 140 — ns Fall time t f —5 5—n s Body–drain diode forward voltage VDF — 0.95 — V I F = 12A, VGS = 0 Body–drain diode reverse recovery time trr — 2.5 — msI F = 12A, VGS = 0 diF/ dt =100A/ms Note: 3. Pulse test

0.5 105 20 50 100 500 1000 0 10 20 30 40 50 0 2468 1 0 0.2 0.1 200 10 µs 100 µs 1 msPW = 10 ms (1shot) DC Operation (Tc = 25°C) Ta = 25 °C 10 V V = 4 VGS 6 V 8 V 5 V

4.5 V Tc = 75°C

25°C –25°C Channel Dissipation Pch (W) Case Temperature Tc (°C) Power vs. Temperature Derating Drain to Source Voltage V (V)DS Drain Current I (A)D Maximum Safe Operation Area Drain to Source Voltage V (V)DS Drain Current I (A)D Typical Output Characteristics Gate to Source Voltage V (V)GS Typical Transfer Characteristics Operation in this area is limited by R DS(on) Pulse Test V = 10 V Pulse Test DS Drain Current I (A)D

0 48 12 16 20 1 5 20 100 21 0 5 0 0.5 0.2 0.1 4.0 3.2 2.4 1.6 0.8 –40 0 40 80 120 160 0.2 1 2 10 20 0.5 I = 10 AD 5 A I = 10 AD V = 10 VGS 5 A 0.5 5 0.05 V = 10, 15VGS 25 °C Tc = –25 °C 75 °C Gate to Source Voltage V (V)GS Drain to Source Saturation Voltage vs. Gate to Source Voltage V (V)DS(on) Drain to Source Saturation Voltage Drain Current I (A)D Drain to Source On State Resistance R ( )WDS(on) Static Drain to Source on State Resistance vs. Drain Current Case Temperature Tc (°C) R ( )DS(on) Static Drain to Source on State Resistance W Static Drain to Source on State Resistance vs. Temperature Drain Current I (A)D Forward Transfer Admittance |y | (S)fs Forward Transfer Admittance vs. Drain Current Pulse Test Pulse Test V = 10 V Pulse Test DS Pulse Test

0.1 0.2 1 2 10 20 50 0.05 0.2 0.5 0.1 01 0 2 0 3 0 4 05 0 2000 5000 1000 100 200 500 1000 800 600 400 200 20 40 60 80 100 200 500 100 0.1 0.3 1 3 10 30 100 V = 100 V 250 V 400 V DD V = 400 V 250 V 100 V DD 0.5 5 di / dt = 100 A / µs V = 0, Ta = 25 °CGS V = 0 f = 1 MHz GS Ciss Coss Crss tf rt d(on)t d(off)t V = 10 V, V = 30 V PW = 5 µs, duty < 1 % GS DD Reverse Drain Current I (A)DR Reverse Recovery Time trr (ns) Body–Drain Diode Reverse Recovery Time Capacitance C (pF) Drain to Source Voltage V (V)DS Typical Capacitance vs. Drain to Source Voltage Gate Charge Qg (nc) Drain to Source Voltage V (V)DS Gate to Source Voltage V (V)GS Dynamic Input Characteristics Drain Current I (A)D Switching Time t (ns) Switching Characteristics ID = 12 A VGS VDS

0.3 0.1 0.03 0.01 10 µ 100 µ 1 m 10 m 100 m 1 10 DMP PW T D = PW T ch – c(t) = s (t) • ch – c ch – c = 0.71 °C/W, Tc = 25 °C q g q q Tc = 25°C D = 1 0.5 0.2 0.1 0.05 0.02 0.01 1shot pulse V = 0, –5 VGS Source to Drain Voltage V (V)SD Reverse Drain Current I (A)DR Reverse Drain Current vs. Source to Drain Voltage Pulse Width PW (S) Normalized Transient Thermal Impedance s (t)g Normalized Transient Thermal Impedance vs. Pulse Width Pulse Test

D.U.T. Vin 10 V R L V = 30 V DD trtd(on) Vin 90% 90% 10% 10%Vout td(off) Vout Monitor 50W 90% 10% tf Switching Time Test Circuit Switching Time Waveform

Unit: mm 16.0 max 1.0 ± 0.2 1.0 typ 3.2 ± 0.2f 20.1 max18.0 ± 0.5 2.0 typ 0.5 typ 1.4 max 2.0 typ 0.9 typ 1.0 typ 3.6 typ 5.0 max 0.3 typ 1.5 typ 2.8 typ 0.6 ± 0.2 1.6 typ Hitachi Code EIAJ JEDEC TO–3P SC–65

  1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & IC Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 Copyright © Hitachi, Ltd., 1998. All rights reserved. Printed in Japan. Hitachi Asia Pte. Ltd.

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