Overview
IRF530NS is listed in the Microcontroller category. Available datasheets include documents from International Rectifier.
Summary
Ultra Low On-Resistance
Description
The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.
Source title
IRF530NS Datasheet(PDF) - Kersemi Electronic Co., Ltd.