IMX51AEC

IMX51xEC_wrkng.fm

Document overview

• Manufacturer or author: B34823
• PDF pages: 175

Technical content

© 2012 Freescale Semiconductor, Inc. All rights reserved. Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX51AEC Rev. 6, 10/2012 IMX51A

Package Information

Case 2017 19 x 19 mm, 0.8 mm pitch

Ordering Information

See Ta ble 1 on page 2 for ordering information.

1 Introduction

The MCIMX51A (i.MX51A) Automotive Infotainment Processor represents Freescale Semiconductor’s latest addition to a growing family of multimedia focused products offering high performance processing with a high degree of functional integration, aimed at the growing automotive infotainment market. This device includes two graphics processors, 720p video processing, dual display, and many I/Os. The i.MX51A processor features Freescale’s advanced implementation of the ARM Cortex A8™ core, targeting speeds up to 600 MHz with 200 MHz I/O bus clock DDR2 and mobile DDR. This device is well-suited for graphics rendering for HMI and navigation, high performance speech processing with large databases, video processing and display, audio playback and ripping, and many other applications. i.MX51A Automotive and Infotainment Applications Processors 3.3. I 4.2. Supply Power-Up/Power-Down Requirements and

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support and vector floating point co-processor), and a programmable smart DMA controller.

1.1 Ordering Information

Table 1 provides the ordering information. Table 1. Ordering Information 1 Case 2017 and Case 2058 are RoHS compliant, lead-free, MSL = 3.

1.2 Block Diagram

Figure 1 shows the functional modules of the processor. Figure 1. Functional Block Diagram

3 HS Ports

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Features

The i.MX51A processor contains a large number of digital and analog modules that are described in Table 2. Table 2. i.MX51A Digital and Analog Modules battery interfaces, for example: Dallas DS2502. Non-Pipelined Vector Floating Point (VFP) co-processor (VFPv3). (SSI1-3), a Digital Audio Mux (AUDMUX), and Digital Audio Out (SPDIF TX). See the specific interface listings in this table. configuring two or more AUDMUX ports. a Frequency Pre-Multiplier (FPM). modes, four chip selects to support multiple peripherals. are locked to prevent further writing. comparators, cross-system triggers, counters, and sequencers.

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 5 EMI External Memory Interface Connectivity Peripherals The EMI is an external and internal memory interface. It performs arbitration between multi-AXI masters to multi-memory controllers, divided into four major channels: fast memories (Mobile DDR, DDR2) channel, slow memories (NOR-FLASH/PSRAM/NAND-FLASH and so on) channel, internal memory (RAM, ROM) channel and graphical memory (GMEM) Channel. In order to increase the bandwidth performance, the EMI separates the buffering and the arbitration between different channels so parallel accesses can occur. By separating the channels, slow accesses do not interfere with fast accesses. EMI features:  64-bit and 32-bit AXI ports  Enhanced arbitration scheme for fast channel, including dynamic master priority, and taking into account which pages are open or closed and what type (Read or Write) was the last access  Flexible bank interleaving  Supports 16/32-bit Mobile DDR up to 200 MHz SDCLK (mDDR400)  Supports 16/32-bit (Non-Mobile) DDR2 up to 200 MHz SDCLK (DDR2-400)  Supports up to 2 Gbit Mobile DDR memories  Supports 16-bit (in muxed mode only) PSRAM memories (sync and async operating modes), at slow frequency, for debugging purposes  Supports 32-bit NOR-Flash memories (only in muxed mode), at slow frequencies for debugging purposes  Supports 4/8-ECC, page sizes of 512 Bytes, 2 Kbytes and 4 Kbytes  NAND-Flash (including MLC)  Multiple chip selects  Enhanced Mobile DDR memory controller, supporting access latency hiding  Supports watermarking for security (Internal and external memories)  Supports Samsung OneNAND ™ (only in muxed I/O mode) EPIT -1 EPIT -2 Enhanced Periodic Interrupt Timer Timer Peripherals Each EPIT is a 32-bit “set and forget” timer that starts counting after the EPIT is enabled by software. It is capable of providing precise interrupts at regular intervals with minimal processor intervention. It has a 12-bit prescaler for division of input clock frequency to get the required time setting for the interrupts to occur, and counter values can be programmed on the fly. eSDHC-1 eSDHC-2 eSDHC-3 Enhanced Multi-Media Card/ Secure Digital Host Controller Connectivity Peripherals The features of the eSDHC module, when serving as host, include the following:  Conforms to SD Host Controller Standard Specification version 2.0  Compatible with the MMC System Specification version 4.2  Compatible with the SD Memory Card Specification version 2.0  Compatible with the SDIO Card Specification version 1.2  Designed to work with SD Memory, miniSD Memory, SDIO, miniSDIO, SD Combo, MMC and MMC RS cards  Configurable to work in one of the following modes: —SD/SDIO 1-bit, 4-bit —MMC 1-bit, 4-bit, 8-bit  Full-/high-speed mode  Host clock frequency variable between 32 kHz to 52 MHz  Up to 200 Mbps data transfer for SD/SDIO cards using four parallel data lines  Up to 416 Mbps data transfer for MMC cards using eight parallel data lines Table 2. i.MX51A Digital and Analog Modules (continued)

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(muxed with P-A TA) Enhanced Multi-Media Card/ Secure Digital Host Controller Connectivity Peripherals Can be configured as eSDHC (see above) and is muxed with the P-AT A interface. FEC Fast Ethernet Controller Connectivity Peripherals The Ethernet Media Access Controller (MAC) is designed to support both 10 Mbps and 100 Mbps ethernet/IEEE Std 802.3™ networks. An external transceiver interface and transceiver function are required to complete the interface to the media. FIRI Fast Infra-Red Interface Connectivity Peripherals Fast Infra-Red Interface GPIO-1 GPIO-2 GPIO-3 GPIO-4 General Purpose I/O Modules System Control Peripherals These modules are used for general purpose input/output to external ICs. Each GPIO module supports up to 32 bits of I/O. GPT General Purpose Timer Timer Peripherals Each GPT is a 32-bit “free-running” or “set and forget” mode timer with a programmable prescaler and compare and capture register. A timer counter value can be captured using an external event, and can be configured to trigger a capture event on either the leading or trailing edges of an input pulse. When the timer is configured to operate in “set and forget” mode, it is capable of providing precise interrupts at regular intervals with minimal processor intervention. The counter has output compare logic to provide the status and interrupt at comparison. This timer can be configured to run either on an external clock or on an internal clock. GPU Graphics Processing Unit Multimedia Peripherals The GPU provides hardware acceleration for 2D and 3D graphics algorithms with sufficient processor power to run desk-top quality interactive graphics applications on displays up to HD720 resolution. It supports color representation up to 32 bits per pixel. The GPU with its 128 KByte memory enables high performance mobile 3D and 2D vector graphics at rates up to 27 Mtriangles/sec, 166 Mpixels/sec, 664 Mpixels/sec (Z). GPU2D Graphics Processing Unit-2D Ver. 1 Multimedia Peripherals The GPU2D provides hardware acceleration for 2D graphic algorithms with sufficient processor power to run desk-top quality interactive graphics applications on displays up to HD720 resolution. I 2C-1 I2C-2 HS-I2C I2C Interface Connectivity Peripherals I2C provides serial interface for controlling peripheral devices. Data rates of up to 400 Kbps are supported by two of the I2C ports. Data rates of up to 3.4 Mbps (I2C Specification v2.1) are supported by the HS-I 2C. Note: See the errata for the HS-I2C in the i.MX51 Chip Errata. The two standard I2C modules have no errata.

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 7 IIM IC Identification Module Security The IC Identification Module (IIM) provides an interface for reading, programming, and/or overriding identification and control information stored in on-chip fuse elements. The module supports electrically programmable poly fuses (e-Fuses). The IIM also provides a set of volatile software-accessible signals that can be used for software control of hardware elements not requiring non-volatility. The IIM provides the primary user-visible mechanism for interfacing with on-chip fuse elements. Among the uses for the fuses are unique chip identifiers, mask revision numbers, cryptographic keys, JT AG secure mode, boot characteristics, and various control signals requiring permanent non-volatility. The IIM also provides up to 28 volatile control signals. The IIM consists of a master controller, a software fuse value shadow cache, and a set of registers to hold the values of signals visible outside the module. IOMUXC IOMUX Control System Control Peripherals This module enables flexible I/O multiplexing. Each I/O pad has default as well as several alternate functions. The alternate functions are software configurable. IPU Image Processing Unit Multimedia Peripherals IPU enables connectivity to displays and image sensors, relevant processing and synchronization. It supports two display ports and two camera ports, through the following interfaces.  Legacy Interfaces  Analog TV interfaces (through a TV encoder bridge) The processing includes:  Support for camera control  Image enhancement: color adjustment and gamut mapping, gamma correction and contrast enhancement, sharpening and noise reduction  Video/graphics combining  Support for display backlight reduction  Image conversion—resizing, rotation, inversion and color space conversion  Synchronization and control capabilities, allowing autonomous operation.  Hardware de-interlacing support KPP Keypad Port Connectivity Peripherals The KPP supports an 8 × 8 external keypad matrix. The KPP features are as follows:  Open drain design  Glitch suppression circuit design  Multiple keys detection  Standby key press detection P-A TA (Muxed with eSDHC-4 Parallel AT A Connectivity Peripherals The P-A TA block is an AT attachment host interface. Its main use is to interface with hard disc drives and optical disc drives. It interfaces with the AT A-5 (UDMA-4) compliant device over a number of AT A signals. It is possible to connect a bus buffer between the host side and the device side. This is muxed with eSDHC-4 interfaces. PWM-1 PWM-2 Pulse Width Modulation Connectivity Peripherals The pulse-width modulator (PWM) has a 16-bit counter and is optimized to generate sound from stored sample audio images. It can also generate tones. The PWM uses 16-bit resolution and a 4 x 16 data FIFO to generate sound. RAM

128 Kbytes

Unified RAM, can be split between Secure RAM and Non-Secure RAM ROM

36 Kbytes

Supports secure and regular Boot Modes

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Security Protecting read-only data from modification is one of the basic elements in trusted platforms. The Run-Time Integrity Checker v3 (RTICv3) module, is a data monitoring device responsible for ensuring that memory content is not corrupted during program execution. The RTICv3 mechanism periodically checks the integrity of code or data sections during normal OS run-time execution without interfering with normal operation. The RTICv3’s purpose is to ensure the integrity of the peripheral memory contents, protect against unauthorized external memory elements replacement, and assist with boot authentication. SAHARA Lite SAHARA security accelerator Lite Security SAHARA (Symmetric/Asymmetric Hashing and Random Accelerator) is a security co-processor. It implements symmetric encryption algorithms, (AES, DES, 3DES, and RC4), public key algorithms, hashing algorithms (MD5, SHA-1, SHA-224, and SHA-256), and a hardware random number generator. It has a slave IP bus interface for the host to write configuration and command information, and to read status information. It also has a DMA controller, with an AHB bus interface, to reduce the burden on the host to move the required data to and from memory . SCC Security Controller Security The Security Controller is a security assurance hardware module designed to safely hold sensitive data such as encryption keys, digital right management (DRM) keys, passwords, and biometrics reference data. The SCC monitors the system’s alert signal to determine if the data paths to and from it are secure—that is, cannot be accessed from outside of the defined security perimeter. If not, it erases all sensitive data on its internal RAM. The SCC also features a Key Encryption Module (KEM) that allows non-volatile (external memory) storage of any sensitive data that is temporarily not in use. The KEM utilizes a device-specific hidden secret key and a symmetric cryptographic algorithm to transform the sensitive data into encrypted data. SDMA Smart Direct Memory Access System Control Peripherals The SDMA is multi-channel flexible DMA engine. It helps in maximizing system performance by off loading various cores in dynamic data routing. The SDMA features list is as follows:  Powered by a 16-bit instruction-set micro-RISC engine  Multi-channel DMA supports up to 32 time-division multiplexed DMA channels  48 events with total flexibility to trigger any combination of channels  Memory accesses including linear, FIFO, and 2D addressing  Shared peripherals between ARM Cortex™-A8 and SDMA  Very fast context-switching with two-level priority-based preemptive multi-tasking  DMA units with auto-flush and prefetch capability  Flexible address management for DMA transfers (increment, decrement, and no address changes on source and destination address)  DMA ports can handle unit-directional and bi-directional flows (copy mode)  Up to 8-word buffer for configurable burst transfers for EMI  Support of byte-swapping and CRC calculations  A library of scripts and API are available SIM Subscriber Identity Module Interface Connectivity Peripherals The SIM is an asynchronous interface with additional features for allowing communication with Smart Cards conforming to the ISO 7816 specification. The SIM is designed to facilitate communication to SIM cards or pre-paid phone cards.

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 9 SJC Secure JT AG Interface System Control Peripherals JTAG manipulation is a known hacker’s method of executing unauthorized program code, getting control over secure applications, and running code in privileged modes. The JTAG port provides a debug access to several hardware blocks including the ARM processor and the system bus. The JT AG port must be accessible during platform initial laboratory bring-up, manufacturing tests and troubleshooting, as well as for software debugging by authorized entities. However, in order to properly secure the system, unauthorized JT AG usage should be strictly forbidden. In order to prevent JTAG manipulation while allowing access for manufacturing tests and software debugging, the i.MX51A processor incorporates a mechanism for regulating JT AG access. The i.MX51A Secure JT AG Controller provides four different JT AG security modes that can be selected via e-fuse configuration. SPBA Shared Peripheral Bus Arbiter System Control Peripherals SPBA (Shared Peripheral Bus Arbiter) is a two-to-one IP bus interface (IP bus) arbiter. SPDIF Sony Philips Digital Interface Multimedia Peripherals A standard digital audio transmission protocol developed jointly by the Sony and Philips corporations. Only the transmitter functi onality is supported. SRTC Secure Real Time Clock Security The SRTC incorporates a special System State Retention Register (SSRR) that stores system parameters during system shutdown modes. This register and all SRTC counters are powered by dedicated supply rail NVCC_SRTC_POW. The NVCC_SRTC_POW can be energized even if all other supply rails are shut down. The power for this block comes from NVCC_SRTC_POW supply. When this supply is driven by the MC13892 power management controller, this block can be power backed up via the coin-cell feature of the MC13892.This register is helpful for storing warm boot parameters. The SSRR also stores the system security state. In case of a security violation, the SSRR mark the event (security violation indication). SSI-1 I2S/SSI/AC97 Interface Connectivity Peripherals The SSI is a full-duplex synchronous interface used on the i.MX51A processor to provide connectivity with off-chip audio peripherals. The SSI interfaces connect internally to the AUDMUX which interfaces to the i.MX51 system memory. The SSI supports a wide variety of protocols (SSI normal, SSI network, I2S, and AC-97), bit depths (up to 24 bits per word), and clock/frame sync options. Each SSI has two pairs of 8x24 FIFOs and hardware support for an external DMA controller in order to minimize its impact on system performance. The second pair of FIFOs provides hardware interleaving of a second audio stream, which reduces CPU overhead in use cases where two timeslots are being used simultaneously. SSI-2 SSI-3 TVE TV Encoder Multimedia The TVE is implemented in conjunction with the Image Processing Unit (IPU) allowing handheld devices to display captured still images and video directly on a TV or LCD projector. It supports the following analog video outputs: composite, S-video, and component video up to HD720p/1080i.

