Overview
IRF520NS is listed in the Microcontroller category. Available datasheets include documents from International Rectifier.
Summary
Low-profile through-hole (IRF520NL)
Description
The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the high est power capability and the lowest pos sible on-resistance in any existing surfa ce mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surf ace mount application. The through-hole version (IRF520NL) is available for low-pr ofile applications.
Source title
IRF520NS Datasheet(PDF) - Kersemi Electronic Co., Ltd.