Microcontroller

IRFZ44NS

7 manufacturer specifications

The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing sur…

Manufacturer variants: 7

Selected specification: Kersemi Electronic Co.,...

Documents: 7

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Manufacturer Specifications

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7 manufacturers / 7 documents

Manufacturer	Series	Package	Documents	Available	Select specification
EVER SEMICONDUCTOR CO.,...	-	-	1	PDF HTML	View spec
Guangdong Youtai Semico...	-	-	1	PDF HTML	View spec
Inchange Semiconductor ...	-	-	1	PDF HTML	View spec
International Rectifier	-	-	1	PDF HTML	View spec
Kersemi Electronic Co.,...	-	-	1	PDF HTML	Viewing
NXP Semiconductors	-	-	1	PDF HTML	View spec
Tiger Electronic Co.,Lt...	-	-	1	PDF HTML	View spec

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Kersemi Electronic Co.,... IRFZ44NS overview.

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Overview

IRFZ44NS is listed in the Microcontroller category. Available datasheets include documents from International Rectifier, NXP Semiconductors.

Summary

Advanced Process Technology

Description

The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.

Source title IRFZ44NS Datasheet(PDF) - Kersemi Electronic Co., Ltd.

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