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ARM/Control The TrustZone Interrupt Controller (TZIC) collects interrupt requests from all i.MX51 sources and routes them to the ARM core. Each interrupt can be configured as a normal or a secure interrupt. Software Force Registers and software Priority Masking are also supported. UART-1 UART-2 UART-3 UART Interface Connectivity Peripherals Each of the UART modules supports the following serial data transmit/receive protocols and configurations:  7 or 8 bit data words, 1 or 2 stop bits, programmable parity (even, odd, or none)  Programmable baud rates up to 4 MHz. This is a higher max baud rate relative to the 1.875 MHz, which is stated by the TIA/EIA-232-F standard and previous Freescale UART modules.  32-byte FIFO on Tx and 32 half-word FIFO on Rx supporting auto-baud  IrDA 1.0 support (up to SIR speed of 115200 bps)  Option to operate as 8-pins full UART , DCE, or DTE USB USB 2.0 High-Speed OTG and 3x Hosts Connectivity Peripherals USB-OTG contains one high-speed OTG module, which is internally connected to the on-chip HS USB PHY . There are an additional three high-speed host modules that require external USB PHYs. VPU Video Processing Unit Multimedia Peripherals A high-performing video processing unit (VPU), which covers many SD-level video decoders and SD-level encoders as a multi-standard video codec engine as well as several important video processing such as rotation and mirroring. VPU Features:  MPEG-4 decode: 720p, 30 fps, simple profile and advanced simple profile  MPEG-4 encode: D1, 25/30 fps, simple profile  H.263 decode: 720p, 30 fps, profile 3  H.263 encode: D1, 25/30 fps, profile 3  H.264 decode: 720p, 30 fps, baseline, main, and high profile  H.264 encode: D1, 25/30 fps, baseline profile  MPEG-2 decode: 720p, 30 fps, MP-ML  MPEG-2 encode: D1, 25/30 fps, MP-ML (in software with partial acceleration in hardware)  VC-1 decode: 720p, 30 fps, simple, main, and advanced profile  DivX decode: 720p, 30 fps versions 3, 4, and 5  RV10 decode: 720p, 30 fps  MJPEG decode: 32 Mpix/s  MJPEG encode: 64 Mpix/s WDOG-1 Watch Dog Timer Peripherals The Watch Dog Timer supports two comparison points during each counting period. Each of the comparison points is configurable to evoke an interrupt to the ARM core, and a second point evokes an external event on the WDOG line.

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2.1 Special Signal Considerations

Table 3 lists special signal considerations for the i.MX51. The signal names are listed in alphabetical order. The package contact assignments are found in Section 5, “Package Information and Contact Assignments.” Signal descriptions are defined in the i.MX51 Multimedia Applications Processor Reference Manual (MCIMX51RM). WDOG-2 (TZ) Watch Dog (T rustZone) Timer Peripherals The TrustZone Watchdog (TZ WDOG) timer module protects against TrustZone starvation by providing a method of escaping normal mode and forcing a switch to the TZ mode. TZ starvation is a situation where the normal OS prevents switching to the TZ mode. This situation should be avoided, as it can compromise the system’s security. Once the TZ WDOG module is activated, it must be serviced by TZ software on a periodic basis. If servicing does not take place, the timer times out. Upon a time-out, the TZ WDOG asserts a TZ mapped interrupt that forces switching to the TZ mode. If it is still not served, the TZ WDOG asserts a security violation signal to the CSU. The TZ WDOG module cannot be programmed or deactivated by a normal mode SW. XT ALOSC Crystal Oscillator I/F Clocking The XTALOSC module allows connectivity to an external crystal. Table 3. Special Signal Considerations details on the respective clock trees. tie CKIH1/CKIH2 to GND for best practice. not used, float the COMP contact and ensure the DACs are powered down. Note: Previous engineering samples required this reference to be bypassed to a positive supply. GP ANAIO This signal is reserved for Freescale manufacturing use only. Users should float this output.

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GPIO_NAND This is a general-purpose input/output (GPIO3_12) on the NVCC_NANDF_A power rail. IOB, IOG, IOR, IOB_BACK, IOG_BACK, and IOR_BACK These signals are analog TV outputs that should be tied to GND when not being used. JTAG_nnnn The JT AG interface is summarized in Ta ble 4. Use of external resistors is unnecessary. However, if external resistors are used, the user must ensure that the on-chip pull-up/down configuration is followed. For example, do not use an external pull down on an input that has on-chip pull-up. JTAG_TDO is configured with a keeper circuit such that the floating condition is eliminated if an external pull resistor is not present. An external pull resistor on JT AG_TDO is detrimental and should be avoided. JTAG_MOD is referenced as SJC_MOD in the i.MX51 Multimedia Applications Processor Reference Manual (MCIMX51RM). Both names refer to the same signal. JT AG_MOD must be externally connected to GND for normal operation. T ermination to GND through an external pull-down resistor (such as 1 k Ω) is allowed. NC These signals are No Connect (NC) and should be floated by the user. PMIC_INT_REQ When using the MC13892 power management IC, the PMIC_INT_REQ high-priority interrupt input on i.MX51 should be either floated or tied to NVCC_SRTC_POW with a 4.7 k Ω to 68 kΩ resistor. This avoids a continuous current drain on the real-time clock backup battery due to a 100 k Ω on-chip pull-up resistor. PMIC_INT_REQ is not used by the Freescale BSP (board support package) software. The BSP requires that the general-purpose INT output from the MC13892 be connected to the i.MX51 GPIO input GPIO1_8 configured to cause an interrupt that is not high-priority. The original intent was for PMIC_INT_REQ to be connected to a circuit that detects when the battery is almost depleted. In this case, the I/O must be configured as alternate mode 0 (ALT0 = power fail). POR_B This cold reset negative logic input resets all modules and logic in the IC. Note: The POR_B input must be immediately asserted at power-up and remain asserted until after the last power rail is at its working voltage. RESET_IN_B This warm reset negative logic input resets all modules and logic except for the following:  Test logic (JTAG, IOMUXC, DAP) S R T C  Memory repair – Configuration of memory repair per fuse settings  Cold reset logic of WDOG – Some WDOG logic is only reset by POR_B. See WDOG chapter in i.MX51 Multimedia Applications Processor Reference Manual (MCIMX51RM) for details. RREFEXT Determines the reference current for the USB PHY bandgap reference. An external 6.04 k Ω 1% resistor to GND is required. SGND, SVCC, and SVDDGP These sense lines provide the ability to sense actual on-chip voltage levels on their respective supplies. SGND monitors differentials of the on-chip ground versus an external power source. SVCC monitors on-chip VCC, and SVDDGP monitors VDDGP . Freescale recommends connection of the SVCC and SVDDGP signals to the feedback inputs of switching power-supplies or to test points. STR This signal is reserved for Freescale manufacturing use. The user should float this signal. TEST_MODE TEST_MODE is for Freescale factory use only. This signal is internally connected to an on-chip pull-down device. Users must either float this signal or tie it to GND. Table 3. Special Signal Considerations (continued)

3 IOMUX Configuration for Boot Media

The information provided in this section describes the contacts assigned for each type of bootable media. with a closely-mounted 0.1 µF capacitor. maintained when four DDR-2 ICs plus the i.MX51 are drawing current on the resistor divider. Note: When VREF is used with mDDR this signal must be tied to GND. VREFOUT to an external 1.05 k Ω 1% resistor to GND. VREG This regulator is no longer used and should be floated by the user. Table 4. JTAG Controller Interface Summary

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3.1 NAND

dedicated contacts on the IC.

3.2 SD/MMC IOMUX Pin Configuration

Table 5 shows the SD/MMC IOMUX pin configuration.

3.3 I 2C IOMUX Pin Configuration

The contacts assigned to the signals used by the three I2C modules is shown in Table 6. Table 5. SD/MMC IOMUX Pin Configuration 1 N/A in the ROM code indicates the pins are not available. Table 6. I2C IOMUX Pin Configuration

The contacts assigned to the signals used by the three SPI modules is shown in Table 7.

3.5 Wireless External Interface Module (WEIM)

3.6 UART IOMUX Pin Configuration

The contacts assigned to the signals used by the three UART modules are shown in Table 8.

3.7 USB-OTG IOMUX Pin Configuration

dedicated contacts on the IC. Table 7. SPI IOMUX Pin Configuration 1 N/A in the ROM code indicates the pins are not available. Table 8. UART IOMUX Pin Configuration Table 9. ULPI PHY IOMUX Pin Configuration

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Electrical Characteristics

USB OTG ULPI port is not supported and it is not functional. On-chip PHY is always used for the OTG port.

4 Electrical Characteristics

This section provides the device and module-level electrical characteristics for the i.MX51A processor.

4.1 Chip-Level Conditions

This section provides the device-level electrical characteristics for the IC. See Table 10 for a quick reference to the individual tables and sections. CAUTION Stresses beyond those listed under Table 11 may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Table 13 is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. USBOTG_CLK EIM_CS4.alt2 USBOTG_NXT EIM_CS3.alt2 USBOTG_STP EIM_CS2.alt2 USBOTG_DAT0 EIM_D24.alt2 USBOTG_DAT1 EIM_D25.alt2 USBOTG_DAT2 EIM_D26.alt2 USBOTG_DAT3 EIM_D27.alt2 USBOTG_DAT4 EIM_D28.alt2 USBOTG_DAT5 EIM_D29.alt2 USBOTG_DAT6 EIM_D30.alt2 USBOTG_DAT7 EIM_D31.alt2 Table 10. i.MX51A Chip-Level Conditions Table 9. ULPI PHY IOMUX Pin Configuration (continued)

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 17 Table 12 provides the thermal resistance data. Table 11. Absolute Maximum Ratings T able 128. The maximum range can be superseded by the DC tables. 2 During the life of the device, TJ must be limited to a cumulative of 2% of the time over 105 oC. Table 12. Thermal Resistance Data or bottom (B) of the package, with no board attached to the package.

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Table 13 shows the i.MX51 operating ranges. Table 13. i.MX51A Operating Ranges (as needed). The DDR clock rate is 200 MHz.

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4.1.1 Supply Current

Table 15 shows the fuse supply current. NVCC_HS4_1 NVCC_HS4_2 NVCC_HS6 NVCC_HS10 HS-GPIO additional digital power supplies 1.65 — 3.1 V NVCC_I2C I 2C and HS-I2C I/O Supply7 1.65 1.875 1.95 V 2.7 3.0 3.3 NVCC_SRTC_ POW SRTC Core and I/O Supply (L VIO) 1.1 1.2 1.3 V VDDA33 USB PHY I/O analog supply 3.0 3.3 3.6 V VBUS See Table 11 and Table 126 for details. This is not a power supply. —— — — 1 Voltage at the package power supply contact must be maintained between the minimum and maximum voltages. The design must allow for supply tolerances and system voltage drops. 2 The nominal values for the supplies indicate the target setpoint for a tolerance no tighter than ± 50 mV . Use of supplies with a tighter tolerance allows reduction of the setpoint with commensurate power savings. 3 The NVCC_IPUx rails are isolated from one another. This allows the connection of different supply voltages for each one. For example, NVCC_IPU2 can operate at 1.8 V while NVCC_IPU4 operates at 3.0 V. 4 In Read mode, Freescale recommends VDD_FUSE be floated or grounded. T ying VDD_FUSE to a positive supply (3.0 V–3.3 V) increases the possibility of inadvertently blowing fuses and is not recommended. 5 The NAND Flash supplies are composed of three groups: A, B, and C. Each group can be powered with a different supply 6 The analog supplies should be isolated in the application design. Use of series inductors is recommended. 7 Operation of the HS-I2C and I2C is not guaranteed when operated between the supply voltages of 1.95 to 2.7 V . Table 14. Interface Frequency Table 15. Fuse Supply Current1 VDD_FUSE supply per Table 13. Table 13. i.MX51A Operating Ranges (continued)

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Table 16 shows the current core consumption (not including I/O) of the i.MX51. 1 The read current of approximately 5 mA is derived from the DDR supply (NVCC_EMI_DRAM). 2 The current Iprogram is only required during program time. Table 16. i.MX51 Stop Mode Current and Power Consumption

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4.1.2 USB PHY Current Consumption

Table 17 shows the USB PHY current consumption.

4.2 Supply Power-Up/Power-Down Requirements and Restrictions

The system design must comply with the power-up and power-down sequence guidelines as described in this section to guarantee reliable operation of the device. Any deviation from these sequences may result in the following situations:  Excessive current during power-up phase  Prevention of the device from booting  Irreversible damage to the i.MX51A processor (worst-case scenario) Stop Mode  External reference clocks enabled  No power gating for ARM and processing units  HPM voltage VDDGP = 1.0 V, VCC = 1.225 V, VDDA = 1.2 V All PLLs off, all CCM-generated clocks off CKIL input on with 32 kHz signal present All modules disabled USBPHY PLL off External (MHz) crystal and on-chip oscillator powered and generating reference clock No external resistive loads that cause current flow T A = 25 °C VDDGP 50 mA VCC 2 VDDA 1.15 NVCC_OSC 1.5 To ta l 6 3 m W Table 17. USB PHY Current Consumption Table 16. i.MX51 Stop Mode Current and Power Consumption (continued)

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4.2.1 Power-Up Sequence

Figure 2 shows the power-up sequence. Figure 2. Power-Up Sequence asserted until after the last power rail is at its working voltage.

