IRF1407SPBF integrated circuit reference

Microcontroller

IRF1407SPBF

2 manufacturer specifications

Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the f…

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Infineon Technologies A...
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Manufacturer Specifications

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2 manufacturers / 4 documents
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Infineon Technologies A... IRF1407SPBF overview.

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Overview

IRF1407SPBF is listed in the Microcontroller category. Available datasheets include documents from International Rectifier.

Summary

HEXFET짰 Power MOSFET 2016-5-26

Description

Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.

Source title IRF1407SPBF Datasheet(PDF) - Infineon Technologies AG