IRF5305S

4 manufacturer specifications

The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the

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Manufacturer Specifications

Compare IRF5305S variants.

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4 manufacturers / 5 documents

Manufacturer	Series	Package	Documents	Available	Select specification
International Rectifier	-	-	2	PDF HTML	View spec
EVER SEMICONDUCTOR CO.,...	-	-	1	PDF HTML	View spec
Inchange Semiconductor ...	-	-	1	PDF HTML	View spec
Kersemi Electronic Co.,...	-	-	1	PDF HTML	Viewing

Selected Specification

Overview

IRF5305S is listed in the IC category. Available datasheets include documents from International Rectifier.

Summary

Advanced Process Technology

Description

The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the

Source title IRF5305S Datasheet(PDF) - Kersemi Electronic Co., Ltd.

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