4.3 I/O DC Parameters

1. VDD_FUSE should only be powered when writing.
2. No power-up sequence dependencies exist between the supplies shown in the block diagram shaded in gray.
3. There is no requirement for VDDGP to be preceded by any other power supply other than NVCC_SRTC_POW.
4. If all of the UHVIO supplies (NVCC_NANDFx, NVCC_PER15 and NVCC_PER17) are less than 2.75 V then there is no

is 2.75 V and above, then NVCC_EMI_DRAM needs to power up before the UHVIO supplies as shown here.

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 23 NOTE The term OVDD in this section refers to the associated supply rail of an input or output. The association is shown in Table 128.

4.3.1 GPIO/HSGPIO DC Parameters

The parameters in Table 18 are guaranteed per the operating ranges in Table 13, unless otherwise noted. Table 18. GPIO/HSGPIO DC Electrical Characteristics level through to the target DC level, VIL or VIH. Monotonic input transition time is from 0.1 ns to 1 s. 2 Hysteresis of 250 mV is guaranteed over all operating conditions when hysteresis is enabled. 3 I/O leakage currents are listed in Table 25.

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4.3.2 DDR2 I/O DC Parameters

The parameters in Table 19 are guaranteed per the operating ranges in Table 13, unless otherwise noted.

4.3.3 Low Voltage I/O (LVIO) DC Parameters

The parameters in Table 20 are guaranteed per the operating ranges in Table 13, unless otherwise noted. Table 19. DDR2 I/O DC Electrical Parameters 1 I/O leakage currents are listed in Table 25. Table 20. LVIO DC Electrical Characteristics

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4.3.4 Ultra-High Voltage I/O (UHVIO) DC Parameters

The parameters in Table 21 are guaranteed per the operating ranges in Table 13, unless otherwise noted. Schmitt trigger VT+1, 2 VT+ — 0.5 × OVDD — — V Schmitt trigger VT– 1, 2 VT– — — — 0.5 × OVDD V Input current (no pull-up/down) Iin VI = 0 or OVDD — — See Note 3 — Input current (22 kΩ Pull-up) Iin VI = 0 — — 161 μA Input current (47 kΩ Pull-up) Iin VI = 0 — — 76 μA Input current (100 kΩ Pull-up) Iin VI = 0 — — 36 μA Input current (100 kΩ Pull-down) Iin VI = OVDD — — 36 μA Keeper Circuit Resistance — OVDD = 1.875 V OVDD = 2.775 V kΩ 1 To maintain a valid level, the transition edge of the input must sustain a constant slew rate (monotonic) from the current DC level through to the target DC level, VIL or VIH. Monotonic input transition time is from 0.1 ns to 1 s. 2 Hysteresis of 250 mV is guaranteed over all operating conditions when hysteresis is enabled. 3 I/O leakage currents are listed in Ta ble 25. Table 21. UHVIO DC Electrical Characteristics Table 20. LVIO DC Electrical Characteristics (continued)

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The UHVIO type of I/O cells have to be configured properly according to their supply voltage level, in order to prevent permanent damage to them and in order to not degrade their timing performance. The HVE control bit of the I/O cell (in IOMUX control registers) should be set to 1 for Low voltage operation and to 0 for High voltage operation. The HVE bit should be set as follows:  HVE = 0: High output voltage mode (3.0V to 3.6V)  HVE = 1: Low output voltage mode (1.65V to 3.1V) This is related to power domains, such as NVCC_NANDF, NVCC_PER15, and NVCC_PER17. If HVE bit is not set properly when high voltage level is applied for long durations, it may cause permanent damage over a period of time, causing reduced timing performance of the pad. Similarly, not setting HVE bit properly for low voltage will degrade pad timing performance. The below discussion clarifies concerns about boot-up period. The HVE bit is set, by default, to 1 for low voltage operation. As a result, there might be a short period conflict between the HVE bit value and the applied voltage. This conflict is acceptable under the following conditions: Input Hysteresis VHYS Low voltage mode High voltage mode 0.38 0.95 —0 . 4 3 1.33 V Schmitt trigger VT+2,3 VT+ — 0.5OVDD — — V Schmitt trigger VT– 2,4 VT– — — — 0.5 × OVDD V Input current (no pull-up/down) Iin Vin = 0 Vin = OVDD — — See Note 4 — Input current (22 kΩ Pull-up) Iin Vin = 0 — — 202 μA Input current (75 kΩ Pull-up) Iin Vin = 0 — — 61 μA Input current (100 kΩ Pull-up) Iin Vin = 0 — — 47 μA Input current (360 kΩ Pull-down) Iin Vin = OVDD — — 5.7 μA Keeper Circuit Resistance — NA — 17 — k Ω 1 T o maintain a valid level, the transitioning edge of the input must sustain a constant slew rate (monotonic) from the current DC level through to the target DC level, VIL or VIH. Monotonic input transition time is from 0.1 ns to 1 s. 2 Overshoot and undershoot conditions (transitions above OVDD and below OVSS) on switching pads must be held below 0.6 V, and the duration of the overshoot/undershoot must not exceed 10% of the system clock cycle. Overshoot/undershoot must be controlled through printed circuit board layout, transmission line impedance matching, signal line termination, or other methods. Non-compliance to this specification may affect device reliability or cause permanent damage to the device. 3 Hysteresis of 250 mV is guaranteed over all operating conditions when hysteresis is enabled. 4 I/O leakage currents are listed in Ta bl e 2 5. Table 21. UHVIO DC Electrical Characteristics (continued)

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 27  The UHVIO pads receive supply voltage up to 3.3V (3.6V max); however, the pads do not toggle during the boot-up sequence (using another interface as a boot code source), for boot-up period of about 22 msec.  The UHVIO pads receive up to 3.15V (3.3V max) and are used for accessing the boot code, for boot-up period of about 11 msec. In any case, it is recommended to try to minimize the duration of this period and reduce the amount of toggling on the pads as much as possible. For this, it is recommended to add proper HVE bit programming to the DCD boot-up tables. DCD is a table located in the start of the image that can hold up to 60 address/values. ROM code reads addresses and writes values to it. This space should be sufficient to reprogram the NAND Flash pads for HVE bits.

4.3.5 I 2C I/O DC Parameters

See the errata for HS-I2C in i.MX51 Chip Errata document. The two standard I2C modules have no errata. The DC Electrical Characteristics listed in Table 22 are guaranteed using operating ranges per Table 13, unless otherwise noted.

4.3.6 USBOTG Electrical DC Parameters

This section describes the electrical DC parameters of USBOTG. Table 22. I2C Standard/Fast/High-Speed Mode Electrical Parameters for Low/Medium Drive Strength DC level through to the target DC level, VIL or VIH. Monotonic input transition time is from 0.1 ns to 1 s. 2 Hysteresis of 250 mV is guaranteed over all operating conditions when hysteresis is enabled. 3 I/O leakage currents are listed in Ta ble 2 5.

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4.3.7 USB Port Electrical DC Characteristics

Table 23 and Table 24 list the electrical DC characteristics. Table 23. USBOTG Interface Electrical Specification Table 24. USB Interface Electrical Specification

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 29 Table 25 shows the I/O leakage currents that are based on the operating ranges in Table 13 and the operating temperatures in Table 1.

4.4 Output Buffer Impedance Characteristics

This section defines the I/O Impedance parameters of the i.MX51A processor.

4.4.1 LVIO I/O Output Buffer Impedance

Table 26 shows the LVIO I/O output buffer impedance. Table 25. I/O Leakage Current

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4.4.2 DDR2 Output Buffer Impedance

Table 27 shows the DDR2 output buffer impedance. Table 26. LVIO I/O Output Buffer Impedance Table 27. DDR2 I/O Output Buffer Impedance HVE = 0

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4.4.3 UHVIO Output Buffer Impedance

Table 28 shows the UHVIO output buffer impedance. NOTE Output driver impedance is measured with long transmission line of impedance Ztl attached to I/O pad and incident wave launched into transmission lime. Rpu/Rpd and Ztl form a voltage divider that defines specific voltage of incident wave relative to OVDD. Output driver impedance is calculated from this voltage divider (see Figure 3). Table 28. UHVIO Output Buffer Impedance

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Figure 3. Impedance Matching Load for Measurement

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4.5 I/O AC Parameters

The load circuit and output transition time waveforms are shown in Figure 4 and Figure 5. AC electrical characteristics for slow and fast I/O are presented in the Table 29 and Table 30, respectively. Figure 4. Load Circuit for Output Figure 5. Output Transition Time Waveform

4.5.1 Slow I/O AC Parameters

Table 29 shows the slow I/O AC parameters. Table 29. Slow I/O AC Parameters

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4.5.2 Fast I/O AC Parameters

Table 30 shows the fast I/O AC parameters.

4.5.3 I 2C AC Parameters

See the errata for HS-I2C in the i.MX51 Chip Errata document. The two standard I2C modules have no errata Output Pad di/dt (Low drive) tdit — — — 7 mA/ns Input Transition Times1 trm — — — 25 ns 1 Hysteresis mode is recommended for inputs with transition times greater than 25 ns. Table 30. Fast I/O AC Parameters 1 Hysteresis mode is recommended for inputs with transition time greater than 25 ns. Table 29. Slow I/O AC Parameters (continued)

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The electrical characteristics for I2C I/O are listed in Table 31 to Table 34. Characteristics are guaranteed using operating ranges per Table 13, unless otherwise noted. Table 31. I2C Standard- and Fast-Mode Electrical Parameters Table 32. I2C Standard- and Fast-Mode Electrical Parameters Table 33. I2C High-Speed Mode Electrical Parameters

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 37 Table 34. I2C High-Speed Mode Electrical Parameters Table 35. Low Voltage I2C I/O Parameters

1 Hysteresis mode is recommended for inputs with transition time greater than 25 ns

Table 36. High Voltage I2C I/O Parameters

1 Hysteresis mode is recommended for inputs with transition time > 25 ns

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4.5.4 AC Electrical Characteristics for DDR2

The load circuit for output pads, the output pad transition time waveform and the output pad propagation and transition time waveform are below. Figure 10 shows the output pad transition time waveform. Figure 10. Output Pad Transition Time Waveform Figure 11 shows the output pad propagation and transition time waveform. Figure 11. Output Pad Propagation and Transition Time Waveform Table 37. AC Electrical Characteristics of DDR2 IO Pads for Fast mode and

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 39 AC electrical characteristics in DDR2 mode for Slow mode and for ovdd=1.65 – 1.95 V , ipp_hve = 0 are placed in Table 38: Output Pad di/dt1 di/dt — 390 201 99 mA/ns Input Pad Propagation Delay without Hysteresis (CMOS input), 50%-50%2 Input Pad Propagation Delay with Hysteresis (CMOS input), 50%-50% Input Pad Propagation Delay (DDR input), 50%-50% Maximum Input T ransition Times3 trm — — — 5 ns 1 Max condition for tpr, tpo, tps and didt: wcs model, 1.1 V, IO 1.65 V , 105 °C and s0-s5=111111. Typ condition for tpr, tpo, tps and didt: typ model, 1.2 V , IO 1.8 V , 25 °C and s0-s5 = 101010. Min condition for tpr, tpo, tps and didt: bcs model, 1.3 V , IO 1.95 V, –40 °C and s0-s5=000000. 2 Max condition for trfi and tpi: wcs model, 1.1 V , IO 1.65 V and 105 °C. Typ condition for trfi and tpi: typ model, 1.2 V , IO 3 Hysteresis mode is recommended for input with transition time greater than 25 ns. Table 38. AC Electrical Characteristics of DDR2 IO Pads for Slow Mode and

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AC electrical characteristics in DDR mobile for Fast mode and ovdd=1.65 – 1.95 V , ipp_hve=0 are placed in Table 39. 1 Max condition for tpr, tpo, tps and didt: wcs model, 1.1 V , IO 1.65 V, 105 °C and s0-s5=111111. T yp condition for tpr, tpo, tps and didt: typ model, 1.2 V , IO 1.8 V, 25 °C and s0-s5 = 101010. Min condition for tpr, tpo, tps and didt: bcs model, 1.3 V , IO 1.95 V , –40 °C and s0-s5 = 000000. 2 Max condition for trfi and tpi: wcs model, 1.1 V , IO 1.65 V and 105 °C. Typ condition for trfi and tpi: typ model, 1.2 V , IO 3 Hysteresis mode is recommended for input with transition time greater than 25 ns. Table 39. AC Electrical Characteristics of DDR mobile IO Pads for Fast Mode and

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 41 AC electrical characteristics in DDR mobile for Slow mode and ovdd=1.65-1.95V , ipp_hve=0 are placed in Table 40. 1 Max condition for tpr, tpo, tps and didt: wcs model, 1.1 V , IO 1.65 V, 105 °C and s0-s5=111111. T yp condition for tpr, tpo, tps and didt: typ model, 1.2 V , IO 1.8 V, 25 °C and s0-s5 = 101010. Min condition for tpr, tpo, tps and didt: bcs model, 1.3 V , IO 1.95 V , –40 °C and s0-s5 = 000000. 2 Max condition for trfi and tpi: wcs model, 1.1 V , IO 1.65 V and 105 °C. Typ condition for trfi and tpi: typ model, 1.2 V , IO 3 Hysteresis mode is recommended for input with transition time greater than 25 ns. Table 40. AC Electrical Characteristics of DDR mobile IO Pads for Slow Mode

