Overview
IRF9530NS is listed in the Microcontroller category. Available datasheets include documents from International Rectifier. DigiCamel provides a local PDF for online reference.
Summary
Advanced Process Technology
Description
The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.
Source title
IRF9530NS Datasheet(PDF) - Kersemi Electronic Co., Ltd.