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AC electrical characteristics in DDR2 mode for Fast mode and for ovdd=1.65–1.95V , ipp_hve=0 are placed in Table 41. AC electrical characteristics in DDR2 mode for Slow mode and for ovdd=1.65-1.95V , ipp_hve=0 are placed in Table 42. 1 Max condition for tpr, tpo, tps and didt: wcs model, 1.1 V , IO 1.65 V, 105 °C and s0-s5=111111. T yp condition for tpr, tpo, tps and didt: typ model, 1.2 V , IO 1.8 V , 25 °C and s0-s5=101010. Min condition for tpr, tpo, tps and didt: bcs model, 1.3 V, IO 1.95 V , –40 °C and s0-s5=000000. 2 Max condition for trfi and tpi: wcs model, 1.1 V , IO 1.65 V and 105 °C. Typ condition for trfi and tpi: typ model, 1.2 V , IO 3 Hysteresis mode is recommended for input with transition time greater than 25 ns. Table 41. AC Electrical Characteristics of DDR2_clk IO Pads for Fast mode and V and 25 °C. Min condition for trfi and tpi: bcs model, 1.3 V , IO 1.95 V and -40 °C. 3 Hysteresis mode is recommended for input with transition time greater than 25 ns. Table 42. AC Electrical Characteristics of DDR2_clk IO Pads for Slow mode and for

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 43 AC electrical characteristics in DDR mobile for Fast mode and ovdd=1.65-1.95V , ipp_hve=0 are placed in Table 43. Output Pad di/dt1 di/dt — 82 40 19 mA/ns Input Pad Propagation Delay (DDR input), 50%-50%2 Maximum Input Transition Times3 trm — — — 5 ns 1 Max condition for tpr, tpo, tps and didt: wcs model, 1.1 V , IO 1.65 V, 105 °C and s0-s5=111111. T yp condition for tpr, tpo, tps and didt: typ model, 1.2 V , IO 1.8 V, 25 °C and s0-s5=101010. Min condition for tpr, tpo, tps and didt: bcs model, 1.3 V, IO 1.95 V , -40 °C and s0-s5=000000. V and 25 °C. Min condition for trfi and tpi: bcs model, 1.3 V , IO 1.95 V and -40 °C. 3 Hysteresis mode is recommended for input with transition time greater than 25 ns. Table 43. AC Electrical Characteristics of DDR_clk mobile IO Pads for Fast mode

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AC electrical characteristics in DDR mobile for Slow mode and ovdd=1.65-1.95V , ipp_hve=0 are placed in Table 44. Output Pad di/dt (Low drive)1 di/dt — 62 30 16 mA/ns Input Pad Propagation Delay (DDR input), 50%-50%2 Maximum Input Transition Times3 trm — — — 5 ns 1 Max condition for tpr, tpo, tps and didt: wcs model, 1.1 V , IO 1.65 V, 105 °C and s0-s5=111111. T yp condition for tpr, tpo, tps and didt: typ model, 1.2 V , IO 1.8 V , 25 °C and s0-s5=101010. Min condition for tpr, tpo, tps and didt: bcs model, 1.3 V, IO 1.95 V , –40 °C and s0-s5=000000. 2 Max condition for trfi and tpi: wcs model, 1.1 V , IO 1.65 V and 105 °C. Typ condition for trfi and tpi: typ model, 1.2 V , IO 3 Hysteresis mode is recommended for input with transition time greater than 25 ns. Table 44. AC Electrical Characteristics of DDR mobile IO Pads for Slow Mode and

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4.6 Module Timing

This section contains the timing and electrical parameters for the modules in the i.MX51 processor.

4.6.1 Reset Timings Parameters

Figure 12 shows the reset timing and Table 45 lists the timing parameters. Figure 12. Reset Timing Diagram 3 Hysteresis mode is recommended for input with transition time greater than 25 ns. Table 45. Reset Timing Parameters

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4.6.2 WDOG Reset Timing Parameters

Figure 13 shows the WDOG reset timing and Table 46 lists the timing parameters. Figure 13. WATCHDOG_RST Timing Diagram CKIL is approximately 32 kHz. TCKIL is one period or approximately 30 μs.

4.6.3 AUDMUX Timing Parameters

AUDMUX external pins is hence governed by the SSI module.

4.6.4 Clock Amplifier Parameters (CKIH1, CKIH2)

Table 46. WATCHDOG_RST Timing Parameters Table 47. CAMP Electrical Parameters (CKIH1, CKIH2)

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4.6.5 DPLL Electrical Parameters

Table 48 shows the DPLL electrical parameters.

4.6.6 NAND Flash Controller (NFC) Parameters

This section provides the relative timing requirements among different signals of NFC at the module level in the different operational modes. Timing parameters in Figure 14, Figure 15, Figure 16, Figure 17, Figure 19, and Table 50 show the default NFC mode (asymmetric mode) using two Flash clock cycles per one access of RE_B and WE_B. Timing parameters in Figure 14, Figure 15, Figure 16, Figure 18, Figure 19, and Table 50 show symmetric NFC mode using one Flash clock cycle per one access of RE_B and WE_B. Table 48. DPLL Electrical Parameters 1 Device input range cannot exceed the electrical specifications of the CAMP , see Table 47. the user has to enter a value “1” less than the desired value at the inputs of DPLL for PDF and MFD. mode is 398 cycles of divided reference clock when DPLL starts after full reset. 5 Tdck is the time period of the output clock, dpdck_2.

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With reference to the timing diagrams, a high is defined as 80% of signal value and low is defined as 20% of signal value. All parameters are given in nanoseconds. The BGA contact load used in calculations is 20 pF (except for NF16 - 40 pF) and there is max drive strength on all contacts. All timing parameters are a function of T, which is the period of the flash_clk clock (“enfc_clk” at system level). This clock frequency can be controlled by the user, configuring CCM (SoC clock controller). The clock is derived from emi_slow_clk after single divider. Table 49 demonstrates few examples for clock frequency settings. NOTE A potential limitation for minimum clock frequency may exist for some devices. When the clock frequency is too low the actual data bus capturing might occur after the specified trhoh (RE_B high to output hold) period. Setting the clock frequency above 25.6 MHz (T = 39 ns) guarantees proper operation for devices having trhoh > 15 ns. It is also recommended to set the NFC_FREQ_SEL Fuse accordingly to initiate the boot with 33.33 MHz clock. Lower frequency operation can be supported for most available devices in the market, relying on data lines Bus-Keeper logic. This depends on device behavior on the data bus in the time interval between data output valid to data output high-Z state. In NAND device parameters this period is marked between trhoh and trhz (RE_B high to output high-Z). In most devices, the data transition from valid value to high-Z occurs without going through other states. Setting the data bus pads to Bus-Keeper mode in the IOMUX registers, keeps the data bus valid internally after the specified hold time, allowing proper capturing with slower clock. Table 49. NFC Clock Settings Examples 1 Rounded up to whole nanoseconds.

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Figure 17. Read Data Latch Timing—Asymmetric Mode Figure 18. Read Data Latch Timing—Symmetric Mode

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 51 Figure 19. Other Timing Parameters Table 50. NFC—Timing Characteristics

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4.6.7 External Interface Module (WEIM)

The following sections provide information on the WEIM.

4.6.7.1 WEIM Signal Cross Reference

Table 51 is a guide to help the user identify signals in the WEIM Chapter of the i.MX51 Multimedia data sheet. NF21 WE high to RE low tWHR 14T -5.45 14T -5.45 — NF22 WE high to busy tWB — — 6T 1 tDSR is calculated by the following formula: Asymmetric mode: tDSR = tREpd + tDpd + 1/2T – Tdl2 Symmetric mode: tDSR = tREpd + tDpd – Tdl2 tREpd + tDpd = 11.2 ns (including clock skew) where tREpd is RE propogation delay in the chip including IO pad delay, and tDpd is Data propogation delay from IO pad to EMI including IO pad delay. tDSR can be used to determine t REA max parameter with the following formula: t REA = 1.5T – tDSR. 2 Tdl is composed of 4 delay-line units each generates an equal delay with min 1.25 ns and max 1 aclk period (T aclk). Default is 1/4 aclk period for each delay-line unit, so all 4 delay lines together generates a total of 1 aclk period. Taclk is “emi_slow_clk” of the system, which default value is 7.5 ns (133 MHz). 3 NF17 is defined only in asymmetric operation mode. NF17 max value is equivalent to max t RHZ value that can be used with NFC. Taclk is “emi_slow_clk” of the system. 4 NF18 is defined only in Symmetric operation mode. t DHR (MIN) is calculated by the following formula: Tdl 2 – (tREpd + tDpd) where tREpd is RE propogation delay in the chip including IO pad delay, and tDpd is Data propogation delay from IO pad to EMI including IO pad delay. NF18 max value is equivalent to max t RHZ value that can be used with NFC. Taclk is “emi_slow_clk” of the system. Table 51. WEIM Signal Cross Reference Table 50. NFC—Timing Characteristics (continued)

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4.6.7.2 WEIM Internal Module Multiplexing

Table 52 provides WEIM internal muxing information. 38 4 ADDR EIM_A[27:16], EIM_DA[15:0] ADDR/M_DA T A EIM_DAx (Addr/Data muxed mode) DAT A EIM_NFC_D (Data bus shared with NAND Flash) EIM_Dx (dedicated data bus) WAIT_B EIM_WAIT Table 52. WEIM Interface Pinout in Various Configurations 1 This mode is not supported due to erratum ENGcm11244. Table 51. WEIM Signal Cross Reference (continued)

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4.6.7.3 General WEIM Timing-Synchronous Mode

Figure 20, Figure 21, and Table 53 specify the timings related to the WEIM module. All WEIM output control signals may be asserted and deasserted by an internal clock synchronized to the BCLK rising edge according to corresponding assertion/negation control fields. Figure 20. WEIM Outputs Timing Diagram Figure 21. WEIM Inputs Timing Diagram Table 53. WEIM Bus Timing Parameters 1

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 55 WE3 BCLK High Level Width 0.4 x t 0.8 x t 1.2 x t 1.6 x t WE4 Clock rise to address valid3 -0.5 x t - 1.25 -0.5 x t + 1.75 1.25 -1.5 x t +1.75 -2 x t - 1.25 -2 x t + 1.75 WE5 Clock rise to address invalid 0.5 x t - 1.25 1.25 1.5 x t + 1.75 2 x t - 1.25 2 x t + 1.75 WE6 Clock rise to CSx_B valid -0.5 x t - 1.25 -0.5 x t + 1.75 1.25 -1.5 x t + 1.75 -2 x t - 1.25 -2 x t + 1.75 WE7 Clock rise to CSx_B invalid 0.5 x t - 1.25 1.25 1.5 x t + 1.75 2 x t - 1.25 2 x t + 1.75 WE8 Clock rise to WE_B Valid -0.5 x t - 1.25 -0.5 x t + 1.75 1.25 -1.5 x t + 1.75 -2 x t - 1.25 -2 x t + 1.75 WE9 Clock rise to WE_B Invalid 0.5 x t - 1.25 1.25 1.5 x t + 1.75 2 x t - 1.25 2 x t + 1.75 WE10 Clock rise to OE_B Valid -0.5 x t - 1.25 -0.5 x t + 1.75 1.25 -1.5 x t + 1.75 -2 x t - 1.25 -2 x t + 1.75 WE11 Clock rise to OE_B Invalid 0.5 x t - 1.25 1.25 1.5 x t + 1.75 2 x t - 1.25 2 x t + 1.75 WE12 Clock rise to BEy_B Valid -0.5 x t - 1.25 .5 x t + 1.75 1.25 -1.5 x t + 1.75 -2 x t - 1.25 -2 x t + 1.75 WE13 Clock rise to BEy_B Invalid 0.5 x t - 1.25 1.25 1.5 x t + 1.75 2 x t - 1.25 2 x t + 1.75 WE14 Clock rise to ADV_B Valid -0.5 x t - 1.25 -0.5 x t + 1.75 1.25 -1.5 x t + 1.75 -2 x t - 1.25 -2 x t + 1.75 WE15 Clock rise to ADV_B Invalid 0.5 x t - 1.25 1.25 1.5 x t + 1.75 2 x t - 1.25 2 x t + 1.75 WE16 Clock rise to Output Data Valid -0.5 x t - 1.25 -0.5 x t + 1.75 1.25 -1.5 x t + 1.75 -2 x t - 1.25 -2 x t + 1.75 WE17 Clock rise to Output Data Invalid 0.5 x t - 1.25 1.25 1.5 x t + 1.75 2 x t - 1.25 2 x t + 1.75 WE18 Input Data setup time to Clock rise WE19 Input Data hold time from Clock rise WE20 WAIT_B setup time to Clock rise WE21 WAIT_B hold time from Clock rise Table 53. WEIM Bus Timing Parameters (continued) 1

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4.6.7.4 Examples of WEIM Synchronous Accesses

Figure 22 to Figure 25 provide few examples of basic WEIM accesses to external memory devices with the timing parameters mentioned previously for specific control parameters settings. Figure 22. Synchronous Memory Read Access, WSC=1 3 For signal measurements “High” is defined as 80% of signal value and “Low” is defined as 20% of signal value.

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Figure 25. 16-Bit Muxed A/D Mode, Synchronous Read Access, WSC=7, RADVN=1, ADH=1, and OEA=0

4.6.7.5 General WEIM Timing-Asynchronous Mode

timing parameters mentioned above.

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Figure 28. Asynchronous Memory Write Access Figure 29. Asynchronous A/D Muxed Write Access

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Table 54. WEIM Asynchronous Timing Parameters Table Relative Chip Select internal driving FFs to CSx out.

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 63 WE43 Input Data Valid to CSx_B Invalid MAXCO - MAXCSO + MAXDI MAXCO - MAXCSO + MAXDI —n s WE44 CSx_B Invalid to Input Data invalid 00 — ns WE45 CSx_B Valid to BEy_B Valid (Write access) WE12 - WE6 + (WBEA - CSA) — 3 + (WBEA - CSA) ns WE46 BEy_B Invalid to CSx_B Invalid (Write access) WE7 - WE13 + (WBEN - CSN) — -3 + (WBEN - CSN) ns MAXDTI DT ACK MAXIMUM delay from chip dtack input to its internal FF + 2 cycles for synchronization —— — WE47 Dtack Active to CSx_B Invalid MAXCO - MAXCSO + MAXDTI MAXCO - MAXCSO + MAXDTI —n s WE48 CSx_B Invalid to Dtack invalid 0 0 — ns 1 Parameters WE4... WE21 value see column BCD = 0 in Table 53. 2 All config. parameters (CSA,CSN,WBEA,WBEN,ADVA,AD VN,OEN,OEA,RBEA & RBEN) are in cycle units. 3 CS Assertion. This bit field determines when CS signal is asserted during read/write cycles. 4 CS Negation. This bit field determines when CS signal is negated during read/write cycles. 5 t is axi_clk cycle time. 6 BE Assertion. This bit field determines when BE signal is asserted during read cycles. 7 BE Negation. This bit field determines when BE signal is negated during read cycles.

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4.6.8 SDRAM Controller Timing Parameters

4.6.8.1 Mobile DDR SDRAM Timing Parameters

Figure 32 shows the basic timing parameters for mobile DDR (mDDR) SDRAM. The timing parameters for this diagram is shown in Table 55. Figure 32. mDDR SDRAM Basic Timing Parameters Table 55. mDDR SDRAM Timing Parameter Table

200 MHz 166 MHz 133 MHz

this is true for medium and low drive strengths.

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 65 Figure 33 shows the timing diagram for mDDR SDRAM write cycle. The timing parameters for this diagram is shown in Table 56. Figure 33. mDDR SDRAM Write cycle Timing Diagram Table 56. mDDR SDRAM Write Cycle Parameter Table 1

200 MHz2

166 MHz 133 MHz

3 This parameter is affected by pad timing. If the slew rate is < 1 V/ns, 0.1 ns should be increased to this value.

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Figure 34 shows the timing diagram for mDDR SDRAM DQ versus DQS and SDCLK read cycle. The timing parameters for this diagram is shown in Table 57. Figure 34. mDDR SDRAM DQ vs. DQS and SDCLK READ Cycle Timing Diagram Table 57. mDDR SDRAM Read Cycle Parameter Table 1

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4.6.9 DDR2 SDRAM Specific Parameters

Figure 35 shows the timing parameters for DDR2. The timing parameters for this diagram appear in Table 58. Figure 35. DDR2 SDRAM Basic Timing Parameters Table 58. DDR2 SDRAM Timing Parameter Table

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Measurements are taken from Vref to Vref (cross-point to cross-point), but JEDEC timings for single-ended signals are defined from Vref to Vil(ac) max or to Vih(ac) min. DDR6 Address output setup time tIS1 1.7 — ns DDR7 Address output hold time tIH1 1.5 — ns 1 These values are for command/address slew rates of 1 V/ns and SDCLK / SDCLK_B differential slew rate of 2 V/ns. For different values use the settings shown in Ta ble 5 9. Table 59. Derating Values for DDR2-400 (SDCLK = 200 MHz) Table 58. DDR2 SDRAM Timing Parameter Table (continued)

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Measurements are taken from Vref to Vref (cross-point to cross-point), but JEDEC timings for single-ended signals are defined from Vref to Vil(ac) max or to Vih(ac) min. Table 61. Derating values for DDR2 Differential DQS 1,2 Table 62. Derating values for DDR2 Single Ended DQS 3,4

1. T est conditions are: Capacitance 15 pF for DDR P ADS. Recommended drive strengths is medium for SDCLK and high for
2. SDRAM CLK and DQS related parameters are being measured from the 50% point. that is, high is defined as 50% of signal
3. T est conditions are: Capacitance 15 pF for DDR P ADS. Recommended drive strengths is medium for SDCLK and high for
4. SDRAM CLK and DQS related parameters are being measured from the 50% point. that is, high is defined as 50% of signal

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4.7 External Peripheral Interfaces

The following sections provide information on external peripheral interfaces.

4.7.1 CSPI Timing Parameters

This section describes the timing parameters of the CSPI. The CSPI has separate timing parameters for master and slave modes. The nomenclature used with the CSPI modules and the respective routing of these signals is shown in Table 64.

4.7.1.1 CSPI Master Mode Timing

Figure 38 depicts the timing of CSPI in Master mode and Table 65 lists the CSPI Master Mode timing characteristics. Figure 38. CSPI Master Mode Timing Diagram Table 64. CSPI Nomenclature and Routing

1 This set of BGA contacts is labeled CSPI, but is actually an eCSPI channel

Table 65. CSPI Master Mode Timing Parameters

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4.7.1.2 CSPI Slave Mode Timing

Figure 39 depicts the timing of CSPI in Slave mode. Table 66 lists the CSPI Slave Mode timing characteristics. Figure 39. CSPI Slave Mode Timing Diagram 2 SPI_RDY is sampled internally by ipg_clk and is asynchronous to all other CSPI signals. Table 66. CSPI Slave Mode Timing Parameters Table 65. CSPI Master Mode Timing Parameters (continued)

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4.7.2 eCSPI Timing Parameters This section describes the timing parameters of the eCSPI. The eCSPI has separate timing parameters for master and slave modes. The nomenclature used with the CSPI modules and the respective routing of these signals is shown in Table 64. 4.7.2.1 eCSPI Master Mode Timing Figure 40 depicts the timing of eCSPI in Master mode and Table 67 lists the eCSPI Master Mode timing characteristics. Figure 40. eCSPI Master Mode Timing Diagram Table 67. eCSPI Master Mode Timing Parameters Table 66. CSPI Slave Mode Timing Parameters (continued)

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4.7.3 eSDHCv2 Timing Parameters This section describes the electrical information of the eSDHCv2. Figure 42 depicts the timing of eSDHCv2, and Table 69 lists the eSDHCv2 timing characteristics. Figure 42. eSDHCv2 Timing Table 69. eSDHCv2 Interface Timing Specification

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4.7.4 FEC AC Timing Parameters

This section describes the electrical information of the Fast Ethernet Controller (FEC) module. The FEC is designed to support both 10 and 100 Mbps Ethernet/IEEE 802.3 networks. An external transceiver interface and transceiver function are required to complete the interface to the media. The FEC supports the 10/100 Mbps MII (18 pins in total) and the 10 Mbps-only 7-wire interface, which uses 7 of the MII pins, for connection to an external Ethernet transceiver. For the pin list of MII and 7-wire, see i.MX51 Multimedia Applications Processor Reference Manual (MCIMX51RM). This section describes the AC timing specifications of the FEC.

4.7.4.1 MII Receive Signal Timing

The MII receive signal timing involves the FEC_RXD[3:0], FEC_RX_DV , FEC_RX_ER, and FEC_RX_CLK signals. The receiver functions correctly up to a FEC_RX_CLK maximum frequency of 25 MHz + 1%. There is no minimum frequency requirement but the processor clock frequency must exceed twice the FEC_RX_CLK frequency. Table 70 lists the MII receive channel signal timing parameters and Figure 43 shows MII receive signal timings. SD7 eSDHC Input Setup Time tISU 2.5 — ns SD8 eSDHC Input Hold Time t IH5 2.5 — ns 1 In low speed mode, card clock must be lower than 400 kHz, voltage ranges from 2.7 to 3.6 V. 2 In normal speed mode for SD/SDIO card, clock frequency can be any value between 0 –25 MHz. In high-speed mode, clock frequency can be any value between 0 –50 MHz. 3 In normal speed mode for MMC card, clock frequency can be any value between 0 –20 MHz. In high-speed mode, clock frequency can be any value between 0 –52 MHz.

4 Measurement taken with CLoad = 20 pF

5 T o satisfy hold timing, the delay difference between clock input and cmd/data input must not exceed 2 ns. Table 70. MII Receive Signal Timing 1 FEC_RX_DV, FEC_RX_CLK, and FEC_RXD0 have same timing in 10 Mbps 7-wire interface mode. Table 69. eSDHCv2 Interface Timing Specification (continued)

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Figure 43. MII Receive Signal Timing Diagram

4.7.4.2 MII Transmit Signal Timing

and Figure 44 shows MII transmit signal timing diagram for the values listed in Table 71. Figure 44. MII Transmit Signal Timing Diagram Table 71. MII Transmit Signal Timing 1 FEC_TX_EN, FEC_TX_CLK, and FEC_TXD0 have the same timing in 10 Mbps 7-wire interface mode.

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4.7.4.3 MII Async Inputs Signal Timing (FEC_CRS and FEC_COL)

Table 72 lists MII asynchronous inputs signal timing information. Figure 45 shows MII asynchronous input timings listed in Table 72. Figure 45. MII Async Inputs Timing Diagram

4.7.4.4 MII Serial Management Channel Timing (FEC_MDIO and FEC_MDC)

Table 72. MII Async Inputs Signal Timing 1 FEC_COL has the same timing in 10 Mbit 7-wire interface mode. Table 73. MII Transmit Signal Timing

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Figure 46. MII Serial Management Channel Timing Diagram

4.7.5 Frequency Pre-Multiplier (FPM) Electrical Parameters (CKIL)

in the megahertz region. The output of the FPM provides the reference frequency for the on-chip DPLLs. Parameters of the FPM are listed in Table 74.

4.7.6 High-Speed I 2C (HS-I2C) Timing Parameters

following modes: Standard, Fast and High speed. two standard I2C modules that have no errata. Table 74. FPM Specifications

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4.7.6.1 Standard and Fast Mode Timing Parameters

Figure 47 depicts the standard and fast mode timings of HS-I2C module, and Table 75 lists the timing characteristics. Figure 47. HS-I2C Standard and Fast Mode Bus Timing Table 75. HS-I2C Timing Parameters—Standard and Fast Mode of 250 ns must then be met. This automatically is the case if the device does not stretch the LOW period of the SCLH signal. before the SCLH line is released. 4 Cb = total capacitance of one bus line in pF .

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4.7.6.2 High-Speed Mode Timing Parameters

Figure 48 depicts the high-speed mode timings of HS-I2C module, and Table 76 lists the timing characteristics. Figure 48. High-Speed Mode Timing Table 76. HS-I2C High-Speed Mode Timing Parameters

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4.7.7 I 2C Module Timing Parameters

This section describes the timing parameters of the I2C Module. Figure 49 depicts the timing of I2C module, and Table 77 lists the I2C Module timing characteristics. Figure 49. I2C Bus Timing Table 77. I2C Module Timing Parameters of 250 ns must be met. This automatically is the case if the device does not stretch the LOW period of the I2CLK signal. before the I2CLK line is released. 4 Cb = total capacitance of one bus line in pF .

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4.7.8 Image Processing Unit (IPU) Module Parameters

The purpose of the IPU is to provide comprehensive support for the flow of data from an image sensor and/or to a display device. This support covers all aspects of these activities:  Connectivity to relevant devices — cameras, displays, graphics accelerators, and TV encoders.  Related image processing and manipulation: di splay processing, image conversions, and other related functions.  Synchronization and control capabilities such as avoidance of tearing artifacts.

4.7.8.1 Sensor Interface Timings

There are three camera timing modes supported by the IPU. Smart camera sensors, which include imaging processing, usually support video mode transfer. They use an embedded timing syntax to replace the SENSB_VSYNC and SENSB_HSYNC signals. The timing syntax is defined by the BT.656/BT.1120 standards. This operation mode follows the recommendations of ITU BT.656/ ITU BT.1120 specifications. The only control signal used is SENSB_PIX_CLK. Start-of-frame and active-line signals are embedded in the data stream. An active line starts with a SA V code and ends with a EA V code. In some cases, digital blanking is inserted in between EA V and SA V code. The CSI decodes and filters out the timing-coding from the data stream, thus recovering SENSB_VSYNC and SENSB_HSYNC signals for internal use. On BT.656 one component per cycle is received over the SENSB_DATA bus. On BT.1120 two components per cycle are received over the SENSB_DATA bus.

4.7.8.1.2 Gated Clock Mode

The SENSB_VSYNC, SENSB_HSYNC, and SENSB_PIX_CLK signals are used in this mode. See Figure 50. Figure 50. Gated Clock Mode Timing Diagram

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 85 A frame starts with a rising edge on SENSB_VSYNC (all the timings correspond to straight polarity of the corresponding signals). Then SENSB_HSYNC goes to high and hold for the entire line. Pixel clock is valid as long as SENSB_HSYNC is high. Data is latched at the rising edge of the valid pixel clocks. SENSB_HSYNC goes to low at the end of line. Pixel clocks then become invalid and the CSI stops receiving data from the stream. For next line the SENSB_HSYNC timing repeats. For next frame the SENSB_VSYNC timing repeats.

4.7.8.1.3 Non-Gated Clock Mode

The timing is the same as the gated-clock mode (described in Section 4.7.8.1.2, “Gated Clock Mode”), except for the SENSB_HSYNC signal, which is not used. See Figure 51. All incoming pixel clocks are valid and cause data to be latched into the input FIFO. The SENSB_PIX_CLK signal is inactive (states low) until valid data is going to be transmitted over the bus. Figure 51. Non-Gated Clock Mode Timing Diagram active-high/low SENSB_HSYNC; and rising/falling-edge triggered SENSB_PIX_CLK.

4.7.8.2 Electrical Characteristics

generated by the IPU. Table 78 shows the timing characteristics for the diagram shown in Figure 52. Figure 52. Sensor Interface Timing Diagram

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4.7.8.3 IPU Display Interface Signal Mapping

The IPU supports a number of display output video formats. Table 79 defines the mapping of the Display Interface Pins used during various supported video interface formats. Table 78. Sensor Interface Timing Characteristics

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 87 Table 79. Video Signal Cross-Reference Groups should not be overlapped.

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DIx_DISP_CLK PixCLK — — DIx_PIN1 — VSYNC_IN May be required for anti-tearing DIx_PIN2 HSYNC — — DIx_PIN3 VSYNC — VSYNC out DIx_PIN4 — — Additional frame/row synchronous signals with programmable timing DIx_PIN5 — — DIx_PIN6 — — DIx_PIN7 — — DIx_PIN8 — — DIx_D0_CS — CS0 — DIx_D1_CS — CS1 Alternate mode of PWM output for contrast or brightness control DIx_PIN11 — WR — DIx_PIN12 — RD — DIx_PIN13 — RS1 Register select signal DIx_PIN14 — RS2 Optional RS2 DIx_PIN15 DRDY/DV DRDY Data validation/blank, data enable DIx_PIN16 — — Additional data synchronous signals with programmable features/timingDIx_PIN17 Q — 1 Signal mapping (both data and control/synchronization) is flexible. The table provides examples. 2 This mode works in compliance with recommendation ITU-R BT .656. The timing reference signals (frame start, frame end, line start, and line end) are embedded in the 8-bit data bus. Only video data is supported, transmission of non-video related data during blanking intervals is not supported. Table 79. Video Signal Cross-Reference (continued)

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4.7.8.4 IPU Display Interface Timing

The IPU Display Interface supports two kinds of display’s accesses: synchronous and asynchronous. There are two groups of external interface pins to provide synchronous and asynchronous controls accordantly.

4.7.8.4.1 Synchronous Controls

The synchronous control is a signal that changes its value as a function either of a system or of an external clock. This control has a permanent period and a permanent wave form. There are special physical outputs to provide synchronous controls:  The ipp_disp_clk is a dedicated base synchronous si gnal that is used to generate a base display (component, pixel) clock for a display.  The ipp_pin_1– ipp_pin_7 are general purpose synchronous pins, that can be used to provide HSYNC, VSYNC, DRDY or any else independent signal to a display. The IPU has a system of internal binding counters for internal events (like HSYNC/VSYCN and so on) calculation. The internal event (local start point) is synchronized with internal DI_CLK. A suitable control starts from the local start point with predefined UP and DOWN values to calculate control’s changing points with half DI_CLK resolution. A full description of the counters system is in the IPU chapter of the i.MX51 Multimedia Applications Processor Reference Manual (MCIMX51RM).

4.7.8.4.2 Asynchronous Controls

The asynchronous control is a data oriented signal that changes its a value with an output data according to an additional internal flags coming with the data. There are special physical outputs to provide asynchronous controls, as follows:  The ipp_d0_cs and ipp_d1_cspins are dedicated to pr ovide chip select signals to two displays  The ipp_pin_11– ipp_pin_17 are general purpose asynchronous pins, that can be used to provide WR. RD, RS or any else data oriented signal to display. NOTE The IPU has independent signal generators for asynchronous signals toggling. When a DI decides to put a new asynchronous data in the bus, a new internal start (local start point) is generated. The signals generators calculate predefined UP and DOWN values to change pins states with half DI_CLK resolution.

4.7.8.5 Synchronous Interfaces to Standard Active Matrix TFT LCD Panels

4.7.8.5.1 IPU Display Operating Signals

The IPU uses four control signals and data to operate a standard synchronous interface:  IPP_DISP_CLK—Clock to display  HSYNC—Horizontal synchronization

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 VSYNC—Vertical synchronization  DRDY—Active data All synchronous display controls are generated on base of an internal generated “local start point”. The synchronous display controls can be placed on time axis with DI’s offset, up and down parameters. The display access can be whole number of DI clock (Tdiclk) only. The IPP_DATA can not be moved relative to the local start point.

4.7.8.5.2 LCD Interface Functional Description

Figure 53 depicts the LCD interface timing for a generic active matrix color TFT panel. In this figure signals are shown with negative polarity. The sequence of events for active matrix interface timing is:  DI_CLK internal DI clock, used for calculation of other controls.  IPP_DISP_CLK latches data into the panel on its ne gative edge (when positive polarity is selected). In active mode, IPP_DISP_CLK runs continuously.  HSYNC causes the panel to start a new line. (Usually IPP_PIN_2 is used as HSYNC)  VSYNC causes the panel to start a new frame. It always encompasses at least one HSYNC pulse. (Usually IPP_PIN_3 is used as VSYNC)  DRDY acts like an output enable signal to the CRT display. This output enables the data to be shifted onto the display. When disabled, the data is invalid and the trace is off. (For DRDY can be used either synchronous or asynchronous generic purpose pin as well.) Figure 53. Interface Timing Diagram for TFT (Active Matrix) Panels

4.7.8.5.3 TFT Panel Sync Pulse Timing Diagrams

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Table 80 shows timing characteristics of signals presented in Figure 54 and Figure 55. Table 80. Synchronous Display Interface Timing Characteristics (Pixel Level) FW—with of active line in interface clocks. be built by suitable DI’s counter. built by suitable DI’s counter.

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 93 The maximal accuracy of UP/DOWN edge of controls is IP5o Offset of IPP_DISP_CLK Todicp DISP_CLK_OFFSET × Tdiclk DISP_CLK_OFFSET— offset of IPP_DISP_CLK edges from local start point, in DI_CLK×2 (0.5 DI_CLK Resolution) Defined by DISP_CLK counter ns IP13o Offset of VSYNC Tovs VSYNC_OFFSET × Tdiclk VSYNC_OFFSET—offset of Vsync edges from a local start point, when a Vsync should be active, in DI_CLK (0.5 DI_CLK Resolution).The VSYNC_OFFSET should be built by suitable DI’s counter. ns IP8o Offset of HSYNC T ohs HSYNC_OFFSET × Tdiclk HSYNC_OFFSET—offset of Hsync edges from a local start point, when a Hsync should be active, in DI_CLK (0.5 DI_CLK Resolution).The HSYNC_OFFSET should be built by suitable DI’s counter. ns IP9o Offset of DRDY Todrdy DRDY_OFFSET × Tdiclk DRDY_OFFSET— offset of DRDY edges from a suitable local start point, when a corresponding data has been set on the bus, in DI_CLK (0.5 DI_CLK Resolution) The DRDY_OFFSET should be built by suitable DI’s counter. ns 1 Display interface clock period immediate value. DISP_CLK_PERIOD—number of DI_CLK per one Tdicp. Resolution 1/16 of DI_CLK DI_CLK_PERIOD—relation of between programing clock frequency and current system clock frequency Display interface clock period average value. 2 DI’s counter can define offset, period and UP/DOWN characteristic of output signal according to programed parameters of the counter. Same of parameters in the table are not defined by DI’s registers directly (by name), but can be generated by corresponding DI’s counter. The SCREEN_WIDTH is an input value for DI’s HSYNC generation counter. The distance between HSYNCs is a SCREEN_WIDTH. Table 80. Synchronous Display Interface Timing Characteristics (Pixel Level) (continued)

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The maximal accuracy of UP/DOWN edge of IPP_DATA is The DISP_CLK_PERIOD, DI_CLK_PERIOD parameters are programmed via registers. Figure 56 shows the synchronous display interface timing diagram for access level. The DISP_CLK_DOWN and DISP_CLK_UP parameters are set by using the register. Table 81 shows the timing characteristics for the diagram shown in Figure 56. Figure 56. Synchronous Display Interface Timing Diagram—Access Level Table 81. Synchronous Display Interface Timing Characteristics (Access Level) 1The exact conditions have not been finalized, but will likely match the current customer requirement for their specific display . These conditions may be chip specific.

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4.7.8.6 Interface to a TV Encoder

The interface has an 8-bit data bus, transferring a single 8-bit value (Y/U/V) in each cycle. The timing of the interface is described in Figure 57. NOTE  The frequency of the clock DISP_CLK is 27 MHz (within 10%)  The HSYNC, VSYNC signals are active low.  The DRDY signal is shown as active high.  The transition to the next row is marked by the negative edge of the HSYNC signal. It remains low for a single clock cycle  The transition to the next field/frame is marked by the negative edge of the VSYNC signal. It remains low for at least one clock cycles — At a transition to an odd field (of the next frame), the negative edges of VSYNC and HSYNC coincide. — At a transition is to an even field (of the same frame), they do not coincide.  The active intervals—during which data is transferred—are marked by the HSYNC signal being high.

2 Display interface clock down time

3 Display interface clock up time

where CEIL(X) rounds the elements of X to the nearest integers towards infinity. Tdicd 1 2---T diclk ceil× 2 DISP_CLK_DOWN× ⎛⎞= Tdicu 1 2---T diclk ceil× 2 DISP_CLK_UP× ⎛⎞=

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Figure 57. TV Encoder Interface Timing Diagram

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4.7.8.6.1 TV Encoder Performance Specifications

All the parameters in the table are defined under the following conditions: Rset = 1.05 kΩ ±1%, resistor on VREFOUT pin to Ground Rload = 37.5 Ω ±1%, output load to Ground The TV encoder output specifications are shown in Table 82. Table 82. TV Encoder Video Performance Specifications

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4.7.8.7 Asynchronous Interfaces

4.7.8.7.1 Standard Parallel Interfaces

The IPU has four signal generator machines for asynchronous signal. Each machine generates IPU’s internal control levels (0 or 1) by UP and DOWN are defined in Registers. Each asynchronous pin has a dynamic connection with one of the signal generators. This connection is redefined again with a new display access (pixel/component) The IPU can generate control signals according to system 80/68 requirements. The burst length is received as a result from predefined behavior of the internal signal generator machines. The access to a display is realized by the following:  CS (IPP_CS) chip select  WR (IPP_PIN_11) write strobe  RD (IPP_PIN_12) read strobe  RS (IPP_PIN_13) Register select (A0) Both system 80 and system 68k interfaces are supported for all described modes as depicted in Figure 58, Figure 59, Figure 60, and Figure 61. The timing images correspond to active-low IPP_CS, WR and RD signals. Each asynchronous access is defined by an access size parameter. This parameter can be different between different kinds of accesses. This parameter defines a length of windows, when suitable controls of the current access are valid. A pause between two different display accesses can be guaranteed by programing of suitable access sizes. There are no minimal/maximal hold/setup time hard defined by DI. Each control signal can be switched at any time during access size. Chroma/Luma Gain Inequality — — 1.0 — ±% Chroma/Luma Delay Inequality — — 1.0 — ±ns VIDEO PERFORMANCE IN HD MODE 2 Luma Frequency Response 0-30 MHz –0.2 — 0.2 dB Chroma Frequency Response 0-15 MHz, YCbCr 422 mode –0.2 — 0.2 dB Luma Nonlinearity — — 3.2 — % Chroma Nonlinearity — — 3.4 — % Luma Signal-to-Noise Ratio 0-30 MHz — 62 — dB Chroma Signal-to-Noise Ratio 0-15 MHz — 72 — dB

1 Guaranteed by design

2 Guaranteed by characterization

3 Rset = VREFOUT's external resistor to ground = 1.05 k Ω Table 82. TV Encoder Video Performance Specifications (continued)

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Figure 59. Asynchronous Parallel System 80 Interface (Type 2) Timing Diagram

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 101 Figure 60. Asynchronous Parallel System 68k Interface (Type 1) Timing Diagram

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Figure 61. Asynchronous Parallel System 68k Interface (Type 2) TIming Diagram

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4.7.8.7.2 Asynchronous Parallel Interface Timing Parameters

Figure 63 depicts timing of asynchronous parallel interfaces based on the system 80 and system 68k interfaces. Table 84 shows the timing characteristics at display access level. Table 83 shows the timing characteristics at the logical level—from configuration perspective. All timing diagrams are based on active low control signals (signals polarity is controlled through the DI_DISP_SIG_POL register). Figure 63. Asynchronous Parallel Interface Timing Diagram Table 83. Asynchronous Display Interface Timing Parameters (Pixel Level)

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 105 IP31 CS hold Tdchc DOWN# CS strobe release, predefined value in DI REGISTER IP32 RS hold Tdchrr DOWN# RS strobe release, predefined value in DI REGISTER IP33 Read start Tdcsr UP# read strobe switch, predefined value in DI REGISTER ns IP34 Read hold Tdchr DOWN# read strobe release signal, predefined value in DI REGISTER ns IP35 Write start Tdcsw UP# write strobe switch, predefined value in DI REGISTER ns IP36 Controls hold time for write Tdchw DOWN# write strobe release, predefined value in DI REGISTER ns IP37 Slave device data delay 1 T racc Delay of incoming data Physical delay of display’s data, defined from Read access local start point ns IP38 Slave device data hold time 3 T roh Hold time of data on the buss Time that display read data is valid in input bus ns IP47 Read time point 13 Tdrp Data sampling point Point of input data sampling by DI, predefined in DC Microcode 1This parameter is a requirement to the display connected to the IPU. Table 84. Asynchronous Parallel Interface Timing Parameters (Access Level) Table 83. Asynchronous Display Interface Timing Parameters (Pixel Level) (continued)

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IP39 Setup time for wait signal Tswait — — — — IP47 Read time point 13 Tdrp Tdrp–1.5 Tdrp Tdrp+1.5 ns 1The exact conditions have not been finalized, but will likely match the current customer requirement for their specific display . These conditions may be chip specific. 2Display period value for read ACCESS_SIZE is predefined in REGISTER 3Display period value for write ACCESS_SIZE is predefined in REGISTER 4Display control down for CS DISP_DOWN is predefined in REGISTER 5Display control up for CS DISP_UP is predefined in REGISTER 6Display control down for RS DISP_DOWN is predefined in REGISTER 7Display control up for RS DISP_UP is predefined in REGISTER 8Display control down for read DISP_DOWN is predefined in REGISTER Table 84. Asynchronous Parallel Interface Timing Parameters (Access Level) (continued)

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4.7.8.8 Standard Serial Interfaces

The IPU supports the following types of asynchronous serial interfaces: 1. 3-wire (with bidirectional data line). 2. 4-wire (with separate data input and output lines). 3. 5-wire type 1 (with sampling RS by the serial clock). 4. 5-wire type 2 (with sampling RS by the chip select signal). The IPU has four independent outputs and one input. The port can be configured to provide 3, 4, or 5-wire interfaces. Figure 64 depicts the timing diagram of the 3-wire serial interface. The timing diagrams correspond to active-low IPP#_CS signal and the straight polarity of the IPP_CLK signal. For this interface, a bidirectional data line is used outside the chip. The IPU still uses separate input and output data lines (IPP_IND_DISPB_SD_D and IPP_DO_DISPB_SD_D). The I/O mux should provide 9Display control up for read DISP_UP is predefined in REGISTER 10Display control down for read DISP_DOWN is predefined in REGISTER 11Display control up for write DISP_UP is predefined in REGISTER 12This parameter is a requirement to the display connected to the IPU 13Data read point Note: DISP#_READ_EN—operand of DC’s MICROCDE READ command to sample incoming data 14Loop back delay Tlbd is the cumulative propagation delay of read controls and read data. It includes an IPU output delay, a chip-level output delay , board delays, a chip-level input delay, an IPU input delay. This value is chip specific. Tdicur 1 2---T DI_CLK ceil× 2 DISP_UP_#× ⎛⎞= Tdicdrw 1 2---T DI_CLK ceil× 2 DISP_DOWN_#× ⎛⎞= Tdicuw 1 2---T DI_CLK ceil× 2 DISP_UP_#× DI_CLK_PERIOD ⎛⎞= Tdrp T DI_CLK ceil× DISP#_READ_EN

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joining the internal data lines to the bidirectional external line according to the IPP_OBE_DISPB_SD_D signal provided by the IPU. Figure 64. 3-Wire Serial Interface Timing Diagram and output data lines both inside and outside the chip. Figure 65. 4-Wire Serial Interface Timing Diagram

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4.7.8.8.1 Asynchronous Serial Interface Timing Parameters

Figure 67 depicts timing of the serial interface. Table 85 shows timing characteristics at display access level. Figure 67. Asynchronous Serial Interface Timing Diagram Table 85. Asynchronous Serial Interface Timing Characteristics (Access Level)

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 111 IP52 Write clock low pulse width T wl Tdicdw–Tdicuw–1.5 Tdicdw 6–Tdicuw7 Tdicdw–Tdicuw+1.5 ns IP53 Write clock high pulse width T wh Tdicpw–Tdicdw+ Tdicuw–1.5 Tdicpw–Tdicdw+ Tdicuw Tdicpw–Tdicdw+ Tdicuw+1.5 ns IP54 Controls setup time for read Tdcsr Tdicur–1.5 Tdicur — ns IP55 Controls hold time for read Tdchr Tdicpr–Tdicdr–1.5 Tdicpr–Tdicdr — ns IP56 Controls setup time for write Tdcsw Tdicuw–1.5 Tdicuw — ns IP57 Controls hold time for write Tdchw Tdicpw–Tdicdw–1.5 Tdicpw–Tdicdw — ns IP58 Slave device data delay 8 T racc 0 — Tdrp 9–Tlbd10-Tdicur-1.5 ns IP59 Slave device data hold time 8 T roh Tdrp-Tlbd-Tdicdr+1.5 — Tdicpr-Tdicdr-1.5 ns IP60 Write data setup time Tds Tdicdw-1.5 Tdicdw — ns IP61 Write data hold time Tdh Tdicpw-Tdicdw-1.5 Tdicpw-Tdicdw — ns IP62 Read period 2 Tdicpr Tdicpr-1.5 Tdicpr Tdicpr+1.5 ns IP63 Write period 3 Tdicpw Tdicpw-1.5 Tdicpw Tdicpw+1.5 ns IP64 Read down time 4 Tdicdr Tdicdr-1.5 Tdicdr Tdicdr+1.5 ns IP65 Read up time 5 Tdicur Tdicur-1.5 Tdicur Tdicur+1.5 ns IP66 Write down time 6 Tdicdw Tdicdw-1.5 Tdicdw Tdicdw+1.5 ns IP67 Write up time 7 Tdicuw Tdicuw-1.5 Tdicuw Tdicuw+1.5 ns IP68 Read time point 9 Tdrp Tdrp-1.5 Tdrp Tdrp+1.5 ns IP69 Clock offset 11 Toclk Toclk-1.5 Toclk Toclk+1.5 ns IP70 RS up time 12 Tdicurs Tdicurs–1.5 Tdicurs Tdicurs+1.5 ns IP71 RS down time 13 Tdicdrs Tdicdrs -1.5 Tdicdrs Tdicdrs+1.5 ns IP72 CS up time 14 Tdicucs Tdicucs –1.5 Tdicucs Tdicucs+1.5 ns IP73 CS down time 15 Tdicdcs Tdicdcs –1.5 Tdicdcs Tdicdcs+1.5 ns 1The exact conditions have not been finalized, but will likely match the current customer requirement for their specific display . These conditions may be chip specific. 2Display interface clock period value for read 3Display interface clock period value for write Table 85. Asynchronous Serial Interface Timing Characteristics (Access Level) (continued)

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4Display interface clock down time for read 5Display interface clock up time for read 6Display interface clock down time for write 7Display interface clock up time for write 8This parameter is a requirement to the display connected to the IPU 9Data read point DISP_RD_EN is predefined in REGISTER 10Loop back delay Tlbd is the cumulative propagation delay of read controls and read data. It includes an IPU output delay, a chip-level output delay, board delays, a chip-level input delay, an IPU input delay. This value is chip specific. 11Display interface clock offset value CLK_OFFSET is predefined in REGISTER 12Display RS up time DISP_RS_UP is predefined in REGISTER 13Display RS down time DISP_RS_DOWN is predefined in REGISTER 14Display RS up time DISP_CS_UP is predefined in REGISTER Tdicdr 1 2---T DI_CLK ceil× 2 DISP_DOWN_#× ⎛⎞= Tdicur 1 2---T DI_CLK ceil× 2 DISP_UP_#× ⎛⎞= Tdicdw 1 2---T DI_CLK ceil× 2 DISP_DOWN_#× ⎛⎞= Tdicuw 1 2---T DI_CLK ceil× 2 DISP_UP_#× DI_CLK_PERIOD ⎛⎞= Tdrp T DI_CLK ceil× DISP_READ_EN Toclk T DI_CLK ceil× DISP_CLK_OFFSET Tdicurs T DI_CLK ceil× DISP_RS_UP_# Tdicdrs T DI_CLK ceil× DISP_RS_DOWN_# Tdicucs T DI_CLK ceil× DISP_CS_UP_#

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Figure 70 depicts Write 1 Sequence timing, Figure 71 depicts the Read Sequence timing, and Table 88 lists the timing parameters. Figure 70. Write 1 Sequence Timing Diagram Figure 71. Read Sequence Timing Diagram

4.7.10 Pulse Width Modulator (PWM) Timing Parameters

Table 88. WR1 /RD Timing Parameters

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 115 Figure 72 depicts the timing of the PWM, and Table 89 lists the PWM timing parameters. Figure 72. PWM Timing

4.7.11 P-ATA Timing Parameters

A TA/ATAPI-5 specification and these requirements are configurable by the ATA module registers. Table 89. PWM Output Timing Parameter

1 System CLK frequency 1

1 CL of PWMO = 30 pF

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Table 90 and Figure 73 define the AC characteristics of all the P-ATA interface signals on all data transfer modes. Figure 73. P-ATA Interface Signals Timing Diagram interface is 3.3 V compatible. UDMA mode operation is needed, this may not be compatible with bus buffers. Another area of attention is the slew rate limit imposed by the ATA specification on the ATA bus. a 40 pF load. Not many vendors of bus buffers specify slew rate of the outgoing signals. signal is such that contention on the host and device tri-state busses is always avoided. of the i.MX51 P-ATA interface on silicon, the bus buffer used, the cable delay and cable skew. Table 90. AC Characteristics of All Interface Signals amplitude with all capacitive loads from 15 –40 pF where all signals have the same capacitive load value.

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4.7.11.1 PIO Mode Read Timing

Figure 74 shows timing for PIO read and Table 92 lists the timing parameters for PIO read. Figure 74. PIO Read Timing Diagram Table 92. PIO Read Timing Parameters

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Figure 76 shows timing for MDMA read, Figure 77 shows timing for MDMA write, and Table 94 lists the timing parameters for MDMA read and write. Figure 76. MDMA Read Timing Diagram Figure 77. MDMA Write Timing Diagram Table 94. MDMA Read and Write Timing Parameters

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4.7.11.2 Ultra DMA (UDMA) Input Timing

Figure 78 shows timing when the UDMA in transfer starts, Figure 79 shows timing when the UDMA in host terminates transfer, Figure 80 shows timing when the UDMA in device terminates transfer, and Table 95 lists the timing parameters for UDMA in burst. Figure 78. UDMA In Transfer Starts Timing Diagram Figure 79. UDMA In Host Terminates Transfer Timing Diagram Table 94. MDMA Read and Write Timing Parameters (continued)

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Figure 80. UDMA In Device Terminates Transfer Timing Diagram Table 95. UDMA In Burst Timing Parameters active edge on the DSTROBE signal. The equation given on this line tries to capture this constraint. 2 Make ton and toff big enough to avoid bus contention.

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4.7.11.3 UDMA Output Timing

Figure 81 shows timing when the UDMA out transfer starts, Figure 82 shows timing when the UDMA out host terminates transfer, Figure 83 shows timing when the UDMA out device terminates transfer, and Table 96 lists the timing parameters for UDMA out burst. Figure 81. UDMA Out Transfer Starts Timing Diagram Figure 82. UDMA Out Host Terminates Transfer Timing Diagram

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Figure 83. UDMA Out Device Terminates Transfer Timing Diagram Table 96. UDMA Out Burst Timing Parameters

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4.7.12 SIM (Subscriber Identification Module) Timing

This section describes the electrical parameters of the SIM module. Each SIM module interface consists of 12 signals (two separate ports each containing six signals). Typically a a port uses five signals. The interface is designed to be used with synchronous SIM cards meaning the SIM module provides the clock used by the SIM card. The clock frequency is typically 372 times the Tx/Rxdata rate, however the SIM module can work with CLK frequencies of 16 times the Tx/Rx data rate. There is no timing relationship between the clock and the data. The clock that the SIM module provides to the SIM card is used by the SIM card to recover the clock from the data in the same manner as standard UART data exchanges. All six signals (5 for bi-directional Tx/Rx) of the SIM module are asynchronous to each other. There are no required timing relationships between signals in normal mode. The SIM card is initiated by the interface device; the SIM card responds with Answer to Reset. Although the SIM interface has no defined requirements, the ISO-7816 defines reset and power-down sequences. (For detailed information, see ISO-7816.) Table 97 defines the general timing requirements for the SIM interface. Figure 84. SIM Clock Timing Diagram Table 97. SIM Timing Parameters, High Drive Strength

2 With C = 50 pF

3 With C = 50 pF

4 With Cin = 30 pF , Cout = 30 pF

5 With Cin = 30 pF

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4.7.12.1 Reset Sequence

4.7.12.1.1 Cards with internal reset

The sequence of reset for this kind of SIM Cards is as follows (see Figure 85):  After power up, the clock signal is enabled on SIMx_CLKy(time T0)  After 200 clock cycles, RX must be high.  The card must send a response on RX acknowl edging the reset between 400 and 40000 clock cycles after T0. Figure 85. Internal-Reset Card Reset Sequence

4.7.12.1.2 Cards with Active Low Reset

 After 200 clock cycles, SIMx_DA TAy_RX_TX must be high. received on SIMx_DA TAy_RX_TX between 400 and 40000 clock cycles after T1.

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 127 Figure 86. Active-Low-Reset Cards Reset Sequence

4.7.12.2 Power Down Sequence

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Each of these steps is done in one CKIL period (usually 32 kHz). Power-down can be started because of a SIM Card removal detection or launched by the processor. Figure 87 and Table 98 shows the usual timing requirements for this sequence, with Fckil = CKIL frequency value. Figure 87. SmartCard Interface Power Down AC Timing Table 98. Timing Requirements for Power Down Sequence

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4.7.13 SCAN JTAG Controller (SJC) Timing Parameters

Figure 88 depicts the SJC test clock input timing. Figure 89 depicts the SJC boundary scan timing. Figure 91 depicts the TRST timing with respect to TCK. Figure 90 depicts the SJC test access port. Signal parameters are listed in Table 99. Figure 88. Test Clock Input Timing Diagram Figure 89. Boundary Scan (JTAG) Timing Diagram

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Figure 90. Test Access Port Timing Diagram Figure 91. TRST Timing Diagram Table 99. JTAG Timing

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4.7.14 SPDIF Timing Parameters

Table 100 shows the timing parameters for the Sony/Philips Digital Interconnect Format (SPDIF).

4.7.15 SSI Timing Parameters

This section describes the timing parameters of the SSI module. The connectivity of the serial synchronous interfaces is summarized in Table 101. SJ9 TMS, TDI data hold time 25 — ns SJ10 TCK low to TDO data valid — 44 ns SJ11 TCK low to TDO high impedance — 44 ns SJ12 TRST assert time 100 — ns SJ13 TRST set-up time to TCK low 40 — ns

1 TDC = target frequency of SJC

2 VM = mid-point voltage

Table 100. SPDIF Timing Table 101. AUDMUX Port Allocation Table 99. JTAG Timing (continued)

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 The terms WL and BL used in the timing diagrams and tables refer to Word Length (WL) and Bit Length (BL).  The SSI timing diagrams use gene ric signal names wherein the names used in the i.MX51 Multimedia Applications Processor Reference Manual (MCIMX51RM) are channel specific signal names. For example, a channel clock referenced in the IOMUXC chapter as AUD3_TXC appears in the timing diagram as TXC.

4.7.15.1 SSI Transmitter Timing with Internal Clock

Figure 92 depicts the SSI transmitter internal clock timing and Table 102 lists the timing parameters for the SSI transmitter internal clock. Figure 92. SSI Transmitter Internal Clock Timing Diagram Table 101. AUDMUX Port Allocation (continued)

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 133 NOTE  All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync (TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting the clock signal STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables and in the figures.  All timings are on Audiomux Pads when SSI is being used for data transfer.  The terms WL and BL refer to Word Length (WL) and Bit Length (BL).  ”Tx” and “Rx” refer to the Transmit and Receive sections of the SSI.  For internal Frame Sync operation using external clock, the FS timing is same as that of Tx Data (for example, during AC97 mode of operation). Table 102. SSI Transmitter Timing with Internal Clock

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4.7.15.2 SSI Receiver Timing with Internal Clock

Figure 93 depicts the SSI receiver internal clock timing and Table 103 lists the timing parameters for the SSI receiver internal clock. Figure 93. SSI Receiver Internal Clock Timing Diagram Table 103. SSI Receiver Timing with Internal Clock

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 135 NOTE  All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync (TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting the clock signal STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables and in the figures.  All timings are on Audiomux Pads when SSI is being used for data transfer.  “Tx” and “Rx” refer to the Transmit and Receive sections of the SSI.  The terms WL and BL refer to Word Length (WL) and Bit Length (BL).  For internal Frame Sync operation using external clock, the FS timing is same as that of Tx Data (for example, during AC97 mode of operation). Oversampling Clock Operation SS47 Oversampling clock period 15.04 — ns SS48 Oversampling clock high period 6.0 — ns SS49 Oversampling clock rise time — 3.0 ns SS50 Oversampling clock low period 6.0 — ns SS51 Oversampling clock fall time — 3.0 ns Table 103. SSI Receiver Timing with Internal Clock (continued)

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4.7.15.3 SSI Transmitter Timing with External Clock

Figure 94 depicts the SSI transmitter external clock timing and Table 104 lists the timing parameters for the SSI transmitter external clock. Figure 94. SSI Transmitter External Clock Timing Diagram Table 104. SSI Transmitter Timing with External Clock

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 137 NOTE  All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync (TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting the clock signal STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables and in the figures.  All timings are on Audiomux Pads when SSI is being used for data transfer.  “Tx” and “Rx” refer to the Transmit and Receive sections of the SSI.  The terms WL and BL refer to Word Length (WL) and Bit Length (BL).  For internal Frame Sync operation using external clock, the FS timing is same as that of Tx Data (for example, during AC97 mode of operation). SS39 (Tx) CK high to STXD high impedance — 15.0 ns Synchronous External Clock Operation SS44 SRXD setup before (Tx) CK falling 10.0 — ns SS45 SRXD hold after (Tx) CK falling 2.0 — ns SS46 SRXD rise/fall time — 6.0 ns Table 104. SSI Transmitter Timing with External Clock (continued)

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4.7.15.4 SSI Receiver Timing with External Clock

Figure 95 depicts the SSI receiver external clock timing and Table 105 lists the timing parameters for the SSI receiver external clock. Figure 95. SSI Receiver External Clock Timing Diagram Table 105. SSI Receiver Timing with External Clock

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 139 NOTE  All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync (TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting the clock signal STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables and in the figures.  All timings are on Audiomux Pads when SSI is being used for data transfer.  “Tx” and “Rx” refer to the Transmit and Receive sections of the SSI.  The terms WL and BL refer to Word Length (WL) and Bit Length (BL).  For internal Frame Sync operation using external clock, the FS timing is same as that of Tx Data (for example, during AC97 mode of operation).

4.7.16 UART

Table 106 shows the UART I/O configuration based on which mode is enabled.

4.7.16.1 UART Electrical

This section describes the electrical information of the UART module. Table 106. UART I/O Configuration vs. Mode

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4.7.16.1.1 UART RS-232 Serial Mode Timing

Figure 96 depicts the transmit timing of UART in RS-232 serial mode, with 8 data bit/1 stop bit format. Table 107 lists the UART RS-232 serial mode transmit timing characteristics. Figure 96. UART RS-232 Serial Mode Transmit Timing Diagram serial mode receive timing characteristics. Figure 97. UART RS-232 Serial Mode Receive Timing Diagram

4.7.16.1.2 UART IrDA Mode Timing

The following subsections give the UART transmit and receive timings in IrDA mode. Table 107. UART RS-232 Serial Mode Transmit Timing Diagram 1 1/Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16. 2 Tref_clk: The period of UART reference clock ref_clk (ipg_perclk after RFDIV divider). Table 108. UART RS-232 Serial Mode Transmit Timing Diagram not exceed 3/(16×Fbaud_rate). 2 Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.

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4.7.17 USBOH3 Parameters

This section describes the electrical parameters of the USB OTG port and USB HOST ports. For on-chip USB PHY parameters see Section 4.7.19, “USB PHY Parameters.”

4.7.17.1 USB Serial Interface

In order to support four serial different interfaces, the USB serial transceiver can be configured to operate in one of four modes:  DA T_SE0 bidirectional, 3-wire mode  DA T_SE0 unidirectional, 6-wire mode  VP_VM bidirectional, 4-wire mode  VP_VM unidirectional, 6-wire mode The USB controller does not support ULPI Serial mode. Only the legacy serial mode is supported. Table 111 shows the serial mode signal map for 6-pin Full speed/Low speed (FsLs) serial mode. Table 112 shows the serial mode signal map for 3-pin FsLs serial mode. 2 Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16. Table 111. Serial Mode Signal Map for 6-pin FsLs Serial Mode Table 112. Serial Mode Signal Map for 3-pin FsLs Serial Mode

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4.7.17.1.1 USB DAT_SE0 Bi-Directional Mode

Table 113 shows the signal definitions in DAT_SE0 bi-directional mode and Figure 100 shows the USB transmit waveform in DAT_SE0 bi-directional mode. Figure 100. USB Transmit Waveform in DAT_SE0 Bi-Directional Mode definitions of USB receive waveform in DAT_SE0 bi-directional mode. Figure 101. USB Receive Waveform in DAT_SE0 Bi-Directional Mode Table 113. Signal Definitions—DAT_SE0 Bi-Directional Mode

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4.7.17.1.2 USB DAT_SE0 Unidirectional Mode

Table 115 shows the signal definitions in DAT_SE0 unidirectional mode Figure 102 and Figure 103 shows the USB transmit/receive waveform in DAT_SE0 uni-directional mode respectively. Figure 102. USB Transmit Waveform in DAT_SE0 Uni-directional Mode Table 114. Definitions of USB Receive Waveform in DAT_SE0 Bi-Directional Mode Table 115. Signal Definitions—DAT_SE0 Unidirectional Mode

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 145 Figure 103. USB Receive Waveform in DAT_SE0 Uni-directional Mode Table 116 shows the USB port timing specification in DAT_SE0 uni-directional mode.

4.7.17.1.3 USB VP_VM Bi-Directional Mode

the USB transmit/receive waveform in VP_VM bi-directional mode respectively. Table 116. USB Port Timing Specification in DAT_SE0 Uni-Directional Mode Table 117. Signal Definitions—VP_VM Bi-Directional Mode

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Figure 104. USB Transmit Waveform in VP_VM Bi-Directional Mode Figure 105. USB Receive Waveform in VP_VM Bi-Directional Mode Table 118 shows the USB port timing specification in VP_VM bi-directional mode. Table 118. USB Port Timing Specification in VP_VM Bi-directional Mode

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4.7.17.1.4 USB VP_VM Uni-Directional Mode

Table 119 shows the signal definitions in VP_VM uni-directional mode. Figure 106 and Figure 107 shows the USB transmit/receive waveform in VP_VM uni-directional mode respectively. Figure 106. USB Transmit Waveform in VP_VM Unidirectional Mode Table 119. USB Signal Definitions—VP_VM Uni-Directional Mode Table 118. USB Port Timing Specification in VP_VM Bi-directional Mode (continued)

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Figure 107. USB Receive Waveform in VP_VM Uni-directional Mode Table 120 shows the USB port timing specification in VP_VM uni-directional mode. Table 120. USB Timing Specification in VP_VM Unidirectional Mode

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4.7.18 USB Parallel Interface Timing

Electrical and timing specifications of Parallel Interface are presented in the subsequent sections. Table 121 shows the signal definitions in parallel mode. Figure 108 shows the USB transmit/receive waveform in parallel mode. Table 122 shows the USB timing specification for ULPI parallel mode. Figure 108. USB Transmit/Receive Waveform in Parallel Mode Table 121. Signal Definitions—Parallel Interface (Normal ULPI) USB_Clk In Interface clock. All interface signals are synchronous to Clock. ownership is determined by Dir. USB_Dir In Direction. Control the direction of the Data bus. stream currently on the bus. USB_Nxt In Next. The PHY asserts this signal to throttle the data. Table 122. USB Timing Specification for ULPI Parallel Mode 1 H3 routed to NANDF I/O is recommended for Full and Low-Speed use only.

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4.7.19 USB PHY Parameters

This section describes the USB PHY parameters.

4.7.19.1 USB PHY AC Parameters

Table 123 lists the AC timing parameters for USB PHY.

4.7.19.2 USB PHY Additional Electrical Parameters

Table 124 lists the parameters for additional electrical characteristics for USB PHY.

4.7.19.3 USB PHY System Clocking (SYSCLK)

Table 125 lists the USB PHY system clocking parameters. Table 123. USB PHY AC Timing Parameters

12 Mbps

480 Mbps

Table 124. Additional Electrical Characteristics for USB PHY Table 125. USB PHY System Clocking Parameters

4.7.19.4 USB PHY Voltage Thresholds

Table 126 lists the USB PHY voltage thresholds.

5 Package Information and Contact Assignments

This section includes the contact assignment information and mechanical package drawing. location) for the 19 × 19 mm, 0.8 mm pitch package. Table 126. VBUS Comparators Thresholds

1 For VBUS maximum rating, see Ta ble 1 1 on page 17

Table 125. USB PHY System Clocking Parameters (continued)

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Figure 109 shows the top view, bottom view, and side view of the 19 ×19 mm package. Figure 109. 19 x 19 mm Package: Case 2017-01—0.8 mm Pitch

The following notes apply to Figure 109. 1 All dimensions in millimeters. 2 Dimensioning and tolerancing per ASME Y14.5M-1994. 3 Maximum solder ball diameter measured parallel to Datum A. 4 Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. assignments including associated power supplies. Table 127. 19 x 19 mm Ground, Power, Sense, and Reference Contact Assignments

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Table 127. 19 x 19 mm Ground, Power, Sense, and Reference Contact Assignments (continued)

Table 128 displays an alpha-sorted list of the signal assignments including power rails. Table 128. 19 x 19 mm Signal Assignments, Power Rails, and I/O

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Table 128. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

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1 The state immediately after reset and before ROM firmware or software has executed. 2 See Table 3 on page 11 for more information. 3 During power-on reset this port acts as input for fuse override signal. See Table 129 on page 167 for more information. 4 During power-on reset this port acts as output for diagnostic signal. See Table 129 on page 167 for more information.

5.1.2.3 Fuse Override Considerations

Table 129 lists the contacts that can be overridden with fuse settings. Table 129. Fuse Override Contacts

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during product development. In production, the boot configuration is controlled by fuses. 2 External USB PHY selection is not functional. 3 Consider using an external 68 k Ω pull-up if system constraints indicate that the on-chip 100 kΩ pull-up is too weak. Table 129. Fuse Override Contacts (continued)

Table 130 shows the 19 × 19 mm, 0.8 pitch ball map. Table 130. 19 × 19 mm, 0.8 Pitch Ball Map

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Table 130. 19 × 19 mm, 0.8 Pitch Ball Map (continued)

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Revision History

i.MX51A Automotive and Infotainment Applications Processors, Rev. 6 Freescale Semiconductor 173

6 Revision History

Table 131 provides a revision history for this data sheet. Table 131. i.MX51 Data Sheet Document Revision History paragraph and added a note after Ta bl e 9. cell HVE bit functionality after Table 21.  Corrected cross-references throughout the document. Rev. 4 08/2010  Removed table footnote in T able 47, "CAMP Electrical Parameters (CKIH1, CKIH2)," on page 46.  Updated T able 52, "WEIM Interface Pinout in Various Configurations," on page 53.

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Rev. 3 06/2010  Updated Max column of T able 15, "Fuse Supply Current," on page 19. Deleted eFuse Read Current row from the same table.  Updated Symbol, Test Conditions, and Max columns of T able 18, "GPIO/HSGPIO DC Electrical Characteristics," on page 23 .  Updated Max and Unit columns of Table 19, "DDR2 I/O DC Electrical Parameters," on page 24 .  Updated T est Conditions, Max, and Unit columns of T able 20, "LVIO DC Electrical Characteristics," on page 24  Updated Symbol, Test Conditions, Max, and Unit columns of Table 21, "UHVIO DC Electrical Characteristics," on page 25 .  Updated Max and Unit columns of Table 22, "I2C Standard/Fast/High-Speed Mode Electrical Parameters for Low/Medium Drive Strength," on page 27 .  Added a new table T able 25, "I/O Leakage Current," on page 29 . Rev. 2 05/2010  Changed the VREFOUT column in T able 3, "Special Signal Considerations," on page 11.  Added Section 3, “IOMUX Configuration for Boot Media”.  Updated Figure 2, "Power-Up Sequence," on page 22 .  Added a note in Section 4.2.1, “Power-Up Sequence”.  Updated Section 4.2.1, “Power-Up Sequence.”  Changed the Input current (47 k Ω Pull-up) column in T able 21, "UHVIO DC Electrical Characteristics," on page 25 to Input current (75 kO Pull-up).  Added new table for parameters for DDR2 Pad output buffer Impedance. See Table 27, "DDR2 I/O Output Buffer Impedance HVE = 0," on page 30 .  Added new section under Section 4.5, “I/O AC Parameters” . See Section 4.5.4, “AC Electrical Characteristics for DDR2”.  Updated T able 47, "CAMP Electrical Parameters (CKIH1, CKIH2)," on page 46. In the VIH (for square wave input) parameter, the minimum frequency was changed to NVCC_PER3 - 0.25V and the maximum frequency was changed to NVCC_PER3.  Added a note in Section 4.6.6, “NAND Flash Controller (NFC) Parameters” after Ta ble 49.  Updated Asymmetric Mode Min, Symmetric Mode Min, and Max columns of Ta bl e 5 0.  Removed Conditions parameters of the Full scale output voltage row in Ta ble 82.  Updated Section 4.7.11, “P-A TA Timing Parameters”. Replaced A T A/A TAPI-6 specification with A TA/AT API-5 specification. I n T able 102, "SSI T ransmitter Timing with Internal Clock," on page 133, under the Synchronous Internal Clock Operation sections for the ID SS42, minimum frequency was changed from 10.0 to 30. I n Table 103, "SSI Receiver Timing with Internal Clock," on page 134 , under the Internal Clock Operation section for ID SS20, minimum frequency was changed from 10.0 to 30. I n Table 104, "SSI T ransmitter Timing with External Clock," on page 136, under the External Clock Operation section for ID SS38, maximum frequency was changed from 15.0 to 30. I n T able 118, "USB Port Timing Specification in VP_VM Bi-directional Mode," on page 146, for IDs SS28 and SS29, direction was changed from out to in. I n T able 120, "USB Timing Specification in VP_VM Unidirectional Mode," on page 148, for IDs US40 and US41, direction was changed from out to in and the reference signal was changed to USB_VM1 and USB_VP1 respectively. n Table 122, "USB Timing Specification for ULPI Parallel Mode," on page 149, added an extra row for ID17.  Updated Signal and Direction columns in T able 120, "USB Timing Specification in VP_VM Unidirectional Mode," on page 148.  Updated Signal names in Table 118, "USB Port Timing Specification in VP_VM Bi-directional Mode," on page 146. Rev. 1 10/2009 Initial public release. Table 131. i.MX51 Data Sheet Document Revision History (continued)

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